Heat dissipation structure of computer case

Abstract

The utility model provides a computer case radiating structure which comprises a radiator, the two sides of the radiator are sealed through sealing plates, so that a channel allowing airflow to flow through is formed in the radiator, the two ends of the radiator are provided with installation frames, the installation frames are connected with the sealing plates respectively, and the side, away from the radiator, of each installation frame is provided with an air guide channel. And an air exhaust device is arranged in the end part of at least one air guide channel. When the CPU radiator is used, external fresh air is continuously introduced into the radiating fins, and the external air passes through the gaps of the radiating fins, so that the heat exchange efficiency of the radiating fins and cold air is high, and the cooling efficiency of the CPU is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer case heat sink technology, specifically a computer case heat dissipation structure. Background Technology

[0002] A computer case typically includes the outer shell, bracket, and various switches and indicator lights on the front panel. As a component of a computer, the case's main function is to house and secure the various computer components, providing support and protection.

[0003] The computer case must be equipped with a heatsink, which is mounted on the CPU for heat dissipation. Existing computer cases typically have the following internal layout: Figure 5 As shown, although a heatsink is installed on the motherboard, the air blown out by the heatsink is concentrated inside the case. During operation, the graphics card and power supply also generate heat, so the temperature inside the case is significantly higher than the outside. Although an exhaust fan is installed outside the case, most of the air around the CPU still circulates inside the case, resulting in low CPU cooling efficiency. Therefore, we propose a computer case cooling structure. Utility Model Content

[0004] This invention provides a computer case heat dissipation structure that allows a continuous flow of external cold air through the heat sink, thereby improving the heat dissipation efficiency of the heat sink and solving the problems mentioned in the background art.

[0005] The technical solution of this utility model is implemented as follows: a computer case heat dissipation structure is designed, including a heat sink, the two sides of the heat sink are sealed by a sealing plate, so that a channel for airflow is formed inside the heat sink; mounting frames are provided at both ends of the heat sink, and the mounting frames are respectively connected to the sealing plate; each mounting frame is provided with an air guide channel on the side away from the heat sink, and an exhaust device is installed in at least one end of the air guide channel.

[0006] Optionally, each air duct has a flange edge at the edge furthest from the radiator.

[0007] Optionally, the exhaust device includes a circular air duct, which is coaxially fixed inside the air guide channel. The air guide channel and the outer wall of the circular air duct are sealed together. A motor is installed inside the circular air duct via a motor bracket, and a fan is mounted on the output shaft of the motor.

[0008] Optionally, the air duct and the mounting frame can be detachably connected.

[0009] Optionally, a docking frame is provided at the inner edge of the mounting frame, and a connecting sleeve corresponding to the docking frame is provided at the end of the air guide channel near the radiator. The connecting sleeve is fitted onto the docking frame, and the two sides of the connecting sleeve are respectively connected to the sealing plate by a locking buckle.

[0010] Optionally, the latch includes hooks disposed on both sides of the connecting sleeve and a latch disposed on the sealing plate.

[0011] Optionally, the heat sink includes a heat-conducting base with multiple heat pipes installed on it. Several layers of heat sink fins are installed on the heat pipes, and ventilation gaps are provided between adjacent heat sink fins. The surface of the sealing plate is provided with at least one slot corresponding to the heat sink fins, and the sealing plate is fixed to the edge of the heat sink fins by the slots. The two sides of the mounting frame are connected to the sides of the sealing plate by fasteners.

[0012] Optionally, the upper and lower ends of the mounting frame are connected by at least one screw.

[0013] Optionally, the edge of the heat-conducting base is provided with a connecting piece or hook.

[0014] Compared with the prior art, when this utility model is in use, fresh air from the outside is continuously introduced into the heat sink, and the outside air passes through the gaps in the heat sink, which makes the heat exchange efficiency between the heat sink and the cold air high, thus improving the CPU cooling efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the specific structure of the radiator of this utility model.

[0018] Figure 3 This is a schematic diagram of the structure of this utility model in conjunction with the chassis. Figure 1 .

[0019] Figure 4 This is a schematic diagram of the structure of this utility model in conjunction with the chassis. Figure 2 .

[0020] Figure 5 This is a diagram showing the internal layout of the existing chassis.

[0021] In the diagram: 1. Air duct; 2. Flange edge; 3. Circular air duct; 4. Motor bracket; 5. Fan; 6. Hook; 7. Connecting sleeve; 8. Docking frame; 9. Sealing plate; 10. Fastener; 11. Screw; 12. Radiator; 13. Heat pipe; 14. Mounting frame; 15. Heat sink; 16. Heat-conducting base; 17. Slot. Detailed Implementation

[0022] The technical solution of this utility model will be clearly and completely described below with reference to its embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] Reference Figures 1 to 2 This utility model provides a technical solution: a computer case heat dissipation structure, including a heat sink 12, the heat sink 12 including a heat conduction base 16, the heat conduction base 16 being a square base made of copper or aluminum, which has good thermal conductivity, and multiple heat pipes 13 installed on the heat conduction base 16, the heat pipes 13 being copper heat pipes, and several layers of heat sink fins 15 installed on the heat pipes 13, the heat sink fins 15 being aluminum fins or copper fins, etc., and ventilation gaps are provided between adjacent heat sink fins 15. During installation, thermal paste is applied to the bottom of the heat conduction base 16 and placed on the CPU of the motherboard of the computer case, the edge of the heat conduction base 16 is provided with connecting pieces or hooks (such as... Figure 2 (As indicated by the middle arrow A) If the edge of the heat-conducting base 16 is connected to the connecting piece, there are four connecting pieces arranged symmetrically. The connecting pieces can be fastened to the motherboard with bolts. If the edge of the heat-conducting base 16 is connected to the hook, there are two hooks arranged symmetrically. The hooks can be hung on the corresponding hanging points on the motherboard.

[0024] like Figure 1 As shown, the two sides of the radiator are sealed by the sealing plate 9. That is, the sealing plate 9 seals one side of the heat sink 15, thus blocking both sides of the heat sink 15, but allowing airflow through the middle. This creates a channel for airflow inside the radiator 12. The specific installation relationship between the sealing plate 9 and the heat sink 15 is as follows: Figure 2 As shown, at least one slot 17 corresponding to the heat sink 15 is provided on the surface of the sealing plate 9. The sealing plate 9 is fixed to the edge of the heat sink 15 by the slot 17. Figure 2 The card slots 17 are two and symmetrically arranged at the upper and lower ends of the surface of the sealing plate 9. During installation, the heat sink 15 located at the top and bottom can be inserted into the card slots 17, so that the sealing plate 9 can be fixed on the heat sink 15.

[0025] Next, mounting frames 14 are provided at both ends of the radiator. The mounting frames 14 are connected to the sealing plates 9 respectively. Specifically, the two side edges of the mounting frames 14 are connected to the sides of the sealing plates 9 by fasteners, which are bolts. The sealing plates 9 can be clipped onto the heat sink 15, and the mounting frames 14 are connected to the sealing plates 9 by fasteners, so it is convenient to assemble the sealing plates 9, mounting frames 14 and heat sink 15 together.

[0026] It should be further explained that, in order to make the upper and lower ends of the mounting frame 14 more tightly fitted to the heat sink 15, such as... Figure 1 and Figure 2 As shown, the upper and lower ends of the mounting frame 14 are connected by at least one screw 11. The screw 11 is a slender screw. The screw 11 pulls the middle of the two mounting frames 14 together, making the mounting frame 14 and the edge of the heat sink 15 more tightly, thus ensuring airtightness.

[0027] Each mounting frame 14 has an air guide channel 1 on the side away from the radiator 12. An exhaust device is installed at at least one end of the air guide channel 1. The exhaust device includes a circular air duct 3, which is coaxially fixed inside the air guide channel 1. The air guide channel 1 and the outer wall of the circular air duct 3 are sealed together. A motor is installed inside the circular air duct 3 via a motor bracket 4. A fan 5 is installed on the output shaft of the motor. The motor is preferably a brushless motor. The motor bracket 4 is cross-shaped, straight, or star-shaped, and the motor is installed in the middle of the motor bracket 4. It is important to note that the advantage of placing the fan 5 inside the circular air duct 3 is that the circular air duct 3 can provide the highest airflow efficiency and avoid the large wind resistance caused by square or other shapes. The circular air duct 3 is equivalent to the outer shell of the fan, so the combination of the circular air duct 3 and the fan can make the airflow efficiency higher.

[0028] In actual use, an exhaust device can be installed in one air guide channel 1, so that one exhaust device can exhaust air outward; however, exhaust devices can also be installed in two air guide channels 1 at the same time, so that one exhaust device exhausts air outward and the other exhaust device blows air inward.

[0029] Specifically, such as Figure 1 As shown, each air duct 1 has a flange edge 2 at the edge furthest from the radiator 12, and so on. Figure 3 As shown, after the heatsink is installed in the CPU position on the motherboard, the end of the air duct 1 away from the heatsink 12 is respectively set on the inner wall of the chassis through the flange edge 2. The inner wall of the chassis has holes corresponding to the air duct 1, allowing fresh air from the outside to flow in. Figure 3 Like the middle arrow, heat flows continuously through the heatsink 15, thus quickly dissipating the CPU's heat to the outside of the chassis.

[0030] The above-described air intake process continuously introduces fresh external air into the heatsink 15, resulting in high heat exchange efficiency between the heatsink 15 and the cool air, thus improving CPU cooling efficiency. Figure 3 As shown, the air guide channel 1 can be bent, such as... Figure 4 As shown, the air guide channel 1 can be set in a straight line.

[0031] Furthermore, the heat dissipation mechanism proposed in this application also requires cleaning after prolonged use. Therefore, to facilitate cleaning, the air guide channel 1 and the mounting frame 14 are designed as detachable structures. Figure 1 and Figure 2 As shown, a docking frame 8 is provided at the inner edge of the mounting frame 14, and a connecting sleeve 7 corresponding to the docking frame 8 is provided at one end of the air guide channel 1 near the radiator 12. The connecting sleeve 7 is fitted onto the docking frame 8, and the two sides of the connecting sleeve 7 are respectively connected to the sealing plate 9 by a latch. The latch includes a hook 6 on both sides of the connecting sleeve 7 and a buckle 10 on the sealing plate 9. The buckle can tighten the connecting sleeve 7 onto the docking frame 8, thereby improving the airtightness between the two. When cleaning is required, the air guide channel 1 can be removed simply by opening the buckle.

[0032] Based on the above embodiments, further optimization can be achieved by providing filters at the ends of the air duct 1, which can prevent large dust and debris from entering the chassis.

[0033] Based on the above embodiments, it should be further explained that one end of the air guide channel 1 is fixed to the heat sink and the other end is fixed to the chassis. Therefore, both ends of the air guide channel are fixed, which will not hinder the arrangement of the internal circuitry of the chassis. Moreover, the air guide channel does not affect the installation of the graphics card and power supply.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A computer case heat dissipation structure, comprising a heat sink (12), characterized in that, The two sides of the radiator are sealed by sealing plates (9), so that a channel for airflow is formed inside the radiator (12); The radiator has mounting frames (14) at both ends, and the mounting frames (14) are connected to the sealing plate (9) respectively; Each mounting frame (14) has an air guide channel (1) on the side away from the radiator (12), and an exhaust device is installed in at least one end of the air guide channel (1).

2. The computer chassis heat dissipation structure as described in claim 1, characterized in that, Each air duct (1) has a flange edge (2) at one end away from the radiator (12).

3. The computer chassis heat dissipation structure as described in claim 1, characterized in that, The exhaust device includes a circular air duct (3), which is coaxially fixed inside the air guide channel (1). The air guide channel (1) and the outer wall of the circular air duct (3) are sealed together. A motor is installed inside the circular air duct (3) through a motor bracket (4), and a fan (5) is installed on the output shaft of the motor.

4. The computer chassis heat dissipation structure as described in claim 1, characterized in that, The air duct (1) is detachably connected to the mounting frame (14).

5. The computer chassis heat dissipation structure as described in claim 4, characterized in that, The mounting frame (14) has a docking frame (8) at its inner edge. A connecting sleeve (7) corresponding to the docking frame (8) is provided at one end of the air guide channel (1) near the radiator (12). The connecting sleeve (7) is fitted onto the docking frame (8), and the two sides of the connecting sleeve (7) are respectively connected to the sealing plate (9) by a latch.

6. The computer chassis heat dissipation structure as described in claim 5, characterized in that, The latch includes hooks (6) on both sides of the connecting sleeve (7) and buckles (10) on the sealing plate (9).

7. The computer chassis heat dissipation structure as described in any one of claims 1-6, characterized in that, The radiator (12) includes a heat-conducting base (16), on which multiple heat pipes (13) are installed, and on which several layers of heat sinks (15) are installed, with ventilation gaps between adjacent heat sinks (15). The sealing plate (9) has at least one slot (17) corresponding to the heat sink (15) on its surface. The sealing plate (9) is fixed at the edge of the heat sink (15) by the slot (17). The two sides of the mounting frame (14) are connected to the side of the sealing plate (9) by fasteners.

8. The computer chassis heat dissipation structure as described in claim 7, characterized in that, The upper and lower ends of the mounting frame (14) are connected by at least one screw (11).

9. The computer chassis heat dissipation structure as described in claim 7, characterized in that, The edge of the heat-conducting base (16) is provided with connecting pieces or hooks.

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