Inductance-free dip-plating winding resistor structure

Abstract

The utility model relates to the technical field of winding resistors, in particular to a non-inductive dip-plating winding resistor structure. The resistor comprises a resistor rod, a resistor groove carved on the resistor rod, a layer of dip plating film formed in the resistor groove through a dip plating process, a winding resistor wire wound outside the resistor rod, end covers mounted at two ends of the resistor rod, and an insulating material sleeved on the outer side, and the winding directions of the resistor groove and the winding resistance wire are opposite to each other. The beneficial effects of the utility model are that according to the technical scheme, the threaded inner groove is engraved on the resistor rod, and the threaded film layer is formed in the inner groove through the immersion plating technology, so that the resistor can be kept stable and is not easy to break down or damage in a high-voltage environment while the film layer forms a resistance value, thereby ensuring the stability and reliability of a circuit.

Description

Technical Field

[0001] This utility model relates to the field of wire-wound resistor technology, and in particular to a non-inductor dip-plated wire-wound resistor structure. Background Technology

[0002] Wire-wound resistors are a type of fixed resistor. They are constructed by winding resistance wire around an insulating frame. The resistance wire is typically made of alloys with specific resistivity, such as nickel-chromium or manganese-copper. The insulating frame is made of materials such as ceramic, plastic, or metal coated with an insulating layer, and can be tubular, flat, or other shapes. The resistance wire can be wound on the frame in single or multiple layers, or using a non-inductive winding method, as needed. Wire-wound resistors are mainly used in AC / DC circuits of precision instruments, telecommunications equipment, and electronic equipment as voltage dividers, voltage reducers, current shunts, and load resistors.

[0003] Existing wire-wound resistors use an immersion plating process, where a layer of material is deposited onto the outside of the resistor rod. However, existing resistors cannot achieve non-inductive properties, and their stability under high voltage conditions is insufficient, making them easily damaged.

[0004] Therefore, it is necessary to design an inductor-free dip-plated wire-wound resistor structure to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide an inductor-free dip-plated wire-wound resistor structure to overcome the aforementioned shortcomings of the existing technology.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A non-inductor dip-plated wire-wound resistor structure includes a resistor rod, a resistor groove engraved on the resistor rod, a dip-plated thin film formed in the resistor groove by a dip-plating process, a wire-wound resistor wire wound around the resistor rod, end caps installed at both ends of the resistor rod, and an insulating material sleeved on the outside, wherein the resistor groove and the winding direction of the wire-wound resistor wire are opposite to each other.

[0008] Preferably, the resistor groove is threaded.

[0009] Preferably, the two ends of the wound resistance wire are welded to the end caps on both sides respectively.

[0010] Preferably, a lead wire extends from the end cap.

[0011] The beneficial effects of this utility model are as follows: This technical solution involves carving a threaded inner groove on the resistor rod and then forming a threaded film layer in the inner groove through an immersion plating process. While forming a resistance value, the film layer can maintain a stable resistance under high voltage conditions, making it less prone to breakdown or damage, thereby ensuring the stability and reliability of the circuit. The external pressure cap winding process can also offset the inductance, enabling the production of low inductance specifications for high-resistance resistor products and developing new technical conditions. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a non-inductor dip-coated wire-wound resistor according to the present invention.

[0013] Figure 2 This is a schematic diagram of the structure of a non-inductor dip-coated wire-wound resistor according to the present invention.

[0014] In the diagram: 1. Resistor rod; 2. Resistor groove; 3. Dip-coated thin film; 4. Wire-wound resistor wire; 5. End cap; 6. Insulating material; 8. Lead wire. Detailed Implementation

[0015] Reference Figure 1 and Figure 2 A non-inductive dip-plated wire-wound resistor structure includes a resistor rod 1, a resistor groove 2 engraved on the resistor rod, a dip-plated thin film 3 formed in the resistor groove by a dip-plating process, a wire-wound resistor wire 4 wound around the resistor rod, end caps 5 installed at both ends of the resistor rod, and an insulating material 6 sleeved on the outside.

[0016] The resistor groove is threaded, and the amount of metal conductor material immersed in the groove can be effectively controlled, thereby achieving better resistance accuracy and stability. Specifically, the groove can be cut as needed, and the specific width and thread gap are all linked to the resistance value.

[0017] After high-voltage resistor immersion plating, a spiral film layer is formed inside the tank. This film layer not only forms the resistance value but also maintains stability under high voltage conditions, preventing breakdown or damage and ensuring circuit stability and reliability. The specific plating material is selected according to needs; for example, silver plating improves conductivity and reduces resistance, while nickel or chromium plating enhances corrosion resistance and stability. These improvements make the high-voltage resistor perform better in circuits, improving the overall circuit performance.

[0018] Further repair by winding the resistance wire can counteract the inductance, enabling the production of low-inductance specifications for high-resistance resistors and the development of new technical conditions. The resistance rod has a resistance value after being dip-plated, and then the resistance is repaired by winding the wire through an external pressure cap process. The thickness of the winding resistance wire and the winding gap are adjusted according to the required resistance value.

[0019] The two ends of the wound resistance wire are respectively welded to the end caps on both sides;

[0020] A lead wire 8 extends from the outside of the end cap;

[0021] The resistor groove 2 and the winding resistor wire 4 are wound in opposite directions, so that the current flows in opposite directions, thereby achieving mutual cancellation of inductance.

[0022] The specific implementation plan is as follows: Select a resistance rod with the required resistance size, attach a protective film to the outside of the resistance rod, and then carve a threaded groove into the resistance rod according to the required resistance size. After carving, perform an immersion plating process. After the resistor is immersed in the plating, a threaded film layer is formed in the groove. End caps are pressed into both ends of the resistance rod, and then the resistance wire is wound by an external cap winding process to offset the inductance. At the same time, the resistance of the entire resistance rod is adjusted to achieve the required resistance value. Finally, an insulating outer sheath is attached.

[0023] The advantages of this utility model are that by carving a threaded groove on the resistor rod and then forming a threaded film layer in the groove through an immersion plating process, the film layer can maintain a stable resistance under high voltage conditions, making it less prone to breakdown or damage, thereby ensuring the stability and reliability of the circuit. The external pressure cap winding process can also offset the inductance, enabling the production of low inductance specifications for high resistance resistors and developing new technical conditions.

[0024] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A non-inductor dip-plated wire-wound resistor structure, characterized in that: It includes a resistance rod, a resistance groove engraved on the resistance rod, a thin film formed in the resistance groove by an immersion plating process, a wire-wound resistance wire wound around the resistance rod, end caps installed at both ends of the resistance rod, and an insulating material sleeved on the outside. The direction of the immersion groove and the direction of the winding resistance wire are opposite to each other.

2. The non-inductor dip-coated wire-wound resistor structure according to claim 1, characterized in that: The resistor groove is threaded.

3. The inductance-free dip-plated wire-wound resistor structure according to claim 1, characterized in that: The two ends of the wound resistor wire are welded to the end caps on both sides respectively.

4. The inductance-free dip-plated wire-wound resistor structure according to claim 3, characterized in that: Lead wires also extend from the end cap.

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