Board card assembly and electronic equipment

Abstract

The utility model discloses a board card assembly and electronic equipment, the board card assembly comprises a plurality of board card modules and a heat conduction structure, the plurality of board card modules are sequentially stacked in a preset direction, and at least a partial dislocation area exists between two adjacent board card modules; at least part of the heat conduction structure is located at the dislocation area, and the surface of the side, deviating from the dislocation area, of the heat conduction structure is used for being attached to a cold plate of the electronic equipment. Wherein the uppermost board card module is used for being attached to a cold plate so as to be used for directly dissipating heat through the cold plate; and the other board card modules except the uppermost board card modules are at least indirectly connected with the cold plate through the heat conduction structures so as to transfer heat to the cold plate through the heat conduction structures. According to the memory module, the problem that heat can be taken away only by arranging a heat pipe and a cold plate in the memory module in the related technology is solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a board assembly and an electronic device. Background Technology

[0002] In today's rapidly developing information technology field, especially in applications such as artificial intelligence, big data processing, and high-performance computing, the demand for memory has surged, requiring not only larger storage capacity but also higher data transfer rates. This directly leads to a significant increase in the power consumption of memory modules, making traditional air cooling methods insufficient to meet the cooling requirements. Therefore, liquid cooling technology has gradually been introduced into memory cooling as a highly efficient heat dissipation solution to address the challenges posed by high power consumption. The core of liquid cooling technology is to tightly attach a cold plate containing microchannels to the surface of the memory module. Coolant flows through the microchannels to carry away heat, achieving the purpose of cooling.

[0003] In existing technologies, memory modules efficiently dissipate heat generated within the module by using heat pipes, and then rapidly remove this heat using liquid cooling. However, this approach has limitations in practical applications. For example, the arrangement and maintenance of heat pipes are relatively complex, and the design and installation of cold plates require a large number of pipes and joints, increasing manufacturing costs and maintenance difficulty. Utility Model Content

[0004] This application provides a board assembly and electronic device to at least solve the problem in the related art that memory modules need to be arranged with heat pipes and cold plates to remove heat.

[0005] This application provides a board assembly, including multiple board modules and a heat-conducting structure. The multiple board modules are stacked sequentially along a preset direction, and there is at least a partial misalignment area between adjacent sets of board modules. At least part of the heat-conducting structure is located at the misalignment area, and the side surface of the heat-conducting structure facing away from the misalignment area is used to be bonded to the cold plate of the electronic device. The uppermost board module is bonded to the cold plate for direct heat dissipation through the cold plate. The remaining board modules, except the uppermost one, are indirectly connected to the cold plate at least through the heat-conducting structure for transferring heat to the cold plate through the heat-conducting structure.

[0006] In one exemplary embodiment, a portion of the thermally conductive structure is located between the overlapping areas of two adjacent sets of board modules, and another portion of the thermally conductive structure is used to be disposed between the misaligned area and the cold plate.

[0007] In one exemplary embodiment, the board assembly further includes thermal pads; the thermal pads are at least used to be disposed between the topmost board module and the cold plate; and / or, the thermal pads are at least used to be disposed between the thermally conductive structure and the cold plate; and / or, the thermal pads are at least used to be disposed between each of the remaining board modules other than the topmost one and the thermally conductive structure.

[0008] In one exemplary embodiment, the thickness of the thermal pad ranges from 0.2 mm to 1.0 mm.

[0009] In an exemplary embodiment, the heat-conducting structure includes a heat-conducting plate and a heat-conducting boss, wherein the heat-conducting plate is laid on at least one set of board modules among the remaining board modules excluding the topmost one, and at least a portion of the heat-conducting plate is located between two adjacent sets of board modules; the heat-conducting boss is disposed on the heat-conducting plate located at a misaligned area, and the heat-conducting boss is located on the side of the heat-conducting plate away from the misaligned area for bonding with a cold plate.

[0010] In one exemplary embodiment, the thickness of the heat-conducting plate is not less than 0.8 mm; and / or, the height of the heat-conducting boss is equal to the height of the uppermost board module.

[0011] In one exemplary embodiment, the board module includes a circuit board and a plurality of chip particles, wherein the circuit board is used to connect to the motherboard of an electronic device; the plurality of chip particles are evenly distributed on both sides of the circuit board in the thickness direction; and a heat-conducting plate is detachably connected to the circuit boards of at least one set of board modules in the remaining board modules excluding the topmost one.

[0012] In one exemplary embodiment, there are multiple connection points between the heat-conducting plate and the board module, and the multiple connection points are distributed at the circumferential edges of the heat-conducting plate and the board module.

[0013] In an exemplary embodiment, the heat-conducting plate body also has supporting limiting posts, which are arranged in pairs, and each supporting limiting post has a limiting groove on at least a portion of its outer periphery; the circuit board of the uppermost board module has limiting notches on both sides of its edge for cooperating with the limiting grooves, so that when the heat-conducting boss provides downward pressure to the board module connected to it, the cooperation between the limiting notches and the limiting grooves provides upward resistance to the board module connected to the heat-conducting boss.

[0014] This application also provides an electronic device, including a motherboard, a board assembly, multiple connectors, and a cold plate. The board assembly includes multiple board modules, and the board assembly is the aforementioned board assembly. The multiple connectors correspond one-to-one with the multiple board modules, and each board module is connected to the motherboard through its corresponding connector. The cold plate is located on the motherboard and forms a hollow area between the cold plate and the motherboard for placing the board assembly.

[0015] This application provides a board assembly including multiple board modules and a heat-conducting structure. The multiple board modules are stacked sequentially along a preset direction, and there is at least a partial misalignment area between adjacent sets of board modules. At least part of the heat-conducting structure is located at the misalignment area, and the side surface of the heat-conducting structure facing away from the misalignment area is used to be bonded to the cold plate of the electronic device. The uppermost board module is bonded to the cold plate for direct heat dissipation through the cold plate. The remaining board modules, except the uppermost one, are indirectly connected to the cold plate at least through the heat-conducting structure for transferring heat to the cold plate through the heat-conducting structure.

[0016] By stacking multiple circuit board modules sequentially along a preset direction, with the topmost module bonded to a cold plate, the heat generated by the topmost module can be directly dissipated through the cold plate. Furthermore, by indirectly connecting all other circuit board modules (excluding the top one) to the cold plate via a heat-conducting structure, heat can be transferred from the top modules to the cold plate through this structure, achieving indirect heat dissipation. The circuit board assembly provided in this application achieves excellent heat dissipation for all modules except the top one through the heat-conducting structure. The overall structure of the assembly is relatively simple, which helps reduce manufacturing costs and maintenance difficulty. Attached Figure Description

[0017] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a board assembly provided in an embodiment of this application;

[0019] Figure 2 for Figure 1 An exploded view of the two-layer board module in the board assembly;

[0020] Figure 3 for Figure 1 A side view of the structure of the board assembly being installed on the electronic device;

[0021] Figure 4 for Figure 2 The diagram of the board assembly in the figure omits the structural diagram of the upper board module. The diagram shows the structural diagram of the heat conduction structure.

[0022] The above figures include the following reference numerals:

[0023] 1. Cold plate; 2. Motherboard; 3. Circuit board assembly; 4. Connector;

[0024] 10. Board module; 11. Circuit board; 111. Limiting notch; 12. Chip chip;

[0025] 20. Heat-conducting structure; 21. Heat-conducting plate; 211. Supporting and limiting post; 2111. Limiting groove; 22. Heat-conducting boss. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0027] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Embodiments of this application provide a board assembly and an electronic device. The device is described in detail below, taking into account its structure and working principle (technical terms must be explained). The electronic device can be a server, switching equipment, storage device, personal computer, or other device with memory elements.

[0030] like Figure 3As shown, taking a server as an example, the electronic device includes a motherboard 2, a board assembly 3, multiple connectors 4, and a cold plate 1. The board assembly 3 includes multiple board modules 10, which are the board assemblies described above and below. The multiple connectors 4 correspond one-to-one with the multiple board modules 10, and each board module 10 is connected to the motherboard 2 through its corresponding connector 4. The cold plate 1 is located on the motherboard 2 and forms a hollow area with the motherboard 2 for placing the board assembly 3.

[0031] It should be noted that in this application, the heights of the multiple connectors 4 may be inconsistent. The height of the connectors 4 can be adjusted appropriately according to the needs of the board module 10, so that each board module 10 can be connected to the motherboard 2 of the electronic device through the connectors 4 of the corresponding height.

[0032] Furthermore, connector 4 is vertically connected to motherboard 2.

[0033] Furthermore, the cold plate 1 can be selected as needed; it can be a microchannel cold plate for pursuing high heat dissipation efficiency or an aluminum substrate with embedded copper tubes for cost reduction. As an embodiment of this utility model, in order to reduce the thermal resistance between the cold plate 1 and the heating element, the cold plate 1 can be a flexible structure, so that the surface of the cold plate 1 fits more closely to the surface of the heating element.

[0034] Considering that two layers of board modules 10 can be placed in the 1U space of the server, the specific embodiments of this application are described using two layers of board modules 10 as an example.

[0035] like Figures 1 to 4 As shown, the board assembly 3 includes multiple board modules 10 and a heat-conducting structure 20. The multiple board modules 10 are stacked sequentially along a preset direction, and there is at least a partial misalignment area between two adjacent sets of board modules 10. At least a portion of the heat-conducting structure 20 is located at the misalignment area, and the side surface of the heat-conducting structure 20 facing away from the misalignment area is used to be bonded to the cold plate 1 of the electronic device. The uppermost board module 10 is bonded to the cold plate 1 for direct heat dissipation through the cold plate 1. The remaining board modules 10, except for the uppermost one, are indirectly connected to the cold plate 1 at least through the heat-conducting structure 20 for transferring heat to the cold plate 1 through the heat-conducting structure 20.

[0036] By stacking multiple board modules 10 sequentially along a preset direction, with the topmost board module 10 being attached to the cold plate 1, the heat generated by the topmost board module 10 can be directly dissipated through the cold plate 1. Furthermore, by indirectly connecting the remaining board modules 10 (excluding the topmost one) to the cold plate 1 at least through a heat-conducting structure 20, the remaining board modules 10 can transfer heat to the cold plate 1 through the heat-conducting structure 20, thereby achieving indirect heat dissipation. The board assembly 3 provided in this application achieves heat dissipation for the remaining board modules 10 (excluding the topmost one) by setting the heat-conducting structure 20, and the heat dissipation effect is excellent. The overall structure of the board assembly 3 is relatively simple, which helps to reduce the processing and manufacturing cost of the board assembly 3, and also helps to reduce the maintenance difficulty of the board assembly 3.

[0037] It should be noted that the board module 10 in this application can be a memory module or other types of modules, and the chip 12 in this application is a memory chip.

[0038] It should be noted that in this application, a portion of the heat-conducting structure 20 is located between the overlapping areas of two adjacent sets of board modules 10, and another portion of the heat-conducting structure 20 is disposed between the misaligned area and the cold plate 1. Thus, having a portion of the heat-conducting structure 20 located between the overlapping areas of two adjacent sets of board modules 10 facilitates the transfer of heat from the multiple chip particles 12 below the circuit board 11 of the uppermost board module 10 to the cold plate 1 through the heat-conducting structure 20 by contacting it, thereby achieving heat dissipation for the uppermost board module 10. Furthermore, by disposing of the other portion of the heat-conducting structure 20 between the misaligned area and the cold plate 1, it facilitates the transfer of heat from the board modules 10 other than the uppermost one to the cold plate 1 through the heat-conducting structure 20, thereby achieving heat dissipation for the board modules 10 other than the uppermost one. The purpose of heat dissipation for the board module 10 is as follows: Of course, the heat generated by the multiple chip particles 12 in the non-overlapping area below the circuit board 11 of the uppermost board module 10 can be directly transferred to the cold plate 1 through the circuit board 11 to achieve the purpose of heat dissipation on one side. That is to say, in an embodiment not shown in this application, there may be no overlapping area between two adjacent board modules 10, and they may still be staggered. Thus, the heat generated by the multiple chip particles 12 below the circuit board 11 of the uppermost board module 10 can be directly transferred to the cold plate 1 through the circuit board 11 to achieve the purpose of heat dissipation.

[0039] It should be noted that, in this application, considering the processing tolerances of the multiple chip particles 12 on the circuit board 11 of the board module 10, the board assembly 3 also includes thermal pads; the thermal pads are at least used between the uppermost board module 10 and the cold plate 1; and / or, the thermal pads are at least used between the thermally conductive structure 20 and the cold plate 1; and / or, the thermal pads are at least used between each of the remaining board modules 10 (excluding the uppermost one) and the thermally conductive structure 20. Thus, the thermal pads, at least used between the uppermost board module 10 and the cold plate 1, absorb the tolerances between the multiple chip particles 12, thereby reducing contact thermal resistance. Furthermore, the thermal pads, at least used between the thermally conductive structure 20 and the cold plate 1, further reduce contact thermal resistance; and further still, the thermal pads, at least used between each of the remaining board modules 10 (excluding the uppermost one) and the thermally conductive structure 20, further absorb the tolerances between the multiple chip particles 12.

[0040] It should be noted that in this application, the thickness of the thermal pad ranges from 0.2mm to 1.0mm.

[0041] In one exemplary embodiment, the thermal pad thickness is 0.5 mm. This optimizes the heat conduction path between the board module 10 and the cold plate 1. By selecting an appropriate thermal pad thickness, not only is thermal resistance effectively reduced, ensuring rapid heat transfer from the board module 10 to the cold plate 1, but tolerances during memory installation are also absorbed, guaranteeing stable contact between the two. This design significantly enhances the heat dissipation efficiency of the dual-layer stacked memory module, simplifies maintenance, and reduces production costs. In practical applications, high-performance computing servers, data exchange devices, storage devices, and consumer electronics such as laptops and mobile phones can all benefit from this improved memory liquid cooling technology, achieving higher computing density and better space utilization efficiency.

[0042] like Figures 2 to 4As shown, the heat-conducting structure 20 includes a heat-conducting plate 21 and a heat-conducting boss 22. The heat-conducting plate 21 is laid on at least one set of board modules 10, excluding the topmost one, and at least a portion of the heat-conducting plate 21 is located between two adjacent sets of board modules 10. The heat-conducting boss 22 is disposed on the heat-conducting plate 21 located in the misaligned area, and the heat-conducting boss 22 is located on the side of the heat-conducting plate 21 away from the misaligned area, for bonding with the cold plate 1. In this way, by setting the heat-conducting structure 20 to include a heat-conducting plate 21 and a heat-conducting boss 22, the heat-conducting plate 21 can ensure effective heat dissipation for the remaining circuit board modules 10 except for the topmost one, while also ensuring that the heat-conducting plate 21 provides effective support for the remaining circuit board modules 10 except for the topmost one. Through the setting of the heat-conducting boss 22, the heat generated by the remaining circuit board modules 10 except for the topmost one can be effectively transferred to the cold plate 1.

[0043] It should be noted that in this application, the thickness of the heat-conducting plate 21 is not less than 0.8 mm; and / or, the height of the heat-conducting protrusion 22 is equal to the height of the uppermost board module 10. By reasonably optimizing the thickness range of the heat-conducting plate 21, ensuring it is not less than 0.8 mm, the heat-conducting plate 21 possesses sufficient structural strength and thermal conductivity. Furthermore, by setting the height of the heat-conducting protrusion 22 to be equal to the height of the uppermost board module 10, the lower board module 10 can exchange heat with the cold plate 1 through the heat-conducting structure 20, thereby achieving indirect heat dissipation. By first transferring the heat from the lower board module 10 to the heat-conducting structure 20, and then having the heat-conducting protrusion 22 of the heat-conducting structure 20 directly contact the cold plate 1, the thermal conductivity is significantly improved. Meanwhile, the application of thermal pads between the thermally conductive protrusion 22 and the cold plate 1, and between the thermally conductive structure 20 and the lower board module 10, effectively absorbs manufacturing tolerances, reduces contact thermal resistance, and ensures the continuity and efficiency of heat transfer. This design not only solves the heat dissipation problem of the lower board module 10 in the double-layer board module 10, but also reduces production costs and increases the vertical spatial density of server nodes through simplified structure and material selection, providing an innovative solution to the heat dissipation problem in high-density computing environments. In other embodiments not shown, the material and thickness of the thermally conductive structure 20 can be adjusted according to specific heat dissipation requirements and cost considerations to achieve the best balance between heat dissipation effect and structural strength.

[0044] It should be noted that, in one exemplary embodiment, the thickness of the heat-conducting plate 21 is 1.45 mm. This ensures that the heat-conducting structure 20 has sufficient structural strength and thermal conductivity. One side of this heat-conducting structure 20 is in close contact with the lower circuit board module 10, and the other side is provided with a heat-conducting protrusion 22 that contacts the upper cold plate 1. The height of the heat-conducting protrusion 22 is consistent with the height of the upper circuit board module 10, so that the heat generated by the lower circuit board module 10 can be effectively transferred to the upper cold plate 1 through the heat-conducting structure 20 and then carried away by the coolant. In the implementation process, in order to reduce thermal resistance and absorb the tolerance between the circuit board modules 10, thermal pads are provided between the upper and lower circuit board modules 10 and the cold plate 1 or the heat-conducting structure 20.

[0045] like Figure 2 and Figure 3 As shown, the board module 10 includes a circuit board 11 and multiple chip particles 12. The circuit board 11 is used to connect to the motherboard 2 of the server. The multiple chip particles 12 are evenly distributed on both sides of the circuit board 11 in the thickness direction. The heat-conducting plate 21 is detachably connected to the circuit boards 11 of at least one set of board modules 10 other than the topmost one. In this way, by detachably connecting the heat-conducting plate 21 to the circuit boards 11 of at least one set of board modules 10 other than the topmost one, the installation and removal of the heat-conducting plate 21 is convenient, while the connection reliability between the heat-conducting plate 21 and the lower board modules 10 is also ensured.

[0046] It should be noted that in this application, there are multiple connection points between the heat-conducting plate 21 and the board module 10, and these connection points are distributed at the circumferential edges of both the heat-conducting plate 21 and the board module 10. In this way, by having multiple connection points between the heat-conducting plate 21 and the board module 10, the reliability of the connection between the two is ensured.

[0047] It should be noted that, in this application, to enhance the connection stability between the lower circuit board module 10 and the heat-conducting structure 20, the heat-conducting plate 21 is secured to the circuit board module 10 with five screws. This ensures a stable connection between the lower circuit board module 10 and the heat-conducting structure 20, enhancing the overall structural stability and reliability. The heat-conducting structure 20 is made of a metal material with a high thermal conductivity and a thickness of not less than 0.8 mm to ensure good heat conduction performance and sufficient structural strength. One side of this structure is tightly fitted to the lower circuit board module 10, while the other side is designed with a heat-conducting boss 22 that contacts the cold plate 1. The height of the heat-conducting boss 22 is consistent with the height of the upper circuit board module 10. By installing heat-conducting pads between the lower circuit board module 10 and the heat-conducting structure 20, and between the heat-conducting boss 22 and the cold plate 1, thermal resistance can be effectively reduced and heat transfer efficiency improved. Meanwhile, to prevent the cold plate 1 from exerting pressure on the heat-conducting protrusions 22 of the lower-layer board module 10 and causing deformation, two additional screws are designed on the heat-conducting structure 20 to support the upper-layer board module 10, thereby maintaining the geometric stability of the board module 10 while ensuring heat dissipation. This combination of a double-layer stacked memory structure and indirect heat dissipation significantly improves the overall heat dissipation capacity and space utilization of the board module 10, reduces the complexity and cost of the memory liquid cooling system, and optimizes the height design of the server node, achieving high efficiency in memory heat dissipation and improved server architecture density. The locking method between the board module 10 and the heat-conducting structure 20 not only simplifies the assembly process but also enhances maintainability, making the memory liquid cooling solution more valuable in various high-density computing nodes.

[0048] like Figure 2 and Figure 4 As shown, the heat-conducting plate 21 also has supporting and limiting posts 211. The supporting and limiting posts 211 are arranged in pairs, and at least part of the outer periphery of each supporting and limiting post 211 has a limiting groove 2111. The circuit board 11 of the uppermost board module 10 has limiting notches 111 on both sides for cooperating with the limiting grooves 2111. When the heat-conducting boss 22 provides downward pressure to the board module 10 connected to it, the cooperation between the limiting notches 111 and the limiting grooves 2111 provides upward resistance to the board module 10 connected to the heat-conducting boss 22. This helps to avoid excessive pressure on the lower heat-conducting boss 22 by the cold plate 1, which could cause deformation. The upper board module 10 and the lower heat-conducting structure 20 are also designed with a pair of support and limiting posts 211. The limiting grooves 2111 on the pair of support and limiting posts 211 cooperate with the limiting notches 111 on both sides of the circuit board 11 of the uppermost board module 10, thereby providing support.

[0049] It should be noted that in this application, the support limiting post 211 is a structure in which two screws are set on the cylindrical boss.

[0050] It should be noted that in this application, the upper-layer board module 10 is supported by two screws. This design aims to enhance the overall structural stability of the board module 10, especially in the case of dual-layer stacked memory. The lower-layer board module 10 indirectly contacts the cold plate 1 for heat dissipation through the heat-conducting structure 20, while the upper-layer memory directly contacts the cold plate 1. To ensure a secure connection between the lower-layer board module 10 and the heat-conducting structure 20, five screws are used for locking. The additional two screws are used to support the upper-layer board module 10, balancing the downward pressure applied by the cold plate 1 and preventing the lower-layer heat-conducting structure 20 from deforming or being damaged due to pressure, thus ensuring unobstructed heat dissipation paths for the memory. This meticulous structural design not only effectively enhances the structural strength of the board module 10 but also maintains the efficiency of the dual-layer memory heat dissipation solution, thereby achieving optimized layout of server nodes in the height direction, improving overall architecture density, and achieving better space utilization and computing performance.

[0051] It should be noted that in the technical solution of this application, the server's heat dissipation process is as follows: First, the board module 10 is vertically inserted into the motherboard 2 through the connector 4. The upper board module 10 is directly attached to the cold plate 1, while the lower board module 10 is in close contact with one side of the heat-conducting structure 20. The heat-conducting structure 20 is designed with heat-conducting protrusions 22 of the same height as the upper board module 10, and the other side of the heat-conducting protrusions 22 is in contact with the cold plate 1. Driven by the pump, the coolant flows through the microchannels or copper tubes embedded in the aluminum substrate inside the cold plate 1, directly absorbing and exchanging heat with the upper board module 10. At the same time, the heat generated by the lower board module 10 is efficiently transferred through the heat-conducting structure 20, ultimately achieving the purpose of heat exchange with the cold plate 1. A 0.5mm thick thermal pad is installed between the cold plate 1 and the board module 10, and between the cold plate 1 and the heat-conducting protrusions 22, to reduce thermal resistance and compensate for manufacturing tolerances, ensuring the continuity and effectiveness of heat conduction. To reinforce the connection between the lower-level board module 10 and the heat-conducting structure 20, five screws are used for securing it. Simultaneously, two screws are provided on the heat-conducting structure 20 below the upper-level board module 10 to support it and prevent deformation of the heat-conducting structure 20 caused by the downward pressure applied by the cold plate 1. The tight fit between the board module 10 and the cold plate 1 or heat-conducting structure 20, along with the circulating flow of coolant, enables the efficient operation of the memory liquid cooling system. This optimizes the vertical architecture density of server nodes, reduces maintenance complexity and production costs, and meets the stringent requirements for heat dissipation efficiency and space utilization in high-density computing environments.

[0052] It should be noted that, in a specific embodiment of this application, the server node adopts a memory liquid cooling structure, wherein the memory is designed in a horizontal double-layer stacked form, with each layer of memory being 3.4mm thick, reducing the overall module thickness (excluding the cold plate 1) to 12.9mm. The board module 10 is vertically inserted into the motherboard 2 via connector 4, while the cold plate 1 is laid flat on top of the board module 10. A microchannel cold plate or an aluminum substrate with embedded copper pipes can be selected, flexibly adjusted according to heat dissipation efficiency requirements and cost considerations. The thickness of the cold plate 1 is designed to be within the range of 6mm to 10mm, allowing two layers of board modules 10 to be arranged side-by-side within a 1U space. Two board modules 10 and one cold plate 1 are configured on top of the motherboard 2, achieving efficient space utilization. To ensure effective heat dissipation of the lower-layer circuit board module 10, this embodiment introduces a thermally conductive structure 20. This structure is in close contact with the lower-layer circuit board module 10. By designing thermally conductive protrusions 22 of the same height as the upper-layer circuit board module 10, the lower-layer circuit board module 10 can also indirectly exchange heat with the cold plate 1, solving the heat dissipation problem of the lower layer in double-layer stacked memory. In addition, by installing a 0.5mm thick thermally conductive pad between the circuit board module 10 and the cold plate 1, not only are the tolerances between the circuit board modules 10 absorbed, but the contact thermal resistance is also reduced, further improving the heat dissipation efficiency. To enhance structural stability, the lower-layer circuit board module 10 and the thermally conductive structure 20 are secured with five screws. At the same time, the thermally conductive structure 20 under the upper memory module is provided with two screws for support to prevent deformation caused by the downward pressure applied by the cold plate 1. This innovative dual-layer liquid cooling solution for memory not only simplifies the complexity of the cooling system and reduces production costs, but also greatly improves the architectural density of server nodes, enabling nodes to accommodate more memory resources and computing units within a limited 1U height, thus meeting the needs of modern data centers for high-performance and high-density computing nodes.

[0053] By stacking multiple board modules 10 sequentially along a preset direction, with the topmost board module 10 being attached to the cold plate 1, the heat generated by the topmost board module 10 can be directly dissipated through the cold plate 1. Furthermore, by indirectly connecting the remaining board modules 10 (excluding the topmost one) to the cold plate 1 at least through a heat-conducting structure 20, the remaining board modules 10 can transfer heat to the cold plate 1 through the heat-conducting structure 20, thereby achieving indirect heat dissipation. The board assembly 3 provided in this application achieves heat dissipation for the remaining board modules 10 (excluding the topmost one) by setting the heat-conducting structure 20, and the heat dissipation effect is excellent. The overall structure of the board assembly 3 is relatively simple, which helps to reduce the processing and manufacturing cost of the board assembly 3, and also helps to reduce the maintenance difficulty of the board assembly 3.

[0054] In the embodiments of this application, the server's heat dissipation process is as follows: When the server starts and executes a high-load computing task, the board module 10 begins to generate heat. The upper board module 10 directly contacts the cold plate 1 located above it, and the heat is quickly conducted to the liquid circulation channel within the cold plate 1 through the thermal pads, achieving rapid heat dissipation. For the lower board module 10, heat is first transferred to the thermally conductive structure 20 through close contact. Subsequently, the thermally conductive protrusions 22 on the thermally conductive structure 20 contact the cold plate 1, continuing to conduct heat to the circulating coolant within the cold plate 1 through the thermal pads. The coolant continuously circulates under the drive of the pump, ensuring that the temperature of the cold plate 1 remains within a safe range, thereby effectively controlling the temperature of the board module 10. Throughout the process, the thickness of the thermally conductive structure 20 is not less than 0.8 mm, ensuring good structural strength, while the thickness of the thermally conductive plate 21 of the thermally conductive structure 20 is 1.45 mm, providing sufficient heat exchange area while maintaining structural stability. The memory PCB thickness is set at 2.85mm, while the thickness of the cold plate 1 is between 6mm and 10mm. This precise control of dimensions allows the server node to stack memory and cold plate 1 in a double layer within a 1U (44.5mm) space, significantly improving computing density and heat dissipation efficiency. Through this innovative heat dissipation structure design, the server node can maintain high-performance operation while reducing maintenance costs, making it suitable for high-density computing needs in various application scenarios from data centers to edge computing.

[0055] This application employs a horizontally stacked double-layer board assembly 3, where the thickness of the board module 10 is precisely positioned at 3.4mm, and the overall thickness of the board assembly (excluding the cold plate 1) is controlled at 12.9mm. The thickness of the cold plate 1 can be designed within the range of 6mm to 10mm. The motherboard 2 can accommodate two layers of board modules 10 and one layer of cold plate 1 in the vertical direction, significantly optimizing space utilization. Specifically, the upper board module 10 is in direct contact with the cold plate 1 for efficient heat dissipation, while the lower board module 10 is indirectly connected to the cold plate 1 through a thermally conductive structure 20. The minimum recommended thickness of this structure is 0.8mm to ensure good structural strength and thermal conductivity. To accommodate the tolerances of the board module 10, a 0.5mm thick thermally conductive pad is installed between the board module 10 and the cold plate 1 to reduce thermal resistance and improve heat conduction efficiency. Furthermore, each board module 10 is equipped with board modules 10 on both sides. The lower-layer chips interact with the cold plate 1 through the heat-conducting structure 20, or transfer heat to the upper layer through the memory PCB (circuit board 11), ultimately dissipating heat to the cold plate 1, achieving a comprehensive double-sided heat dissipation mechanism. To reinforce the connection between the lower-layer board module 10 and the heat-conducting structure 20, five screws are used for securing it. Simultaneously, two screws are installed on the heat-conducting structure 20 below the upper-layer board module 10 to support it and prevent deformation caused by the downward pressure applied by the cold plate 1, ensuring the stability and heat dissipation efficiency of the board module 10. This design not only improves the maintainability and cost-effectiveness of the memory liquid cooling solution but also significantly enhances the server's vertical architectural density, making it suitable for high-density memory layout requirements in AI servers, edge servers, and even portable electronic devices. The precise thickness of the board module 10 is designed to be 7.5mm, which, combined with the above structure, ensures optimal heat conduction path and heat dissipation effect.

[0056] The foregoing has provided a detailed description of a board assembly and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A board assembly, characterized in that, include: Multiple board modules (10) are stacked sequentially along a preset direction, and there is at least a partial misalignment area between two adjacent sets of board modules (10). A heat-conducting structure (20) is provided, at least a portion of which is located in the misaligned region, and the side surface of the heat-conducting structure (20) facing away from the misaligned region is used to be attached to the cold plate (1) of the electronic device. The uppermost board module (10) is attached to the cold plate (1) for direct heat dissipation through the cold plate (1). All of the board modules (10) except the top one are indirectly connected to the cold plate (1) at least through the heat-conducting structure (20) for transferring heat to the cold plate (1) through the heat-conducting structure (20).

2. The board assembly according to claim 1, characterized in that, A portion of the heat-conducting structure (20) is located between the overlapping areas of two adjacent sets of the board modules (10), and another portion of the heat-conducting structure (20) is used to be disposed between the misaligned area and the cold plate (1).

3. The board assembly according to claim 1, characterized in that, The board assembly also includes thermal pads; The thermal pad is used at least between the uppermost board module (10) and the cold plate (1); And / or, The thermal pad is used at least between the thermally conductive structure (20) and the cold plate (1); And / or, The thermal pad is used at least between each of the remaining board modules (10) except the topmost one and the thermal structure (20).

4. The board assembly according to claim 3, characterized in that, The thickness of the thermal pad ranges from 0.2mm to 1.0mm.

5. The board assembly according to claim 1, characterized in that, The thermally conductive structure (20) includes: A heat-conducting plate (21) is laid on at least one set of the board modules (10) except for the topmost one, and at least a portion of the heat-conducting plate (21) is located between two adjacent sets of board modules (10). A heat-conducting boss (22) is disposed on the heat-conducting plate (21) located in the misaligned area, and the heat-conducting boss (22) is located on the side of the heat-conducting plate (21) away from the misaligned area, so as to be fitted to the cold plate (1).

6. The board assembly according to claim 5, characterized in that, The thickness of the heat-conducting plate (21) is not less than 0.8 mm; and / or, The height of the heat-conducting boss (22) is equal to the height of the uppermost board module (10).

7. The board assembly according to claim 5, characterized in that, The board module (10) includes: Circuit board (11), the circuit board (11) being used to connect to the motherboard (2) of the electronic device; Multiple chip particles (12) are evenly distributed on both sides of the thickness direction of the circuit board (11); The heat-conducting plate (21) is detachably connected to the circuit board (11) of at least one set of the remaining board modules (10) excluding the topmost one.

8. The board assembly according to claim 7, characterized in that, The heat-conducting plate (21) and the board module (10) have multiple connection points, which are distributed at the circumferential edges of the heat-conducting plate (21) and the board module (10).

9. The board assembly according to claim 7, characterized in that, The heat-conducting plate (21) also has a support limiting post (211), the support limiting post (211) is arranged in pairs, and at least part of the outer peripheral surface of each support limiting post (211) has a limiting groove (2111). The circuit board (11) of the uppermost board module (10) has a limiting notch (111) on both sides of the edge for engaging with the limiting groove (2111). When the heat-conducting boss (22) applies downward pressure to the board module (10) connected to it, the engagement of the limiting notch (111) and the limiting groove (2111) provides upward resistance to the board module (10) connected to the heat-conducting boss (22).

10. An electronic device, characterized in that, include: Motherboard (2); The board assembly (3) includes a plurality of board modules (10), and the board assembly (3) is the board assembly according to any one of claims 1 to 9; Multiple connectors (4), each of the multiple connectors (4) corresponds one-to-one with the multiple board modules (10), and each board module (10) is connected to the motherboard (2) through its corresponding connector (4); A cold plate (1) is located on the motherboard (2) and forms a hollow area between the cold plate (1) and the motherboard (2) for placing the board assembly (3).

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