Heat dissipation device and photovoltaic inverter

Abstract

The utility model belongs to the technical field of photovoltaic inverters, and particularly relates to a heat dissipation device and a photovoltaic inverter. The heat dissipation device comprises a shell, a heat dissipation fan and a first heat exchange assembly. A containing bin body and a cavity located outside the containing bin body are arranged in the shell, the interior of the containing bin body is used for containing a device needing to be cooled, an air outlet is formed in the top wall of the shell, and a first air inlet is formed in at least one side wall of the shell; the cooling fan is arranged on the top of the shell and used for guiding airflow to flow from the first air inlet to the air outlet. The first heat exchange assembly comprises a condenser and an evaporator, the condenser is located in the cavity, a medium outlet of the evaporator communicates with a medium inlet of the condenser, a medium outlet of the condenser communicates with a medium inlet of the evaporator, and the condenser is located above the evaporator; the evaporator is arranged on the outer wall of the containing bin and used for making heat-conducting contact with a device needing heat dissipation. According to the technical scheme, the heat dissipation device is good in heat dissipation efficiency, low in noise and convenient to hang on a wall and maintain.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic inverter technology, specifically relating to a heat dissipation device and a photovoltaic inverter. Background Technology

[0002] As a key device in photovoltaic power systems that converts direct current (DC) to alternating current (AC), the efficiency and lifespan of photovoltaic inverters directly affect the performance of the entire system. However, during operation, the power and magnetic components within the inverter generate a significant amount of heat, especially in high-temperature environments. Excessive heat can lead to decreased inverter efficiency, performance degradation, and even damage. Therefore, heat dissipation in photovoltaic inverters has always been a research focus. Traditional inverters rely on their own heat sinks and heat transfer between the casing and the environment for cooling, but their heat dissipation efficiency is limited. As inverter power increases, natural heat dissipation is no longer sufficient to meet the demands of current high-power inverters.

[0003] Existing technologies typically use a combination of fans and heat exchangers to cool inverters. However, their internal structure often causes the following problems: the cooling duct is too long, resulting in greater airflow resistance and hindering heat dissipation; the air outlet faces forward, so when a person stands in front of the inverter, hot air blows directly at them, and the noise is loud; the fan is located behind the condenser, which increases the overall thickness of the unit, making it inconvenient for wall mounting and difficult to maintain and replace.

[0004] Therefore, there is an urgent need to propose a heat dissipation device and a photovoltaic inverter to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation device with a reasonable internal component layout and good heat dissipation effect. This purpose is achieved through the following technical solution:

[0006] The first aspect of this utility model provides a heat dissipation device, comprising:

[0007] The housing has an internal accommodating chamber and a cavity located outside the accommodating chamber. The interior of the accommodating chamber is used to place heat dissipation devices. An air outlet is provided on the top wall of the housing, and a first air inlet is provided on at least one side wall of the housing.

[0008] A cooling fan is disposed on the top of the housing and is used to guide airflow from the first air inlet to the air outlet.

[0009] The first heat exchange assembly includes a condenser and an evaporator. The condenser is located in the chamber, and the medium outlet of the evaporator is connected to the medium inlet of the condenser. The condenser is located above the evaporator. The evaporator is disposed on the outer wall of the receiving chamber and is used for thermally conductive contact with the heat dissipation device.

[0010] When using the heat dissipation device provided by this technical solution, the heat dissipation device can be placed inside the housing. The evaporator of the first heat exchange component and the heat dissipation device are in thermal contact and exchange heat. The air circulation is accelerated by the cooling fan, which can send the heat generated by the condenser of the first heat exchange component out of the housing in time. This is beneficial to improve the heat exchange efficiency of the first heat exchange component and effectively avoid damage to the performance or lifespan of the heat dissipation device due to excessive temperature.

[0011] In addition, the heat dissipation device of this utility model may also have the following additional technical features:

[0012] In some embodiments of this utility model, the condenser includes a gas collecting pipe, a liquid collecting pipe, and a plurality of first connecting pipes; the first heat exchange assembly includes an inlet pipe and a return pipe, the gas collecting pipe and the liquid collecting pipe are arranged in parallel and connected through the plurality of first connecting pipes, the gas collecting pipe is connected to the medium outlet of the evaporator through the inlet pipe, the liquid collecting pipe is connected to the medium inlet of the evaporator through the return pipe, and the gas collecting pipe is positioned higher than the liquid collecting pipe.

[0013] In some embodiments of this utility model, two gas collecting pipes are provided, with the two gas collecting pipes located on the upper sides of the liquid collecting pipe respectively; or, two liquid collecting pipes are provided, with the two liquid collecting pipes located on the lower sides of the gas collecting pipe respectively.

[0014] In some embodiments of this utility model, two gas collecting pipes are provided, with the two gas collecting pipes located on the upper sides of the liquid collecting pipe respectively, and the two gas collecting pipes are connected through a second connecting pipe; or, two liquid collecting pipes are provided, with the two liquid collecting pipes located on the lower sides of the gas collecting pipe respectively, and the two liquid collecting pipes are connected through a second connecting pipe.

[0015] In some embodiments of this utility model, the evaporator includes a base plate and a cover plate, the base plate and the cover plate are connected to form a cavity, the base plate faces the receiving chamber, the air inlet pipe and the liquid return pipe are respectively connected to the cavity through the cover plate, heat dissipation teeth are provided in the cavity, one side of the heat dissipation teeth is connected to the inner wall of the base plate, and the outer wall of the base plate is used for thermal contact with the heat dissipation device; the medium outlet of the evaporator is located above the medium inlet of the evaporator.

[0016] In some embodiments of this utility model, the heat dissipation teeth are disposed in the middle region of the cavity, a gas conduction area is formed above the heat dissipation teeth, a liquid conduction area is formed below the heat dissipation teeth, the gas conduction area is connected to the air inlet pipe, and the liquid conduction area is connected to the liquid return pipe.

[0017] The other side of the heat dissipation dent is connected to the inner wall of the cover plate; or, a reinforcing rib is provided between the substrate and the cover plate, and the substrate and the cover plate are connected by the reinforcing rib.

[0018] In some embodiments of this utility model, a second heat exchange component is provided inside the shell, the second heat exchange component is located outside the receiving chamber, and a second air inlet is provided on the shell facing the second heat exchange component. The second heat exchange component is a partition wall heat exchanger.

[0019] In some embodiments of this utility model, a second heat exchange component is provided inside the shell. The second heat exchange component is located outside the accommodating chamber. The second heat exchange component is a gravity heat pipe heat exchanger. The gravity heat pipe heat exchanger includes a condensation component and an evaporation component. The condensation component and the evaporation component are connected to form a loop through a two-phase pipeline.

[0020] In some embodiments of this utility model, an internal circulation fan is provided inside the receiving chamber, and an internal circulation air inlet and an internal circulation air outlet are provided on the side wall of the receiving chamber. The internal circulation air inlet and the internal circulation air outlet are connected to the interior of the receiving chamber, and the internal circulation fan is provided corresponding to the internal circulation air outlet or the internal circulation air inlet; the external circulation airflow of the second heat exchange component is formed by the cooling fan.

[0021] In a second aspect, this utility model provides a photovoltaic inverter, which includes an electronic control component and the aforementioned heat dissipation device; the electronic control component includes a first heating element, a power element, a first electronic component, and a circuit board; the first heating element, the power element, and the first electronic component are all electrically connected to the circuit board; the power element is in thermal contact with the evaporator; the first heating element is located in the chamber and close to the condenser, and the power element and the first electronic component are disposed inside the housing. Attached Figure Description

[0022] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0023] Figure 1 A schematic diagram of the structure of a photovoltaic inverter according to an embodiment of the present invention is shown from a certain perspective.

[0024] Figure 2 A schematic diagram of the structure of a photovoltaic inverter according to an embodiment of the present invention is shown from another perspective.

[0025] Figure 3 A schematic diagram of the structure of a condenser according to an embodiment of the present invention is shown.

[0026] Figure 4 The schematic diagram shows the structure of a photovoltaic inverter (with an inverted V-shaped condenser) according to an embodiment of the present invention from a certain perspective.

[0027] Figure 5 A schematic diagram of the evaporator according to an embodiment of the present invention is shown from a certain perspective.

[0028] Figure 6 A schematic diagram of the evaporator according to an embodiment of the present invention is shown from another perspective.

[0029] Figure 7 The schematic diagram shows the structure of a photovoltaic inverter (with a second heat exchange component added, which is a partition wall heat exchanger) according to an embodiment of the present invention from a certain perspective.

[0030] Figure 8 The schematic diagram shows a photovoltaic inverter (with a second heat exchange component added, which is a partition wall heat exchanger) according to an embodiment of the present invention from another perspective.

[0031] Figure 9 A schematic diagram of the structure of a photovoltaic inverter (with an L-shaped air duct for external circulation and an L-shaped air duct for internal circulation) according to an embodiment of the present invention is shown.

[0032] Figure 10 A schematic diagram of the structure of a photovoltaic inverter (with an L-shaped air duct for external circulation and a C-shaped air duct for internal circulation) according to an embodiment of the present invention is shown.

[0033] Figure 11 A schematic diagram of the structure of a photovoltaic inverter (with an added second heat exchange component, which is a gravity heat pipe heat exchanger) according to an embodiment of the present invention is shown.

[0034] Figure 12 A schematic diagram of a second heat exchange assembly according to an embodiment of the present invention is shown.

[0035] Figure 13 A schematic diagram of another structure of the second heat exchange assembly according to an embodiment of the present invention is shown.

[0036] The labels in the attached diagram are as follows:

[0037] 100. Housing; 110. Air outlet; 120. First air inlet; 130. Second air inlet; 140. Chamber;

[0038] 200. Housing; 300. Cooling fan;

[0039] 400. First heat exchange assembly; 410. Condenser; 411. Gas collecting pipe; 412. Liquid collecting pipe; 413. First connecting pipe; 414. Second connecting pipe; 420. Evaporator; 421. Base plate; 422. Cover plate; 423. Heat dissipation fins; 424. Reinforcing rib; 425. Gas conduction area; 426. Liquid conduction area; 430. Gas inlet pipe; 440. Liquid return pipe;

[0040] 500, Second heat exchange component; 510, Condensation component; 520, Evaporation component; 600, Internal circulation fan; 700, Power device; 800, First heating element; 900, Circuit board. Detailed Implementation

[0041] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0042] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0043] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0044] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations.

[0045] Figure 1 The schematic diagram shows a structural schematic of a photovoltaic inverter (condenser 410 is V-shaped) according to an embodiment of the present invention from a certain perspective. Figure 2 A schematic diagram of the structure of a photovoltaic inverter (condenser 410 is V-shaped) according to an embodiment of the present invention is shown from another perspective. Figure 1 and Figure 2As shown, this utility model proposes a heat dissipation device, including a housing 100, a cooling fan 300, and a first heat exchange component 400; the housing 100 has an internal receiving chamber 200 and a cavity 140 located outside the receiving chamber 200, the receiving chamber 200 is used to place the device to be cooled, the top wall of the housing 100 has an air outlet 110, and at least one side wall of the housing 100 has a first air inlet 120; the cooling fan 300 is located on the top of the housing, and the cooling fan 300... 0 is used to guide airflow from the first air inlet 120 to the air outlet 110; the first heat exchange assembly 400 includes a condenser 410 and an evaporator 420. The condenser 410 is located in the chamber 140. The medium outlet of the evaporator 420 is connected to the medium inlet of the condenser 410, and the medium outlet of the condenser 410 is connected to the medium inlet of the evaporator 420. The condenser 410 is located above the evaporator 420; the evaporator 420 is disposed on the outer wall of the housing 200 for heat conduction contact with the heat dissipation device.

[0046] When using the heat dissipation device provided by this technical solution, the device to be cooled can be placed inside the housing 200. Heat exchange occurs through the evaporator 420 of the first heat exchange component 400 and the device to be cooled via conductive contact. The cooling fan 300 accelerates airflow, effectively removing the heat generated by the condenser 410 of the first heat exchange component 400 from the housing 100. This improves the heat exchange efficiency of the first heat exchange component 400 and effectively prevents damage to the performance or lifespan of the device to be cooled due to excessive temperature. Furthermore, this heat dissipation device improves upon existing technologies by rationally arranging its internal components. First, the top of the housing 100 has ample space. By placing the cooling fan 300 on the top of the housing 100, a larger fan can be used, effectively increasing airflow and reducing the overall structural thickness, facilitating wall mounting, and avoiding maintenance difficulties caused by the first heat exchange component 400 obstructing the view. Additionally, the fan's location on the top of the housing 100 helps reduce frontal noise. Second, the air outlet 110 is located on the top of the housing 100, preventing the airflow from directly hitting the operator and causing discomfort. Furthermore, the first air inlet 120 is located on one or more side walls of the housing 100, making the distance between the first air inlet 120 and the air outlet 110 closer, thereby reducing airflow resistance, which is conducive to accelerating airflow and improving heat dissipation efficiency.

[0047] Furthermore, the chamber 140 may be a rectangular space located above the receiving chamber 200, or it may be an L-shaped space (including a rectangular space located above the receiving chamber 200 and a rectangular space located behind the receiving chamber 200). If the chamber 140 is only a rectangular space located above the receiving chamber 200, then the evaporator 420 is not located in the chamber 140; if the chamber 140 is L-shaped, then the evaporator 420 is located in the rectangular space behind the receiving chamber 200. This application does not limit this.

[0048] In this embodiment, the heat-dissipating device includes a power device 700. Optionally, the housing 200 can also be used to house the circuit board 900 and other electronic components electrically connected to it, depending on actual needs. Optionally, the first heat exchange component 400 is disposed outside the housing 200, and a window is provided on the side wall of the housing 200 facing the first heat exchange component 400. The evaporator 420 is disposed close to the window, and the heat-dissipating device is attached to the outer wall of the evaporator 420 through the window. Optionally, a first heating device 800 is also disposed inside the housing 100. The first heating device 800 can be disposed on the top of the outer side of the housing 200, i.e., inside the chamber 140, so that the first heating device 800 is also located in the air duct formed by the cooling fan 300, thereby achieving heat dissipation of the first heating device 800. Of course, the first heating device 800 can also be disposed inside the housing 200. Optionally, the first heating device 800 is a magnetic device.

[0049] Furthermore, the condenser 410 includes a gas collecting pipe 411, a liquid collecting pipe 412, and a plurality of first connecting pipes 413. The first heat exchange assembly 400 includes an inlet pipe 430 and a return pipe 440. The gas collecting pipe 411 and the liquid collecting pipe 412 are arranged in parallel and connected by a plurality of first connecting pipes 413. The gas collecting pipe 411 is connected to the medium outlet of the evaporator 420 through the inlet pipe 430, and the liquid collecting pipe 412 is connected to the medium inlet of the evaporator 420 through the return pipe 440. The gas collecting pipe 411 is positioned higher than the liquid collecting pipe 412.

[0050] Specifically, the medium is divided into a gas-liquid two-phase system inside the first heat exchange component 400. When the device requiring heat dissipation generates heat, the heat is transferred to the evaporator 420, causing the medium to vaporize into a gaseous state. Due to the low density of vapor, it can enter the condenser 410 through the inlet pipe 430. After cooling down in the condenser 410, the vapor becomes liquid again. The density of the liquid medium increases, and it flows back to the evaporator 420 through the return pipe 440 under gravity, thus achieving the function of heat dissipation through this cycle. Energy absorption and release are achieved through gas-liquid phase change, resulting in high heat transfer efficiency and good heat dissipation effect for the device requiring heat dissipation. Optionally, the first connecting pipe 413 is a microchannel flat tube. To increase the heat dissipation area, two adjacent first connecting pipes 413 can be connected by heat dissipation fins.

[0051] Furthermore, Figure 3 A schematic diagram of the structure of a condenser 410 according to an embodiment of the present invention is shown. Figure 4 The diagram schematically illustrates the inverted V-shaped structure of the photovoltaic inverter condenser 410 according to an embodiment of the present invention from a certain perspective. See also... Figure 3 and Figure 4 There are two gas collecting pipes 411, located on either side above the liquid collecting pipe 412; or, there are two liquid collecting pipes 412, located on either side below the gas collecting pipe 411. Figure 3 With the connection shown, the condenser 410 is roughly V-shaped. Figure 4 With the connection shown, the condenser 410 is roughly in an inverted V shape.

[0052] In other embodiments, the number of gas collecting pipes 411 and liquid collecting pipes 412 can be one or more, and the number of gas inlet pipes 430 and liquid return pipes 440 can be set according to the usage requirements, as long as the condenser 410 and evaporator 420 can form a medium flow loop.

[0053] Furthermore, in some embodiments, two gas collecting pipes 411 are provided, with the two gas collecting pipes 411 located on the upper sides of the liquid collecting pipe 412 respectively. The two gas collecting pipes 411 are connected by a second connecting pipe 414. Connecting the two gas collecting pipes 411 through the second connecting pipe 414 can evenly distribute the pressure and flow rate of the gaseous medium between the two gas collecting pipes 411, making the circulation of the medium more stable. Alternatively, two liquid collecting pipes 412 are provided, with the two liquid collecting pipes 412 located on the lower sides of the gas collecting pipe 411 respectively. The two liquid collecting pipes 412 are connected by a second connecting pipe 414. Connecting the two liquid collecting pipes 412 through the second connecting pipe 414 can evenly distribute the pressure and flow rate of the liquid medium between the two liquid collecting pipes 412, making the circulation of the medium more stable.

[0054] Furthermore, Figure 5 A schematic diagram of the evaporator 420 according to an embodiment of the present invention is shown from a certain perspective. Figure 6 A schematic structural diagram of the evaporator 420 according to an embodiment of the present invention is shown from another perspective. See also Figure 5 and Figure 6 The evaporator 420 includes a substrate 421 and a cover plate 422. The substrate 421 and the cover plate 422 are connected to form a cavity. The substrate 421 faces the receiving chamber 200. The air inlet pipe 430 and the liquid return pipe 440 are respectively connected to the cavity through the cover plate 422. The cavity is provided with heat dissipation teeth 423. One side of the heat dissipation teeth 423 is connected to the inner wall of the substrate 421. The outer wall of the substrate 421 is used for thermal contact with the heat dissipation device. The medium outlet of the evaporator 420 is located above the medium inlet of the evaporator 420.

[0055] Optionally, the heat dissipation fins 423 can be integrally formed with the substrate 421, or they can be fixed to the substrate 421 by welding. Optionally, the outer surface of the substrate 421 is in contact with the device that needs to be dissipated.

[0056] Furthermore, the heat dissipation fins 423 are disposed in the middle region of the cavity, a gas conduction area 425 is formed above the heat dissipation fins 423, and a liquid conduction area 426 is formed below the heat dissipation fins 423. The gas conduction area 425 is connected to the air inlet pipe 430, and the liquid conduction area 426 is connected to the liquid return pipe 440. The other side of the heat dissipation fins 423 is connected to the inner wall of the cover plate 422. Alternatively, a reinforcing rib 424 is provided between the substrate 421 and the cover plate 422, and the substrate 421 and the cover plate 422 are connected by the reinforcing rib 424.

[0057] The liquid conduction area 426 is used to distribute the flow of the liquid medium returning from the return pipe 440, ensuring that all heat-dissipating components in contact with the evaporator 420 receive adequate heat dissipation. The gas conduction area 425 is used to guide the gaseous medium, vaporized by the heat dissipation teeth 423, to the inlet pipe 430, reducing the flow resistance of the gaseous medium. Connecting the side of the heat dissipation teeth 423 away from the substrate 421 to the cover plate 422 can strengthen the structural strength. The reinforcing ribs 424 also contribute to improving structural strength and preventing bulging of the substrate 421 and the cover plate 422.

[0058] Furthermore, Figure 7 The diagram schematically illustrates the structure of a photovoltaic inverter (with an added second heat exchange component 500, which is a partition wall heat exchanger) according to an embodiment of the present invention, viewed from a certain angle. Figure 8 The diagram schematically illustrates the structure of a photovoltaic inverter according to an embodiment of the present invention (with an added second heat exchange component 500, which is a partition wall heat exchanger) from another perspective. Figure 9 A schematic diagram of the photovoltaic inverter according to an embodiment of the present invention is shown from another perspective. See also Figures 7 to 9 The shell 100 is provided with a second heat exchange component 500. The second heat exchange component 500 is located on the outside of the housing 200. The shell 100 is provided with a second air inlet 130 facing the second heat exchange component 500. The second heat exchange component 500 is a partition heat exchanger.

[0059] By adding a second heat exchange component 500, heat dissipation from the housing 200 can be enhanced, greatly improving heat dissipation efficiency. Optionally, the second air inlet 130 can be located on the side of the housing 100 near the second heat exchange component 500, or it can be located on the bottom of the housing 100 directly opposite the second heat exchange component 500. Optionally, the second heat exchange component 500 can be located on the left or right side of the housing 200.

[0060] Indirect heat exchangers use solid walls to separate two or more fluids at different temperatures, and achieve heat exchange through the heat conduction of the walls. They have advantages such as high efficiency, flexibility, reliability, energy saving and scalability.

[0061] Furthermore, an internal circulation fan 600 is provided inside the housing 200, and an internal circulation air inlet and an internal circulation air outlet are provided on the side wall of the housing 200. The internal circulation air inlet and the internal circulation air outlet are connected to the interior of the housing 200, and the internal circulation fan 600 is provided corresponding to the internal circulation air outlet or the internal circulation air inlet; the external circulation airflow of the second heat exchange component is formed by the cooling fan 300.

[0062] Optionally, the internal circulation fan 600 and the internal circulation air inlet are positioned opposite the top of the second heat exchange component 500. Depending on the location of the second air inlet 130, the channel for external air circulation to the second heat exchanger can be type I (second air inlet 130 is located at the bottom of the second heat exchange component 500) or type L (second air inlet 130 is located on the side of the second heat exchange component 500 opposite to the receiving chamber 200); depending on the location of the internal circulation air outlet, the channel for internal air circulation to the second heat exchanger can be type L (internal circulation air outlet is located below the second heat exchange component 500) or type C (internal circulation air inlet and outlet are located on the same side of the second heat exchange component). For example, Figure 7 The air duct arrangement shown is as follows: the external circulation is a type I air duct, and the internal circulation is a type C air duct. Figure 9 The air duct arrangement shown is as follows: the external circulation is an L-shaped air duct, and the internal circulation is an L-shaped air duct. Figure 10 The air duct arrangement shown is as follows: the external circulation is an L-shaped air duct, and the internal circulation is a C-shaped air duct.

[0063] See Figures 11 to 13In some embodiments, a second heat exchange assembly 500 is disposed inside the housing 100, located outside the housing 200. The second heat exchange assembly 500 is a gravity heat pipe heat exchanger, comprising a condenser assembly 510 and an evaporator assembly 520, which are connected by two-phase pipes to form a loop. The principle of the gravity heat pipe heat exchanger is the same as that of the first heat exchange assembly 400; the medium inside is heated and vaporized, rises, cools and liquefies at the top, and then flows back to the bottom. Exemplarily, the condenser assembly 510 includes two horizontally arranged condenser pipes connected to adjacent condenser pipes by a connecting pipe, and the evaporator assembly 520 includes two horizontally arranged evaporator pipes connected to adjacent evaporator pipes by a connecting pipe. The condenser assembly 510 and the evaporator assembly 520 are connected by two-phase pipes to form a loop. Alternatively, the second heat exchange assembly 500 may also include multiple horizontally arranged pipes connected to adjacent pipes by a connecting pipe. The number of horizontal pipes can be two, three, or four, etc.

[0064] This technical solution also provides a photovoltaic inverter, which includes an electronic control component and the aforementioned heat dissipation device. The electronic control component includes a first heating element 800, a power element 700, a first electronic component, and a circuit board 900. The first heating element 800, the power element 700, and the first electronic component are all electrically connected to the circuit board 900. The power element 700 is in thermal contact with the evaporator 420. The first electronic component and the power element 700 are located on the same side or different sides of the circuit board 900. The first heating element 800 is located in the chamber 140 and is positioned near the condenser 410. The power element 700 and the first electronic component are located inside the housing 200. The first heating element 800 can be a magnetic device. The first heating element 800 is located outside the top wall of the housing 200 (in the external circulating airflow) and is cooled by the airflow from the external circulating fan. The first electronic component is a collective term for many devices, and the internal circulating airflow of the second heat exchange component 500 is mainly for cooling the first electronic component.

[0065] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A heat dissipation device, characterized in that, include: The housing (100) has an internal housing (200) and a chamber (140) located outside the housing (200). The internal housing (200) is used to place heat dissipation devices. The top wall of the housing (100) has an air outlet (110), and at least one side wall of the housing (100) has a first air inlet (120). A cooling fan (300) is disposed on the top of the housing and is used to guide airflow from the first air inlet (120) to the air outlet (110). A first heat exchange assembly (400) includes a condenser (410) and an evaporator (420). The condenser (410) is located in the chamber (140). The medium outlet of the evaporator (420) is connected to the medium inlet of the condenser (410), and the medium outlet of the condenser (410) is connected to the medium inlet of the evaporator (420). The condenser (410) is located above the evaporator (420). The evaporator (420) is disposed on the outer wall of the receiving chamber (200) for thermal contact with the heat dissipation device.

2. The heat dissipation device according to claim 1, characterized in that, The condenser (410) includes a gas collecting pipe (411), a liquid collecting pipe (412), and a plurality of first connecting pipes (413); the first heat exchange assembly (400) includes an inlet pipe (430) and a return pipe (440). The gas collecting pipe (411) and the liquid collecting pipe (412) are arranged in parallel and connected through the plurality of first connecting pipes (413). The gas collecting pipe (411) is connected to the medium outlet of the evaporator (420) through the inlet pipe (430). The liquid collecting pipe (412) is connected to the medium inlet of the evaporator (420) through the return pipe (440). The gas collecting pipe (411) is positioned higher than the liquid collecting pipe (412).

3. The heat dissipation device according to claim 2, characterized in that, Two gas collecting pipes (411) are provided, and the two gas collecting pipes (411) are respectively located on the upper two sides of the liquid collecting pipe (412); or, two liquid collecting pipes (412) are provided, and the two liquid collecting pipes (412) are respectively located on the lower two sides of the gas collecting pipe (411).

4. The heat dissipation device according to claim 2, characterized in that, Two gas collecting pipes (411) are provided, and the two gas collecting pipes (411) are respectively located on the upper sides of the liquid collecting pipe (412), and the two gas collecting pipes (411) are connected through a second connecting pipe (414); or, two liquid collecting pipes (412) are provided, and the two liquid collecting pipes (412) are respectively located on the lower sides of the gas collecting pipe (411), and the two liquid collecting pipes (412) are connected through a second connecting pipe (414).

5. The heat dissipation device according to claim 2, characterized in that, The evaporator (420) includes a substrate (421) and a cover plate (422). The substrate (421) and the cover plate (422) are connected to form a cavity. The substrate (421) faces the receiving chamber (200). The air inlet pipe (430) and the liquid return pipe (440) are respectively connected to the cavity through the cover plate (422). The cavity is provided with heat dissipation teeth (423). One side of the heat dissipation teeth (423) is connected to the inner wall of the substrate (421). The outer wall of the substrate (421) is used for thermal contact with the heat dissipation device. The medium outlet of the evaporator (420) is located above the medium inlet of the evaporator (420).

6. The heat dissipation device according to claim 5, characterized in that, The heat dissipation fins (423) are disposed in the middle region of the cavity. A gas conduction area (425) is formed above the heat dissipation fins (423), and a liquid conduction area (426) is formed below the heat dissipation fins (423). The gas conduction area (425) is connected to the air inlet pipe (430), and the liquid conduction area (426) is connected to the liquid return pipe (440). The other side of the heat dissipation tooth (423) is connected to the inner wall of the cover plate (422); or, a reinforcing rib (424) is provided between the substrate (421) and the cover plate (422), and the substrate (421) and the cover plate (422) are connected by the reinforcing rib (424).

7. The heat dissipation device according to claim 1, characterized in that, The housing (100) is provided with a second heat exchange assembly (500) inside. The second heat exchange assembly (500) is located outside the housing (200). The housing (100) is provided with a second air inlet (130) facing the second heat exchange assembly (500). The second heat exchange assembly (500) is a partition wall heat exchanger.

8. The heat dissipation device according to claim 1, characterized in that, The housing (100) is provided with a second heat exchange component (500) inside. The second heat exchange component (500) is located outside the housing (200). The second heat exchange component (500) is a gravity heat pipe heat exchanger. The gravity heat pipe heat exchanger includes a condenser component (510) and an evaporator component (520). The condenser component (510) and the evaporator component (520) are connected to form a loop through a two-phase pipeline.

9. The heat dissipation device according to any one of claims 7 or 8, characterized in that, An internal circulation fan (600) is provided inside the housing (200). An internal circulation air inlet and an internal circulation air outlet are provided on the side wall of the housing (200). The internal circulation air inlet and the internal circulation air outlet are connected to the interior of the housing (200). The internal circulation fan (600) is provided corresponding to the internal circulation air outlet or the internal circulation air inlet. The external circulation airflow of the second heat exchange component is formed by the cooling fan (300).

10. A photovoltaic inverter, characterized in that, The photovoltaic inverter includes an electrical control component and a heat dissipation device according to any one of claims 1-9; the electrical control component includes a first heating element (800), a power element (700), a first electronic component, and a circuit board (900); the first heating element (800), the power element (700), and the first electronic component are all electrically connected to the circuit board (900); the power element (700) is in thermal contact with the evaporator (420); the first heating element (800) is located in the chamber (140) and is disposed near the condenser (410); the power element (700) and the first electronic component are disposed inside the housing (200).

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