Immersion liquid cooling mobile wireless charging equipment
By employing immersion liquid cooling technology in mobile wireless charging devices, the heat-generating components are immersed in insulating coolant and a heat dissipation module is used, which solves the problem of low heat dissipation efficiency in existing technologies and achieves rapid heat dissipation and improved charging speed.
Patent Information
- Application Number
- CN202423222257.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing mobile wireless charging devices have low heat dissipation efficiency and cannot effectively alleviate heat accumulation in multiple heat-generating units, resulting in a poor consumer experience.
The device employs immersion liquid cooling technology, immersing the heat-generating element in an insulating coolant and dissipating heat through a heat dissipation module, which includes a semiconductor cooling chip and heat dissipation fins, combined with a micro fan to improve heat dissipation efficiency.
It achieves rapid heat dissipation, improves the charging speed and overall heat dissipation effect of electronic products, and enhances the consumer experience.
Smart Images

Figure CN223843556U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of heat dissipation technology, and in particular relates to an immersion liquid-cooled mobile wireless charging device. Background Technology
[0002] With the development of technology and the increasing use of electronic products, mobile charging devices (such as power banks) have gradually become popular. With the development of wireless charging wearable devices, many power banks support wireless charging. In wireless power banks, the main components that require thermal management are the battery, power management chip, casing, and charging coil module. There are various existing heat dissipation solutions, such as the power bank heat dissipation device with patent application CN216673652U. This solution dissipates heat externally, which has low heat dissipation efficiency and is not convenient to carry.
[0003] Another approach is to improve the internal structure, such as adding a heat-insulating film to alleviate the temperature of the outer casing, or adding an internal fan for airflow. However, these methods only address the heat generated by a single heat-generating unit, leaving other heat-generating units unresolved, resulting in poor heat dissipation and a poor user experience. Other attempts include using thermoelectric cooling pads to cool the coils, but this involves a long heat transfer path. The phone's heat must first pass through the charger's casing, then the charging coil, then the magnetic shielding sheet and thermal interface material, before finally reaching the cold end of the cooling pad. This high thermal resistance hinders heat dissipation. Utility Model Content
[0004] The purpose of this invention is to provide an immersion liquid-cooled mobile wireless charging device, which aims to solve the technical problem of poor heat dissipation in the existing mobile wireless charging devices.
[0005] To achieve the above objectives, this utility model provides an immersion liquid-cooled mobile wireless charging device, including a housing; the housing has a first cavity and a second cavity, the first cavity has a wireless charging module and is filled with insulating coolant, and the second cavity has a heat dissipation module, which helps the insulating coolant dissipate heat.
[0006] Optionally, the housing also includes a circuit board located between the first cavity and the second cavity, with one side of the circuit board in contact with the insulating coolant and the other side not in contact with the insulating coolant.
[0007] Optionally, the heat dissipation module includes a thermoelectric cooler; the thermoelectric cooler is disposed on the circuit board.
[0008] Optionally, the circuit board is a PCB circuit board with an opening, and the semiconductor cooling chip is disposed at the opening, with the cold surface of the semiconductor cooling chip directly contacting the insulating coolant.
[0009] Optionally, the circuit board is an FPC circuit board, and the cold side of the semiconductor cooling chip directly contacts the circuit board.
[0010] Optionally, the heat dissipation module further includes a heat sink; the heat sink is disposed on the hot surface of the semiconductor cooling chip, and the heat sink is provided with a plurality of heat dissipation fins, with a gap between two heat dissipation fins.
[0011] Optionally, the circuit board is also provided with a miniature fan, which is positioned close to the heat sink.
[0012] Optionally, the plurality of heat dissipation fins are arranged perpendicularly to the micro fan.
[0013] Optionally, the insulating coolant includes one of silicone oil, mineral oil, synthetic oil, and fluorinated liquid.
[0014] Optionally, the circuit board, the battery, and the wireless charging module are electrically connected to each other.
[0015] Compared with the prior art, the immersion liquid-cooled mobile wireless charging device and one or more of the above-mentioned technical solutions in the immersion liquid-cooled mobile wireless charging device provided by the present invention have at least one of the following technical effects:
[0016] By filling the first cavity with insulating coolant and immersing all heat-generating components in the insulating coolant, heat can be quickly dissipated through the insulating coolant. The heat dissipation module further assists the insulating coolant in dissipating heat, which can alleviate the overheating phenomenon of electronic devices during wireless charging and significantly improve the charging speed of electronic products. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a top view of the structure of this utility model.
[0019] Figure 2 This is a side view of the structure of this utility model.
[0020] Figure 3This is a schematic diagram of another embodiment of the present invention.
[0021] The following are the labeling elements in the figure:
[0022] 100. Outer casing; 110. First cavity; 120. Second cavity; 130. Battery; 140. Wireless charging module; 150. Insulating coolant; 160. Circuit board;
[0023] 200. Heat dissipation module; 210. Semiconductor cooling chip; 220. Heat sink; 221. Heat dissipation fins; 230. Miniature fan. Detailed Implementation
[0024] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.
[0025] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0027] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.
[0028] according to Figure 1 and 2 As shown, an immersion liquid-cooled mobile wireless charging device includes a housing 100; the housing 100 has a first cavity 110 and a second cavity 120. The first cavity 110 has a battery 130 and a wireless charging module 140, which are electrically connected to each other. The first cavity 110 is filled with insulating coolant 150, and the second cavity 120 has a heat dissipation module 200, which helps the insulating coolant 150 dissipate heat.
[0029] Specifically, by filling the first cavity 110 with insulating coolant 150, each heat-generating element is immersed in the insulating coolant 150, which can quickly dissipate heat through the insulating coolant 150. The heat dissipation module 200 further assists the insulating coolant 150 in dissipating heat, which can alleviate the heat generation phenomenon of electronic devices during wireless charging and significantly improve the charging speed of electronic products.
[0030] Furthermore, the second cavity 120 is in an independent space, and the insulating coolant 150 cannot enter the second cavity 120.
[0031] In another embodiment, such as Figure 3 As shown, it does not require a battery 130 and is a mobile wireless charging device that connects directly to a power source.
[0032] according to Figure 1 and 2 As shown, a circuit board 160 is also provided inside the outer casing 100. The circuit board 160 is located between the first cavity 110 and the second cavity 120. One side of the circuit board 160 is in contact with the insulating coolant 150, and the other side is not in contact with the insulating coolant 150. The circuit board 160, the battery 130, and the wireless charging module 140 are electrically connected to each other.
[0033] Specifically, the circuit board 160 acts as a barrier between the first cavity 110 and the second cavity 120. One side of the circuit board 160 is in contact with the insulating coolant 150, which can cool the circuit board 160.
[0034] according to Figure 1 and 2 As shown, the heat dissipation module 200 includes a thermoelectric cooler 210; the thermoelectric cooler 210 is disposed on a circuit board 160. The circuit board 160 is a PCB circuit board 160, and an opening is provided on the circuit board 160. The thermoelectric cooler 210 is disposed at the opening, and the cold surface of the thermoelectric cooler 210 can directly contact the insulating coolant 150.
[0035] In another embodiment, the circuit board 160 is an FPC circuit board 160, and the cold side of the semiconductor cooling chip 210 directly contacts the circuit board 160.
[0036] Specifically, the circuit board 160 can be of two types. If it is a traditional PCB circuit board 160, which is relatively thick, an opening needs to be made in the PCB circuit board 160 to place the thermoelectric cooler 210 at the opening, with the cold side of the thermoelectric cooler 210 contacting the insulating coolant for heat dissipation. If it is an FPC circuit board 160, which is relatively thin and has lower thermal resistance in the thickness direction, the cold side of the thermoelectric cooler 210 can be placed in contact with the circuit board 160.
[0037] In another embodiment, according to Figure 1 and 2 As shown, the heat dissipation module 200 also includes a heat sink 220; the heat sink 220 is disposed on the hot surface of the thermoelectric cooler 210, and the heat sink 220 is provided with multiple heat dissipation fins 221, with gaps between two heat dissipation fins 221. A miniature fan 230 is also provided on the circuit board 160, and the miniature fan 230 is disposed close to the heat sink 220. The multiple heat dissipation fins 221 are arranged perpendicularly to the miniature fan 230.
[0038] Specifically, the heat dissipation fins 221 are designed to increase the heat dissipation area. The heat dissipation fins 221 are also arranged perpendicularly to the micro fan 230. The micro fan 230 can blow air into the gap to carry away the heat, thereby increasing the heat dissipation efficiency.
[0039] In another embodiment, according to Figure 1 and 2 As shown, the insulating coolant 150 includes one of silicone oil, mineral oil, synthetic oil, and fluorinated liquid. Specifically, the above liquids all have good insulation and thermal conductivity, and are chemically stable, and are commonly used for immersion cooling of electronic equipment.
[0040] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this utility model. It should not be construed that the specific implementation of this utility model is limited to these descriptions. For those skilled in the art, the architectural form of this utility model can be flexibly varied without departing from its concept, and a series of products can be derived. Any simple deductions or substitutions should be considered as falling within the patent protection scope defined by the submitted claims.
Claims
1. An immersion liquid-cooled mobile wireless charging device, comprising a housing; the housing having a first cavity and a second cavity, the first cavity having a wireless charging module, characterized in that, The first cavity is filled with insulating coolant, and the second cavity is equipped with a heat dissipation module, which helps the insulating coolant dissipate heat.
2. The immersion liquid-cooled mobile wireless charging device according to claim 1, characterized in that, The outer casing also contains a circuit board, which is located between the first cavity and the second cavity. One side of the circuit board is in contact with the insulating coolant, while the other side is not in contact with the insulating coolant.
3. The immersion liquid-cooled mobile wireless charging device according to claim 2, characterized in that, The heat dissipation module includes a semiconductor cooling chip; the semiconductor cooling chip is disposed on the circuit board.
4. The immersion liquid-cooled mobile wireless charging device according to claim 3, characterized in that, The circuit board is a PCB circuit board with an opening. The semiconductor cooling chip is located at the opening, and the cold side of the semiconductor cooling chip can directly contact the insulating coolant.
5. The immersion liquid-cooled mobile wireless charging device according to claim 3, characterized in that, The circuit board is an FPC circuit board, and the cold side of the semiconductor cooling chip is in direct contact with the circuit board.
6. The immersion liquid-cooled mobile wireless charging device according to claim 4 or 5, characterized in that, The heat dissipation module also includes a heat sink; the heat sink is disposed on the hot surface of the semiconductor cooling chip, and the heat sink is provided with a plurality of heat dissipation fins, with a gap between two heat dissipation fins.
7. The immersion liquid-cooled mobile wireless charging device according to claim 6, characterized in that, The circuit board is also equipped with a miniature fan, which is positioned close to the heat sink.
8. The immersion liquid-cooled mobile wireless charging device according to claim 7, characterized in that, The heat dissipation fins are arranged perpendicularly to the micro fan.
9. The immersion liquid-cooled mobile wireless charging device according to claim 1, characterized in that, The insulating coolant includes one of silicone oil, mineral oil, synthetic oil, and fluorinated liquid.
10. The immersion liquid-cooled mobile wireless charging device according to claim 2, characterized in that, The first cavity also contains a battery, and the circuit board, the battery, and the wireless charging module are electrically connected to each other.
Citation Information
Patent Citations
Power bank heat dissipation device
CN216673652U