Device support, light-emitting device and display module

Abstract

The utility model discloses a device support, a luminescent device and a display module, the device support comprises a housing and a lead frame, the lead frame comprises two first leads, four second leads and two third leads which are mutually spaced, the first leads comprise first extension parts extending into the housing, and the second leads comprise second extension parts extending into the housing. The two sides of any first lead in the second direction are correspondingly provided with two second leads respectively, and each second lead comprises a second extending part extending into the shell, so that the first extending parts and the second extending parts can be fixed through the shell. On one hand, the first lead comprises two first welding pins, the second lead comprises two second welding pins, the edge parts of the first welding disc and the second welding disc are fixed in an auxiliary mode through the first extending part and the second extending part, the inclination and warping amplitude of the first welding disc and the second welding disc is reduced, and the inclination degree of the surfaces of the welding discs is small; the total effective welding area of the whole welding legs of the device support can be increased by increasing the number of the third welding legs.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to a device bracket, a light-emitting device, and a display module. Background Technology

[0002] With the pursuit of miniaturization in light-emitting devices, the size of device substrates in related technologies is becoming increasingly smaller, leading to smaller pads and solder feet on the substrate. Smaller pads result in a smaller effective connection area between the pad and the substrate housing, making them more prone to tilting and warping. Since the solder joints between the light-emitting chip and the pad are difficult to spread on a tilted surface, the solder joints on the tilted surface of the pad are smaller, leading to poor wire bonding stability and a higher likelihood of soldering failure. Similarly, smaller solder feet result in a smaller effective soldering area between the solder feet and external circuitry, leading to poorer connection stability between the light-emitting device and the external substrate, making the light-emitting device more susceptible to detachment. Utility Model Content

[0003] The first objective of this invention is to provide a device support that allows for a smaller degree of surface tilt of the pads and a larger effective welding area between the device support and the external circuit.

[0004] The second objective of this invention is to provide a light-emitting device that, by using the aforementioned device support, can improve the connection stability between the light-emitting chip and the pad, thereby improving the fabrication yield and lifespan of the light-emitting device, and also improving the connection stability between the light-emitting device and the external substrate.

[0005] The third objective of this utility model is to provide a display module that, by using the aforementioned light-emitting device, can improve the lifespan of the light-emitting device and the stability of the connection between the light-emitting device and the substrate, thereby improving the overall structural stability and lifespan of the display module.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, a device support is provided, comprising:

[0008] The housing includes a base and four annular structures, the four annular structures being arranged in a spaced-apart array along a first direction and a second direction on the same side of the base. Each annular structure has a cup-shaped space, and a portion of the surface of the base forms the bottom surface of the cup-shaped space; and...

[0009] A lead frame, the lead frame comprising two first leads spaced apart from each other, four second leads, and two third leads;

[0010] Two first leads are respectively disposed on two halves of the housing along the first direction. Each first lead includes a first body, two first pads, a first lead, and two first extensions. The two first pads and the first leads are connected to the first body. The first body is bent on one side of the housing along the first direction, such that the two first pads are at least partially located in the two cup-shaped spaces spaced apart along the second direction, and the first leads are located on the side of the base away from the annular structure. The two first extensions are respectively connected to the two first pads, and the first extensions extend between the annular structure and the base.

[0011] Two second leads are respectively provided on both sides of each first lead along the second direction. Each second lead includes a second body, a second pad, a third pad, a second lead, and a second extension. The second pad and the second lead are both connected to the second body. The second body and the corresponding first body are bent on the same side of the housing along the first direction, such that the second pads of the two second leads are at least partially located in the two cup-shaped spaces spaced apart along the second direction, and the second lead is located on the side of the base away from the annular structure. The third pad and the second extension are both connected to the second pad. The third pad is at least partially located in the cup-shaped space directly opposite the side of the second pad along the first direction. The second extension extends into the space between the annular structure and the base.

[0012] The two third leads are respectively located on two opposite sides of all the first leads and the second leads along the second direction. The third leads include two fourth pads, two third bodies and two third pins. The fourth pads, the third bodies and the third pins are connected in sequence, and the two fourth pads are connected to each other. The two fourth pads are at least partially located in the two cup-shaped spaces that are directly opposite each other along the first direction. The two third bodies are respectively bent on both sides of the housing along the first direction, so that the two third pins are located on the side of the base away from the annular structure, and the two third pins are spaced apart from each other along the first direction.

[0013] Wherein, the first direction forms an angle with the second direction.

[0014] As a preferred embodiment of the device support, the second extension is located on the side of the first pad of the corresponding first lead that is away from the other first lead.

[0015] As a preferred embodiment of the device support, the first extension extends from the first pad toward the interior of the annular structure along the second direction, and at least a portion of the first extension extending into the annular structure along the second direction has a minimum dimension d1, 0.03mm≤d1≤0.05mm; and / or,

[0016] The second extension extends from the second pad toward the interior of the annular structure along the second direction. At least a portion of the second extension extending into the annular structure along the second direction has a maximum dimension d2, 0.01mm≤d2≤0.03mm.

[0017] As a preferred embodiment of the device support, the first extension extends toward the middle of the housing along the second direction; and / or,

[0018] The second extension extends toward the middle of the housing along the second direction.

[0019] As a preferred technical solution for the device support, the third direction is a direction perpendicular to both the first direction and the second direction;

[0020] The projection of the first extension onto the base along the third direction lies within the range of the projection of the annular structure onto the base along the third direction; and / or,

[0021] The projection of the second extension onto the base along the third direction is located within the range of the projection of the annular structure onto the base along the third direction.

[0022] As a preferred embodiment of the device support, the surface of the first extension facing away from the base is flush with the surface of the first pad facing away from the base; and / or,

[0023] The surface of the second extension away from the base is flush with the surface of the second pad away from the base.

[0024] As a preferred embodiment of the device support, the second pad and the third pad are connected by a first connecting part, and the two fourth pads are connected by a second connecting part.

[0025] All the connecting parts are bent and protruded toward the middle of the housing along the second direction, and for the connecting parts located on the same half of the housing along the second direction, the closer the connecting part is to the middle of the housing along the second direction, the larger the bending and protruding dimension s of the connecting part.

[0026] As a preferred technical solution for the device support, the outer peripheral surface of the annular structure is inclined, and the diameter of the outer circle of the annular structure gradually decreases along the direction from the base to the annular structure.

[0027] As a preferred technical solution of the device support, the outer peripheral surface of the annular structure includes two first planes opposite each other along the first direction, two second planes opposite each other along the second direction, and a first transition arc surface, and the first transition arc surface connects any adjacent first plane and second plane.

[0028] The first transition arc surface forms an arc edge on the side of the annular structure facing away from the base, and the radius r of the arc edge satisfies: 0.05mm≤r≤0.1mm.

[0029] As a preferred technical solution of the device support, the side wall of the cup-shaped space includes two first walls opposite each other along the first direction, two second walls opposite each other along the second direction, and a second transition arc surface, and the second transition arc surface connects any adjacent first wall and second wall.

[0030] As a preferred technical solution of the device support, the base has a first groove on both outer surfaces along the first direction, and a second groove on the surface of the base away from the annular structure. The second groove is connected to the first groove. The first body, the second body and the third body are all partially located in the first groove, and the first solder foot, the second solder foot and the third solder foot are all at least partially located in the second groove.

[0031] As a preferred technical solution of the device support, the base has a plurality of first grooves on both outer surfaces along the first direction for a plurality of main bodies, and a partition is formed between any two adjacent first grooves. The partition has a dimension b3 along the second direction, and the dimension b3 of the partition is smaller the further away from the annular structure.

[0032] As a preferred technical solution for the device support, the two opposite sides of the partition portion along the second direction form an included angle θ, where 20°≤θ≤35°.

[0033] As a preferred technical solution for the device support, the groove depth d3 of the second groove and the thickness d4 of the solder foot satisfy: (1 / 3)d4≤d3≤(1 / 2)d4.

[0034] As a preferred technical solution for the device support, the third direction is a direction perpendicular to the first direction and the second direction. The projections of all the main bodies along the third direction onto the plane perpendicular to the third direction are all within the range of the projections of the base along the third direction onto the plane perpendicular to the third direction.

[0035] As a preferred embodiment of the device support, along the second direction, each solder pad has a width b1, 0.25mm ≤ b1 ≤ 0.35mm; and / or,

[0036] Along the second direction, any two adjacent solder pads are spaced by a distance b2, where 0.34mm ≤ b2 ≤ 0.44mm; and / or,

[0037] The weld feet located on one half of the base along the first direction are symmetrical to the weld feet located on the other half of the base along the first direction.

[0038] As a preferred technical solution of the device support, the housing further includes a filling part, which is disposed on the side of the base where the annular structure is provided, and is located in the gap between the multiple annular structures. A cross-shaped groove is formed between the filling part and the four annular structures.

[0039] The groove depth t1 of the cross-shaped groove and the cup depth t2 of the cup-shaped space satisfy the following condition: (1 / 3)t2≤t1<t2.

[0040] As a preferred technical solution for the device support, the base is provided with at least one marking groove on the side opposite to the annular structure, and the marking groove is offset from the middle of the base along the second direction.

[0041] Secondly, a light-emitting device is provided, comprising:

[0042] The device comprises four first light-emitting chips, four second light-emitting chips, four third light-emitting chips, an encapsulating colloid, and a device support as described in the first aspect above. Each cup-shaped space contains one first light-emitting chip, one second light-emitting chip, and one third light-emitting chip. The first light-emitting chip is electrically connected between the first pad and the third pad, the second light-emitting chip is electrically connected between the first pad and the fourth pad, and the third light-emitting chip is electrically connected between the first pad and the second pad. The encapsulating colloid fills the cup-shaped space and covers the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip.

[0043] As a preferred technical solution for the light-emitting device, the cup depth t2 of the cup-shaped space and the height t3 of the encapsulating colloid satisfy the following condition: t2≤t3≤1.1t2.

[0044] Thirdly, a display module is provided, including a substrate and at least one light-emitting device as described in the second aspect above, the substrate having a control circuit, and a first solder pad, a second solder pad, and a third solder pad of the light-emitting device being soldered to the substrate and electrically connected to the control circuit.

[0045] The beneficial effects of this utility model are as follows:

[0046] To address the issues of easy tilting of pad surfaces and small effective soldering area of ​​solder feet in the light-emitting brackets of small-sized light-emitting devices, on the one hand, by providing a first extension connected to the first pad and a second extension connected to the second pad, the first and second extensions extend between the annular structure and the base, so that the annular structure and the base can fix the first and second extensions, thereby helping to fix the edge portions of the first and second pads, reducing the degree of tilting and warping of the first and second pads, and thus making the surface tilt of the pads smaller. On the other hand, by including two third solder feet in the third lead, that is, by including more than one third solder foot in the third lead, the total effective soldering area of ​​the overall solder feet of the device bracket can be increased by increasing the number of third solder feet. Attached Figure Description

[0047] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0048] Figure 1 This is a top view of the structure of the device support described in the embodiment.

[0049] Figure 2 for Figure 1 The diagram shows a schematic of the device support structure (with all leads extended and showing the outlines of all leads).

[0050] Figure 3 for Figure 2 The diagram shows the structure of the lead frame.

[0051] Figure 4 for Figure 3 The diagram shows the structure of the lead frame.

[0052] Figure 5 for Figure 2 A cross-sectional view along the AA direction.

[0053] Figure 6 This is a side view of the device support structure described in the embodiment.

[0054] Figure 7 This is a bottom view of the structure of the device support described in the embodiment.

[0055] Figure 8 This is a top view schematic diagram of the structure of the light-emitting device described in the embodiment.

[0056] Figure 9 for Figure 8 A cross-sectional view along the BB direction.

[0057] Figure 10 This is a schematic diagram of the display module described in the embodiment.

[0058] In the picture:

[0059] 100. Light-emitting device; 200. Substrate;

[0060] 1. Device support;

[0061] 11. Shell; 111. Base; 1111. First groove; 1112. Second groove; 1113. Partition; 1114. Marking groove; 112. Annular structure; 1120. Cup-shaped space; 1121. First plane; 1122. Second plane; 1123. First transition arc surface; 1124. First wall surface; 1125. Second wall surface; 1126. Second transition arc surface; 113. Cross-shaped groove; 114. Filling part;

[0062] 12. Leadframe; 121. First lead; 1210. First body; 1211. First pad; 1212. First solder foot; 1213. First extension; 122. Second lead; 1220. Second body; 1221. Second pad; 1222. Third pad; 1223. Second solder foot; 1224. Second extension; 1225. First connection; 123. Third lead; 1230. Third body; 1231. Fourth pad; 1232. Third solder foot; 1233. Second connection;

[0063] 2. First light-emitting chip;

[0064] 3. Second light-emitting chip;

[0065] 4. Third light-emitting chip;

[0066] 5. Encapsulating colloid. Detailed Implementation

[0067] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0068] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0069] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0070] like Figures 1 to 3 As shown, this utility model provides a device support 1, including a housing 11 and a lead frame 12, including a base 111 and four annular structures 112. The four annular structures 112 are arranged in a spaced array along a first direction S1 and a second direction S2 on the same side of the base 111. The annular structures 112 have a cup-shaped space 1120. A portion of the surface of the base 111 is formed as the bottom surface of the cup-shaped space 1120. The lead frame 12 includes two first leads 121, four second leads 122 and two third leads 123 spaced apart from each other.

[0071] Two first leads 121 are respectively disposed on the two halves of the housing 11 along the first direction S1. The first lead 121 includes a first body 1210, two first pads 1211, a first lead 1212, and two first extensions 1213. The two first pads 1211 and the first leads 1212 are connected to the first body 1210. The first body 1210 is bent on one side of the housing 11 along the first direction S1, so that the two first pads 1211 are at least partially located in two cup-shaped spaces 1120 spaced apart along the second direction S2, and the first leads 1212 are located on the side of the base 111 away from the annular structure 112. The two first extensions 1213 are respectively connected to the two first pads 1211, and the first extensions 1213 extend into the space between the annular structure 112 and the base 111.

[0072] Each first lead 121 has two second leads 122 corresponding to its two sides along the second direction S2. Each second lead 122 includes a second body 1220, a second pad 1221, a third pad 1222, a second lead 1223, and a second extension 1224. The second pad 1221 and the second lead 1223 are both connected to the second body 1220. The second body 1220 and the corresponding first body 1210 are bent on the same side of the housing 11 along the first direction S1, so that the two second leads 122... The second pads 1221 are at least partially located within two cup-shaped spaces 1120 spaced apart along the second direction S2, and the second pads 1223 are located on the side of the base 111 away from the annular structure 112. The third pad 1222 and the second extension 1224 are both connected to the second pad 1221. The third pad 1222 is at least partially located within the cup-shaped space 1120 directly opposite to the side of the second pad 1221 along the first direction S1. The second extension 1224 extends between the annular structure 112 and the base 111.

[0073] Two third leads 123 are located on opposite sides of all first leads 121 and second leads 122 along the second direction S2. Each third lead 123 includes two fourth pads 1231, two third bodies 1230, and two third leads 1232. The fourth pads 1231, third bodies 1230, and third leads 1232 are connected in sequence, and the two fourth pads 1231 are connected to each other. The two fourth pads 1231 are located at least partially within two cup-shaped spaces 1120 that are directly opposite each other along the first direction S1. The two third bodies 1230 are bent on both sides of the housing 11 along the first direction S1, so that the two third leads 1232 are located on the side of the base 111 away from the annular structure 112, and the two third leads 1232 are spaced apart and opposite each other along the first direction S1, wherein the first direction S1 and the second direction S2 form an angle.

[0074] For ease of observation, Figure 2The bends of all the leads are shown in the diagram, with the outline of the housing 11 shown using thicker solid lines and the entire outline of the lead frame 12 (including the portion of the outline obscured by the housing 11) shown using thinner solid lines. Figure 3 The boundary between the portion of the lead frame 12 located within the cup-shaped space 1120 and the portion located outside the cup-shaped space 1120 is shown using thick dashed lines, and the boundary between the first extension 1213 and the first body 1210, and the boundary between the second extension 1224 and the second body 1220 is shown using thin dotted lines. It can be understood that... Figure 3 The thick dashed lines and thin dotted lines are only used to indicate the boundary position, and do not represent the specific structural shape at that point.

[0075] To address the issues of easy tilting of the pad surface and small effective soldering area of ​​the solder feet in the device holder 1 of small-sized light-emitting devices, the device holder 1 provided in this embodiment, on the one hand, provides a first extension 1213 connected to the first pad 1211 and a second extension 1224 connected to the second pad 1221, such that the first extension 1213 and the second extension 1224 extend between the annular structure 112 and the base 111, so that the first extension 1213 and the second extension 1224 can be fixed by the annular structure 112 and the base 111. The first extension 1213 and the second extension 1224 are used to help fix the edge portions of the first pad 1211 and the second pad 1221, thereby reducing the degree of tilting and warping of the first pad 1211 and the second pad 1221, and thus making the surface tilt of the pads smaller. On the other hand, by making the third lead 123 include two third solder feet 1232, that is, by making the third lead 123 include more than one third solder foot 1232, the total effective soldering area of ​​the overall solder feet of the device bracket 1 can be increased by increasing the number of third solder feet 1232.

[0076] Optionally, the second extension 1224 is located on the side of the first pad 1211 of the corresponding first lead 121 away from the other first lead 121, thereby avoiding interference between the second extension 1224 and the first pad 1211 of the corresponding first lead 121, and making the setting position of the second extension 1224 more reasonable.

[0077] Please combine Figure 4 and compare Figure 4 and Figure 3As shown, the first extension 1213 extends from the first pad 1211 along the second direction S2 toward the interior of the annular structure 112. Along the second direction S2, the first extension 1213 extending between the annular structure 112 and the base 111 has a minimum dimension d1. The larger the minimum dimension d1, the more the first extension 1213 extends between the annular structure 112 and the base 111 along the second direction S2, and the greater the fixing force of the annular structure 112 on the first extension 1213. This makes it easier to reduce the surface tilt of the first pad 1211. However, an excessively large minimum dimension d1 can lead to problems with the first extension... Since 1213 extends from the outer periphery of the annular structure 112 and the base 111, the minimum dimension d1 cannot be too large. Based on this, the minimum dimension d1 of the first extension 1213 along the second direction S2 can optionally satisfy: 0.03mm≤d1≤0.05mm. For example, the minimum dimension d1 can be 0.03mm, 0.032mm, 0.034mm, 0.035mm, 0.036mm, 0.038mm, 0.04mm, 0.042mm, 0.044mm, 0.045mm, 0.046mm, 0.048mm, or 0.05mm, etc.

[0078] in, Figure 4 The lead frame 12 structure shown is similar to Figure 3 The lead frame 12 shown is completely identical, and for ease of observation, in Figure 3 The structural features of the lead frame 12 are labeled in the text. Figure 4 The dimensions of the lead frame 12 are marked in the text, therefore, refer to... Figure 3 and Figure 4 This allows us to obtain the correspondence between the dimensional features and structural features of the lead frame 12.

[0079] Optionally, the first extension 1213 extends toward the middle of the housing 11 along the second direction S2, thereby enabling the first extension 1213 to extend away from the second lead 122 and the third lead 123. In other words, the first extension 1213 can have a larger extendable space so that the minimum dimension d1 can be larger.

[0080] The third direction S3 is perpendicular to the first direction S1 and the second direction S2. Optionally, the projection of the first extension 1213 onto the base 111 along the third direction S3 is located within the range of the projection of the annular structure 112 onto the base 111 along the third direction S3, so that the first extension 1213 will not extend from the outer periphery of the annular structure 112 and the base 111 and be exposed to the outside of the housing 11.

[0081] Optionally, the surface of the first extension 1213 facing away from the base 111 is flush with the surface of the first pad 1211 facing away from the base 111. This makes the structure of the first lead 121 simpler and makes it easier to make the inclination of the surface of the first extension 1213 facing away from the base 111 smaller through the annular structure 112, so that the inclination of the surface of the first pad 1211 facing away from the base 111 is also smaller.

[0082] The second extension 1224 extends from the second pad 1221 toward the interior of the annular structure 112 along the second direction S2. Along the second direction S2, the second extension 1224 extending between the annular structure 112 and the base 111 has a maximum size d2. The larger the maximum size d2, the more the second extension 1224 extends between the annular structure 112 and the base 111 along the second direction S2, and the greater the fixing force of the annular structure 112 on the second extension 1224. This makes it easier to reduce the surface tilt of the second pad 1221. However, an excessively large maximum size d2 will cause the second extension 1224 to extend beyond the outer periphery of the annular structure 112 and the base 111. This would result in the spacing between the second extension 1224 and the first lead 121 or the third lead 123 being too small, failing to meet the insulation requirements. Therefore, the maximum dimension d2 cannot be too large. Based on this, optionally, the maximum dimension d2 of the second extension 1224 along the second direction S2 can satisfy: 0.01mm≤d2≤0.03mm. For example, the maximum dimension d2 can be 0.01mm, 0.012mm, 0.014mm, 0.015mm, 0.016mm, 0.018mm, 0.02mm, 0.022mm, 0.024mm, 0.025mm, 0.026mm, 0.028mm, or 0.03mm, etc.

[0083] Since the first lead 121 is located between the two second leads 122 and the two third leads 123 along the second direction S2, the first lead 121 is usually located in the middle of the housing 11 along the second direction S2. Since the first body 1210 needs to extend into the cup-shaped space 1120, the first body 1210 is usually located between the two annular structures 112 spaced along the second direction S2. Thus, the second pad 1221 has a large space on the side facing the middle of the housing 11 along the second direction S2 for the second extension 1224 to extend. Based on this, the second extension 1224 can optionally extend towards the middle of the housing 11 along the second direction S2, so that the second extension 1224 can extend beyond the first body 1210, so that the second extension 1224 can have a large extendable space, so that the maximum dimension d2 can be large.

[0084] Optionally, the projection of the second extension 1224 along the third direction S3 onto the base 111 is located within the range of the projection of the annular structure 112 along the third direction S3 onto the base 111, so that the second extension 1224 does not extend from the outer periphery of the annular structure 112 and the base 111 and is exposed to the outside of the housing 11.

[0085] Optionally, the surface of the second extension 1224 facing away from the base 111 is flush with the surface of the second pad 1221 facing away from the base 111. This makes the structure of the second lead 122 simpler and makes it easier to make the inclination of the surface of the second extension 1224 facing away from the base 111 smaller through the annular structure 112, so that the inclination of the surface of the second pad 1221 facing away from the base 111 is also smaller.

[0086] Along the second direction S2, each weld foot (i.e., each first weld foot 1212, second weld foot 1223, and third weld foot 1232) has a width b1. Since there are many weld feet on the same side of the housing 11 along the first direction S1, the width b1 of the weld foot needs to be small in order to set all the weld feet in a limited space. However, the smaller the width b1 of the weld foot, the smaller the effective connection area between the weld foot and the solder when the weld foot is welded to the external structure, which will lead to a poorer welding stability between the weld foot and the external structure. Therefore, the width b1 of the weld foot cannot be too small. Based on this, the width b1 of the weld foot can optionally satisfy: 0.25mm≤b1≤0.35mm. For example, the width b1 of the weld foot can be 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, or 0.35mm, etc.

[0087] Along the second direction S2, there is a spacing b2 between any two adjacent solder pads. The smaller the spacing b2 between two adjacent solder pads, the more compact the distribution of the solder pads, which is more conducive to the miniaturization of the device bracket 1. However, the possibility of solder overflow between adjacent solder pads leading to short circuits is also higher. Therefore, the spacing b2 between two adjacent solder pads cannot be too small. Based on this, the spacing b2 between two adjacent solder pads can optionally satisfy: 0.34mm≤b2≤0.44mm. For example, the spacing b2 between two adjacent solder pads can be 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.4mm, 0.41mm, 0.42mm, 0.43mm, or 0.44mm, etc.

[0088] Optionally, the second pad 1221 and the third pad 1222 are connected by the first connecting portion 1225, and the two fourth pads 1231 are connected by the second connecting portion 1233. Thus, the second pad 1221 and the third pad 1222 of a second lead 122 can be electrically connected through the first connecting portion 1225, and the two fourth pads 1231 of a third lead 123 can be electrically connected through the second connecting portion 1233.

[0089] Optionally, all connecting parts are bent and protruded toward the middle of the housing 11 along the second direction S2, so that all connecting parts can make fuller use of the space located on the middle side of themselves toward the housing 11 along the second direction S2.

[0090] Optionally, for the connecting portion provided on the same half of the housing 11 along the second direction S2, the closer the connecting portion is to the middle of the housing 11 along the second direction S2, the larger the bending protrusion dimension s of the connecting portion, so as to avoid interference between adjacent connecting portions.

[0091] Please refer to the following: Figure 1 and Figure 5 Optionally, the outer peripheral surface of the annular structure 112 is inclined, and the diameter of the circumscribed circle of the annular structure 112 gradually decreases along the direction from the base 111 to the annular structure 112. This makes it easier to observe the outer peripheral surface of the annular structure 112 when viewed directly along the third direction S3 or when viewed from other angles, thereby enhancing the three-dimensional appearance of the annular structure 112 and improving the user's viewing experience.

[0092] Optionally, the outer peripheral surface of the annular structure 112 includes two first planes 1121 opposite each other along the first direction S1, two second planes 1122 opposite each other along the second direction S2, and a first transition arc surface 1123. Any adjacent first plane 1121 and second plane 1122 are connected by the first transition arc surface 1123, so that the connection between the first plane 1121 and the second plane 1122 is rounded. This reduces the sharp corner structure included in the annular structure 112, thereby reducing the weak points in the structural strength of the annular structure 112 and reducing the possibility of damage caused by bumps during the transportation and use of the device support 1. On the other hand, it can improve the shape smoothness of the outer peripheral surface of the annular structure 112, thereby improving the user's viewing experience.

[0093] The first transition arc surface 1123 forms an arc edge on the side of the annular structure 112 facing away from the base 111. The arc edge has a radius r. The larger the radius r, the better the effect on improving the smoothness of the shape of the outer peripheral surface of the annular structure 112. However, the smaller the distance between the first transition arc surface 1123 and the cup-shaped space 1120, the smaller the space that the first extension 1213 and the second extension 1224 can be set in the annular structure 112. Therefore, the radius r cannot be too small. Based on this, the radius r of the arc edge can optionally satisfy: 0.05mm≤r≤0.1mm. For example, the radius r can be 0.05mm, 0.055mm, 0.06mm, 0.065mm, 0.07mm, 0.075mm, 0.08mm, 0.085mm, 0.09mm, 0.095mm or 0.1mm, etc.

[0094] Optionally, the sidewall of the cup-shaped space 1120 includes two first walls 1124 opposite each other along the first direction S1, two second walls 1125 opposite each other along the second direction S2, and a second transition arc surface 1126. Any adjacent first walls 1124 and second walls 1125 are connected by the second transition arc surface 1126, so that some of the light in the cup-shaped space 1120 can be reflected by the second transition arc surface 1126, which helps to improve the light intensity of the light-emitting device using the device support 1.

[0095] Optionally, the first wall surface 1124 may be an arc surface, or the second wall surface 1125 may be an arc surface, or both the first wall surface 1124 and the second wall surface 1125 may be arc surfaces, so that some of the light in the cup-shaped space 1120 can be reflected through the wall surface, while the light is focused to a certain extent, so as to improve the luminous brightness of the light-emitting device.

[0096] Please combine Figure 6 and Figure 7 As shown, optionally, the base 111 has a first groove 1111 on both outer surfaces along the first direction S1, and a second groove 1112 on the surface of the base 111 facing away from the annular structure 112. The second groove 1112 is connected to the first groove 1111. The first body 1210, the second body 1220, and the third body 1230 are all partially located within the annular structure 112.

[0097] Within the first groove 1111, the first solder foot 1212, the second solder foot 1223, and the third solder foot 1232 are all at least partially located within the second groove 1112. This reduces the portion of the first solder foot 1212, the second solder foot 1223, and the third solder foot 1232 protruding from the base 111, thereby reducing the possibility that the first solder foot 1212, the second solder foot 1223, and the third solder foot 1232 may be scraped and lifted during the transportation of the device bracket 1. This reduces the possibility of lead failure and improves the stability of the device bracket 1 in terms of performance.

[0098] Optionally, the base 111 has multiple first grooves 1111 on both outer surfaces along the first direction S1 for multiple main bodies, and a partition 1113 is formed between any two adjacent first grooves 1111. This allows the first grooves 1111 to accommodate at least part of the main body located on the outer side of the base 111 along the first direction S1, and the partition 1113 to shield part of the side of the main body, thereby protecting the main body and reducing the possibility of deformation or damage caused by impact.

[0099] Optionally, the dimension of the partition portion 1113 along the second direction S2 is b3. The dimension b3 of the partition portion 1113 is smaller the further away from the annular structure 112, so that the width of the first groove 1111 along the second direction S2 is larger the further away from the annular structure 112, so that more encapsulating adhesive can be accommodated in the first groove 1111. This improves the sealing and moisture-proof effect of the encapsulating adhesive on the main body when the device bracket 1 is encapsulated on the outside of the structure by the encapsulating adhesive.

[0100] The two opposing sides of the partition portion 1113 along the second direction S2 form an included angle θ. The larger the included angle θ, the more encapsulating adhesive the first groove 1111 can accommodate, thus improving the sealing and moisture-proofing effect of the encapsulating adhesive on the main body. However, the smaller the dimension b3 of the part of the partition portion 1113 away from the annular structure 112, the weaker the structural strength of the partition portion 1113. Therefore, the included angle θ cannot be too large. Based on this, the included angle θ formed by the two opposing sides of the partition portion 1113 along the second direction S2 can optionally satisfy: 20°≤θ≤35°. For example, the included angle θ can be 20°, 22°, 25°, 27°, 30°, 32°, or 35°, etc.

[0101] The second groove 1112 has a groove depth d3, and the solder foot has a thickness d4. Optionally, d3 < d4, so that the solder foot portion can be exposed in the second groove 1112 to facilitate soldering of the solder foot to external circuitry.

[0102] The closer the groove depth d3 is to the thickness d4 of the solder foot, the better the shielding and protection effect of the partition 1113 on the solder foot, and the lower the possibility of deformation or warping of the solder foot due to scratches during transportation and use. However, it will also result in less of the solder foot being exposed in the second groove 1112, which in turn leads to a smaller effective welding area between the solder foot and the external circuit. Therefore, the groove depth d3 should not be too close to the thickness d4 of the solder foot. Based on this, the groove depth d3 of the second groove 1112 and the thickness d4 of the solder foot can optionally satisfy: (1 / 3)d4≤d3≤(1 / 2)d4. For example, the groove depth d3 of the second groove 1112 can be (1 / 3)d4, (3 / 8)d4, (2 / 5)d4, (3 / 7)d4, (4 / 9)d4 or (1 / 2)d4, etc.

[0103] Optionally, the projections of all the main bodies along the third direction S3 onto the plane perpendicular to the third direction S3 are all within the range of the projections of the base 111 along the third direction S3 onto the plane perpendicular to the third direction S3. In other words, the base 111 can block the main bodies on the side of the main body close to the annular structure 112 along the third direction S3, so that when the user observes the device support 1 from the side where the cup-shaped space 1120 is located, it is less easy to observe each main body, so as to improve the uniformity of the appearance color of the device support 1 in the use state.

[0104] Optionally, the solder feet located on one half of the base 111 along the first direction S1 are symmetrical with the solder feet located on the other half of the base 111 along the first direction S1. Thus, when the device bracket 1 is soldered to the external structure through the solder feet, the welding action on the two halves of the device bracket 1 along the first direction S1 can be more balanced, so that the welding stability between the device bracket 1 and the external structure is better.

[0105] Since the four annular structures 112 are spaced apart, a cross-shaped groove 113 is formed between the four annular structures 112, which can reduce the possibility of different annular structures 112 affecting each other during the injection molding process of the housing 11, and at the same time improve the independence of each annular structure 112 when the user observes the device support 1.

[0106] Optionally, the housing 11 also includes a filling part 114, which is provided on one side of the base 111 where the annular structure 112 is provided, and is located in the gap between the multiple annular structures 112. The filling part 114 and the four annular structures 112 form a cross-shaped groove 113, so that the groove depth of the cross-shaped groove 113 is less than the cup depth of the cup-shaped space 1120. In this way, the filling part 114 can cover part of the structure of the first lead 121, the second lead 122 and the third lead 123 that are routed between adjacent annular structures 112.

[0107] In order for the filling portion 114 to completely cover each lead wire, the filling portion 114 needs to be relatively high. In other words, the difference between the groove depth of the cross-shaped groove 113 and the cup depth of the cup-shaped space 1120 needs to be relatively large. Based on this, the groove depth t1 of the cross-shaped groove 113 and the cup depth t2 of the cup-shaped space 1120 can optionally satisfy: (1 / 3)t2≤t1<t2. For example, the groove depth t1 of the cross-shaped groove 113 can be: (1 / 3)t2, (2 / 5)t2, (3 / 7)t2, (1 / 2)t2, (4 / 7)t2, (3 / 5)t2, (2 / 3)t2, (7 / 10)t2, (4 / 5)t2, (5 / 7)t2, (6 / 7)t2, (9 / 10)t2 or (10 / 11)t2, etc.

[0108] Optionally, the base 111 is provided with at least one marking groove 1114 on the side opposite to the annular structure 112, and the marking groove 1114 is offset from the middle of the base 111 along the second direction S2, so that the marking can be provided by the eccentrically arranged marking groove 1114 to indicate the positive and negative pole directions of the lead frame 12.

[0109] Optionally, the bottom surface of the marking groove 1114 may be a shape including but not limited to triangle, rectangle, circle, pentagon, text shape, and symbol shape.

[0110] Optionally, there may be multiple marking slots 1114, which are spaced apart on the side of the base 111 away from the annular structure 112. At least two marking slots 1114 that are offset from opposite sides of the base 111 along the second direction S2 have different shapes, so that the positive and negative pole directions of the lead frame 12 can be jointly indicated by marking slots 1114 with different shapes.

[0111] like Figure 8 and Figure 9 As shown, this utility model also provides a light-emitting device 100, including four first light-emitting chips 2, four second light-emitting chips 3, four third light-emitting chips 4, an encapsulating colloid 5, and a device support 1 as described in the foregoing technical solutions. Please refer to... Figure 3 As shown, specifically, each cup-shaped space 1120 contains a first light-emitting chip 2, a second light-emitting chip 3, and a third light-emitting chip 4. The first light-emitting chip 2 is electrically connected between the first pad 1211 and the third pad 1222, the second light-emitting chip 3 is electrically connected between the first pad 1211 and the fourth pad 1231, and the third light-emitting chip 4 is electrically connected between the first pad 1211 and the second pad 1221. The encapsulating colloid 5 fills the cup-shaped space 1120 and covers the first light-emitting chip 2, the second light-emitting chip 3, and the third light-emitting chip 4. By using the aforementioned device support 1, the connection stability between the light-emitting chip and the pad can be improved, thereby improving the fabrication yield and lifespan of the light-emitting device 100. Furthermore, the connection stability between the light-emitting device 100 and the external substrate can also be improved.

[0112] Optionally, of the first light-emitting chip 2, the second light-emitting chip 3, and the third light-emitting chip 4, one is a red light chip, one is a green light chip, and the remaining one is a blue light chip, thereby enabling the light-emitting device 100 to display a wider color gamut.

[0113] Optionally, the encapsulating colloid 5 can be flush with the rim of the cup-shaped space 1120 (i.e., the cup depth t2 of the cup-shaped space 1120 is equal to the height t3 of the encapsulating colloid 5) to improve the encapsulation and sealing effect of the encapsulating colloid 5 on each light-emitting chip. Alternatively, the encapsulating colloid 5 can partially protrude from the rim of the cup-shaped space 1120 to improve the encapsulation and sealing effect of the encapsulating colloid 5 on each light-emitting chip, while also forming a curved surface that bulges outward toward the cup-shaped space 1120. This allows the encapsulating colloid 5 to act like a convex lens, scattering the light emitted from the encapsulating colloid 5 through its surface, thereby increasing the light emission angle of the light-emitting device 100.

[0114] The higher the protrusion height of the encapsulating colloid 5 from the cup-shaped space 1120, the greater the scattering effect of the light emitted from the encapsulating colloid 5 on its surface. However, the worse the structural stability of the encapsulating colloid 5 before curing, the easier it is to overflow to the outer periphery of the cup-shaped space 1120. Therefore, the encapsulating colloid 5 should not protrude too much from the cup-shaped space 1120. Based on this, the cup depth t2 of the cup-shaped space 1120 and the height t3 of the encapsulating colloid 5 can optionally satisfy: t2 < t3 ≤ 1.1t2. For example, the height t3 of the encapsulating colloid 5 can be 1.01t2, 1.02t2, 1.03t2, 1.04t2, 1.05t2, 1.06t2, 1.07t2, 1.08t2, 1.09t2, or 1.1t2, etc.

[0115] like Figure 10 As shown, this utility model also provides a display module (not labeled in the figure), including a substrate 200 and at least one light-emitting device 100 as described in the foregoing technical solutions. Please refer to... Figure 3 As shown, specifically, the substrate 200 has a control circuit (not shown in the figure). The first solder pad 1212, the second solder pad 1223 and the third solder pad 1232 of the light-emitting device 100 are soldered to the substrate 200 and electrically connected to the control circuit, which can improve the service life of the light-emitting device 100 and the connection stability between the light-emitting device 100 and the substrate 200, thereby improving the overall structural stability and service life of the display module.

[0116] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings, and are used only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are merely used for distinction in description and have no special meaning.

[0117] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0118] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0119] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A device support, characterized in that, include: The housing includes a base and four annular structures, the four annular structures being arranged in a spaced-apart array along a first direction and a second direction on the same side of the base. Each annular structure has a cup-shaped space, and a portion of the surface of the base forms the bottom surface of the cup-shaped space; and... A lead frame, the lead frame comprising two first leads spaced apart from each other, four second leads, and two third leads; Two first leads are respectively disposed on two halves of the housing along the first direction. Each first lead includes a first body, two first pads, a first lead, and two first extensions. The two first pads and the first leads are connected to the first body. The first body is bent on one side of the housing along the first direction, such that the two first pads are at least partially located in the two cup-shaped spaces spaced apart along the second direction, and the first leads are located on the side of the base away from the annular structure. The two first extensions are respectively connected to the two first pads, and the first extensions extend between the annular structure and the base. Two second leads are respectively provided on both sides of each first lead along the second direction. Each second lead includes a second body, a second pad, a third pad, a second lead, and a second extension. The second pad and the second lead are both connected to the second body. The second body and the corresponding first body are bent on the same side of the housing along the first direction, such that the second pads of the two second leads are at least partially located in the two cup-shaped spaces spaced apart along the second direction, and the second lead is located on the side of the base away from the annular structure. The third pad and the second extension are both connected to the second pad. The third pad is at least partially located in the cup-shaped space directly opposite the side of the second pad along the first direction. The second extension extends into the space between the annular structure and the base. The two third leads are respectively located on two opposite sides of all the first leads and the second leads along the second direction. The third leads include two fourth pads, two third bodies and two third pins. The fourth pads, the third bodies and the third pins are connected in sequence, and the two fourth pads are connected to each other. The two fourth pads are at least partially located in the two cup-shaped spaces that are directly opposite each other along the first direction. The two third bodies are respectively bent on both sides of the housing along the first direction, so that the two third pins are located on the side of the base away from the annular structure, and the two third pins are spaced apart from each other along the first direction. Wherein, the first direction forms an angle with the second direction.

2. The device support according to claim 1, characterized in that, The second extension is located on the side of the first pad of the corresponding first lead that is away from the other first lead.

3. The device support according to claim 1, characterized in that, The first extension extends from the first pad toward the interior of the annular structure along the second direction, and at least a portion of the first extension extending into the annular structure along the second direction has a minimum dimension d1, 0.03 mm ≤ d1 ≤ 0.05 mm; and / or, The second extension extends from the second pad toward the interior of the annular structure along the second direction. At least a portion of the second extension extending into the annular structure along the second direction has a maximum dimension d2, 0.01mm≤d2≤0.03mm.

4. The device support according to claim 1, characterized in that, The first extension extends toward the middle of the housing along the second direction; and / or, The second extension extends toward the middle of the housing along the second direction.

5. The device support according to claim 1, characterized in that, The third direction is a direction perpendicular to both the first direction and the second direction; The projection of the first extension onto the base along the third direction lies within the range of the projection of the annular structure onto the base along the third direction; and / or, The projection of the second extension onto the base along the third direction is within the range of the projection of the annular structure onto the base along the third direction.

6. The device support according to any one of claims 1-5, characterized in that, The surface of the first extension facing away from the base is flush with the surface of the first pad facing away from the base; and / or, The surface of the second extension away from the base is flush with the surface of the second pad away from the base.

7. The device support according to claim 1, characterized in that, The second pad is connected to the third pad via a first connecting part, and the two fourth pads are connected via a second connecting part; All the connecting parts are bent and protruded toward the middle of the housing along the second direction, and for the connecting parts located on the same half of the housing along the second direction, the closer the connecting part is to the middle of the housing along the second direction, the larger the bending and protruding dimension s of the connecting part.

8. The device support according to claim 1, characterized in that, The outer circumferential surface of the annular structure is inclined, and the diameter of the circumscribed circle of the annular structure gradually decreases along the direction from the base to the annular structure.

9. The device support according to claim 8, characterized in that, The outer peripheral surface of the annular structure includes two first planes opposite each other along the first direction, two second planes opposite each other along the second direction, and a first transition arc surface. The first transition arc surface connects any adjacent first plane and second plane. The first transition arc surface forms an arc edge on the side of the annular structure facing away from the base, and the radius r of the arc edge satisfies: 0.05mm≤r≤0.1mm.

10. The device support according to any one of claims 1-5 or any one of claims 7-9, characterized in that, The sidewall of the cup-shaped space includes two first walls facing each other along the first direction, two second walls facing each other along the second direction, and a second transition arc surface. Any adjacent first wall and second wall are connected by the second transition arc surface.

11. The device support according to any one of claims 1-5 or any one of claims 7-9, characterized in that, The base has a first groove on both outer surfaces along the first direction, and a second groove on the surface of the base away from the annular structure. The second groove is connected to the first groove. The first body, the second body, and the third body are all partially located in the first groove. The first weld foot, the second weld foot, and the third weld foot are all at least partially located in the second groove.

12. The device support according to claim 11, characterized in that, The base has multiple first grooves on its two outer surfaces along the first direction for multiple main bodies. A partition is formed between any two adjacent first grooves. The partition has a dimension b3 along the second direction. The dimension b3 of the partition is smaller the further away from the annular structure it is.

13. The device support according to claim 12, characterized in that, The two opposite sides of the partition are at an angle θ, where 20°≤θ≤35°.

14. The device support according to claim 11, characterized in that, The second groove has a groove depth d3 and a weld thickness d4 that satisfy: (1 / 3)d4≤d3≤(1 / 2)d4.

15. The device support according to claim 11, characterized in that, The third direction is perpendicular to the first direction and the second direction. The projections of all the main bodies along the third direction onto the plane perpendicular to the third direction are all within the range of the projections of the base along the third direction onto the plane perpendicular to the third direction.

16. The device support according to any one of claims 1-5 or any one of claims 7-9, characterized in that, Along the second direction, each solder leg has a width b1, 0.25mm ≤ b1 ≤ 0.35mm; and / or, Along the second direction, any two adjacent solder pads are spaced by a distance b2, where 0.34mm ≤ b2 ≤ 0.44mm; and / or, The weld feet located on one half of the base along the first direction are symmetrical to the weld feet located on the other half of the base along the first direction.

17. The device support according to any one of claims 1-5 or any one of claims 7-9, characterized in that, The housing also includes a filling part, which is located on the side of the base where the annular structure is located and in the gap between the multiple annular structures. A cross-shaped groove is formed between the filling part and the four annular structures. The groove depth t1 of the cross-shaped groove and the cup depth t2 of the cup-shaped space satisfy the following condition: (1 / 3)t2≤t1<t2.

18. A light-emitting device, characterized in that, include: The device comprises four first light-emitting chips, four second light-emitting chips, four third light-emitting chips, an encapsulating colloid, and a device support as described in any one of claims 1-17. Each cup-shaped space contains one first light-emitting chip, one second light-emitting chip, and one third light-emitting chip. The first light-emitting chip is electrically connected between the first pad and the third pad, the second light-emitting chip is electrically connected between the first pad and the fourth pad, and the third light-emitting chip is electrically connected between the first pad and the second pad. The encapsulating colloid fills the cup-shaped space and covers the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip.

19. The light-emitting device according to claim 18, characterized in that, The cup depth t2 of the cup-shaped space and the height t3 of the encapsulating colloid satisfy the following condition: t2≤t3≤1.1t2.

20. A display module, characterized in that, The device includes a substrate and at least one light-emitting device as described in claim 18 or 19, the substrate having a control circuit, and the first solder pad, the second solder pad, and the third solder pad of the light-emitting device being soldered to the substrate and electrically connected to the control circuit.

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