Shell for domain controller, domain controller and vehicle

Abstract

The utility model discloses a housing for a domain controller. An outer surface (101) of the housing is provided with a first heat radiation area (P1) corresponding to a main heating element of the domain controller and a second heat radiation area (P2) surrounding the periphery of the first heat radiation area. The first heat dissipation area is provided with first heat dissipation fins (102) which are arranged in a staggered mode and at least one concave part (103) which is concave towards an inner cavity of the shell, the concave part forms a first heat dissipation boss (105) on the inner surface (104) of the shell, and the first heat dissipation boss is used for being connected with at least one electronic device of the domain controller in a heat exchange mode; the second heat dissipation area is provided with a plurality of radial heat dissipation fins extending outwards from the first heat dissipation area in a radial mode.

Description

Technical Field

[0001] This utility model relates to a housing structure, and more particularly to a housing structure for a domain controller. Background Technology

[0002] With the rapid development of domain controller applications, the computing power and functional requirements of domain controllers are increasing, which in turn leads to higher requirements for their heat dissipation performance.

[0003] The domain controller's enclosure is a crucial heat dissipation structure. Currently, to improve the enclosure's heat dissipation capacity, the common approach is to add heat sink fins. However, simply increasing the number of heat sink fins does not help improve airflow, especially in areas with concentrated heat sources. Simply adding heat sink fins cannot solve the problem of timely heat dissipation from these areas. Utility Model Content

[0004] One of the objectives of this invention is to provide a housing for a controller, which, through a reasonable structural design, provides a heat dissipation solution that can both improve the flow performance of air-cooled air and enhance the heat dissipation capacity of areas with concentrated heat sources.

[0005] To achieve the above objectives, this utility model proposes a housing for a domain controller, wherein:

[0006] The outer surface of the housing has a first heat dissipation area corresponding to the main heat-generating element of the domain controller and a second heat dissipation area surrounding the first heat dissipation area.

[0007] The first heat dissipation area has first heat dissipation fins arranged in an interleaved manner and at least one recessed portion that is recessed toward the inner cavity of the housing. The recessed portion forms a first heat dissipation protrusion on the inner surface of the housing. The first heat dissipation protrusion is used to thermally connect with at least one electronic device of the domain controller.

[0008] The second heat dissipation area has a number of radial heat dissipation fins that extend outward from the first heat dissipation area.

[0009] Furthermore, in the housing described in this utility model, the radial heat dissipation fins include a second heat dissipation fin and a third heat dissipation fin, wherein the extension length of the third heat dissipation fin is shorter than that of the second heat dissipation fin.

[0010] Furthermore, in the housing described in this utility model, the second heat dissipation fins and the third heat dissipation fins are alternately arranged.

[0011] Furthermore, in the housing described in this utility model, the third heat dissipation fin is disposed near the extended end of the second heat dissipation fin that is relatively far from the first heat dissipation area.

[0012] Furthermore, in the housing described in this utility model, the height of the first heat dissipation fin is lower than the height of the radial heat dissipation fin, so as to form a cavity in the first heat dissipation area.

[0013] Furthermore, in the housing described in this utility model, a fan assembly is provided within the recessed cavity.

[0014] Furthermore, in the housing described in this utility model, the housing includes an upper cover and a lower cover connected to the upper cover to form an inner cavity of the housing. The first heat dissipation area and the second heat dissipation area are disposed on the outer surface of the upper cover, and the inner surface of the lower cover is provided with a second heat dissipation protrusion. The second heat dissipation protrusion is used to thermally exchange with at least one electronic device of the domain controller.

[0015] Furthermore, in the housing described in this utility model, the first heat dissipation boss and / or the second heat dissipation boss are provided with a heat-conducting layer.

[0016] Furthermore, in the housing described in this utility model, the outer surface of the housing has a surface treatment layer that improves thermal radiation performance.

[0017] Another objective of this invention is to provide a domain controller with excellent heat dissipation performance, thereby ensuring the performance stability of the domain controller.

[0018] To achieve the above objectives, the present invention also provides a domain controller, which includes a housing as described above, and a printed circuit board assembly disposed within the internal cavity of the housing, the printed circuit board assembly including a printed circuit board and electronic devices disposed thereon.

[0019] Furthermore, in the domain controller described in this utility model, when the fan assembly is provided on the housing, the electrical connection terminal of the fan assembly is connected to the electrical connection terminal of the printed circuit board in contact with the ground.

[0020] Furthermore, in the domain controller described in this utility model, the electrical connection terminals of the fan assembly and / or the electrical connection terminals of the printed circuit board have metal springs.

[0021] Another object of this invention is to provide a vehicle having a domain controller as described above.

[0022] The housing for the domain controller described in this invention can improve the flow performance of air-cooled air and enhance the heat dissipation capacity of areas with concentrated heat sources. Furthermore, it has a simple structure, high adaptability, and low cost.

[0023] The domain controller described in this invention has excellent heat dissipation capabilities and low cost. Attached Figure Description

[0024] Figure 1 The split structure of the enclosure for a domain controller according to this invention is shown from one perspective in one embodiment.

[0025] Figure 2 Showing Figure 1 A magnified view of the middle part of the structure at point A.

[0026] Figure 3 This invention provides a partial view of the enclosure for a domain controller as described in one embodiment.

[0027] Figure 4 The diagram shows a split structure of the domain controller described in this invention in one embodiment. Detailed Implementation

[0028] The following description, in conjunction with the accompanying drawings and specific embodiments, will further explain and illustrate the housing, domain controller, and vehicle of this utility model. However, such explanation and illustration do not constitute an undue limitation on the technical solution of this utility model.

[0029] The domain controller's enclosure is a crucial heat dissipation structure. Currently, to improve the enclosure's heat dissipation capacity, the common approach is to add heat sink fins. However, simply increasing the number of heat sink fins does not help improve airflow, especially in areas with concentrated heat sources. Simply adding heat sink fins cannot solve the problem of timely heat dissipation from these areas.

[0030] To address the aforementioned problems, this invention proposes, in one embodiment, a housing for a domain controller.

[0031] Figure 1 The split structure of the enclosure for a domain controller according to this invention is shown from one perspective in one embodiment.

[0032] Figure 2 Showing Figure 1 A magnified view of the middle part of the structure at point A.

[0033] Figure 3 This invention provides a partial view of the enclosure for a domain controller as described in one embodiment.

[0034] like Figure 1 As shown, in some embodiments, the outer surface 101 of the housing for the domain controller has a first heat dissipation area P1 corresponding to the main heat-generating element of the domain controller and a second heat dissipation area P2 surrounding the first heat dissipation area P1.

[0035] like Figure 1As shown, the second heat dissipation area P2 has a number of radial heat dissipation fins that extend outward from the first heat dissipation area P1.

[0036] like Figure 1 , Figure 2 and Figure 3 As shown, the first heat dissipation area P1 has first heat dissipation fins 102 arranged in an interleaved manner and at least one recessed portion 103 facing the inner cavity of the housing, such as Figure 3 As shown, the recess 103 forms a first heat dissipation protrusion 105 on the inner surface 104 of the housing, the first heat dissipation protrusion 105 being used for thermally exchanging connection with at least one electronic device of the domain controller.

[0037] According to this configuration, the present invention increases the heat dissipation area of ​​the first heat dissipation region P1, which corresponds to the main heat-generating element (e.g., the main chip), by providing multiple intersecting first heat dissipation fins 102 on the outer surface 101 of the housing. Furthermore, by providing a recessed portion 103 in the first heat dissipation region P1 that sinks towards the printed circuit board of the domain controller, the heat dissipation area of ​​this region is increased, improving heat conduction and heat dissipation at concentrated heat sources. Based on this structure, a first heat dissipation protrusion 105 is formed on the inner surface opposite to the outer surface, connecting to at least one electronic device of the domain controller for heat exchange, further improving the cooling effect on the main heat-generating electronic device. This also avoids the increased housing wall thickness that might result from the heat dissipation protrusion, and structurally enhances the structural stability of the housing, thus achieving multiple benefits. In addition, radial heat dissipation fins are provided in the second heat dissipation region P2, further increasing the heat dissipation area and improving the flow of cooling air, thereby quickly dissipating the heat from the first heat dissipation region P1 through the gas flow channel, thus improving the overall heat dissipation effect of the housing.

[0038] like Figure 1 As shown, in some more specific embodiments, the radial heat dissipation fins of the second heat dissipation region P2 may include a second heat dissipation fin 106 and a third heat dissipation fin 107, wherein the extension length of the third heat dissipation fin 107 is shorter than that of the second heat dissipation fin 106. This arrangement maximizes the heat dissipation surface area while also ensuring the ease of processing the radial heat dissipation fins on the outer casing surface.

[0039] like Figure 1 As shown, in some more specific embodiments, both the second heat dissipation fin 106 and the third heat dissipation fin 107 can be straight-plate heat dissipation fins.

[0040] Of course, in some other alternative implementations, only the second heat dissipation fins may be provided in the second heat dissipation area.

[0041] like Figure 1 As shown, in some more specific embodiments, the second heat dissipation fin 106 and the third heat dissipation fin 107 can be arranged alternately.

[0042] like Figure 1 As shown, in some more specific embodiments, the third heat dissipation fin 107 is located at the extension end of the second heat dissipation fin 106 that is relatively far from the first heat dissipation area P1, rather than at the end that is close to the first heat dissipation area P1. This arrangement takes into account the ease of processing of the radial heat dissipation fins on the outer shell surface, while also taking into account the reasonable spacing between the heat dissipation fins, so as to further optimize the flow channel design of the cooling gas.

[0043] In addition, such as Figure 1 As shown, in some embodiments, the height of the first heat dissipation fin 102 is lower than the height of the surrounding radial heat dissipation fins, thereby forming a cavity in the first heat dissipation area P1. This arrangement reduces the height of the heat dissipation fins in the central region of the upper surface of the housing, allowing cooling airflow to flow from the outside to the central region (i.e., the first heat dissipation area), where there is virtually no resistance to reduce cooling airflow, thus further improving heat dissipation. Furthermore, this arrangement further reduces thermal resistance by improving the flow characteristics along the contour of the heat dissipation fins, thereby improving heat dissipation.

[0044] To further improve heat dissipation, in some embodiments, a fan assembly can be installed inside the cavity to further enhance the flow of cooling gas.

[0045] Of course, in some other implementations, where the power consumption requirements of the domain controller are low, a fan assembly may not be required, thus providing a relatively low-cost solution.

[0046] like Figure 1 As shown, in some embodiments, for ease of installation, the housing includes an upper cover 11 and a lower cover 12 connected to the upper cover 11 to form an inner cavity of the housing. The first heat dissipation area P1 and the second heat dissipation area P2 are both located on the outer surface of the upper cover 11.

[0047] Of course, in other alternative implementations, depending on the location of the main heat-generating element, the first heat dissipation area P1 and the second heat dissipation area P2 can also be located in other positions on the housing, such as on the lower cover.

[0048] In some more specific embodiments, both the upper cover 11 and the lower cover 12 can be made of stamped aluminum sheet, so as to further achieve the beneficial effect of lightweight shell while meeting the structural strength requirements.

[0049] In some embodiments, the inner surface 108 of the lower cover 12 is provided with a second heat dissipation protrusion 109 protruding toward the printed circuit board. The second heat dissipation protrusion 109 is used for thermally exchanging connection with at least one electronic device of the domain controller. With this arrangement, the various electronic devices can be cooled almost simultaneously, which improves cooling efficiency and ensures cooling uniformity.

[0050] In some more specific embodiments, a thermally conductive layer may be provided on the first heat dissipation boss 105 and / or the second heat dissipation boss 109. The thermally conductive layer can reduce thermal resistance, thereby further improving the heat conduction effect.

[0051] In some more specific embodiments, the thermally conductive layer may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheets, or similar thermally conductive materials.

[0052] In some specific embodiments, the outer surface of the housing may also have a surface treatment layer to improve thermal radiation performance, thereby further increasing the heat dissipation capacity of the housing.

[0053] In some more specific embodiments, the surface treatment layer can be formed by spraying paint on the outer surface of the housing or by anodizing the housing surface by deposition plating.

[0054] In some other embodiments, this invention also provides a domain controller.

[0055] Figure 4 The diagram shows a split structure of the domain controller described in this invention in one embodiment.

[0056] like Figure 4 As shown, in some embodiments, the domain controller includes a housing as described above, wherein the housing includes an upper cover 11 and a lower cover 12 connected to the upper cover 11 by a connector 13, such as screws. The upper cover 11 and the lower cover 12 are joined together to form an internal cavity for accommodating a printed circuit board assembly. The printed circuit board assembly 200 is disposed within the internal cavity of the housing, and the printed circuit board assembly 200 includes a printed circuit board 201 and electronic devices 202 disposed thereon.

[0057] In this invention, the electronic devices on the printed circuit board can be a system on a chip (SOC), or other electronic devices that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.

[0058] like Figure 4 As shown, in some embodiments, a plurality of electronic devices 202 with different power consumptions, such as chips, are disposed on the upper surface of the printed circuit board 201. These electronic devices 202 with different power consumptions are in contact with the first heat dissipation protrusion 105 on the inner surface of the upper cover 11 through the thermally conductive layer 31. In this way, the heat generated by these multiple electronic devices 202 with different power consumptions can be quickly transferred to the upper cover 11 and the first heat dissipation fins 102 and the radial heat dissipation fins thereon.

[0059] In some more specific implementations, such as Figure 4 As shown, a fan assembly 300 can also be installed in the cavity Q. The airflow generated by the rotation of the fan blades of the fan assembly 300 will exchange the heat on the upper cover 11, the first heat dissipation fin 102 and the radial heat dissipation fins with the air around the domain controller, thereby accelerating the heat dissipation process.

[0060] In some more specific embodiments, the fan assembly 300 can be mounted in the recess Q via the fan connector 14.

[0061] In some more specific implementations, such as Figure 4 As shown, the electrical connection terminal 301 of the fan assembly is connected to the electrical connection terminal 203 of the printed circuit board 201 by contact. This connection method improves assembly production efficiency and also ensures the stability of the electrical connection.

[0062] In some more specific embodiments, the electrical connection terminal 203 of the printed circuit board may be provided with a resilient metal spring, thereby making press-fit contact with the electrical connection terminal of the fan assembly. In other more specific embodiments, the metal spring may be provided at the electrical connection terminal 301 of the fan assembly.

[0063] In addition, such as Figure 4 As shown, the inner surface of the lower cover 12 is also provided with a number of second heat dissipation protrusions 109. The electronic devices on the lower surface of the printed circuit board can contact the second heat dissipation protrusions 109 on the lower cover 12 through the thermal conductive layer 31, thereby further enhancing the heat dissipation capability of the domain controller.

[0064] In this invention, the domain controller can be a vehicle domain controller, which is used for vehicle status control and status monitoring, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that implements human-machine interface controller functions, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).

[0065] The domain controller described in this invention can be used in vehicles, for example, in the automated driving of intelligent vehicles. Intelligent vehicles may include electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance systems (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.

[0066] Therefore, in another embodiment, this invention also provides a vehicle having the domain controller described above. Since this invention does not improve other components of the vehicle, these components will not be described in detail here.

[0067] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.

[0068] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0069] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.

Claims

1. A housing for a domain controller, characterized in that: The outer surface (101) of the housing has a first heat dissipation area (P1) corresponding to the main heat-generating element of the domain controller and a second heat dissipation area (P2) surrounding the first heat dissipation area; The first heat dissipation area has first heat dissipation fins (102) arranged in an interleaved manner and at least one recess (103) recessed toward the inner cavity of the housing. The recess forms a first heat dissipation boss (105) on the inner surface (104) of the housing. The first heat dissipation boss is used to thermally connect with at least one electronic device of the domain controller. The second heat dissipation area has a number of radial heat dissipation fins that extend outward from the first heat dissipation area.

2. The outer casing as claimed in claim 1, characterized in that, The radial heat dissipation fins include a second heat dissipation fin (106) and a third heat dissipation fin (107), wherein the extension length of the third heat dissipation fin is shorter than that of the second heat dissipation fin.

3. The outer casing as described in claim 2, characterized in that, The second and third heat dissipation fins are arranged alternately.

4. The outer casing as described in claim 2, characterized in that, The third heat dissipation fin is positioned near the extended end of the second heat dissipation fin, which is relatively far from the first heat dissipation area.

5. The outer casing as claimed in claim 1, characterized in that, The height of the first heat dissipation fin is lower than the height of the radial heat dissipation fins, so as to form a cavity (Q) in the first heat dissipation area.

6. The outer casing as claimed in claim 5, characterized in that, A fan assembly (300) is provided inside the cavity.

7. The outer casing as claimed in claim 1, characterized in that, The housing includes an upper cover (11) and a lower cover (12) connected to the upper cover to form an inner cavity of the housing. The first heat dissipation area and the second heat dissipation area are disposed on the outer surface of the upper cover. The inner surface (108) of the lower cover is provided with a second heat dissipation protrusion (109). The second heat dissipation protrusion is used to thermally connect with at least one electronic device of the domain controller.

8. The housing as claimed in claim 1 or 7, characterized in that, The first heat dissipation boss and / or the second heat dissipation boss are provided with a heat-conducting layer (31).

9. The outer casing as claimed in claim 1, characterized in that, The outer surface of the outer casing has a surface treatment layer to improve thermal radiation performance.

10. A domain controller, characterized in that, The housing includes the housing as described in any one of claims 1-9, and a printed circuit board assembly (200) disposed within the internal cavity of the housing, the printed circuit board assembly including a printed circuit board (201) and electronic devices (202) disposed thereon.

11. The domain controller as claimed in claim 10, characterized in that, When the fan assembly (300) is provided on the housing, the electrical connection terminal (301) of the fan assembly is connected to the electrical connection terminal (203) of the printed circuit board by contact.

12. The domain controller as claimed in claim 11, characterized in that, The electrical connection terminals of the fan assembly and / or the electrical connection terminals of the printed circuit board have metal springs.

13. A vehicle, characterized in that, It has a domain controller as described in any one of claims 10-12.

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