Circuit board assembly and electronic equipment
By setting up a stacked structure of electrical connections and expansion circuit boards on the motherboard, combined with reinforcement and protection components, the problem of poor protection caused by limited motherboard space is solved, achieving better support and reliability, while reducing space occupation and supporting the miniaturization of electronic devices.
Patent Information
- Application Number
- CN202423259681.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Due to limited space on the motherboard of electronic devices, the existing structural components are not effective in protecting the motherboard, leading to motherboard deformation and component failure.
A first electrical connection part is provided on the motherboard, and a second electrical connection part is provided on the expansion circuit board. Electrical components are electrically connected through the two. The expansion circuit board and the motherboard are stacked together, and a reinforcing plate and a protective structure component are combined to enhance support and protection.
It effectively expands the space available for the motherboard, improves protection, enhances the reliability of circuit board components, reduces the space occupied inside electronic devices, and supports miniaturized design.
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Figure CN223843964U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of electronic devices, and more particularly to a circuit board assembly and an electronic device. Background Technology
[0002] Currently, structural components are typically placed on the motherboard of electronic devices to protect the motherboard and prevent it from warping. However, due to the limited space on the motherboard, the placement of these structural components is also limited, resulting in inadequate protection for the motherboard. Utility Model Content
[0003] To overcome the problems existing in the related technologies, this disclosure provides a circuit board assembly and an electronic device.
[0004] According to a first aspect of this disclosure, a circuit board assembly is provided, the circuit board assembly comprising: a motherboard having a first electrical connection portion; and an extension circuit board stacked on the motherboard, the extension circuit board having a second electrical connection portion and at least one electrical component, the electrical component being electrically connected to the motherboard through the second electrical connection portion and the first electrical connection portion.
[0005] In some embodiments of this disclosure, the extended circuit board includes: a flexible circuit board, the flexible circuit board including a first surface and a second surface facing away from each other, at least one of the electrical components being disposed on the first surface, and a second electrical connection portion being disposed on the second surface and offset from each of the electrical components; a first reinforcing plate being disposed on the second surface corresponding to the position of each of the electrical components; and a second reinforcing plate being disposed on the first surface corresponding to the position of the second electrical connection portion.
[0006] In some embodiments of this disclosure, the flexible circuit board includes a first portion and a second portion connected to each other, at least one of the electrical components is disposed on the first surface of the first portion, the first reinforcing plate is disposed on the second surface of the first portion, the second electrical connection portion is disposed on the second surface of the second portion, and the second reinforcing plate is disposed on the first surface of the second portion.
[0007] In some embodiments of this disclosure, the first part and the second part are connected by a third part, which is used to electrically connect to the motherboard so that the flexible circuit board is grounded.
[0008] In some embodiments of this disclosure, the third portion includes a first edge and a second edge connected together, the first portion being connected to the first edge and the second portion being connected to the second edge.
[0009] In some embodiments of this disclosure, the motherboard includes a third surface and a fourth surface facing away from each other, the first electrical connection portion is disposed on the third surface, and the circuit board assembly further includes a protective structure assembly disposed on the third surface, the protective structure assembly being used to provide pressure to the motherboard; wherein a portion of the extended circuit board is disposed on the protective structure assembly.
[0010] In some embodiments of this disclosure, the protective structure component includes: a first structural member, the first structural member including a first plate portion and two first support portions connected to the first plate portion, the first plate portion being disposed opposite to the motherboard, the two first support portions being fixed on the third surface, the two first support portions being used to provide pressure to the motherboard, and a portion of the expansion circuit board being disposed on the first plate portion.
[0011] In some embodiments of this disclosure, the first reinforcing plate is attached to the surface of the first plate portion facing away from the motherboard, so that the first portion of the flexible circuit board is fixed to the first plate portion, and the second portion of the flexible circuit board is bent toward the motherboard, so that the second electrical connection portion is connected to the first electrical connection portion on the motherboard.
[0012] In some embodiments of this disclosure, the first reinforcing plate is provided with at least one first mating portion, and the first plate portion is provided with a second mating portion corresponding to the first mating portion. The first mating portion and the second mating portion cooperate to limit the first reinforcing plate to be located on the first plate portion.
[0013] In some embodiments of this disclosure, the first structural member includes a metallic structural member and a plastic structural member covering the metallic structural member, at least one metallic structural member on the first support portion connected to the motherboard is exposed and connected to the motherboard, and a metallic structural member on the first structural member corresponding to the third portion of the flexible circuit board is exposed and connected to the third portion.
[0014] In some embodiments of this disclosure, the protective structure assembly further includes: a second structural member, the second structural member including a second plate portion and two second support portions connected to the second plate portion, the second plate portion being opposite to the motherboard, and the first plate portion being located between the first plate portion and the motherboard, the two second support portions being connected to the surface of the second plate portion facing the motherboard and extending from the second plate portion toward the motherboard.
[0015] In some embodiments of this disclosure, both second support portions are spaced at a preset distance from the motherboard, the preset distance being greater than or equal to 0.05 mm.
[0016] In some embodiments of this disclosure, the second plate portion is provided with a receiving groove corresponding to the first portion of the flexible circuit board, and at least one of the electrical components on the first portion is located in the receiving groove.
[0017] In some embodiments of this disclosure, the circuit board assembly further includes a buffer disposed on the first surface of the first portion and located within the receiving groove.
[0018] In some embodiments of this disclosure, the buffer is a ring structure, and at least one of the electrical components is located within the ring structure.
[0019] According to a second aspect of this disclosure, an electronic device is provided, the electronic device including a circuit board assembly as described in the first aspect.
[0020] In some embodiments of this disclosure, the electronic device further includes an antenna bracket, a back cover, and a decorative element disposed inside the back cover. The antenna bracket constitutes a first structural component of the circuit board assembly, and the decorative element constitutes a second structural component of the circuit board assembly.
[0021] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:
[0022] The circuit board assembly disclosed herein includes a first electrical connection portion on a motherboard and a second electrical connection portion on an expansion circuit board. At least one electrical component can be mounted on the expansion circuit board, and the component is electrically connected to the first electrical connection portion via the second electrical connection portion. This effectively expands the usable space of the motherboard, providing more space for other structural components on the motherboard. This improves the protection of the motherboard and enhances the reliability of the circuit board assembly. Furthermore, the stacked arrangement of the expansion circuit board and the motherboard makes the circuit board assembly more compact, reducing the space occupied by the circuit board assembly within the electronic device.
[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.
[0025] Figure 1 This is an explosion diagram of an electronic device from a first-view perspective, according to an exemplary embodiment.
[0026] Figure 2 This is an explosion diagram of an electronic device from a second perspective, according to an exemplary embodiment.
[0027] Figure 3 This is a partial structural schematic diagram of an electronic device from a first perspective, according to an exemplary embodiment.
[0028] Figure 4 This is a partial structural schematic diagram of an electronic device from a second perspective, according to an exemplary embodiment.
[0029] Figure 5 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment;
[0030] Figure 6 This is a schematic diagram of the structure of an electronic device according to another exemplary embodiment;
[0031] Figure 7 yes Figure 6 Sectional view along the AA direction.
[0032] In the picture:
[0033] 1-Electronic device; 101-Antenna bracket; 102-Back shell; 103-Decorative part; 11-Main board; 111-Third surface; 112-Fourth surface; 12-First electrical connection part; 13-Flexible circuit board; 131-First part; 132-Second part; 133-Third part; 134-First reinforcing plate; 1341-First mating part; 135-Second reinforcing plate; 136-Electrical component; 137-First surface; 138-Second surface; 14-Second electrical connection part; 15-First structural component; 151-First plate part; 1511-Second mating part; 152-First support part; 153-Metallic structural component; 154-Plastic structural component; 16-Second structural component; 161-Second plate part; 1611-Receiving groove; 162-Second support part; 17-Buffer part; 18-Adhesive layer. Detailed Implementation
[0034] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0035] The motherboard of an electronic device contains many electrical components. In order to prevent the motherboard from deforming and causing the components to fail, related technologies usually set up structural components on the motherboard to support it. For example, an insulating rigid structure is set up on the motherboard, or the internal structure of the electronic device (such as an antenna bracket) is used. When the motherboard is subjected to external impact, the supporting components of the structural components can effectively prevent deformation, thereby providing a certain degree of protection for the motherboard.
[0036] However, due to the limited space on the motherboard, the placement of structural components on the motherboard is also limited, which cannot provide good support for the motherboard, resulting in poor protection.
[0037] To address the aforementioned technical problems, this disclosure provides a circuit board assembly. A first electrical connection portion is provided on a motherboard, and a second electrical connection portion is provided on an expansion circuit board. At least one electrical component can be mounted on the expansion circuit board, and the component is electrically connected to the first electrical connection portion via the second electrical connection portion. This effectively expands the usable space of the motherboard, providing more space for other structural components on the motherboard. This improves the protection of the motherboard and enhances the reliability of the circuit board assembly. Furthermore, the stacked arrangement of the expansion circuit board and the motherboard makes the circuit board assembly more compact, reducing the space occupied by the circuit board assembly within the electronic device.
[0038] An exemplary embodiment of this disclosure provides a circuit board assembly, such as Figure 1 As shown, the circuit board assembly includes a motherboard 11 and an expansion board. Combined with... Figure 2 and Figure 3 The motherboard 11 has a first electrical connection portion 12, and the expansion circuit board has a second electrical connection portion 14 and at least one electrical component 136. Exemplarily, only one electrical component 136 may be provided on the expansion circuit board, or multiple electrical components 136 may be provided. The electrical component 136 is electrically connected to the motherboard 11 through the first electrical connection portion 12 and the second electrical connection portion 14. That is, when the first electrical connection portion 12 and the second electrical connection portion 14 are in contact, a conductive connection is achieved between the expansion circuit board and the motherboard 11, thereby enabling the electrical component 136 to be electrically connected to the motherboard 11. Exemplarily, the first electrical connection portion 12 and the second electrical connection portion 14 may be spring contact structures. When the two spring contact structures are in contact, the electrical component 136 on the expansion circuit board is electrically connected to the motherboard 11. The expansion circuit board and the motherboard 11 can also be electrically connected via a BTB (Board To Board) connector, where the first electrical connection part 12 constitutes one interface structure of the BTB connector and the second electrical connection part 14 constitutes another interface structure of the BTB connector. When the two interface structures are plugged in, the electrical connection between the expansion circuit board and the motherboard 11 is achieved.
[0039] By setting up an expansion circuit board, electrical components on the motherboard 11 can be moved to the expansion circuit board, effectively expanding the usable space of the motherboard 11 and improving the phone's performance. This also provides more space for other structural components on the motherboard 11, offering better support and protection, thus improving the protection of the motherboard 11 and enhancing the reliability of the circuit board assembly.
[0040] Furthermore, the stacked arrangement of the expansion circuit board and the motherboard 11 not only facilitates the connection between the expansion circuit board and the motherboard 11, but also makes the structure of the circuit board assembly more compact, which can reduce the space occupied by the circuit board assembly in the internal space of the electronic device 1, thereby facilitating the miniaturization design of the electronic device 1.
[0041] Combination Figure 1 and Figure 2 In one embodiment, the extended circuit board includes a flexible circuit board 13, a first reinforcing plate 134, and a second reinforcing plate 135. The flexible circuit board 13 includes a first surface 137 and a second surface 138 facing away from each other. At least one electrical component 136 is disposed on the first surface 137, and a second electrical connection portion 14 is disposed on the second surface 138, offset from each electrical component 136. This facilitates the connection of the second electrical connection portion 14 on the flexible circuit board 13 to the first electrical connection portion 12 on the main board 11 while avoiding interference between the second electrical connection portion 14 and the electrical component 136, thus ensuring the reliability of each electrical component 136. The first reinforcing plate 134 is disposed on the second surface 138 corresponding to the positions of each electrical component 136. The first reinforcing plate 134 increases the structural strength at the positions where the electrical components 136 are disposed on the flexible circuit board 13, facilitating the placement of the electrical components 136 on the flexible circuit board 13. The second reinforcing plate 135 is disposed on the first surface 137 corresponding to the position of the second electrical connection part 14. The second reinforcing plate 135 improves the structural strength of the flexible circuit board 13 at the position where the second electrical connection part 14 is disposed, making it easier to place the second electrical connection part 14 on the flexible circuit board 13, thereby further improving the reliability of the expansion circuit board.
[0042] Combination Figure 1 and Figure 2In one embodiment, the flexible circuit board 13 includes a first portion 131 and a second portion 132 connected to each other. At least one electrical component 136 is disposed on a first surface 137 of the first portion 131, and a first reinforcing plate 134 is disposed on a second surface 138 of the first portion 131, for example, bonded to the second surface 138 by an adhesive layer 18, which may be, for example, an adhesive backing. A second electrical connection portion 14 is disposed on the second surface 138 of the second portion 132, and a second reinforcing plate 135 is disposed on the first surface 137 of the second portion 132, for example, bonded to the first surface 137 by an adhesive layer 18. This design spacees the positions of the electrical components 136 from the positions of the second electrical connections 14, facilitating the assembly of the circuit board assembly while effectively improving the reliability of each electrical component 136.
[0043] Combination Figure 1 and Figure 2 In one embodiment, the flexible circuit board 13 further includes a third portion 133. The first portion 131 and the second portion 132 are connected through the third portion 133. The third portion 133 is used for electrical connection with the motherboard 11 to ground the flexible circuit board 13. Exemplarily, the third portion 133 can be connected to the motherboard 11 through a metal structure such as a spring or a clip to ground the flexible circuit board 13. Alternatively, the third portion 133 can be connected to the motherboard 11 through contact to ground the flexible circuit board 13. There is no specific limitation on this.
[0044] By grounding the flexible circuit board 13, electromagnetic interference can be effectively avoided on the electrical components 136 on the extension circuit board, and electromagnetic interference can be avoided on other components of the electronic device 1, thereby improving the performance of the electronic device 1.
[0045] Combination Figure 1 In one embodiment, the third portion 133 includes a first edge and a second edge connected together, with the first portion 131 connected to the first edge and the second portion 132 connected to the second edge. Exemplarily, the third portion 133 may be a fan-shaped structure, including two connected straight edges and an arc-shaped edge, with the first portion 131 and the second portion 132 respectively connected to the two straight edges; or, the third portion 133 may be a rectangular structure, with the first portion 131 and the second portion 132 respectively connected to two adjacent edges of the rectangular structure. This arrangement shortens the overall length of the expansion circuit board, making the circuit board assembly more compact and further reducing the space occupied by the circuit board assembly within the internal space of the electronic device 1.
[0046] Combination Figure 1 , Figure 2 and Figure 3In one embodiment, the motherboard 11 includes a third surface 111 and a fourth surface 112 facing away from each other. A first electrical connection portion 12 is disposed on the third surface 111, and a plurality of electrical components are also disposed on the third surface 111. The circuit board assembly also includes a protective structure assembly disposed on the third surface 111. The protective structure assembly is used to provide pressure to the motherboard 11 to support the motherboard 11 and prevent the motherboard 11 from deforming under impact, which could lead to the failure of the electrical components on the motherboard 11. At the same time, a portion of the extended circuit board with electrical components 136 is disposed on the protective structure assembly. In this way, the protective structure assembly can simultaneously protect the extended circuit board, preventing the extended circuit board from deforming under impact and causing the failure of the electrical components 136 on the extended circuit board, thereby further improving the reliability of the circuit board assembly.
[0047] Combination Figure 1 and Figure 3 In one embodiment, the protective structure assembly includes a first structural member 15, which includes a first plate portion 151 and two first support portions 152 connected to the first plate portion 151. The first plate portion 151 is disposed opposite to the motherboard 11, and the two first support portions 152 are fixed to a third surface 111. The first support portions 152 are fixed to the third surface 111, for example, by screw fastening or adhesive bonding. The two first support portions 152 provide pressure to the motherboard 11 to support it, effectively preventing the motherboard 11 from deforming under impact and causing failure of electrical components on the motherboard 11. For example, if only one support portion is provided, not only will the protection effect on the motherboard 11 be poor, but stress concentration may also cause damage to the motherboard 11. If more than two support portions are provided, it will occupy more space on the motherboard 11. Therefore, this embodiment, by providing two first support portions 152 to support the motherboard 11, can simultaneously achieve the protection effect on the motherboard 11 and reduce the space occupied by the motherboard 11. A portion of the expansion circuit board is disposed on the first board portion 151. The first board portion 151 supports the portion of the expansion circuit board on which the electrical components 136 are disposed, thereby protecting the expansion circuit board.
[0048] Combination Figure 1 and Figure 3In one embodiment, a first reinforcing plate 134 is attached to the surface of the first plate portion 151 facing away from the main board 11, so that the first portion 131 of the flexible circuit board 13 is fixed to the first plate portion 151. The first reinforcing plate 134 can be fixed to the first plate portion 151, for example, by means of an adhesive layer 18, screw fastening, etc. The second portion 132 of the flexible circuit board 13 is bent toward the main board 11 so that the second electrical connection portion 14 is connected to the first electrical connection portion 12 on the main board 11. With this arrangement, the expansion circuit board is protected while the connection between the second electrical connection portion 14 and the first electrical connection portion 12 is facilitated, and the structure of the circuit board assembly is made more compact.
[0049] Combination Figure 1 and Figure 4 In one embodiment, the first reinforcing plate 134 is provided with at least one first mating part 1341, and the first plate portion 151 is provided with a second mating part 1511 corresponding to the first mating part 1341. The first mating part 1341 and the second mating part 1511 cooperate to limit the first reinforcing plate 134 to be positioned on the first plate portion 151. Exemplarily, only one first mating part 1341 may be provided, and correspondingly, only one second mating part 1511 may also be provided. Alternatively, multiple first mating parts 1341 may be provided, such as two or three, and the number of corresponding second mating parts 1511 may be the same as the number of first mating parts 1341. The first mating part 1341 can be, for example, a slot structure, and the second mating part 1511 can be, for example, a protrusion structure adapted to the slot, which is inserted into the slot structure to limit the position of the expansion circuit board; or the first mating part 1341 can be, for example, a snap-fit structure, and the second mating part 1511 is an interface structure that mates with the snap-fit structure, which is engaged with the interface structure to limit the position of the expansion circuit board.
[0050] By limiting the position of the expansion circuit board, displacement of the expansion circuit board on the first board portion 151 is prevented, thus improving the reliability of the circuit board assembly. On the other hand, it also facilitates the assembly of the circuit board assembly, thereby improving the assembly efficiency of the electronic device 1.
[0051] Combination Figure 1 , Figure 3 and Figure 7 In one embodiment, the first structural member 15 includes a metallic structural member 153 and a plastic structural member 154 covering the metallic structural member 153. The insulating effect of the plastic structural member 154 prevents the metallic structural member 153 from causing electromagnetic interference to other components of the electronic device 1, thereby ensuring the performance of the electronic device 1.
[0052] At least one metal structural member 153 on the first support portion 152 connected to the motherboard 11 is exposed and connected to the motherboard 11. For example, only one metal structural member 153 on the first support portion 152 connected to the motherboard 11 may be exposed, or the metal structural members 153 on both first support portions 152 connected to the motherboard 11 may be exposed. When the first support portion 152 is fixed to the motherboard 11, the metal structural member 153 on the first support portion 152 connected to the motherboard 11 is also connected to the motherboard 11. The metal structural member 153 on the first structural member 15 corresponding to the third part 133 of the flexible circuit board 13 is exposed and connected to the third part 133. For example, the third part 133 and the exposed metal structural member 153 on the first structural member 15 are connected and fixed by conductive adhesive, snap-fit structure, etc. In this way, the flexible circuit board 13 is grounded through the metal structural member 153 in the first structural member 15. This configuration simplifies the grounding method of the flexible circuit board 13, facilitating the processing and assembly of the circuit board assembly. It also allows for a more compact structure, further reducing the space occupied by the circuit board assembly within the electronic device 1. Furthermore, by directly contacting the flexible circuit board 13 with the exposed metallic structural member 153 on the first structural member 15, the electromagnetic shielding performance is further enhanced.
[0053] Combination Figure 1 , Figure 5 , Figure 6 and Figure 7 In one embodiment, the protective structure assembly further includes a second structural member 16. The second structural member 16 includes a second plate portion 161 and two second support portions 162 connected to the second plate portion 161. The second plate portion 161 is opposite to the main board 11, and a first plate portion 151 is located between the first plate portion 151 and the main board 11. That is, the second plate portion 161 covers the surface of the first plate portion 151 facing away from the main board 11, and the first portion 131 of the flexible circuit board 13 is located between the second plate portion 161 and the first plate portion 151. This further enhances the protection of the expansion circuit board, preventing damage from impacts, bumps, etc., and further improving the reliability of the expansion circuit board.
[0054] Both second support portions 162 are connected to the surface of the second plate portion 161 facing the main plate 11 and extend from the second plate portion 161 toward the main plate 11 to further enhance the protection of the main plate 11 and reduce the risk of deformation of the main plate 11.
[0055] Combination Figure 5In one embodiment, both second support portions 162 are spaced from the motherboard 11 at a predetermined distance, which is greater than or equal to 0.05 mm. This arrangement serves two purposes: firstly, since the two first support portions 152 of the first structural member 15 are connected to the motherboard 11, the predetermined distance between the two second support portions 162 and the motherboard 11 prevents the two second support portions 162 from applying additional pressure to the motherboard 11, thus avoiding stress concentration and deformation. Secondly, by maintaining this predetermined distance, when the motherboard 11 is impacted and deforms, arching towards the first structural member 15, the two second support portions 162 can press down on the arched motherboard 11, preventing further deformation. This allows the second support portions 162 to control the deformation of the motherboard 11, thereby further improving the protection of the motherboard 11.
[0056] Combination Figure 2 and Figure 7 In one embodiment, the second plate portion 161 is provided with a receiving groove 1611 corresponding to the position of the first portion 131 of the flexible circuit board 13, and at least one electrical component 136 on the first portion 131 is located in the receiving groove 1611. In this way, the second plate portion 161 is prevented from squeezing the electrical component 136 on the expansion circuit board, thereby ensuring the reliability of the electrical component 136 on the expansion circuit board.
[0057] Combination Figure 2 and Figure 7 In one embodiment, the circuit board assembly further includes a buffer 17, which may be an elastic component such as foam or silicone. The buffer 17 is disposed on the first surface 137 of the first portion 131 and is located within the receiving groove 1611. When the first portion 131 of the extended circuit board deforms with the first structural member 15, the buffer 17 can buffer the impact force generated during the deformation of the extended circuit board. At the same time, the clamping force of the second structural member 16 on the first portion 131 of the extended circuit board is transmitted through the buffer 17, pressing the first portion 131 of the extended circuit board to prevent deformation and avoid collision between the electrical components 136 on the first portion 131 and the second structural member 16, thereby further improving the protection of the extended circuit board.
[0058] Combination Figure 4 and Figure 7 In one embodiment, the buffer 17 is a ring structure, and at least one electrical component 136 is located within the ring structure. This arrangement effectively improves the protection and comprehensiveness of the electrical components 136 on the expansion circuit board, enhances the uniformity of the clamping force applied by the second structural component 16 to the expansion circuit board, and prevents damage such as squeezing or impact from the second structural component 16 to the expansion circuit board.
[0059] An exemplary embodiment of this disclosure provides an electronic device, which may be a mobile device such as a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), or a non-mobile device such as a personal computer (PC), television (TV), ATM, or self-service machine.
[0060] Combination Figure 1 The electronic device 1 includes the circuit board assembly as described above. The circuit board assembly includes a motherboard 11 and an expansion circuit board. The motherboard 11 is provided with a first electrical connection portion 12. The expansion circuit board is stacked on the motherboard 11. The expansion circuit board is provided with a second electrical connection portion 14 and at least one electrical component 136. The electrical component 136 is electrically connected to the motherboard 11 through the second electrical connection portion 14 and the first electrical connection portion 12.
[0061] By setting up an expansion circuit board, electrical components 136 on the motherboard 11 can be mounted on the expansion circuit board, thereby effectively expanding the usable space of the motherboard 11. This provides more space for other structural components on the motherboard 11, allowing for better support and protection, thus improving the protection effect of the motherboard 11 and enhancing the reliability of the circuit board assembly.
[0062] Furthermore, the stacked arrangement of the expansion circuit board and the motherboard 11 not only facilitates the connection between the expansion circuit board and the motherboard 11, but also makes the structure of the circuit board assembly more compact, which can reduce the space occupied by the circuit board assembly in the internal space of the electronic device 1, thereby facilitating the miniaturization design of the electronic device 1.
[0063] Combination Figure 1 and Figure 7In one embodiment, the electronic device 1 further includes an antenna bracket 101, a back cover 102, and a decorative element 103 disposed inside the back cover 102. The antenna bracket 101 constitutes the first structural component 15 of the circuit board assembly, and the decorative element 103 constitutes the second structural component 16 of the circuit board assembly. During assembly, the antenna bracket 101 is first assembled onto the motherboard 11. Then, the first portion 131 of the expansion circuit board is attached to the antenna bracket 101, and the second electrical connection portion 14 on the expansion circuit board is connected to the first electrical connection portion 12 on the motherboard 11 to realize the transmission of circuit signals. The decorative element 103 is assembled onto the inner side of the back cover 102, and then the back cover 102 with the decorative element 103 assembled is assembled onto the motherboard 11, that is, assembled onto the middle frame of the electronic device 1, thereby completing the assembly of the entire device. At this time, the electrical components 136 on the expansion circuit board are located in the receiving groove 1611 of the decorative element 103, and the two second support portions 162 of the decorative element 103 are spaced at a preset distance from the motherboard 11.
[0064] With this configuration, there is no need to add additional components as the first structural member 15 and the second structural member 16 as protective structural components, further reducing the space occupied inside the electronic device 1.
[0065] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.
[0066] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.
Claims
1. A circuit board assembly, characterized in that, The circuit board assembly includes: A motherboard, wherein a first electrical connection portion is provided on the motherboard; An expansion circuit board is stacked on top of the motherboard. The expansion circuit board is provided with a second electrical connection portion and at least one electrical component. The electrical component is electrically connected to the motherboard through the second electrical connection portion and the first electrical connection portion.
2. The circuit board assembly according to claim 1, characterized in that, The expansion circuit board includes: A flexible circuit board, the flexible circuit board including a first surface and a second surface opposite to each other, at least one of the electrical components is disposed on the first surface, and a second electrical connection portion is disposed on the second surface and is offset from each of the electrical components; A first reinforcing plate is disposed on the second surface corresponding to the positions of each of the aforementioned electrical components; The second reinforcing plate is disposed on the first surface corresponding to the position of the second electrical connection portion.
3. The circuit board assembly according to claim 2, characterized in that, The flexible circuit board includes a first part and a second part connected to each other, at least one of the electrical components is disposed on the first surface of the first part, the first reinforcing plate is disposed on the second surface of the first part, the second electrical connection portion is disposed on the second surface of the second part, and the second reinforcing plate is disposed on the first surface of the second part.
4. The circuit board assembly according to claim 3, characterized in that, The first part and the second part are connected by a third part, which is used to electrically connect to the motherboard so that the flexible circuit board is grounded.
5. The circuit board assembly according to claim 4, characterized in that, The third part includes a first edge and a second edge connected together, the first part being connected to the first edge and the second part being connected to the second edge.
6. The circuit board assembly according to any one of claims 2 to 5, characterized in that, The motherboard includes a third surface and a fourth surface facing away from each other, the first electrical connection portion is disposed on the third surface, and the circuit board assembly further includes: A protective structural assembly is disposed on the third surface, the protective structural assembly being used to apply pressure to the motherboard; Some of the extended circuit boards are disposed on the protective structure assembly.
7. The circuit board assembly according to claim 6, characterized in that, The protective structure component includes: The first structural component includes a first plate portion and two first support portions connected to the first plate portion. The first plate portion is disposed opposite to the motherboard. The two first support portions are fixed on the third surface. The two first support portions are used to provide pressure to the motherboard. A portion of the expansion circuit board is disposed on the first plate portion.
8. The circuit board assembly according to claim 7, characterized in that, The first reinforcing plate is attached to the surface of the first plate portion facing away from the motherboard, so that the first part of the flexible circuit board is fixed to the first plate portion, and the second part of the flexible circuit board is bent toward the motherboard, so that the second electrical connection portion is connected to the first electrical connection portion on the motherboard.
9. The circuit board assembly according to claim 8, characterized in that, The first reinforcing plate is provided with at least one first mating part, and the first plate portion is provided with a second mating part corresponding to the first mating part. The first mating part and the second mating part cooperate to limit the first reinforcing plate to be located on the first plate portion.
10. The circuit board assembly according to claim 7, characterized in that, The first structural component includes a metallic structural component and a plastic structural component covering the metallic structural component. At least one metallic structural component on the first support portion, in an area connected to the motherboard, is exposed and connected to the motherboard. A metallic structural component on the first structural component, corresponding to the third portion of the flexible circuit board, is exposed and connected to the third portion.
11. The circuit board assembly according to claim 7, characterized in that, The protective structure component also includes: The second structural component includes a second plate portion and two second support portions connected to the second plate portion. The second plate portion is opposite to the motherboard, and the first plate portion is located between the first plate portion and the motherboard. The two second support portions are connected to the surface of the second plate portion facing the motherboard and extend from the second plate portion toward the motherboard.
12. The circuit board assembly according to claim 11, characterized in that, Both second support portions are spaced at a preset distance from the motherboard, and the preset distance is greater than or equal to 0.05 mm.
13. The circuit board assembly according to claim 11, characterized in that, The second plate portion is provided with a receiving groove corresponding to the first portion of the flexible circuit board, and at least one of the electrical components on the first portion is located in the receiving groove.
14. The circuit board assembly according to claim 13, characterized in that, The circuit board assembly also includes: A buffer element is disposed on the first surface of the first portion and is located within the receiving groove.
15. The circuit board assembly according to claim 14, characterized in that, The buffer is a ring structure, and at least one of the electrical components is located within the ring structure.
16. An electronic device, characterized in that, The electronic device includes a circuit board assembly as described in any one of claims 1 to 15.
17. The electronic device according to claim 16, characterized in that, The electronic device further includes an antenna bracket, a back cover, and a decorative element disposed inside the back cover. The antenna bracket constitutes a first structural component of the circuit board assembly, and the decorative element constitutes a second structural component of the circuit board assembly.