HDI high-density laminated plate

Abstract

The utility model provides an HDI high-density laminated board comprising a board body and interfaces, one edge of the top surface of the board body is provided with a plurality of interfaces, and two sides of the board body are fixedly connected with golden fingers. The utility model has the advantages that the heat conduction belt can perform soaking and heat conduction on the main chip and the plurality of north bridge chips, so that uniform heat transfer is realized, and local overheating is avoided. A plurality of radiating fins are fixedly connected above the end part of the heat conduction belt, so that the radiating area is effectively increased, the fan outputs high-speed airflow to the radiating fins, the heat of the radiating fins is quickly exchanged with the air to take away the heat on the radiating fins, the output of the fan is specially designed, a conversion port is designed, and the output port of the conversion port is strip-shaped and directly faces the radiating fins, so that the airflow is effectively and fully utilized; by means of the design, waste of airflow is reduced, heat dissipation efficiency is improved, the heat dissipation requirement of the HDI high-density board can be effectively guaranteed, in high-performance electronic equipment, the HDI high-density board can keep stable temperature, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of HDI board technology, and in particular to an HDI high-density laminate board. Background Technology

[0002] HDI boards, or High-Density Interconnect boards, are an advanced printed circuit board (PCB) manufacturing technology. HDI boards utilize micro-blind / buried via technology, enabling higher line density and smaller dimensions. Their minimum line width / spacing is typically less than or equal to 75 / 75μm, and the minimum via diameter is less than or equal to 150μm. These characteristics make HDI boards particularly suitable for miniaturized, highly integrated electronic products.

[0003] On the main HDI board of the graphics card, due to the small size of the board and its small heat dissipation area, the main chip and multiple auxiliary northbridge chips on the board generate a lot of heat and are designed close together, making it very difficult to dissipate the heat. This causes the board to easily accumulate heat and has poor heat dissipation, which affects the performance. Therefore, a high-density HDI multilayer board is proposed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose an HDI high-density laminate to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of the present invention provides an HDI high-density multilayer board, including a board body and interfaces. A plurality of interfaces are installed at one edge of the top surface of the board body, and gold fingers are fixedly connected to both sides of the board body.

[0007] The main chip is installed in the middle of the top surface of the board, and several northbridge chips are installed at the other edge of the top surface of the board.

[0008] The top surfaces of the main chip and the northbridge chip are covered with heat-conducting tape, and the bottom of the heat-conducting tape is attached to the top surfaces of the main chip and the northbridge chip by a silicone grease adhesive layer.

[0009] The heat-conducting tape passes from the top surface of the main chip, then branches and passes over all the northbridge chips;

[0010] Several heat sinks are fixedly connected to the top end of the heat-conducting tape, and a bracket is fixedly connected to the side of the heat-conducting tape.

[0011] A fan is fixedly connected to the end of the bracket. The fan includes the bracket and a fan mounted on the bracket. The air outlet of the fan faces the heat sink.

[0012] The fan's air outlet is fixedly connected to a conversion port, and the output port of the conversion port is elongated and directly faces the heat sink.

[0013] Preferably, the surface layer of the plate is a copper foil layer, as described in any of the above embodiments.

[0014] The above technical solution is adopted: This board is an HDI high-density multilayer board, which adopts micro-blind buried via technology and uses laser drilling technology to connect multiple layers, thereby improving wiring density and reliability. The HDI board has inner layer circuits and outer layer circuits, and uses drilling, in-hole metallization and other processes to achieve internal connection of each layer circuit.

[0015] HDI boards are manufactured using a laminated process. The more layers there are, the higher the technical grade of the board. Ordinary HDI boards are basically single-layered, while high-end HDI boards use single-layer or higher laminated technology.

[0016] Common HDI multilayer board stack-up structures include first-order, second-order, third-order, and higher-order structures. This board is a second-order board. As the design complexity increases, the wiring density and functional integration also increase accordingly. Due to the reduction in aperture and line width, the size of the pads can be significantly reduced, thus allowing for more lines to be distributed per unit area, achieving high-density interconnection.

[0017] Features of this HDI circuit board: The HDI board achieves high-speed and efficient signal transmission on the circuit board through high-density micro-wiring and micro-via technology.

[0018] Preferably, in any of the above solutions, the interface, main chip, and northbridge chip are all connected to the corresponding pads on the board by pin soldering.

[0019] The board can be connected to external connectors via gold fingers to achieve electrical and signal connections.

[0020] The main chip is responsible for processing graphics data and generating display signals. Multiple Northbridge chips are designed to handle high-speed data transfers, such as memory and PCIe. The Northbridge chip also generates considerable heat, especially during heavy data transfers or overclocking.

[0021] This board features an innovative design, including a heat-conducting tape, a thermal adhesive layer, a heat sink, a bracket, a fan, and an adapter port structure.

[0022] First, a heat-dissipating design is implemented for the main chip and multiple northbridge chips. A heat-dissipating tape, made of insulating and thermally conductive material, is connected to the top surface of the main chip via a thermal grease layer. This tape branches off from the top of the main chip and passes over all the northbridge chips, ensuring even heat distribution and preventing localized overheating. Several heat sinks are fixedly connected to the top of the heat sink, effectively increasing the heat dissipation area. Simultaneously, a fan outputs high-speed airflow to the heat sinks, rapidly exchanging heat with the air and carrying away the heat. The fan output is specially designed with a conversion port; the output port is elongated and directly faces the heat sink, effectively utilizing airflow and reducing waste. This design ensures the heat dissipation requirements of the HDI high-density board, maintaining a stable temperature and extending the lifespan of high-performance electronic devices.

[0023] It improves the reliability and stability of the equipment and reduces failures and performance degradation caused by overheating.

[0024] Preferably, of any of the above solutions, the conductive tape is made of polyimide, and the heat sink is arranged vertically.

[0025] Preferably, the heat sink is made of polyimide and is arranged in a linear array at the top end of the heat-conducting tape, as described in any of the above embodiments.

[0026] Preferably, of any of the above solutions, the fan is installed vertically, and the adapter is bonded to the end face of the fan or connected by screws.

[0027] Preferably, the conversion port is made of plastic, and the connection between the conversion port and the fan is a round opening.

[0028] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0029] This HDI high-density multilayer board utilizes a combination of heat-conducting tape, thermally conductive adhesive layer, heat sinks, brackets, fans, and adapter ports to achieve uniform heat dissipation for the main chip and multiple northbridge chips. A heat-conducting tape, made of insulating and thermally conductive material, is connected to the top surface of the board via a thermally conductive adhesive layer. The tape branches off from the top of the main chip and passes over all the northbridge chips, ensuring even heat distribution and preventing localized overheating. Several heat sinks are fixedly connected to the top of the heat-conducting tape, effectively increasing the heat dissipation area. Simultaneously, a fan outputs high-speed airflow to the heat sinks, rapidly exchanging heat with the air and carrying away the heat. The fan output is specially designed with an adapter port; the long, narrow output port directly faces the heat sink, effectively utilizing airflow and reducing waste. This design ensures the heat dissipation requirements of the HDI high-density board, maintaining a stable temperature in high-performance electronic devices and extending the device's lifespan.

[0030] It improves the reliability and stability of the equipment and reduces failures and performance degradation caused by overheating.

[0031] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0032] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0033] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0034] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;

[0035] Figure 3 This is a structural schematic diagram of the present invention from a third-view perspective;

[0036] Figure 4 This is a schematic diagram of the structure of the plate body of this utility model.

[0037] In the diagram: 1-Board body, 2-Interface, 3-Gold fingers, 4-Main chip, 5-Northbridge chip, 6-Heat distribution tape, 7-Silicone grease layer, 8-Heat sink, 9-Bracket, 10-Fan, 11-Adapter port. Detailed Implementation

[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] like Figure 1-4 As shown, this HDI high-density multilayer board includes a board body 1 and interfaces 2. Several interfaces 2 are installed at one edge of the top surface of the board body 1, and gold fingers 3 are fixedly connected to both sides of the board body 1.

[0041] The main chip 4 is installed in the middle of the top surface of board 1, and several northbridge chips 5 are installed at the other edge of the top surface of board 1.

[0042] The top surface of the main chip 4 and the northbridge chip 5 is covered with a heat pipe 6, and the bottom of the heat pipe 6 is attached to the top surface of the main chip 4 and the northbridge chip 5 through a silicone grease layer 7.

[0043] The heat conduction cable 6 passes from the top surface of the main chip 4, then branches off and passes over all the northbridge chips 5.

[0044] Several heat sinks 8 are fixedly connected to the top end of the heat conduction cable 6, and a bracket 9 is fixedly connected to the side of the heat conduction cable 6.

[0045] A fan 10 is fixedly connected to the end of the bracket 9. The fan 10 includes a bracket and a fan mounted on the bracket. The air outlet of the fan 10 faces the heat sink 8.

[0046] The exhaust port of fan 10 is fixedly connected to conversion port 11. The output port of conversion port 11 is long and narrow and directly faces heat sink 8.

[0047] Example 1: The surface layer of board 1 is a copper foil layer. Interface 2, main chip 4, and northbridge chip 5 are all connected to the corresponding pads on board 1 via pin soldering. Board 1 can be connected to external connectors via gold fingers 3 to achieve electrical and signal connections. Main chip 4 is responsible for processing graphics data and generating display signals. Multiple northbridge chips 5 are designed to handle high-speed data transmission, such as memory and PCIe. The heat generated by the northbridge chip is also considerable, especially during large-scale data transmission or overclocking. This board adopts an innovative design, including a heat-conducting tape 6, a thermally conductive adhesive layer 7, a heat sink 8, a bracket 9, a fan 10, and an adapter port 11.

[0048] Example 2: The heat conduction tape 6 is made of polyimide, and the heat sink 8 is vertically arranged. The heat sink 8 is made of polyimide and is linearly arrayed at the top end of the heat conduction tape 6. The fan 10 is vertically installed, and the adapter port 11 is bonded to the end face of the fan 10 or connected by screws. The adapter port 11 is made of plastic, and the connection port between the adapter port 11 and the fan 10 is a round opening.

[0049] The working principle of this utility model is as follows:

[0050] This board is an HDI (High-Density Integrated Circuit) multilayer board that uses micro-blind via technology and laser drilling to connect multiple layers, improving wiring density and reliability. The HDI board has inner and outer layer circuitry, and processes such as drilling and in-hole metallization are used to connect the internal circuitry of each layer.

[0051] HDI boards are manufactured using a laminated process. The more layers there are, the higher the technical grade of the board. Ordinary HDI boards are basically single-layered, while high-end HDI boards use single-layer or higher laminated technology.

[0052] This board is a second-order board. As the design complexity increases, the wiring density and functional integration also increase accordingly. Due to the reduction in aperture and line width, the size of the pads can be significantly reduced, thus allowing for a greater distribution of lines per unit area and achieving high-density interconnection.

[0053] Features of this HDI circuit board: The HDI board achieves high-speed and efficient signal transmission on the circuit board through high-density micro-wiring and micro-via technology.

[0054] In this board, board body 1 can be connected to an external connector via gold fingers 3 to achieve electrical and signal connections.

[0055] Main chip 4 is responsible for processing graphics data and generating display signals. Northbridge chip 5, which can be multiple, is responsible for handling high-speed data transmission, such as memory and PCIe. The heat generated by the Northbridge chip is also considerable, especially during large data transfers or overclocking.

[0056] Compared with the prior art, the present invention has the following advantages:

[0057] This HDI high-density multilayer board, through the coordinated arrangement of heat-conducting tape 6, thermally conductive adhesive layer 7, heat sink 8, bracket 9, fan 10, and conversion port 11, provides a uniform heat dissipation design for the main chip 4 and multiple northbridge chips 5. The top surface of the board is connected to a heat-conducting tape 6 via a thermally conductive adhesive layer 7. The heat-conducting tape 6 is an insulating and thermally conductive material. After passing over the top surface of the main chip 4, the heat-conducting tape 6 branches and passes over all the northbridge chips 5. The heat-conducting tape 6 can provide uniform heat dissipation and conduction for the main chip 4 and multiple northbridge chips 5, achieving uniform heat transfer and avoiding local overheating. Several heat sinks 8 are fixedly connected to the upper end of the heat-conducting tape 6, effectively increasing the heat dissipation area. At the same time, in conjunction with the fan 10, the fan 10 outputs high-speed airflow to the heat sinks 8, and the heat of the heat sinks 8 is rapidly exchanged with the air, carrying away the heat. The output of the fan 10 is specially designed with a conversion port 11. The output port of the conversion port 11 is long and straight and faces the heat sink 8, effectively making full use of the airflow. This design reduces the waste of airflow and improves the heat dissipation efficiency. This can effectively ensure the heat dissipation requirements of the HDI high-density board. In high-performance electronic equipment, this board can maintain a stable temperature and extend the service life of the equipment.

[0058] It improves the reliability and stability of the equipment and reduces failures and performance degradation caused by overheating.

Claims

1. A high-density multilayer (HDI) laminate, characterized in that, Includes a board body (1) and interfaces (2). Several interfaces (2) are installed at one edge of the top surface of the board body (1), and gold fingers (3) are fixedly connected to both sides of the board body (1). The main chip (4) is installed in the middle of the top surface of the board (1), and several northbridge chips (5) are installed at the other edge of the top surface of the board (1). The top surfaces of the main chip (4) and the northbridge chip (5) are covered with a heat-conducting tape (6), and the bottom of the heat-conducting tape (6) is attached to the top surfaces of the main chip (4) and the northbridge chip (5) by a silicone grease adhesive layer (7). The heat-conducting tape (6) passes over the top surface of the main chip (4), then branches and passes over all the northbridge chips (5); several heat sinks (8) are fixedly connected to the top end of the heat-conducting tape (6), and a bracket (9) is fixedly connected to the side of the heat-conducting tape (6). A fan (10) is fixedly connected to the end of the bracket (9). The fan (10) includes a bracket and a fan mounted on the bracket. The air outlet of the fan (10) faces the heat sink (8). The air outlet of the fan (10) is fixedly connected to a conversion port (11), and the output port of the conversion port (11) is long and straight and faces the heat sink (8).

2. The HDI high-density laminate as described in claim 1, characterized in that: The surface layer of the plate (1) is a copper foil layer.

3. The HDI high-density laminate as described in claim 2, characterized in that: The interface (2), main chip (4), and northbridge chip (5) are all connected to the corresponding pads on the board (1) by means of pin soldering.

4. The HDI high-density laminate as described in claim 3, characterized in that: The conductive heat pipe (6) is made of polyimide, and the heat sink (8) is arranged vertically.

5. The HDI high-density laminate as described in claim 4, characterized in that: The heat sink (8) is made of polyimide and is linearly arrayed at the end of the top surface of the heat conduction tape (6).

6. The HDI high-density laminate as described in claim 5, characterized in that: The fan (10) is installed vertically, and the conversion port (11) is bonded to the end face of the fan (10) or connected by screws.

7. The HDI high-density laminate as described in claim 6, characterized in that: The conversion port (11) is made of plastic, and the connection port between the conversion port (11) and the fan (10) is a round port.

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