Heat dissipation circuit of edge server and edge server system

Abstract

The utility model discloses a heat dissipation circuit of an edge server and an edge server system, and relates to the technical field of servers, and the heat dissipation circuit comprises a low temperature detection circuit which is used for outputting a first level signal under the condition that the current temperature of the edge server is smaller than a first preset temperature; the heating device is started under the condition that the first level signal is received, the edge server is heated, and the stability of the equipment at the low temperature is enhanced; the high-temperature detection circuit is used for outputting a second level signal under the condition that the current temperature of the edge server is greater than a second preset temperature; the power compensation circuit comprises a thermoelectric power generation device, and the thermoelectric power generation device is used for converting heat emitted by the edge server into electric energy to supply power to the heat dissipation device when the current temperature of the edge server is higher than the second preset temperature, so that the purpose of saving energy can be achieved, and the effects of reducing cost, saving energy and improving equipment stability are achieved.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a heat dissipation circuit and an edge server system for an edge server. Background Technology

[0002] Edge servers are often deployed outdoors in harsh environments such as signal control boxes at city intersections and oil well site control boxes. These locations are characterized by limited space and poor heat dissipation. Furthermore, the development of edge computing has led to continuously increasing computing power demands, resulting in higher device power consumption and exacerbating heat dissipation issues. For example, at smart intersections, the temperature inside the signal control box housing edge devices can reach 60-70°C in summer, and as low as -5°C in colder regions. Traditional air-cooling technology has been continuously improved, employing a front-to-back airflow design with airflow guides at the front of the fan modules to direct airflow to components such as the CPU cooler, GPU, hard drive, and power supply, maintaining the internal temperature within the chassis within the range of -5 to 50°C. This increases the number of fans required, and the fans consume even more power under extreme temperatures, resulting in a larger overall power supply and higher cost. Additionally, some edge servers currently use liquid cooling, but this is even more expensive. Utility Model Content

[0003] This application provides a heat dissipation circuit and an edge server system for an edge server, which at least solves the problems of low operating efficiency of existing edge servers under low temperature conditions, high power consumption of heat dissipation devices, large power requirements for the whole machine, and high cost.

[0004] This application provides a heat dissipation circuit for an edge server, comprising: a low-temperature detection circuit for outputting a first-level signal when the current temperature of the edge server is lower than a first preset temperature; a heating device electrically connected to a first output terminal of the low-temperature detection circuit for activating upon receiving the first-level signal; a high-temperature detection circuit for outputting a second-level signal when the current temperature of the edge server is higher than a second preset temperature; a heat dissipation device; and a power compensation circuit electrically connected to the first output terminal of the high-temperature detection circuit and the heat dissipation device, wherein the power compensation circuit includes a thermoelectric generator, and the power compensation circuit is used to conduct a path between the thermoelectric generator and the heat dissipation device upon receiving the second-level signal, thereby electrically connecting the thermoelectric generator and the heat dissipation device.

[0005] This application also provides an edge server system, including: an edge server; and a heat dissipation circuit of any of the edge servers, electrically connected to the edge server, for at least heat dissipation of the edge server.

[0006] According to this application, the heat dissipation circuit of the aforementioned edge server includes: a low-temperature detection circuit, used to output a first-level signal when the current temperature of the edge server is lower than a first preset temperature; a heating device, used to turn on upon receiving the first-level signal to heat the edge server and enhance the stability of the device at low temperatures; a high-temperature detection circuit, used to output a second-level signal when the current temperature of the edge server is higher than a second preset temperature; and a power compensation circuit including a thermoelectric generator, which converts the heat dissipated by the edge server into electrical energy to power the heat dissipation device when the current temperature of the edge server is higher than the second preset temperature. This achieves energy saving, reduces costs, saves energy, and improves equipment stability, solving the problems of low operating efficiency of existing edge servers under low-temperature conditions, high power consumption of heat dissipation devices, high power requirements for the entire machine, and high cost. Attached Figure Description

[0007] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the heat dissipation circuit of the first type of edge server according to an embodiment of this application;

[0009] Figure 2 This is a schematic diagram of the heat dissipation circuit of the second type of edge server according to an embodiment of this application;

[0010] Figure 3 This is a schematic diagram of a boost circuit according to an embodiment of this application;

[0011] Figure 4 This is a schematic diagram of the heat dissipation circuit of the third type of edge server according to an embodiment of this application;

[0012] Figure 5 This is a schematic diagram of the heat dissipation circuit of the fourth type of edge server according to an embodiment of this application;

[0013] Figure 6 This is a schematic diagram of the heat dissipation circuit of the fifth type of edge server according to an embodiment of this application;

[0014] Figure 7 This is a schematic diagram of the heat dissipation circuit of the sixth type of edge server according to an embodiment of this application;

[0015] Figure 8 This is a schematic diagram of the structure of an edge server system according to an embodiment of this application.

[0016] The above figures include the following reference numerals:

[0017] 01. Edge server; 02. Edge server heat dissipation circuit; 10. Low temperature detection circuit; 11. First temperature detection circuit; 111. First comparator; 12. First signal stabilization circuit; 121. First buffer; 20. Heating device; 30. High temperature detection circuit; 31. Second temperature detection circuit; 311. Second comparator; 32. Second signal stabilization circuit; 321. Second buffer; 40. Power compensation circuit; 41. Thermoelectric generator; 42. Boost circuit; 43. Switching device; 4 4. Power supply; 45. Adder; 50. Heat sink; 51. First heat sink; 52. Second heat sink; 60. Logic control circuit; R1. First voltage divider resistor; RT1. First thermistor; R2. Second voltage divider resistor; R3. Third voltage divider resistor; R4. Fourth voltage divider resistor; RT2. Second thermistor; R5. Fifth voltage divider resistor; R6. Sixth voltage divider resistor; R7. Seventh voltage divider resistor; R8. Eighth voltage divider resistor; L. Inductor; D. Diode; Q. MOS device; C. Capacitor. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0019] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0020] For ease of description, the following explains some of the nouns or terms used in the embodiments of this application:

[0021] Negative Temperature Coefficient (NTC) thermistor.

[0022] Thermoelectric Generator Module (TEG)

[0023] Boost circuit for generating power: BOOST.

[0024] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] Embodiments of this application provide a heat dissipation circuit for an edge server, such as... Figure 1 As shown, the heat dissipation circuit of the edge server includes: a low-temperature detection circuit 10, used to output a first-level signal when the current temperature of the edge server is lower than a first preset temperature; a heating device 20, electrically connected to the first output terminal of the low-temperature detection circuit 10, used to turn on when the first-level signal is received; a high-temperature detection circuit 30, used to output a second-level signal when the current temperature of the edge server is higher than a second preset temperature; a heat dissipation device 50; and a power compensation circuit 40, electrically connected to the first output terminal of the high-temperature detection circuit 30 and the heat dissipation device 50 respectively. The power compensation circuit 40 includes a thermoelectric generator 41, and the power compensation circuit 40 is used to conduct the path between the thermoelectric generator 41 and the heat dissipation device 50 when the second-level signal is received, so that the thermoelectric generator 41 and the heat dissipation device 50 are electrically connected.

[0026] In this circuit, the temperature sensing elements (e.g., thermistors) of the low-temperature detection circuit and the high-temperature detection circuit are located inside the edge server and are used to detect the internal temperature of the edge server. The first level signal is generally a high-level signal, and the second level signal is generally a low-level signal. It should be noted that in some embodiments, the first level signal can also be a low-level signal, and the second level signal can also be a high-level signal.

[0027] Edge servers are often deployed outdoors in harsh environments such as urban intersection control boxes and oil well site control boxes. These locations are characterized by limited space and poor heat dissipation. Furthermore, the development of edge computing has led to continuously increasing computing power demands, resulting in increased device power consumption and exacerbating heat dissipation issues. For example, in smart intersections, the temperature inside the control box housing edge devices can reach 60-70°C in summer, and as low as -5°C in colder regions. Traditional air-cooling technologies have been continuously improved, employing a front-to-back airflow design with airflow guides at the front of the fan modules to direct airflow to components such as the CPU cooler, GPU, hard drive, and power supply, maintaining the internal temperature within the range of -5 to 50°C. However, this increases the number of fans required, and the fans consume more power in extreme temperatures, resulting in a larger PSU power supply and higher cost. Additionally, some edge servers currently use liquid cooling, but this is even more expensive. To reduce overall system power consumption and lower costs, the above embodiments propose an energy-saving circuit design to optimize edge server heat dissipation. By optimizing the circuit design related to heat dissipation, the power compensation circuit is activated in high-temperature weather, and the heating device is activated in low-temperature weather, so as to solve the heat dissipation problem of edge servers in the best way and achieve the purpose of cost reduction and energy saving.

[0028] Traditional air-cooling systems use multiple fans for heat dissipation, typically powered directly by the power supply unit (PSU) through a chip. The maximum power consumed by the fans is supplied by the PSU, requiring a high-power PSU and resulting in higher cost. This is especially true for edge servers, which require even higher PSU power to cope with the higher temperatures, further increasing costs. Furthermore, in extreme low-temperature weather conditions, some environmentally sensitive components, such as DDR memory, may fail at critical low temperatures.

[0029] To adapt to more extreme environments and achieve the goals of cost reduction and energy saving, the above embodiments propose an energy-saving circuit design for optimizing edge server heat dissipation. It uses a power compensation circuit to achieve energy saving, uses heating devices to enhance the stability of the equipment at low temperatures, and uses a high and low temperature detection circuit, combined with logic control, to more quickly control fan heat dissipation, thereby improving the overall stability of the equipment and achieving the effects of cost reduction and energy saving.

[0030] The specific low-temperature detection circuit monitors the internal ambient temperature of the server. When the temperature drops below a first preset temperature (e.g., -5°C), the heating element is activated. An NTC thermistor is used as a sensor; its resistance increases as the temperature decreases, thus changing the voltage in the circuit. A comparator detects this voltage change to determine whether the current temperature is below the preset value.

[0031] The heating element activates upon receiving a signal from the low-temperature detection circuit, indicating that the current temperature is below a first preset temperature. Once activated, the heating element typically raises the internal temperature of the server via a heating resistor or other heating element, preventing the low temperature from adversely affecting or damaging server hardware such as DRAM.

[0032] The high-temperature detection circuit is similar to the low-temperature detection circuit, but it monitors whether the server is overheating. When the temperature exceeds a second preset temperature (assuming it is 60-70℃), a signal is sent to the power compensation circuit. A PTC thermistor is used as the sensor, and its resistance increases with temperature, which also triggers a comparator to generate a control signal.

[0033] The power compensation circuit is based on a TEG thermoelectric generator, which can generate electricity based on temperature differences. When the high-temperature detection circuit detects that the server temperature is too high, the TEG module starts working, converting the heat dissipated by the server into electrical energy. The lower voltage generated by the TEG is boosted to a usable level, such as 12V, by the BOOST boost circuit. This power is then combined with the PSU (Power Supply Unit) power supply to power the heat dissipation devices.

[0034] By applying the technical solution of the above embodiments, the heat dissipation circuit of the edge server effectively enhances the stability of the equipment in low-temperature environments through the coordinated operation of the low-temperature detection circuit and the heating device. The low-temperature detection circuit utilizes the characteristics of an NTC thermistor; when the ambient temperature drops below a preset first low-temperature threshold, it outputs a signal to the heating device, triggering the heating process. This ensures that server components such as DDR can operate normally in environments as low as -5°C, avoiding equipment failures caused by excessively low temperatures, thereby improving the reliability of the entire system. Simultaneously, the cooperation between the high-temperature detection circuit and the power compensation circuit achieves energy-saving optimization in high-temperature environments. When the server faces high-temperature challenges, the high-temperature detection circuit monitors the temperature through a PTC thermistor. Once the temperature exceeds a second preset high-temperature threshold, the power compensation circuit activates, using a TEG thermoelectric generator to convert the waste heat generated by the server's heat dissipation into electrical energy to power the heat dissipation device. This means that under high-temperature conditions, the fan can not only be driven by the main power supply but also receive additional electrical energy converted from heat, reducing the burden on the PSU power supply, lowering overall power consumption, and improving heat dissipation efficiency, ensuring stable operation of the server even in extreme high-temperature environments. In summary, the heat dissipation circuit design of this application not only solves the heat dissipation problem of edge servers in extreme temperature environments, but also significantly reduces energy consumption and costs, thus demonstrating significant advantages in cost reduction, energy saving and improved stability, and providing a better working environment for edge computing devices.

[0035] Through the synergistic effect of the aforementioned modules, the server can operate stably over a wider temperature range, with measures in place to cope with extreme low and high temperatures. In high-temperature environments, heat energy is recovered and utilized, reducing the load on the PSU, achieving energy reuse, and lowering overall energy consumption. The adoption of more intelligent heat dissipation and heating strategies reduces the need for expensive PSUs and cooling hardware, indirectly lowering server manufacturing and maintenance costs. Heating components ensure normal operation at low temperatures, while power compensation circuitry and efficient heat dissipation strategies guarantee stable performance even at high temperatures.

[0036] In some embodiments, such as Figure 2 As shown, the power compensation circuit 40 includes: a boost circuit 42, the input terminal of which is electrically connected to the output terminal of the thermoelectric generator 41, and the boost circuit 42 is used to boost the voltage output by the thermoelectric generator 41 to the target voltage; a switching device 43, the input terminal of which is electrically connected to the output terminal of the boost circuit 42, the control terminal of which is electrically connected to the output terminal of the high temperature detection circuit 30, and the output terminal of which is electrically connected to the heat dissipation device 50, and the switching device 43 is used to turn on or off in response to the signal output by the high temperature detection circuit 30; and a power supply 44, which is electrically connected to the heat dissipation device 50.

[0037] in, Figure 3 This is a schematic diagram of a boost circuit, such as... Figure 3 As shown, the boost circuit includes an inductor L, a diode D, a MOSFET Q, and a capacitor C. It should be noted that... Figure 3 This is only one embodiment of a boost circuit; other circuits that can achieve boost functionality can also be used as boost circuits in the above embodiment.

[0038] The power compensation mechanism is mainly controlled by a high-temperature detection circuit. The high-temperature detection circuit uses a PTC thermistor, while the power compensation circuit uses a TEG thermoelectric generator. When the temperature exceeds a certain threshold, the PTC resistance increases, the voltage across the PTC increases, the comparator outputs a low level, and the switching device is turned on. Thus, in high-temperature environments, the electrical energy generated by the TEG thermoelectric generator can be used by the fan. Since the fan is typically powered by 12V, and the voltage generated by the TEG is generally low, it can be boosted to 12V using a boost circuit. This voltage can then be combined with the PSU (power supply) power supply via an adder to power the fan. When the temperature is below the set high-temperature threshold, the fan only needs the 12V from the PSU power supply. When the temperature exceeds the threshold, the fan requires a higher speed or more fans to operate. In this case, the TEG module can provide some electrical energy through the temperature difference, achieving energy saving.

[0039] In this embodiment, the power compensation circuit integrates a thermoelectric generator, a boost circuit, a switching device, and a power supply to form a highly efficient and energy-saving edge server cooling solution. The thermoelectric generator, as the core component, converts excess heat emitted by the edge server into electrical energy when the operating temperature exceeds a second preset temperature, achieving energy recovery and reuse. The boost circuit, immediately following the thermoelectric generator, is responsible for boosting the converted voltage to the target voltage, ensuring it meets the power supply requirements of the cooling device. The switching device is crucial; based on the signal output from the high-temperature detection circuit, it intelligently determines whether to supply the boosted electrical energy to the cooling device, thereby saving energy when no additional power support is needed. The power supply, as the basic power supply, is directly connected to the cooling device to ensure its normal operation. This design not only achieves energy compensation for the cooling system in high-temperature environments, reducing the burden on the PSU power supply, but also enhances the adaptability and stability of the edge server in extreme environments through intelligent control strategies, achieving the goal of cost reduction and energy saving.

[0040] Specifically, when the edge server is in a high-temperature environment, its waste heat is converted into electrical energy by thermoelectric generators. This thermoelectric effect transforms the originally dissipated heat into useful electricity, reducing dependence on external energy sources (such as PSU power supplies) and achieving effective energy recovery and reuse. The presence of a boost circuit solves the problem of the typically low output voltage of thermoelectric generators. By boosting the voltage to the target voltage, such as 12V, it ensures that the converted power meets the voltage requirements of the heat dissipation devices, thereby effectively driving cooling equipment such as fans. The switching device automatically controls whether the power generated by the thermoelectric generator is connected to the heat dissipation devices based on the signal from the high-temperature detection circuit. This means that under temperature conditions where no additional power is needed for heat dissipation, the switching device will be disconnected to avoid unnecessary power waste. When the server overheats, it will automatically turn on, making full use of the electrical energy from the thermoelectric generator to support heat dissipation, achieving intelligent energy saving. At high temperatures, the additional power provided by the power compensation circuit allows the heat dissipation devices to operate more efficiently, such as increasing fan speed or the number of fans. This helps to quickly reduce the server temperature, avoiding system performance degradation or equipment damage caused by overheating, thereby enhancing the stability and reliability of the entire server system.

[0041] In some embodiments, such as Figure 4 As shown, the heat dissipation device 50 includes at least one first heat dissipation device 51 and at least one second heat dissipation device 52. The output terminal of the switching device 43 is electrically connected to the first heat dissipation device 51, and the power supply 44 is electrically connected to the second heat dissipation device 52.

[0042] The aforementioned heat dissipation devices are generally fans. The first and second heat dissipation devices are designed as two separate systems: one suitable for temperatures below the high-temperature threshold (e.g., three fans, i.e., three first heat dissipation devices), and the other suitable for temperatures above the high-temperature threshold (e.g., two additional fans, i.e., two first heat dissipation devices). This requires initial simulation of both heat dissipation systems. The TEG module only needs to power these two fans; there is no need to use an adder to combine with the PSU power supply. In other words, the thermoelectric generator powers the three fans (first heat dissipation devices), and the power supply powers the two fans (second heat dissipation devices).

[0043] In this embodiment, the heat dissipation device is subdivided into a first heat dissipation device and a second heat dissipation device. The output terminal of the switching device is electrically connected to the first heat dissipation device, and the power supply is electrically connected to the second heat dissipation device. Multiple first and second heat dissipation devices can be used. This design achieves precise control of the internal temperature of the edge server through a flexible thermal management strategy. Under normal or low-temperature operating conditions, the second heat dissipation device receives a stable power supply through the power supply, ensuring that basic heat dissipation needs are met. In high-temperature environments, the first heat dissipation device is connected to the power compensation circuit through the switching device, enabling it to utilize the electrical energy generated by the TEG thermoelectric generator to improve heat dissipation efficiency, reduce the burden on the main power supply, and achieve energy-saving effects. Furthermore, the introduction of a high and low temperature detection circuit allows the heat dissipation system to respond quickly to real-time temperature changes and automatically adjust the operating state of the heat dissipation device, thereby effectively reducing energy consumption and improving the overall system stability and economy while ensuring equipment performance. In other embodiments, the number and layout of the first and second heat dissipation devices can be adjusted according to specific heat dissipation requirements and ambient temperature changes to optimize heat dissipation effect and energy consumption control, achieving wider environmental adaptability and higher heat dissipation efficiency.

[0044] The first heatsink can receive additional power from the power compensation circuit (via boost and switching devices) at high temperatures. This means that under overheating conditions, the first heatsink can receive extra power support, increasing the efficiency or number of heatsinks (such as fans), responding quickly to high temperatures, and ensuring stable server operation. The second heatsink is directly powered by the power supply and is suitable for heat dissipation needs at normal and lower temperatures. This design allows the system to select the most economical heat dissipation scheme in different temperature ranges, avoiding the waste of activating full heat dissipation capacity under mild or low-temperature conditions. Distributing heat dissipation functions among two heatsinks improves system redundancy. Even if one heatsink fails or its efficiency decreases, the other heatsink can continue to provide the necessary heat dissipation function, ensuring that the server hardware does not overheat due to a single point of failure. By intelligently allocating heat dissipation tasks, the system can use only the lower-cost second heatsink at lower temperatures, while reserving the complex (higher-cost) thermoelectric conversion and boost circuitry for high-temperature conditions, thereby controlling the overall manufacturing cost and operating energy consumption of the equipment. The design of different controlled heatsinks simplifies the maintenance process. When a part needs repair or replacement, it can be handled separately without affecting the operation of other parts, reducing maintenance time and costs.

[0045] In some embodiments, such as Figure 5 As shown, the power compensation circuit 40 also includes an adder 45, wherein the switching device 43 and the power supply 44 are both electrically connected to the heat dissipation device 50 through the adder 45, the first end of the adder 45 is electrically connected to the output end of the switching device 43, the second end of the adder 45 is electrically connected to the power supply 44, and the output end of the adder 45 is electrically connected to the heat dissipation device 50.

[0046] In this embodiment, the power compensation circuit further includes an adder, which plays a crucial role in integrating the output of the switching device and the power supply. Specifically, the first end of the adder is closely connected to the output of the switching device, the second end is directly connected to the power supply, and its output is electrically connected to the heat dissipation device. This design allows the additional electrical energy generated by the TEG module under high-temperature conditions to be combined with the energy provided by the PSU power supply via the adder after adjustment by the switching device, and then supplied to the heat dissipation device, such as a fan, to enhance the heat dissipation effect. When the temperature does not reach the high-temperature threshold, the PSU power supply independently undertakes the task of powering the fan; once the temperature rises above the set threshold, the electrical energy generated by the TEG module using the temperature difference is channeled through this adder channel to work in conjunction with the PSU power supply to provide the power required for heat dissipation, effectively reducing the overall system's power demand on the PSU power supply, achieving energy-saving goals, and also optimizing the heat dissipation performance and equipment stability of the edge server in extreme environments.

[0047] As an energy integration point, the adder combines the power generated by the thermoelectric generator from the switching devices with the stable power supplied by the mains power supply. This means that the heat dissipation devices receive optimized power supply under both normal and high-temperature conditions, ensuring effective heat dissipation while avoiding energy waste. The power output of the thermoelectric generator may fluctuate with changes in temperature. By combining with a stable power supply, the adder helps smooth out these fluctuations, providing a more stable power supply environment for the heat dissipation devices, which is crucial for improving their lifespan and reliability. In high-temperature environments, the adder can intelligently utilize the additional power from the thermoelectric generator, reducing reliance on the mains power supply. This not only saves energy but also reduces the load on the PSU power supply to some extent, extending its lifespan. By integrating power from different sources, the adder ensures that the heat dissipation devices operate at maximum efficiency under any conditions. Especially in high-temperature environments, this efficient energy integration and management mechanism can quickly respond to the server's heat dissipation needs and prevent overheating.

[0048] In some embodiments, such as Figure 4 and Figure 5 As shown, the switching device 43 is turned on when it receives the second level signal output by the high temperature detection circuit 30, so that the thermoelectric generator 41 is electrically connected to the heat dissipation device 50, so that the electrical energy converted by the thermoelectric generator 41 is transmitted to the heat dissipation device 50 to power the heat dissipation device 50. The switching device 43 is turned off when it receives the first level signal output by the high temperature detection circuit 30, wherein the high temperature detection circuit 30 outputs the first level signal when the current temperature of the edge server is less than or equal to the second preset temperature.

[0049] When the temperature is below the second preset value, only the PSU power supply is used, and no additional energy consumption is required; while at high temperatures, the electrical energy generated by the TEG is utilized to reduce the burden on the PSU, thereby saving energy.

[0050] In this embodiment, the switching device is turned on when the high-temperature detection circuit outputs a second-level signal, allowing the electrical energy generated by the thermoelectric generator (TEG) to be transferred to the heat dissipation device to power it. Specifically, when the current temperature of the edge server is higher than a second preset temperature, the high-temperature detection circuit RT2 outputs a second-level signal, triggering the switching device SWITCH to turn on. At this time, the electrical energy generated by the TEG is boosted to the P12V voltage level by the BOOST boost circuit and combined with the PSU power supply to power the cooling fan, enhancing heat dissipation efficiency. When the current temperature is not higher than the second preset temperature, the high-temperature detection circuit outputs a first-level signal, controlling the switching device to turn off. The electrical energy generated by the TEG is no longer transferred to the heat dissipation device, and the heat dissipation device (e.g., the fan) is powered only by the PSU power supply to maintain normal operation. This design can intelligently adjust the working state of the heat dissipation system according to the ambient temperature, effectively balancing heat dissipation efficiency and energy consumption, significantly improving the heat dissipation performance and energy management capabilities of the edge server in high-temperature environments. Especially under extreme temperature conditions, it helps maintain the temperature stability of the internal components of the server, extends the service life of the equipment, and reduces unnecessary energy waste, achieving the goal of energy conservation and emission reduction.

[0051] When the server temperature exceeds a second preset temperature (i.e., overheating), the switching device automatically turns on upon receiving a second-level signal (representing a high-temperature state), allowing the waste heat energy converted by the thermoelectric generator to be transferred to the heat dissipation device. This reuses previously wasted heat energy, reducing the power supply pressure on the main power supply unit (PSU), thereby lowering overall energy consumption and improving energy efficiency. The high-temperature detection circuit monitors the server temperature in real time. Once it detects an excessively high temperature, it immediately sends a first-level signal to the switching device, causing it to turn on and quickly respond to heat dissipation needs. Under normal or low-temperature conditions, the high-temperature detection circuit outputs a first-level signal (representing that the temperature has not reached the overheating threshold), and the switching device turns off, avoiding unnecessary energy conversion and transfer, achieving precise heat dissipation control. Through the control of the switching device, the heat dissipation device can receive additional power support when overheating, rapidly accelerating the operation of fans or other cooling equipment, effectively reducing server temperature and preventing hardware failures or performance degradation caused by overheating. This design ensures that the heat dissipation devices receive adequate power under any temperature conditions, preventing both overcooling and undercooling, thus maintaining the server within an ideal temperature range and enhancing the overall stability and durability of the system. Reducing the load on the main power supply helps extend its lifespan, decreases the frequency of PSU replacement, and consequently reduces maintenance costs. Simultaneously, intelligent temperature control allows the heat dissipation devices to operate under suitable conditions, extending their lifespan and reducing maintenance and replacement costs. By automatically switching the state of the switching devices, the system can flexibly respond to rapid changes in ambient temperature, quickly adjusting its cooling strategy whether it's a sudden rise in temperature or a gradual drop in temperature, ensuring that server performance is unaffected by temperature fluctuations.

[0052] In some embodiments, such as Figure 6 As shown, the heat dissipation circuit further includes: a logic control circuit 60, the first input terminal of which is electrically connected to the output terminal of the low temperature detection circuit 10, the second input terminal of which is electrically connected to the output terminal of the high temperature detection circuit 30, and the output terminal of which is electrically connected to the heat dissipation device 50. The logic control circuit 60 is used to output a first control signal when it receives a first-level signal from both the low temperature detection circuit 10 and the high temperature detection circuit 30; to output a second control signal when the low temperature detection circuit 10 outputs a second-level signal and the high temperature detection circuit 30 outputs a first-level signal; and to output a third control signal when both the low temperature detection circuit 10 and the high temperature detection circuit 30 output a second-level signal. The first control signal is used to control the heat dissipation device 50 to turn off, the second control signal is used to control the heat dissipation device 50 to operate at a first power, and the third control signal is used to control the heat dissipation device 50 to operate at a second power, wherein the first power is less than the second power.

[0053] The aforementioned logic control circuit employs a CPLD chip architecture. In some embodiments, the programmable interconnect array (PIA) is located at the center of the chip, while the logic array blocks are positioned around the chip near the I / O modules. The CPLD includes electrically connected programmable AND arrays, programmable OR arrays, and macrocells. The programmable AND array and programmable OR array constitute the programmable interconnect array (PIA). Variations in the CPLD's logic design lie in the changes to the wiring connections within the programmable logic array (PLA). The most crucial components of the macrocell are the programmable registers and the clock / enable selection. Specifically, the level signals output from the low-temperature detection circuit and the high-temperature detection circuit are input to the programmable interconnect array in the logic control circuit. Based on the logic gates within the programmable interconnect array, the control signals for the heat dissipation device are ultimately output. Specifically, this includes: when both the low-temperature detection circuit and the high-temperature detection circuit output a first level signal (i.e., high level), outputting a first control signal to control the heat dissipation device to shut down; when the low-temperature detection circuit outputs a second level signal (i.e., low level) and both the high-temperature detection circuit outputs a first level signal (i.e., high level), outputting a second control signal to control the heat dissipation device to operate at a first power; and when the low-temperature detection circuit outputs a second level signal (i.e., low level) and both the high-temperature detection circuit outputs a second level signal (i.e., low level), outputting a second control signal to control the heat dissipation device to operate at a second power.

[0054] In this embodiment, the edge server's heat dissipation circuit design further integrates a logic control circuit. Its first input terminal is connected to the output terminal of the low-temperature detection circuit, its second input terminal is connected to the output terminal of the high-temperature detection circuit, and its output terminal is electrically connected to the heat dissipation device. The logic control circuit plays a core role, intelligently adjusting the operating mode of the heat dissipation device based on the signal states provided by the low-temperature and high-temperature detection circuits. Specifically, when the detected temperature is below a first preset temperature, the low-temperature detection circuit outputs a first-level signal. Simultaneously, if the high-temperature detection circuit provides a second-level signal indicating a safe temperature, the logic control circuit will correspondingly shut down the heat dissipation device to save power. Conversely, if the low-temperature detection circuit confirms the temperature is safe and outputs a second-level signal, and the high-temperature detection circuit detects a temperature exceeding a second preset temperature and outputs a first-level signal, the logic control circuit will drive the heat dissipation device to operate at a higher second-level power to ensure efficient heat dissipation. When the temperature is between the two thresholds, the heat dissipation device will maintain basic heat dissipation requirements at a lower first-level power. This multi-level heat dissipation control strategy based on temperature thresholds not only precisely matches the operating state of the heat dissipation system with the actual ambient temperature, but also significantly improves the system's energy efficiency and overall stability, demonstrating superior performance, especially under the variable environmental conditions faced by edge servers. By dynamically adjusting the operating power of the heat dissipation devices, it ensures the normal operation of the equipment at high temperatures while effectively preventing the risk of performance degradation or failure of electronic components in low-temperature environments. This achieves stable operation of the equipment under extreme climatic conditions, while reducing unnecessary energy consumption, aligning with the design concept of green energy saving.

[0055] The logic control circuit intelligently determines the server's current temperature range based on signals from the low-temperature and high-temperature detection circuits, and accordingly performs precise control of the heat dissipation devices. This dual-threshold control strategy ensures that the cooling system's response closely matches the server's actual temperature requirements, avoiding overcooling or undercooling. By intelligently controlling the different operating states of the heat dissipation devices (off, operating at first power, operating at second power), the system can minimize energy consumption while meeting cooling requirements. For example, when the temperature is below the first preset temperature, the heat dissipation devices are turned off, which further saves energy; when the temperature is normal or slightly higher, they operate at a lower first power, only increasing to the second power when the temperature is significantly too high. This tiered control significantly reduces energy consumption and improves energy efficiency. Under low-temperature conditions, the logic control circuit controls the heat dissipation devices to be turned off, avoiding unnecessary power consumption and reducing reliance on heating devices, thereby saving energy and improving system stability. When the temperature reaches or exceeds the second preset temperature, the power of the heat dissipation devices is rapidly increased, effectively preventing server overheating, protecting sensitive hardware from high-temperature damage, and enhancing equipment reliability and durability. Based on real-time temperature signals, the logic control circuit can quickly respond to temperature fluctuations. Whether it's a change from low to normal temperature or a transition from normal to high temperature, it can adjust the operating status of the heat dissipation devices in a timely manner, ensuring stable server operation under various temperature conditions. Through intelligent control of the heat dissipation device's operating status, the system can achieve optimal energy consumption under different temperature conditions. This reduces unnecessary power consumption, lowers server operating costs, and also reduces the frequency of hardware maintenance and replacement, resulting in high economic value in the long run. This intelligent control strategy enables the server to adapt to a wider range of temperature environments. Whether at low or high temperatures, the system can achieve optimal heat dissipation through the adjustment of the logic control circuit, enhancing the environmental adaptability and deployment flexibility of edge servers.

[0056] In some embodiments, such as Figure 7As shown, the low-temperature detection circuit 10 includes: a first temperature detection circuit 11, the first terminal of which is used to receive a first voltage, and the second terminal of which is grounded; a first signal stabilization circuit 12, the input terminal of which is electrically connected to the output terminal of which is used to stabilize the signal output by ...

[0057] In this embodiment, the low-temperature detection circuit includes a first temperature detection circuit, whose first terminal receives a first voltage and its second terminal is grounded, for sensing changes in ambient temperature; and a first signal stabilization circuit, whose input terminal is connected to the output terminal of the first temperature detection circuit, designed to stabilize the temperature signal, and whose output terminal is connected to the heating device and the logic control circuit. In this design, when the ambient temperature drops to a preset low-temperature threshold, such as below -5°C, the first temperature detection circuit responds to the temperature drop, triggering the first signal stabilization circuit to output a control signal, directly activating the heating device and issuing instructions to the logic control circuit to adjust the heat dissipation strategy in real time, preventing performance instability or failure of critical components such as DDR due to low temperatures. Similarly, the high-temperature detection circuit is also composed of a second temperature detection circuit and a second signal stabilization circuit, with similar working principles, but triggered when the temperature rises to a specific threshold. By controlling the power compensation circuit and the logic control circuit, it automatically increases heat dissipation efficiency, ensuring that the server can operate normally even in high-temperature environments. This dynamic adjustment mechanism not only improves the environmental adaptability of the edge server but also supports fan operation through the additional power generated by the TEG module, effectively reducing the burden on the PSU power supply and achieving the system's energy-saving goal. Simultaneously, it enhances the stability and reliability of the equipment under extreme temperature conditions, demonstrating the practical value of the design.

[0058] The first and second temperature detection circuits are used to detect the low-temperature and high-temperature states of the edge server, respectively. By connecting the first terminal of the detection unit to a first voltage source (such as the output of a power supply) and grounding the second terminal, a stable reference voltage can be formed, which helps improve the accuracy and stability of temperature detection. The first and second signal stabilization circuits stabilize the signal output by the temperature detection unit, reducing signal fluctuations caused by environmental changes, electromagnetic interference, and other factors. This ensures that the heating device and logic control circuit receive accurate control signals, improving the accuracy and timeliness of the system response. The presence of the signal stabilization unit not only effectively filters noise but also avoids malfunctions or loss of control due to signal instability, thereby enhancing system reliability. For example, in a low-temperature environment, the logic control circuit can accurately identify the low-temperature signal output by the first signal stabilization circuit and promptly activate the heating device to prevent overcooling; conversely, in a high-temperature environment, the second signal stabilization circuit ensures that the high-temperature signal is accurately captured, triggering the intervention of the power compensation circuit to enhance heat dissipation and prevent overheating.

[0059] In some embodiments, such as Figure 7As shown, the first temperature detection circuit 11 includes: a first voltage divider resistor R1, the first end of which is used to receive a first voltage; a first thermistor RT1, the first end of which is electrically connected to the second end of the first voltage divider resistor R1, and the second end of the first thermistor RT1 is grounded, wherein the lower the current temperature of the edge server, the greater the impedance of the first thermistor RT1; a second voltage divider resistor R2, the first end of which is used to input the first voltage; a third voltage divider resistor R3, the first end of which is electrically connected to the second end of the second voltage divider resistor R2, and the second end of the third voltage divider resistor R3 is grounded; a first comparator 111, the first input terminal of which is electrically connected to the first end of the first thermistor RT1 and the second end of the first voltage divider resistor R1, the second input terminal of which is electrically connected to the second end of the second voltage divider resistor R2 and the first end of the third voltage divider resistor R3, and the output terminal of the first comparator 111 is electrically connected to the input terminal of the first signal stabilization circuit 12; And / or, the second temperature detection circuit 31 includes: a fourth voltage divider resistor R4, the first end of which is used to input a first voltage; a second thermistor RT2, the first end of which is electrically connected to the second end of the fourth voltage divider resistor R4, and the second end of the second thermistor RT2 is grounded, wherein the higher the current temperature of the edge server, the greater the impedance of the second thermistor RT2; a fifth voltage divider resistor R5, the first end of which is used to input the first voltage; a sixth voltage divider resistor R6, the first end of which is electrically connected to the second end of the fifth voltage divider resistor R5, and the second end of the sixth voltage divider resistor R6 is grounded; a second comparator 311, the first input terminal of which is electrically connected to the first end of the second thermistor RT2 and the second end of the fourth voltage divider resistor R4, the second input terminal of which is electrically connected to the second end of the fifth voltage divider resistor R5 and the first end of the sixth voltage divider resistor R6, and the output terminal of the second comparator 311 is electrically connected to the input terminal of the second signal stabilization circuit 32.

[0060] in, Figure 7 P3V3 indicates a 3.3V voltage. Both the first and second thermistors are located inside the edge server and are used to detect the internal temperature of the edge server.

[0061] In this embodiment, the first temperature detection circuit and the second temperature detection circuit constitute a key part of the intelligent temperature regulation system of the edge server. The first temperature detection circuit monitors low temperatures using a first thermistor RT1. RT1, along with a first voltage divider resistor and a second voltage divider resistor, forms a voltage divider circuit. When the server's ambient temperature is below a set threshold, the impedance of RT1 increases, causing the voltage at the first input terminal of the comparator to rise, exceeding the reference voltage at its second input terminal. This causes the first comparator to output a high-level signal to the first signal stabilization circuit. Similarly, the second temperature detection circuit uses a second thermistor RT2 to respond to high temperatures. When the server's ambient temperature rises, the impedance of RT2 decreases, the voltage at the second input terminal of the comparator drops, and the voltage at the first input terminal rises in comparison. The second comparator then outputs a low-level signal to the second signal stabilization circuit. These two sets of detection units accurately reflect the temperature environment of the server through the signals output by the comparators, thereby triggering corresponding heating or power compensation mechanisms to ensure stable operation of the equipment under extreme temperature conditions and achieve efficient energy utilization. The first and second signal stabilization circuits stabilize the comparator output signal through latching or buffering, preventing control signal instability caused by temperature fluctuations. This ensures reliable startup and shutdown of the heating device and power compensation circuit, effectively improving system stability and efficiency. This thermistor-based temperature detection scheme, combined with logic control and energy compensation, significantly enhances the edge server's adaptability and energy efficiency in complex environments.

[0062] By employing a combination of voltage divider resistors (R1, R2, R4, R5) and thermistors (RT1, RT2), the first and second temperature detection circuits can accurately sense temperature changes in the environment where the edge server is located. The impedance characteristics of the thermistors change with temperature; this design allows the temperature detection signal to be directly converted into a voltage signal that can be recognized by the comparator, effectively realizing the conversion from temperature to electrical signal. Through the first and second comparators, the system can compare the actual detected temperature signal based on a preset reference voltage (provided by the voltage divider of R2 and R3, R5 and R6). This allows the system to accurately determine whether the current temperature is lower than the first preset temperature (low temperature) or higher than the second preset temperature (high temperature), and trigger corresponding heating or power compensation operations accordingly, improving the accuracy of the system response. The addition of the first and second signal stabilization circuits further stabilizes the signal and reduces noise interference during the conversion of the temperature signal into a control signal. This ensures that the control signals received by the heating device and power compensation circuit are accurate, avoiding misoperation and control instability, and improving the overall reliability and stability of the system. Through intelligent judgment by comparators and signal stabilization units, the logic control circuit can intelligently control the operating status of heating devices and power compensation circuits based on accurate temperature information. When the temperature is lower than the first preset temperature, the heating function is quickly activated; when the temperature is higher than the second preset temperature, power compensation is promptly activated. By optimizing energy utilization through intelligent strategies, the goal of cost reduction and energy saving is achieved.

[0063] In some embodiments, such as Figure 7 As shown, the first signal stabilization circuit 12 includes: a first buffer 121, the input terminal of which is electrically connected to the output terminal of the first temperature detection circuit 11, and the output terminal of which is electrically connected to the heating device 20 and the logic control circuit 60 respectively; a seventh voltage divider resistor R7, the first terminal of which is used to input a first voltage, and the second terminal of which is electrically connected to the output terminal of the first buffer 121; and / or, the second signal stabilization circuit 32 includes: a second buffer 321, the input terminal of which is electrically connected to the output terminal of the second temperature detection circuit 31, and the output terminal of which is electrically connected to the power compensation circuit 40 and the logic control circuit 60 respectively; an eighth voltage divider resistor R8, the first terminal of which is used to input a first voltage, and the second terminal of which is electrically connected to the output terminal of the second buffer 321.

[0064] In this embodiment, the first signal stabilization circuit includes a first buffer and a seventh voltage divider resistor, while the second signal stabilization circuit consists of a second buffer and an eighth voltage divider resistor. The input terminal of the first buffer is connected to the output terminal of the first temperature detection circuit, and its output terminal is connected to the heating device and the logic control circuit, respectively. The first terminal of the seventh voltage divider resistor is used to receive the first voltage, and the second terminal is connected to the output terminal of the first buffer. Similarly, the input terminal of the second buffer is connected to the output terminal of the second temperature detection circuit, and its output terminal is also connected to the power compensation circuit and the logic control circuit, respectively. The first terminal of the eighth voltage divider resistor is used to receive the first voltage, and the second terminal is connected to the output terminal of the second buffer. This design ensures stable transmission of high and low temperature detection signals, avoids signal attenuation or distortion during transmission, and, through the setting of the voltage divider resistors, can precisely control the operating state of the heating device and the power compensation circuit, achieving effective management of heat dissipation and power consumption of the edge server. In practical applications, when the ambient temperature is below a set critical value, the heating device activates, raising the surrounding temperature by heating loads such as heating resistors, ensuring the normal operation of low-temperature sensitive components such as DDR. When the ambient temperature exceeds a set high-temperature threshold, the power compensation circuit activates, using the electrical energy generated by the TEG module to boost to the standard voltage via the BOOST boost circuit, merging with the PSU power supply to supplement the fan with additional power, enhancing heat dissipation efficiency. This ensures server stability and achieves efficient energy utilization even under extreme temperature conditions. This progressive control strategy not only responds quickly to temperature changes but also adjusts the heat dissipation strategy according to actual conditions, significantly improving the adaptability and energy efficiency of the equipment.

[0065] The introduction of the first and second buffers effectively isolates the temperature detection unit from subsequent circuits (such as heating devices, power compensation circuits, and logic control circuits). This isolation reduces signal attenuation and distortion during transmission, ensuring signal integrity and stability, and improving the overall reliability and accuracy of the system. Through the combination of the seventh and eighth voltage-dividing resistors R7 and R8 with the buffers, the system can adjust the signal level output by the temperature detection unit to a range suitable for the operation of the heating devices and power compensation circuits. This is because some circuit modules may require specific input levels to function properly; adjusting the signal level through the voltage-dividing resistors ensures that subsequent circuits receive control signals of appropriate strength, achieving efficient and stable control. Before the temperature detection signal is transmitted to the heating devices and power compensation circuits, the signal is first amplified by the buffers and then level-matched via the voltage-dividing resistors. This design makes the signal transmission process smoother and the control response faster. This means that the system can immediately activate or adjust heating or cooling measures the moment a temperature change is detected, improving the timeliness and effectiveness of temperature control. The optimized design of the signal stabilization unit reduces energy loss during signal transmission, lowers the overall power consumption of the circuit, and helps save energy. Meanwhile, because the signal is protected and optimized during transmission, the impact on subsequent circuits is reduced, which helps extend the service life of circuit modules and lowers equipment maintenance costs. The buffer has excellent signal amplification and reconstruction capabilities, filtering out noise and interference during signal transmission to ensure that the logic control circuit receives a clean control signal, thus improving the system's anti-interference capability and control accuracy.

[0066] In some embodiments, such as Figure 7 As shown, the low-temperature detection circuit uses an NTC thermistor (RT1). The characteristic of an NTC is that its impedance increases as the temperature decreases. This circuit mainly compares the voltage on the NTC with a standard voltage using a comparator to obtain a control signal, which controls the switching on and off of the heating element. This example uses the heating element of a DDR circuit. The critical low-temperature detection is set to -5℃, and VCC is the initial voltage of the device, P3V3_STBY (3.3V), which is generated by P12V (12V) upon power-on. R1 = R2 = 10kΩ. Based on the characteristics of the NTC thermistor:

[0067]

[0068] Where R = 10kΩ, B = 3380kΩ; T2 = absolute temperature 273.15 + room temperature 25 = 298.15; if it is necessary to detect below -5℃, then T1 = 273.15 - 5 = 268.15; thus, at -5℃, RT1 is calculated to be 35.5K according to the above formula. Thus, in this circuit, R3 = 35.5K. When the temperature is below -5℃, the resistance of RT1 increases, the voltage of the comparator positive terminal NTC_SENSE increases, and the signal LOW_TEMP output by the first comparator 111 is H. When the temperature is above -5℃, similarly, LOW_TEMP = L. In order to stably identify the high and low level changes, a first buffer is used after the comparator. The control signal LOW_TEMP_DETECT output by the first buffer controls the switching on and off of the heating device. For example, heating devices can use electronic fuse protection switches, and the enable of the switch can be controlled by LOW_TEMP_DETECT, which in turn controls the power supply of the heating load, such as the heating resistor, to achieve the heating effect, thereby raising the temperature around the DDR and enabling it to operate stably in the subsequent low-temperature environment, thus improving the stability of the equipment.

[0069] The high-temperature compensation module mainly consists of a high-temperature detection circuit controlling a power compensation circuit. For example... Figure 7 As shown, the high-temperature detection circuit is implemented using a PTC thermistor, and the power compensation circuit is implemented using a TEG thermoelectric generator. The principle of the PTC is the opposite of that of the NTC. When the temperature is higher than a certain threshold, the resistance of the PTC increases, the PTC_SENSE voltage increases, and the HIGH_TEMP signal output by the first comparator goes low, causing the switching device to turn on. Thus, in a high-temperature environment, the electrical energy generated by the TEG can be used by the fan by utilizing the temperature difference. The fan is generally powered by 12V, and the voltage generated by the TEG is generally small, so it can be boosted to P12V through a boost circuit. This voltage can then be combined with the power supply of the PSU through an adder to power the fan. When the temperature is below the set high-temperature threshold, the fan only needs to use the 12V of the PSU. When the temperature is higher than the threshold, the fan needs to rotate at a higher speed or more fans need to work. At this time, the TEG module can provide some electrical energy through the temperature difference, achieving the purpose of energy saving.

[0070] The logic-controlled heat dissipation device mainly uses a CPLD to control the fan speed. Compared with conventional fan control, this module adds a high and low temperature detection and fast control module. When the low temperature threshold is reached, i.e., the control signal LOW_TEMP_DETECT=H output by the first buffer, the fan power supply is directly cut off; when the high temperature threshold is reached, i.e., the control signal HIGH_TEMP_DETECT=L output by the second buffer, the fan is directly turned on at full speed.

[0071] The above embodiments utilize power compensation circuits to achieve energy savings, heating devices to enhance equipment stability at low temperatures, and high / low temperature detection circuits, combined with logic control, to more quickly control fan cooling, thereby improving overall equipment stability and achieving cost reduction and energy saving. This approach can be applied to more extreme environments, using heating devices to enhance equipment stability at low temperatures and achieving cost reduction and energy saving, while the power compensation circuit achieves energy savings, thus improving equipment stability.

[0072] Embodiments of this application also provide an edge server system, such as Figure 8 As shown, it includes: an edge server 01; and a heat dissipation circuit 02 for any edge server, electrically connected to the edge server 01, for at least heat dissipation of the edge server 01.

[0073] This application provides a heat dissipation circuit design for an edge server, which monitors the server's operating environment temperature in real time through an integrated high and low temperature detection circuit. When the detected temperature is below a preset low temperature threshold, heating devices are activated to raise the local temperature of critical components such as DDR memory, ensuring stable operation under low temperature conditions and enhancing the server's reliability in harsh low-temperature environments. Conversely, when the server is in a high-temperature environment, the high-temperature detection circuit triggers a power compensation mechanism, using a TEG thermoelectric generator to convert heat into electrical energy. This energy, after being processed by a BOOST boost circuit, is used to assist or fully drive the cooling fan, reducing dependence on the PSU power supply and thus lowering the overall system power consumption, achieving energy conservation and emission reduction goals. This intelligent heat dissipation management strategy not only improves the server's adaptability to extreme temperatures but also effectively reduces operating costs, providing a more efficient and economical heat dissipation solution for edge computing devices. In short, the technical solution of this application significantly improves the operating efficiency and stability of edge servers under different temperature conditions through intelligently controlled heating and power compensation circuits, while simultaneously achieving effective energy conservation.

[0074] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0075] The above provides a detailed description of the heat dissipation circuit and edge server system for an edge server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only intended to help understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation circuit for an edge server, characterized in that, include: A low-temperature detection circuit is used to output a first-level signal when the current temperature of the edge server is lower than a first preset temperature. A heating device is electrically connected to the first output terminal of the low-temperature detection circuit and is used to turn on when the first level signal is received. A high-temperature detection circuit is used to output a second-level signal when the current temperature of the edge server is greater than a second preset temperature; Heat dissipation devices; A power compensation circuit is electrically connected to the first output terminal of the high temperature detection circuit and the heat dissipation device, respectively. The power compensation circuit includes a thermoelectric generator. When the second level signal is received, the power compensation circuit is used to open the path between the thermoelectric generator and the heat dissipation device, so that the thermoelectric generator and the heat dissipation device are electrically connected.

2. The heat dissipation circuit of the edge server according to claim 1, characterized in that, The power compensation circuit also includes: A boost circuit, wherein the input terminal of the boost circuit is electrically connected to the output terminal of the thermoelectric generator, and the boost circuit is used to increase the voltage output by the thermoelectric generator to the target voltage; A switching device, wherein the input terminal of the switching device is electrically connected to the output terminal of the boost circuit, the control terminal of the switching device is electrically connected to the output terminal of the high temperature detection circuit, and the output terminal of the switching device is electrically connected to the heat dissipation device, and the switching device is used to turn on or off in response to the signal output by the high temperature detection circuit; A power supply, which is electrically connected to the heat dissipation device.

3. The heat dissipation circuit of the edge server according to claim 2, characterized in that, The heat dissipation device includes at least one first heat dissipation device and at least one second heat dissipation device. The output terminal of the switching device is electrically connected to the first heat dissipation device, and the power supply is electrically connected to the second heat dissipation device.

4. The heat dissipation circuit of the edge server according to claim 2, characterized in that, The power compensation circuit also includes: An adder, wherein the switching device and the power supply are both electrically connected to the heat dissipation device through the adder, the first end of the adder is electrically connected to the output end of the switching device, the second end of the adder is electrically connected to the power supply, and the output end of the adder is electrically connected to the heat dissipation device.

5. The heat dissipation circuit of the edge server according to claim 2, characterized in that, The switching device is configured to turn on upon receiving the second level signal output by the high-temperature detection circuit, so as to electrically connect the thermoelectric generator and the heat dissipation device. The switching device is configured to turn off upon receiving the first level signal output by the high-temperature detection circuit, wherein the high-temperature detection circuit outputs the first level signal when the current temperature of the edge server is less than or equal to the second preset temperature.

6. The heat dissipation circuit of the edge server according to claim 1, characterized in that, The heat dissipation circuit also includes: A logic control circuit is provided, wherein a first input terminal of the logic control circuit is electrically connected to the output terminal of the low-temperature detection circuit, a second input terminal of the logic control circuit is electrically connected to the output terminal of the high-temperature detection circuit, and an output terminal of the logic control circuit is electrically connected to the heat dissipation device. The logic control circuit is configured to output a first control signal when it receives a first-level signal from both the low-temperature and high-temperature detection circuits; output a second control signal when both the low-temperature and high-temperature detection circuits output a second-level signal; and output a third control signal when both the low-temperature and high-temperature detection circuits output a second-level signal. The first control signal controls the heat dissipation device to shut down, the second control signal controls the heat dissipation device to operate at a first power, and the third control signal controls the heat dissipation device to operate at a second power, wherein the first power is less than the second power.

7. The heat dissipation circuit of the edge server according to claim 6, characterized in that, The low-temperature detection circuit includes: a first temperature detection circuit, a first terminal of which is used to receive a first voltage, and a second terminal of which is grounded; and a first signal stabilization circuit, the input terminal of which is electrically connected to the output terminal of which is used to stabilize the signal output by which is used to stabilize the signal output by which is used to stabilize the signal output by which is used to stabilize the signal output by which is used to stabilize the signal output by which is used to stabilize the heating device and the logic control circuit, respectively. And / or, The high-temperature detection circuit includes: The second temperature detection circuit has a first terminal for receiving a first voltage and a second terminal for grounding. The second signal stabilization circuit has its input terminal electrically connected to the output terminal of the second temperature detection circuit. The second signal stabilization circuit is used to stabilize the signal output by the second temperature detection circuit. The output terminal of the second signal stabilization circuit is electrically connected to the power compensation circuit and the logic control circuit, respectively.

8. The heat dissipation circuit of the edge server according to claim 7, characterized in that, The first temperature detection circuit includes: a first voltage divider resistor, the first end of which is used to receive the first voltage; a first thermistor, the first end of which is electrically connected to the second end of the first voltage divider resistor, and the second end of which is grounded, wherein the lower the current temperature of the edge server, the greater the impedance of the first thermistor; a second voltage divider resistor, the first end of which is used to input the first voltage; a third voltage divider resistor, the first end of which is electrically connected to the second end of the second voltage divider resistor, and the second end of which is grounded; a first comparator, the first input end of which is electrically connected to the first end of the first thermistor and the second end of the first voltage divider resistor, the second input end of which is electrically connected to the second end of the second voltage divider resistor and the first end of the third voltage divider resistor, and the output end of which is electrically connected to the input end of the first signal stabilization circuit; And / or, The second temperature detection circuit includes: a fourth voltage divider resistor, the first end of which is used to input the first voltage; a second thermistor, the first end of which is electrically connected to the second end of the fourth voltage divider resistor, and the second end of which is grounded, wherein the higher the current temperature of the edge server, the greater the impedance of the second thermistor; a fifth voltage divider resistor, the first end of which is used to input the first voltage; a sixth voltage divider resistor, the first end of which is electrically connected to the second end of the fifth voltage divider resistor, and the second end of which is grounded; a second comparator, the first input end of which is electrically connected to the first end of the second thermistor and the second end of the fourth voltage divider resistor, the second input end of which is electrically connected to the second end of the fifth voltage divider resistor and the first end of the sixth voltage divider resistor, and the output end of which is electrically connected to the input end of the second signal stabilization circuit.

9. The heat dissipation circuit of the edge server according to claim 7, characterized in that, The first signal stabilization circuit includes: a first buffer, the input terminal of which is electrically connected to the output terminal of the first temperature detection circuit, and the output terminal of which is electrically connected to the heating device and the logic control circuit respectively; and a seventh voltage divider resistor, the first terminal of which is used to input the first voltage, and the second terminal of which is electrically connected to the output terminal of the first buffer. And / or, The second signal stabilization circuit includes: a second buffer, the input terminal of which is electrically connected to the output terminal of the second temperature detection circuit, and the output terminal of which is electrically connected to the power compensation circuit and the logic control circuit respectively; and an eighth voltage divider resistor, the first terminal of which is used to input the first voltage, and the second terminal of which is electrically connected to the output terminal of the second buffer.

10. An edge server system, characterized in that, include: Edge servers; The heat dissipation circuit of the edge server according to any one of claims 1 to 9 is electrically connected to the edge server and is used at least for heat dissipation of the edge server.

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