Power package and electronic device

Abstract

A power package and an electronic device, the power package comprising: a package substrate, the package substrate being provided with a pad region, the pad region being provided with a protrusion structure; the power device is arranged on the packaging substrate and is electrically connected with the bonding pad area; and the lead frame is welded on the bonding pad area through a solder layer, and the solder layer at least covers the surface of the convex structure and the surface of the bonding pad area. The welding quality between the lead frame and the packaging substrate is improved, and reliable electric connection between the lead frame and the packaging substrate is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically to a power package and electronic device. Background Technology

[0002] Power device modules, with their advantages of low energy loss, small size, light weight, support for high power, and high switching efficiency, are increasingly being used in electronic devices such as frequency converters, motor drives, and on-board chargers. A power device module comprises a package consisting of IGBT chips, FRD chips, shunts, etc. Specifically, these chips or devices are first mounted on a ceramic substrate, and then a lead frame is soldered onto the ceramic substrate. However, in related technologies, the soldering quality between the lead frame and the ceramic substrate is poor, failing to guarantee a reliable electrical connection between them. Utility Model Content

[0003] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0004] To address the existing problems, this utility model provides a power package, which includes:

[0005] The packaging substrate has a pad area and a raised structure on the pad area.

[0006] Power devices disposed on the packaging substrate and electrically connected to the pad area; and

[0007] The lead frame is soldered onto the pad area by a solder layer, which at least covers the surface of the raised structure and the surface of the pad area.

[0008] In some embodiments of this application, a plurality of spaced and arrayed protrusions are provided on the pad area, and the solder layer fills at least the space between two adjacent protrusions.

[0009] In some embodiments of this application, the tops of multiple protruding structures are at the same horizontal height.

[0010] In some embodiments of this application, the power device includes a shunt, which includes a sampling resistor, a first electrode structure, and a second electrode structure; a first metal sheet and a second metal sheet are disposed on the packaging substrate at intervals, the first electrode structure is attached to the first metal sheet, and the second electrode structure is attached to the second metal sheet;

[0011] The pad area includes a first pad area and a second pad area that are spaced apart. The package substrate is also provided with a first drain structure connecting the first pad area and the first metal sheet, and a second drain structure connecting the second pad area and the second metal sheet.

[0012] In some embodiments of this application, the sampling resistor is spaced apart from the surface of the packaging substrate, and at least a portion of the first and second current-draining structures are located below the sampling resistor and spaced apart from it.

[0013] In some embodiments of this application, the pad area further includes a third pad area that is spaced apart from the first electrode structure and extends to the first metal sheet, wherein the first pad area, the second pad area and the third pad area are arranged at intervals along the edge of the package substrate;

[0014] The lead frame includes a first pin soldered to a first pad area, a second pin soldered to a second pad area, and a third pin soldered to a third pad area.

[0015] In some embodiments of this application, a third metal sheet and a fourth metal sheet are further disposed on the packaging substrate at intervals; the power device includes a first IGBT chip and a first FRD chip mounted on the third metal sheet and spaced apart, and a second IGBT chip and a second FRD chip mounted on the fourth metal sheet and spaced apart.

[0016] The power package also includes: metal bonding wires that electrically connect the pad area, the power device, and the metal sheet on the package substrate.

[0017] In some embodiments of this application, the packaging substrate includes a DBC substrate or an AMB substrate.

[0018] In some embodiments of this application, the power package further includes: a plastic encapsulation substrate, a plastic encapsulation layer for the power device and the lead frame.

[0019] A second aspect of this utility model provides an electronic device, which includes any of the power package components described above.

[0020] According to the power package and electronic device provided by this utility model, by providing a raised structure on the pad area for soldering lead frames on the package substrate, the surface area of ​​the pad area is increased and the slippage between the solder layer and the package substrate is prevented. Thus, when the package substrate and the lead frame are soldered together through the solder layer, the reliability and stability of the connection between the solder layer and the pad area of ​​the package substrate can be improved, the soldering quality between the lead frame and the package substrate can be improved, and a reliable electrical connection between the lead frame and the package substrate can be guaranteed. Attached Figure Description

[0021] The following drawings, which are incorporated herein by reference as part of this invention, are provided for understanding the invention. The drawings illustrate embodiments of the invention and their descriptions, serving to explain the principles of the invention.

[0022] In the attached image:

[0023] Figures 1A-1C The diagram shows a top view of a power package according to a specific embodiment of the present invention, as well as cross-sectional views of different sections.

[0024] Figures 2A-2B The diagram shows a top view of the packaging substrate according to a specific embodiment of the present invention, as well as cross-sectional views of different sections.

[0025] Figures 3A-3B The diagram shows a top view of a power device on a packaging substrate according to a specific embodiment of the present invention, as well as cross-sectional views of different sections.

[0026] Figures 4A-4B The diagram shows a top view of a lead frame disposed on a packaging substrate according to a specific embodiment of the present invention, as well as cross-sectional views of different sections.

[0027] Figure 5 A top view schematic diagram of a shunt on a packaging substrate according to another specific embodiment of the present invention is shown.

[0028] Figure label:

[0029] 10-Packaging substrate 11-First metal sheet

[0030] 12-Second metal sheet 13-Third metal sheet

[0031] 14-Fourth metal sheet 15-Back metal layer

[0032] 16-Solder layer 21-First pad area

[0033] 22 - Second pad area 23 - Third pad area

[0034] 24-Fourth pad area; 31-First drain structure

[0035] 32-Second drainage structure; 41-First pin

[0036] 42 - Second pin 43 - Third pin

[0037] 44-Fourth pin; 45-Connection part

[0038] 51-First electrode structure 52-Second electrode structure

[0039] 53-Sampling resistor element 54-Notch

[0040] 61-First IGBT chip 62-Second IGBT chip

[0041] 71 - First FRD chip 72 - Second FRD chip

[0042] 80-Metal Bonding Wire Detailed Implementation

[0043] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0044] It should be understood that this invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this invention to those skilled in the art. In the drawings, for clarity, the dimensions of layers and regions, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0045] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0046] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0047] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0048] In view of the technical problems existing in the background section, refer to Figure 1A , Figure 1B , Figure 2A and Figure 2B This utility model provides a power package, which includes:

[0049] The packaging substrate 10 has a pad area and a raised structure on the pad area.

[0050] Power devices disposed on the packaging substrate 10 and electrically connected to the pad area; and

[0051] The lead frame is soldered onto the pad area via solder layer 16, which at least covers the surface of the raised structure and the surface of the pad area.

[0052] The above embodiments have the following beneficial effects: by providing a raised structure on the pad area for soldering the lead frame on the packaging substrate 10, the surface area of ​​the pad area is increased, and the slippage between the solder layer 16 and the packaging substrate 10 is prevented. Thus, when the packaging substrate 10 and the lead frame are soldered together through the solder layer 16, the reliability and stability of the connection between the solder layer 16 and the pad area of ​​the packaging substrate 10 can be improved, the soldering quality between the lead frame and the packaging substrate 10 can be improved, and a reliable electrical connection between the lead frame and the packaging substrate 10 can be guaranteed.

[0053] The specific principle is as follows: In related technologies, when soldering the leadframe onto a ceramic substrate, solder is applied between the leadframe and the ceramic substrate's pad area to achieve soldering. However, because the soldering surfaces of the existing packaging substrate and leadframe are both planar, and there are differences in hardness, thermal expansion coefficients, etc., between the packaging substrate, solder, and leadframe, cracks are prone to appear at the solder joint between the packaging substrate and the leadframe. This reduces the reliability of the connection between the packaging substrate and the leadframe, resulting in poor soldering quality between the leadframe and the ceramic substrate. Subsequently, when using a molding compound to encapsulate the packaging substrate and leadframe, the impact of the molding compound may cause displacement or disconnection at the solder joint between the leadframe and the packaging substrate. This cannot guarantee a reliable electrical connection between the leadframe and the ceramic substrate, leading to defects such as lower-than-expected load capacity, open circuits, or short circuits in the final power device module, thus affecting the reliability and stability of the power device module.

[0054] The embodiments described above, referring to FIG1, demonstrate that by providing a raised structure on the pad area of ​​the package substrate 10, the contact area between the pad area and the solder layer 16 can be increased for the same pad area. Specifically, when the package substrate 10 is soldered to the lead frame via the solder layer 16, the solder layer 16 at least covers the surface of the raised structure and the surface of the pad area. Compared to the prior art where the solder layer 16 only covers the surface of the pad area, in this application, the contact area between the solder layer 16 and the package substrate 10 is further increased by adding the surface contact portion of the raised structure, thereby increasing the contact area between the pad area and the solder layer 16.

[0055] At this point, even though there are differences in hardness, coefficient of thermal expansion, etc., between the packaging substrate 10, solder, and lead frame, the large contact area between the solder layer 16 and the packaging substrate 10, along with the supporting structure of the protrusions, can prevent slippage between the packaging substrate 10 and the lead frame. This improves the reliability and stability of the connection between the solder layer 16 and the pad area of ​​the packaging substrate 10, and enhances the soldering quality between the lead frame and the packaging substrate 10. Subsequently, when using the molding compound to encapsulate the packaging substrate 10 and the lead frame, under the same impact force of the molding compound, the risk of displacement or disconnection at the solder joint between the lead frame and the packaging substrate 10 can be reduced, ensuring a reliable electrical connection between the lead frame and the ceramic substrate. This improves the final power package's reliability and stability, addressing issues such as insufficient load capacity, open circuits, or short circuits in the pins.

[0056] Below, for reference. Figures 1A-5 The power package of this utility model embodiment is described in detail.

[0057] Various types of packaging substrates 10 can be used when setting up the packaging substrate 10. In some embodiments, the packaging substrate 10 can be a ceramic substrate or other types of substrates, such as a packaging substrate 10 made of alumina material. Metal sheets can be provided on the packaging substrate 10 for electrical connection with power devices or other electronic devices, so that the power devices can perform corresponding functions when mounted on the packaging substrate 10.

[0058] For example, the packaging substrate 10 can be a DBC substrate (direct copper-clad ceramic substrate), which is formed by eutectic sintering of a ceramic substrate and copper foil at high temperature. That is, the material of the metal sheet formed on the packaging substrate 10 is copper foil. Of course, it should be noted that the type of packaging substrate 10 is not limited to the DBC substrate shown above; other types of substrates can also be used. For example, the packaging substrate 10 can also be an AMB substrate (Active Metal Brazing Ceramic Substrate, abbreviated as AMB). By using the above-mentioned substrate as the packaging substrate 10, the structure of the packaging substrate 10 can be simplified, and standardized packaging substrates 10 can be easily obtained.

[0059] refer to Figure 2A The pad area can be a metal pad area, so that after the lead frame is soldered to the pad area, the conductivity between the lead frame and the pad area can be better, and the resistance between the two can be reduced.

[0060] For example, refer to Figure 2AA portion of the metal sheet on the packaging substrate 10 can be used as a pad area. In this case, the protrusion structure can be formed by extending outward from the metal sheet on the packaging substrate 10. At this time, the protrusion structure and the metal sheet material of the pad area are an integral structure, thereby improving the stability and reliability of the connection between the protrusion structure and the pad area.

[0061] For example, refer to Figure 2A The packaging substrate 10 can be provided with multiple pad areas, which are spaced apart, so that the electrical properties of different pad areas are independent and do not interfere with each other.

[0062] For example, refer to Figure 2A The top view area of ​​the raised structure is smaller than the top view area of ​​the pad area, meaning that the raised structure does not fill the entire area of ​​the pad area. This increases the sum of the surface areas of the pad area and the raised structure, thereby improving the reliability of the connection between the solder layer 16 and the pad area.

[0063] For example, the number of raised structures provided on each pad area can be one or more. When a raised structure is provided on a pad area, the top view shape of the raised structure can be circular, rectangular, elliptical, etc. In some embodiments, the top view shape of the raised structure can also be U-shaped or S-shaped, thereby increasing the surface area of ​​the raised structure and improving the reliability of its connection with the solder layer 16 for the same top view area.

[0064] In some embodiments, reference Figure 2A The pad area has multiple spaced and arrayed protrusions, and the solder layer 16 fills at least the space between two adjacent protrusions. With the same total top-view area of ​​the protrusions, by providing multiple dispersed and independent protrusions, the total surface area of ​​all protrusions can be increased, ensuring the reliability of the connection between the pad area and the protrusions.

[0065] The longitudinal cross-sectional shape of the protruding structure can be of various types. For example, refer to... Figure 2B The longitudinal cross-sectional shape of the protruding structure can be an arc-shaped protrusion, in which case the protruding structure can be a hemispherical protrusion structure, thereby increasing the surface area of ​​the protruding structure. In other embodiments, the longitudinal cross-sectional shape of the protruding structure can also be rectangular, triangular, etc.

[0066] For example, refer to Figure 2A and Figure 2BWhen multiple raised structures are provided in the pad area, the tops of the multiple raised structures can be at the same horizontal height, thereby ensuring consistent flatness of the raised structures. Specifically, the tops of multiple raised structures on a single pad area can be at the same horizontal height, or the tops of the raised structures on all pad areas of the package substrate 10 can be at the same horizontal height. It should be noted that the top of the raised structure is the position on the raised structure that is farthest from the surface of the package substrate 10.

[0067] For example, refer to Figure 1A and Figure 1B The pad areas can be soldered to pins on the leadframe. Specifically, different pad areas can be soldered to different pins on the leadframe. Of course, the pad areas are not limited to soldering only to pins on the leadframe; they can also be soldered to other structures on the leadframe. For example, the pad areas can also be soldered to support components on the leadframe.

[0068] Regarding the material of the solder layer 16, it can be a low-melting-point metal solder such as, but not limited to, tin.

[0069] For example, refer to Figure 3A The packaging substrate 10 is also provided with power devices, which can be such as, but not limited to, IGBT (Insulated Gate Bipolar Transistor) chips, shunts, FRD (Fast Recovery Diode) chips, etc.

[0070] In some embodiments, reference Figure 3A The power device may include a shunt, which includes a sampling resistor 53, a first electrode structure 51, and a second electrode structure 52. Specifically, the sampling resistor 53 may be elongated, and the first electrode structure 51 and the second electrode structure 52 may be connected to opposite ends of the sampling resistor 53.

[0071] There are several ways to mount the shunt onto the package substrate 10. For example, see [reference 1]. Figure 2A and Figure 3A The packaging substrate 10 has a first metal sheet 11 and a second metal sheet 12 spaced apart. A first electrode structure 51 is mounted on the first metal sheet 11, and a second electrode structure 52 is mounted on the second metal sheet 12. The electrode structures can be mounted on the corresponding metal sheets by soldering. For example, a solder layer 16 can be filled between the electrode structure and the corresponding metal sheet to achieve electrical connection between them.

[0072] For example, refer to Figure 2A and Figure 3AThe top view area of ​​the first metal sheet 11 and the second metal sheet 12 can be larger than the top view area of ​​the first electrode structure 51 and the second electrode structure 52, so that the top view outline of the first metal sheet 11 surrounds the top view outline of the first electrode structure 51, and the top view outline of the second metal sheet 12 surrounds the top view outline of the second electrode structure 52. Thus, during the welding process, the overflowing solder flows outward along the extension area of ​​the first metal sheet 11 to the outside of the electrode structure, thereby preventing the overflowing solder from electrically connecting the sampling resistor 53 and thus changing the resistance value of the sampling resistor 53.

[0073] For example, refer to Figure 2A and Figure 3A The pad area may include a first pad area 21 and a second pad area 22 spaced apart. The package substrate 10 is also provided with a first current-guiding structure 31 connecting the first pad area 21 and the first metal sheet 11, and a second current-guiding structure 32 connecting the second pad area 22 and the second metal sheet 12. By providing corresponding first current-guiding structures 31 for the first metal sheet 11 and corresponding second current-guiding structures 32 for the second metal sheet, it is convenient to electrically connect the same electrode structure to different pad areas and corresponding pins. This is beneficial for the time-division multiplexing of the shunt, thereby improving the utilization efficiency of the shunt and reducing the number of shunts on the power package, thus helping to reduce the size of the power package.

[0074] Regarding the configuration of the current-guiding structure, it can employ metal lines with narrower linewidths (narrower than the maximum linewidth of the first metal sheet 11 and the second metal sheet 12) to minimize the area occupied by the packaging substrate 10. The current-guiding structure can be electrically connected between the corresponding metal sheet and the corresponding pad area in a manner such as, but not limited to, bending, straight, or serpentine shapes.

[0075] For example, refer to Figure 1A , Figure 1C , Figure 2A and Figure 3A The sampling resistor 53 is spaced apart from the surface of the packaging substrate 10. At least a portion of the first current-guiding structure 31 and the second current-guiding structure 32 are located below the sampling resistor 53 and spaced apart from it. For example, part or all of the first current-guiding structure 31 is located below the sampling resistor 53 in a direction perpendicular to the surface of the packaging substrate 10, and part or all of the second current-guiding structure 32 is located below the sampling resistor 53 in a direction perpendicular to the surface of the packaging substrate 10. This allows the current-guiding structures to maximize the arrangement density between the current-guiding structures, shunts, and pad areas without interfering with the resistance value of the sampling resistor 53, thereby increasing the integration density of the packaging substrate 10 and improving the device packaging density, which is beneficial for reducing the size of power packages.

[0076] For example, refer to Figure 2AThe pad area may further include a third pad area 23, which is spaced apart from the first electrode structure 51 and extends to the first metal sheet 11. That is, the third pad area 23 is located in a portion of the first metal sheet 11, thereby simplifying the electrical connection between the third pad area 23 and the first metal sheet 11. (Reference) Figure 2A The first pad area 21, the second pad area 22, and the third pad area 23 can be arranged at intervals along the edge of the package substrate 10. (See reference) Figure 1A The leadframe may include a first pin 41 soldered to a first pad area 21, a second pin 42 soldered to a second pad area 22, and a third pin 43 soldered to a third pad area 23. This facilitates electrical connection with corresponding pins on the leadframe without interference. For example, the line widths of different pins may be the same or different; specifically, pins with higher load requirements may have a larger line width, and pins with lower load requirements may have a smaller line width.

[0077] For example, refer to Figure 5 The sampling resistor 53 may also have a notch 54 for adjusting the resistance value of the sampling resistor 53. By setting the notch 54, the resistance value of the sampling resistor 53 can be increased. For example, when the shunt is set on the package substrate 10, the notch 54 of the sampling resistor 53 can be set towards the outside of the package substrate 10, which is beneficial for heat dissipation of the sampling resistor 53.

[0078] For example, refer to Figure 2A and Figure 2B The packaging substrate 10 is further provided with a third metal sheet 13 and a fourth metal sheet 14 spaced apart; Reference Figure 3A and Figure 3B The power devices include a first IGBT chip 61 and a first FRD chip 71 mounted on a third metal sheet 13 and spaced apart, and a second IGBT chip 62 and a second FRD chip 72 mounted on a fourth metal sheet 14 and spaced apart. At this time, refer to... Figure 1A and Figure 1B The power package may further include a metal bonding wire 80 electrically connecting the pad area, the power device, and the metal sheet on the package substrate 10, thereby achieving electrical interconnection between the pad area, the power device, and the metal sheet. Due to the aforementioned embodiment with the raised structure, the connection reliability between the pad area and the lead frame can be improved, thereby enhancing the reliability and stability of the electrical connection between the metal bonding wire 80 and the pad area to meet higher bonding requirements.

[0079] Regarding the way the metal bonding wire 80 electrically connects these pad areas, power devices and metal sheets on the package substrate 10, there are many ways that can be used. As long as they can form a circuit with corresponding electrical functions, they are all within the protection scope of this application.

[0080] Regarding the material of the metal bonding wire 80, conductive wires such as, but not limited to, copper wire, silver wire, and gold wire can be used as the metal bonding wire 80.

[0081] The following is Figures 2A-4B For example, a packaging method for a power package is illustrated. For instance, refer to... Figure 2A and Figure 2B The illustrated packaging substrate 10 has a first metal sheet 11 to a fourth metal sheet 14, a first pad area 21 to a third pad area 23, a first current-guiding structure 31, and a second current-guiding structure 32 disposed thereon. A back metal layer 15 is also disposed below the packaging substrate 10, and the back metal layer 15 can be electrically connected via conductive plugs (not shown) in the packaging substrate 10. Of course, other pad areas can also be disposed on the upper surface of the packaging substrate 10, for example, a fourth pad area 24. Each pad area has a raised structure.

[0082] Next, refer to Figure 3A and Figure 3B Solder layers 16 can be printed on metal sheets and / or pad areas, and then IGBT chips, FRD chips, shunts and other power devices can be mounted.

[0083] Next, refer to Figure 4A and Figure 4B The lead frame is soldered to the pad area on the package substrate 10, and the reflow soldering operation is completed. In this step, the lead frame includes not only the first pin 41, the second pin 42, the third pin 43 and the fourth pin 44, but also the connecting part 45 connecting the different pins, so that the lead frame is a whole at this time.

[0084] For example, refer to Figure 1A and Figure 2A The top view of the second metal sheet 12 can be an L-shaped metal sheet, wherein the second electrode structure 52 is attached to the horizontal segment of the L-shaped metal sheet, and the vertical segment of the L-shaped metal sheet can be located on one side of the sampling resistor 53 and spaced apart from it, so that one end of the metal bonding line 80 is bonded to the vertical segment of the L-shaped metal sheet to provide a larger bonding area.

[0085] Next, you can refer to Figures 1A-1C The metal bonding wire 80 can be used to achieve electrical connections between different power devices, soldering areas, metal sheets, and lead frames. When the metal bonding wire 80 is bonded to the pad area of ​​the lead frame and the packaging substrate 10, the raised structure on the pad area provides support, thus fully meeting the bonding process requirements of the metal bonding wire 80. The connecting portion 45 on the lead frame can also be cut off, thereby achieving independent electrical functions between different pins and avoiding short circuits between different pins.

[0086] In some embodiments, the power package further includes: a molding compound substrate 10, and a molding layer (not shown) for the power device and lead frame. The molding layer encapsulates the power device, as well as the metal sheets and metal bonding wires 80 on the packaging substrate 10, to form the package. This isolates the devices from external electrical interference and also secures the pads and bonding areas, improving connection reliability and stability. The molding compound material can be, but is not limited to, insulating materials with high thermal fluidity and easy cooling molding, such as epoxy resin.

[0087] Example 2

[0088] In another embodiment of the present invention, an electronic device is also provided, which includes any of the power package components described above.

[0089] The electronic device in this embodiment can be any electronic product or device, such as a mobile phone, tablet computer, laptop computer, netbook, game console, television, VCD player, DVD player, navigator, digital photo frame, camera, camcorder, voice recorder, MP3 player, MP4 player, PSP, PFC device, transformer, charger, etc., or any intermediate product including circuitry. The electronic device in this embodiment of the present invention has better performance due to the use of the aforementioned power packaging component.

[0090] This utility model has been described through the above embodiments. However, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit the utility model to the described embodiments. Furthermore, those skilled in the art will understand that this utility model is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this utility model, all of which fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A power package, characterized by The power package comprises: a packaging substrate, a pad region being arranged on the packaging substrate, and a bump structure being arranged on the pad region; a power device being arranged on the packaging substrate and being electrically connected with the pad region; and a lead frame being soldered on the pad region through a solder layer, the solder layer covering at least a surface of the bump structure and a surface of the pad region. A plurality of the bump structures are arranged on the pad region in an array and are spaced apart, and the solder layer fills at least a space between two adjacent bump structures.

2. The power package of claim 1, wherein, The top portions of the plurality of the bump structures are at a same level.

3. The power package of claim 2, wherein, The power device comprises a shunt, the shunt comprising a sampling resistor, a first electrode structure and a second electrode structure; the packaging substrate is provided with first metal sheets and second metal sheets which are spaced apart, the first electrode structure is attached to the first metal sheets, and the second electrode structure is attached to the second metal sheets; 4. The power package of any one of claims 1 to 3, wherein, The pad region comprises first pad regions and second pad regions which are spaced apart, and the packaging substrate is further provided with a first current guide structure connected between the first pad regions and the first metal sheets, and a second current guide structure connected between the second pad regions and the second metal sheets. The sampling resistor is spaced apart from the surface of the packaging substrate, and at least a part of the first current guide structure and the second current guide structure is located below the sampling resistor and is spaced apart from the sampling resistor.

5. The power package of claim 4, wherein, The pad region further comprises third pad regions which are spaced apart from the first electrode structure and extend out of the first metal sheets, and the first pad regions, the second pad regions and the third pad regions are arranged along an edge of the packaging substrate; 6. The power package of claim 4, wherein, The lead frame comprises first pins soldered on the first pad regions, second pins soldered on the second pad regions, and third pins soldered on the third pad regions. The packaging substrate is further provided with third metal sheets and fourth metal sheets which are spaced apart; the power device comprises first IGBT chips and first FRD chips which are attached to the third metal sheets and are spaced apart, and second IGBT chips and second FRD chips which are attached to the fourth metal sheets and are spaced apart; 7. The power package of claim 4, wherein, The power package further comprises metal bonding wires which are electrically connected between the pad region, the power device and the metal sheets of the packaging substrate. The packaging substrate comprises a DBC substrate or an AMB substrate.

8. The power package of claim 1, wherein, The power package further comprises:

9. The power package of claim 1, wherein, a plastic encapsulation layer encapsulating the packaging substrate, the power device and the lead frame. The power package comprises:

10. An electronic device, comprising: The power package according to any one of claims 1-9. ​

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