Heat dissipation structure for domain controller, domain controller and vehicle

Abstract

The utility model discloses a heat dissipation structure used for a domain controller, the domain controller and a vehicle, and the heat dissipation structure comprises an upper cover, a lower cover, a heat dissipation module and a heat dissipation module, the outer side face, opposite to the inner side face, of the upper cover is provided with heat dissipation fins, the outer side face is provided with a first area and a second area, and the heat dissipation area of the heat dissipation fins arranged in the first area corresponding to the position where the groove is located is larger than that of the heat dissipation fins in the second area. The bottom cover is connected with the upper cover to form a shell with a cavity; the heat pipe assembly is arranged in the shell, the heat pipe assembly comprises at least one heat pipe, the heat pipe comprises an evaporation part and at least one cooling part, the evaporation part is used for being connected with an electronic device of the domain controller in a heat exchange mode, and the cooling part is arranged in the groove; the two side faces of each cooling part are connected with the side walls of the groove in an attached mode.

Description

Technical Field

[0001] This utility model relates to a heat dissipation structure, and more particularly to a heat dissipation structure for a domain controller. Background Technology

[0002] With the rapid development of new energy vehicles and autonomous driving technology, the demand for vehicle domain controllers has become more diversified and the functional requirements are becoming more and more demanding. As a result, the heat dissipation requirements of the main chip of the corresponding domain controller have also increased.

[0003] Currently, many domain controllers use fans for heat dissipation. However, using fans for heat dissipation may lead to fan vibration and noise problems. In certain scenarios, fan vibration may even affect the accuracy of inertial navigation chips.

[0004] In addition, some domain controllers use a single heat pipe for heat dissipation. However, as the performance of domain controllers improves and the power consumption of the main chip increases to a certain extent, this method can no longer dissipate too much heat in time, and adding multiple heat pipes will significantly increase the cost. Utility Model Content

[0005] One of the objectives of this invention is to provide a heat dissipation structure for a domain controller that can significantly increase the heat dissipation area of ​​the heat pipe, thereby improving heat dissipation efficiency.

[0006] To achieve the above objectives, this utility model proposes a heat dissipation structure for a domain controller, comprising:

[0007] The top cover has a groove on its inner side; the outer side of the top cover opposite to the inner side is provided with heat dissipation fins, and the outer side has a first region and a second region, wherein the heat dissipation area of ​​the heat dissipation fins provided in the first region corresponding to the location of the groove is greater than the heat dissipation area of ​​the heat dissipation fins in the second region.

[0008] A bottom cover, which connects to the top cover to form a housing with cavities;

[0009] A heat pipe assembly is disposed within the housing. The heat pipe assembly includes at least one heat pipe, which includes an evaporation section and at least one cooling section. The evaporation section is used for heat exchange connection with the electronic devices of the domain controller. The cooling section is disposed within the recess, and two sides of each cooling section are abutted against the sidewall of the recess.

[0010] Furthermore, in the heat dissipation structure described in this utility model, the area of ​​the side surface of the cooling part is greater than the area of ​​the top or bottom surface of the cooling part, and the area of ​​the bottom surface of the evaporation part, which is used for heat exchange connection with the electronic devices of the domain controller, is greater than the area of ​​the side surface.

[0011] Furthermore, in the heat dissipation structure described in this utility model, a heat-conducting element is provided at the position where the evaporation section is connected to the electronic device for heat exchange.

[0012] Furthermore, in the heat dissipation structure described in this utility model, the density of heat dissipation fins in the first region is greater than the density of heat dissipation fins in the second region.

[0013] Furthermore, in the heat dissipation structure described in this utility model, the heat dissipation fins provided in the first region include a first heat dissipation fin and a second heat dissipation fin with an extension length shorter than the first heat dissipation fin.

[0014] Furthermore, in the heat dissipation structure described in this utility model, the first heat dissipation fins and the second heat dissipation fins are alternately arranged.

[0015] Furthermore, in the heat dissipation structure described in this utility model, the cooling part is fixedly disposed in the groove.

[0016] Furthermore, in the heat dissipation structure described in this utility model, the cooling part is fixedly disposed in the groove by means of thermally conductive adhesive; and / or the cooling part is fixedly disposed in the groove by means of welding.

[0017] Furthermore, in the heat dissipation structure described in this utility model, a single heat pipe is constructed in a U-shape or a Z-shape.

[0018] Furthermore, in the heat dissipation structure described in this utility model, the heat pipe assembly includes one heat pipe or two heat pipes.

[0019] Furthermore, the heat dissipation structure of this utility model also includes a fan, which is disposed on the outer side of the upper cover to blow cooling airflow onto the heat dissipation fins.

[0020] Another objective of this invention is to provide a domain controller comprising a printed circuit board on which electronic devices are disposed. Furthermore, the domain controller also includes a heat dissipation structure as described above, and the printed circuit board is disposed within the housing.

[0021] Another object of this invention is to provide a vehicle having a domain controller as described above.

[0022] The heat dissipation structure described in this utility model greatly increases the contact area between the heat pipe and the outer shell through a simple structural design. At the same time, high-density heat dissipation fins are also set in the corresponding position of the heat pipe, thereby greatly improving the heat dissipation efficiency. Attached Figure Description

[0023] Figure 1 The diagram shows a split structure of the heat dissipation structure described in this utility model in one embodiment.

[0024] Figure 2 This illustration shows the state in which the heat dissipation structure described in this invention has the heat pipe installed in the groove of the upper cover in one embodiment.

[0025] Figure 3 The image shows a top view of one embodiment of the heat dissipation structure described in this invention.

[0026] Figure 4 Showing Figure 3 Sectional view at point AA.

[0027] Figure 5 Showing Figure 3 Sectional view at point BB.

[0028] Figure 6 The image shows a side view of one embodiment of the heat dissipation structure described in this invention.

[0029] Figure 7 Showing Figure 6 Sectional view at point DD.

[0030] Figure 8 Showing Figure 4 A magnified view of a section at point C.

[0031] Figure 9 The diagram shows a schematic of the heat dissipation fins of the heat dissipation structure described in this utility model in one embodiment.

[0032] Figure 10 A cooling structure with a fan is shown in one embodiment.

[0033] Figure 11 This invention illustrates a heat pipe structure in another embodiment of the heat dissipation structure described herein.

[0034] Figure 12 This illustration shows a heat dissipation structure with two heat pipes in another embodiment of the present invention.

[0035] Figure 13 This shows the state in another embodiment of the heat dissipation structure described in this utility model, where two heat pipes are installed in the groove of the upper cover. Detailed Implementation

[0036] The heat dissipation structure, domain controller, and vehicle described in this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, such explanation and description do not constitute an undue limitation on the technical solution of this utility model.

[0037] As domain controller functionality continues to improve, the heat generated by domain controllers also increases significantly. Currently, many domain controllers use fans for cooling; however, fan cooling may lead to fan vibration and noise issues. In addition, some domain controllers use a single heat pipe for cooling; however, as domain controller performance improves and the power consumption of the main chip increases to a certain level, this method can no longer dissipate excessive heat in time, and adding multiple heat pipes would significantly increase costs.

[0038] To address the aforementioned problems, this invention proposes a heat dissipation structure in one embodiment.

[0039] Figure 1 The diagram shows a split structure of the heat dissipation structure described in this utility model in one embodiment.

[0040] like Figure 1 As shown, the heat dissipation structure for a domain controller includes: an upper cover 1 and a bottom cover 2, which are connected to the upper cover 1 by bolts 6 to form a housing. A heat pipe assembly, including at least one heat pipe 3, is disposed within the housing. In this invention, a heat pipe refers to a heat exchange tube having an internal capillary structure and a cooling medium.

[0041] Figure 2 This illustration shows the state in which the heat dissipation structure described in this invention has the heat pipe installed in the groove of the upper cover in one embodiment.

[0042] like Figure 2 As shown, a groove 11 is provided on the inner side of the upper cover 1. Furthermore, as... Figure 1 and Figure 5 As shown, the outer side of the upper cover 1, opposite to the inner side, is provided with heat dissipation fins 12. Furthermore, as... Figure 1 , Figure 3 , Figure 6 and Figure 7 As shown, the heat dissipation area of ​​the heat dissipation fins 12 in the first region 101 on the outer side of the top cover is larger than the heat dissipation area of ​​the heat dissipation fins 12 in the second region 102. From Figure 7 As can be seen from the diagram, the first region 101 refers to the region radiated from the inner side groove 11 to the outer side, and the second region 102 refers to the other regions on the outer side besides the first region.

[0043] like Figure 1 and Figure 2 As shown, the heat pipe 3 includes an evaporator section 31 and at least one cooling section 32, for example, Figure 1 and Figure 2 The two cooling sections are shown. The evaporator section 31 is used for heat exchange with the electronic components 41 on the printed circuit board 4 of the domain controller.

[0044] like Figure 2and Figure 4 As shown, the cooling section 32 is disposed in the groove 11, and the two sides 321 and 322 of each cooling section 32 are respectively attached to and connected to the two side walls 111 and 112 of the groove.

[0045] In this invention, by providing grooves on the inner cover and ensuring that both sides of the cooling section are in close contact with the two side walls of the grooves, the heat exchange area between the cooling section and the upper cover is greatly increased. Simultaneously, by increasing the heat dissipation area of ​​the heat dissipation fins in the area corresponding to the grooves, the heat absorbed by the upper cover can be dissipated more quickly.

[0046] Specifically, the heat pipe 3, especially its cooling section 32, is installed in the groove 11 of the upper cover. The evaporation section 31 of the heat pipe 3 is heat-exchangeably connected to the electronic device 41 on the printed circuit board 4 to absorb the heat of the electronic device 41 and transfer the heat to the two cooling sections 32 of the heat pipe 3. Then, through the contact connection between the two sides 321 and 322 of the cooling section 32 and the two side walls 111 and 112 of each groove 11 on the inner side of the upper cover, the heat is transferred to the upper cover. Then, the heat is evenly transferred to the outer side of the upper cover, especially the densely arranged heat dissipation fins 12 in the first region 101. The outer surface of the heat dissipation fins 12 is in contact with the external environment, directly dissipating the heat to the external environment.

[0047] It should be noted that the heat dissipation area of ​​the heat dissipation fins 12 provided in the first region 101 on the outer side of the top cover described in this utility model is greater than the heat dissipation area of ​​the heat dissipation fins 12 in the second region 102. This includes not only the case where both the first region 101 and the second region 102 are provided with heat dissipation fins, but also the case where the first region 101 is provided with heat dissipation fins while the second region 102 is not provided with heat dissipation fins. In this case, the heat dissipation area of ​​the heat dissipation fins in the second region can be understood as zero, and the heat dissipation area of ​​the heat dissipation fins in the first region is still greater than that in the second region.

[0048] In some more preferred embodiments, such as Figure 1 and Figure 2 As shown, the area of ​​the side surfaces 321 and 322 of the cooling section 32 of the heat pipe 3 is larger than the area of ​​the top surface 323 or the bottom surface of the cooling section. That is, the cooling section 32 has a flat structure that is thinner in the thickness direction and relatively taller in the height direction. This structure can further increase the contact area between the cooling section and the two side walls 111 and 112 of the groove.

[0049] In addition, the area of ​​the bottom surface of the evaporation section 31 of the heat pipe 3, which is used to connect with the electronic devices of the domain controller for heat exchange, is larger than the area of ​​the side surface, in order to increase the heat exchange area between the evaporation section and the electronic devices.

[0050] In some more preferred embodiments, such as Figure 1 and Figure 8As shown, a heat-conducting element 5 is also provided between the evaporation section 31 of the heat pipe 3 and the electronic device 41 on the printed circuit board 4. The heat-conducting element 5 helps to further reduce thermal resistance, thereby improving the heat conduction effect.

[0051] In some more specific embodiments, the thermally conductive element 5 may include thermally conductive grease. Those skilled in the art can select the thermal conductivity of the grease according to actual needs; generally, the higher the thermal conductivity of the grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive element may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.

[0052] In some more specific implementations, such as Figure 1 , Figure 3 and Figure 7 As shown, the heat dissipation area of ​​the heat dissipation fins 12 in the first region 101 on the outer side of the top cover is greater than that of the heat dissipation fins 12 in the second region 102. This can be achieved by having a higher density of heat dissipation fins 12 in the first region 101 than in the second region 102. Of course, in some other optional embodiments, this can also be achieved by increasing the size of the heat dissipation fins in the first region.

[0053] like Figure 9 As shown, in some more specific embodiments, the heat dissipation fins 12 disposed within the first region 101 include a first heat dissipation fin 122 and a second heat dissipation fin 121 with an extension length shorter than the first heat dissipation fin 122. It should be noted that in this embodiment, Figure 9 The first heat dissipation fin 122 and the second heat dissipation fin 121 in the figure are only schematic representations to show that the heat dissipation fins in the first region 101 can be of different lengths, and the length shown in the figure is only a schematic representation.

[0054] In addition, such as Figure 9 As shown, in some more specific embodiments, shorter second heat dissipation fins 121 and longer first heat dissipation fins 122 are alternately arranged, that is, shorter second heat dissipation fins 121 are sandwiched between longer first heat dissipation fins 122. This arrangement can satisfy the process feasibility of the die-casting mold, assist the material flow during product mold forming, and improve the strength and life of the die-casting mold. Furthermore, it is beneficial to form crisscrossing cooling air channels between the heat dissipation fins, which further improves the heat dissipation effect, especially as... Figure 10 As shown, when the heat dissipation structure is also equipped with a fan 7 on the outer side of the top cover, the fan 7 blows cooling airflow onto the heat dissipation fins, and the heat dissipation fins 12, in conjunction with the fan 7, will have a better heat dissipation effect.

[0055] In some more specific embodiments, in order to further ensure the installation stability of the heat pipe 3, the cooling part 32 is fixedly disposed in the groove 11, rather than simply inserted into the groove.

[0056] In some more specific embodiments, the cooling part 32 can be fixedly disposed within the groove 11 using thermally conductive adhesive. In other more specific embodiments, the cooling part 32 can also be fixedly disposed within the groove 11 by welding. In these embodiments, the thermally conductive adhesive or solder can fully fill the tiny assembly gap between the groove and the cooling part, thereby further reducing thermal resistance and improving heat conduction.

[0057] In some implementations, for example Figures 1 to 9 In one embodiment, the heat pipe assembly has a heat pipe 3, which is configured in a U-shape, i.e., a single heat pipe has two substantially parallel cooling sections 32.

[0058] It should be noted that in this invention, the extended shape of the heat pipe can be adapted to the heat dissipation requirements, and is not limited to a U-shape or two cooling sections.

[0059] For example, in such Figure 11 In the embodiment shown, the heat pipe 3 is Z-shaped, that is, the two cooling sections 32 extend from the evaporation section 31 in two opposite directions.

[0060] It should also be noted that the heat dissipation structure of this utility model can also be equipped with two heat pipes, for example, as shown below. Figure 12 As shown, it is designed to cover a larger printed circuit board area.

[0061] Accordingly, such as Figure 13 As shown, in this configuration, the cooling sections of both heat pipes are located in the groove 11, and the two sides 321 and 322 of each cooling section 32 are respectively attached to and connected to the two side walls 111 and 112 of the groove.

[0062] All the technical features of setting up a single heat pipe can be used in implementations with two or more heat pipes, so they will not be described again here.

[0063] This invention utilizes the groove 11 structure of the upper cover 1 to allow the two sides 321, 322 of the heat pipe cooling section 32 to be attached to the two side walls 111, 112 of the groove, respectively. Heat dissipation fins 12 are then distributed throughout the corresponding areas of the groove, fully utilizing the surface area of ​​the heat pipe's two sides, greatly increasing the heat dissipation area and significantly improving the passive cooling effect. This invention maintains low cost and preserves the convenience of assembling the heat pipe and upper cover without increasing the number of heat pipes, while also maximizing the utilization of the heat pipe's surface area, making its heat dissipation surface utilization rate nearly several times that of solutions with the same number of heat pipes.

[0064] Another objective of this utility model is to provide a domain controller, which includes a printed circuit board 4, on which electronic devices 41 are provided. In addition, the domain controller also includes a heat dissipation structure as described above. The printed circuit board 4 is disposed in the housing formed by the upper cover 1 and the bottom cover 2.

[0065] In this invention, the printed circuit board (PCB) of the domain controller can be a printed circuit board integrating various electronic components. The domain controller can be a vehicle domain controller, which is used for vehicle status control and status monitoring, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that implements human-machine interface controller functions, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).

[0066] In this invention, the electronic devices on the printed circuit board can be a system on a chip (SOC), or other electronic components that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.

[0067] The domain controller described in this invention can be used in vehicles, for example, in the automated driving of intelligent vehicles. Intelligent vehicles may include electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance systems (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.

[0068] Therefore, in another embodiment, a vehicle is also provided having a domain controller as described above. Since this invention does not improve other components of the vehicle, these components will not be described in detail here.

[0069] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.

[0070] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0071] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.

Claims

1. A heat dissipation structure for a domain controller, characterized in that, include: The top cover (1) has a groove (11) on its inner side; the outer side of the top cover opposite to the inner side is provided with heat dissipation fins (12), and the outer side has a first region (101) and a second region (102), wherein the heat dissipation area of ​​the heat dissipation fins provided in the first region corresponding to the location of the groove is greater than the heat dissipation area of ​​the heat dissipation fins in the second region. Bottom cover (2), which is connected to the top cover to form a shell with a cavity; A heat pipe assembly is disposed within the housing. The heat pipe assembly includes at least one heat pipe (3), which includes an evaporation section (31) and at least one cooling section (32). The evaporation section is used to thermally exchange with the electronic devices of the domain controller. The cooling section is disposed within the groove, and the two sides (321, 322) of each cooling section are abutted against the sidewalls (111, 112) of the groove.

2. The heat dissipation structure as described in claim 1, characterized in that, The area of ​​the side surfaces (321, 322) of the cooling section is greater than the area of ​​the top surface (323) or bottom surface of the cooling section, and the area of ​​the bottom surface of the evaporation section, which is used for heat exchange connection with the electronic devices of the domain controller, is greater than the area of ​​the side surfaces.

3. The heat dissipation structure as described in claim 1, characterized in that, The evaporation section is provided with a heat-conducting element (5) at the location where it is connected to the electronic device for heat exchange.

4. The heat dissipation structure as described in claim 1, characterized in that, The density of heat dissipation fins in the first region (101) is greater than the density of heat dissipation fins in the second region (102).

5. The heat dissipation structure as described in claim 1, characterized in that, The heat dissipation fins provided in the first area include a first heat dissipation fin (122) and a second heat dissipation fin (121) with an extension length shorter than that of the first heat dissipation fin.

6. The heat dissipation structure as described in claim 5, characterized in that, The first and second heat dissipation fins are arranged alternately.

7. The heat dissipation structure as described in claim 1, characterized in that, The cooling unit is fixedly installed in the groove.

8. The heat dissipation structure as described in claim 1, characterized in that, The cooling section is fixedly disposed in the groove by thermally conductive adhesive; and / or the cooling section is fixedly disposed in the groove by welding.

9. The heat dissipation structure as described in claim 1, characterized in that, Each heat pipe is constructed in a U-shape or a Z-shape.

10. The heat dissipation structure as described in claim 1, characterized in that, The heat pipe assembly includes one or two heat pipes.

11. The heat dissipation structure as described in claim 1, characterized in that, It also includes a fan (7) located on the outer side of the top cover to blow cooling airflow onto the heat dissipation fins.

12. A domain controller comprising a printed circuit board (4) on which electronic devices (41) are disposed, characterized in that, The domain controller further includes a heat dissipation structure as described in any one of claims 1-11, wherein the printed circuit board is disposed within the housing.

13. A vehicle, characterized in that, It has a domain controller as described in claim 12.

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