Display panel and display device
By patterning the sidewalls of the power lines in the display panel and optimizing the encapsulation layer, the problem of black spots caused by moisture intrusion was solved, improving the high-temperature and high-humidity reliability and production efficiency of the display panel and reducing costs.
Patent Information
- Application Number
- CN202520008753.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-02
AI Technical Summary
In existing technologies, moisture intrusion into the display area leads to the formation of black spots, especially under high temperature and high humidity conditions, the film layer encapsulation at the power line fails, affecting the reliability of the display panel.
By patterning the sidewalls of the power lines that overlap with the organic grooves in the first border area on the substrate, and combining the setting of organic insulating layer and inorganic encapsulation layer, the encapsulation structure of the power lines is improved, avoiding the use of passivation layer to reduce costs and increase production capacity.
It improves high-temperature and high-humidity reliability, avoids film encapsulation failure at the power line, reduces costs and increases production efficiency, and reduces the occurrence of generative black spots.
Smart Images

Figure CN223844199U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to, but is not limited to, the field of display technology, and particularly to a display panel and display device. Background Technology
[0002] Organic light-emitting diodes (OLEDs) and quantum dot light-emitting diodes (QLEDs) are active light-emitting display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost. Utility Model Content
[0003] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.
[0004] This utility model provides a display panel and display device that can improve the situation where moisture intrusion into the display area causes organic black spots.
[0005] On one hand, this embodiment provides a display panel, including: a substrate, a plurality of sub-pixels, a power line, and an organic insulating layer. The substrate includes a display area and a first border area located on one side of the display area along a first direction. The first border area includes a bending area and a first wiring area located on the side of the bending area closer to the display area. The plurality of sub-pixels are located in the display area. The power line is at least partially located in the first wiring area and is electrically connected to the plurality of sub-pixels. The organic insulating layer may be located on the side of the power line away from the substrate, and an organic groove extending along a second direction is provided in the first wiring area, the organic groove penetrating the organic insulating layer. The power line has at least one sidewall extending along the first direction, the orthographic projection of the at least one sidewall onto the substrate partially overlapping the orthographic projection of the organic groove onto the substrate, and the edge length of the overlapping area of the at least one sidewall and the orthographic projection of the organic groove onto the substrate is greater than the minimum length of the organic groove along the first direction.
[0006] In some exemplary embodiments, the at least one sidewall includes: a main body portion extending along the first direction, and further includes at least one of the following: at least one protrusion protruding from the main body portion, and at least one recessed portion recessed into the main body portion.
[0007] In some exemplary embodiments, the at least one sidewall includes a plurality of protrusions extending from the main body, the plurality of protrusions being arranged along the first direction, and at least one of the plurality of protrusions having its orthographic projection onto the substrate located within the orthographic projection range of the organic groove onto the substrate.
[0008] In some exemplary embodiments, the at least one protrusion includes: a first sub-protrusion protruding from the main body portion, and at least one second sub-protrusion protruding from the first sub-protrusion, wherein the first sub-protrusion and the at least one second sub-protrusion extend in different directions.
[0009] In some exemplary embodiments, the first sub-protrusion extends along the second direction, and the second sub-protrusion extends along the first direction.
[0010] In some exemplary embodiments, the at least one protrusion includes: a first sub-protrusion protruding from the main body along the second direction, and a plurality of second sub-protrusions protruding from the first sub-protrusion along the first direction, the plurality of second sub-protrusions being spaced apart along the second direction.
[0011] In some exemplary embodiments, the at least one protrusion includes: a first sub-protrusion protruding from the main body in the second direction, and at least one second sub-protrusion protruding from the first sub-protrusion in the first direction, the second sub-protrusion covering the end of the first sub-protrusion away from the main body, or the second sub-protrusion being connected to the middle position of the first sub-protrusion.
[0012] In some exemplary embodiments, the at least one protrusion has an X-shaped orthogonal projection onto the substrate.
[0013] In some exemplary embodiments, the at least one sidewall includes a plurality of recesses recessed into the main body, the plurality of recesses being arranged along the first direction, and at least one of the plurality of recesses having its orthographic projection onto the substrate located within the orthographic projection range of the organic groove onto the substrate.
[0014] In some exemplary embodiments, the at least one recess includes: a first sub-recess recessed into the main body portion, and at least one second sub-recess recessed into the first sub-recess recess, wherein the first sub-recess recess and the at least one second sub-recess recess extend in different directions.
[0015] In some exemplary embodiments, the power line includes: a first power line located in the first wiring area and at least one second power line, wherein the first power line and the at least one second power line are in the same layer. The first power line has at least one first sidewall extending along the first direction, and the edge length of the overlapping area between the first sidewall and the organic groove in the orthographic projection of the organic groove on the substrate is greater than the minimum length of the organic groove along the first direction. The second power line has a second sidewall extending along the first direction, and the edge length of the overlapping area between the second sidewall and the organic groove in the orthographic projection of the organic groove on the substrate is greater than the minimum length of the organic groove along the first direction. The first sidewall of the first power line faces the second sidewall of the second power line along the second direction.
[0016] In some exemplary embodiments, the display panel further includes an inorganic encapsulation layer located on the side of the organic insulating layer away from the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic groove on the substrate.
[0017] In some exemplary embodiments, the power line includes a first sublayer, a second sublayer, and a third sublayer stacked along a direction away from the substrate, wherein the materials of the first sublayer and the third sublayer are different from the material of the second sublayer.
[0018] In some exemplary embodiments, the first and third sub-layers of the at least one sidewall of the power line protrude from the second sub-layer, forming a lateral groove.
[0019] In some exemplary embodiments, the display panel further includes organic residue located within the lateral groove of the power line.
[0020] On the other hand, this embodiment provides a display device, including the display panel as described above.
[0021] This embodiment provides a display panel that, by patterning the sidewalls of the power lines in the first frame area that overlap with the orthographic projection of the organic groove on the substrate, can improve the GDS problem caused by the failure of the film encapsulation at the power lines in the first frame area after high temperature and high humidity reliability. Moreover, the passivation layer can be omitted, which can reduce costs and increase production capacity.
[0022] Other features and advantages of this invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. Other advantages of this invention can be realized and obtained by means of the solutions described in the description and drawings. Attached Figure Description
[0023] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.
[0024] Figure 1 This is a schematic diagram of a display panel according to at least one embodiment of the present invention;
[0025] Figure 2 This is a partial cross-sectional schematic diagram of the display area of the display panel of at least one embodiment of the present invention;
[0026] Figure 3 for Figure 1 A schematic diagram of the central region S;
[0027] Figure 4 for Figure 3 A partial cross-sectional view along the OO' direction;
[0028] Figure 5A This is a schematic diagram showing that the first source / drain metal layer is protected by a passivation layer and no lateral etching (undercut) has occurred;
[0029] Figure 5B This is a schematic diagram showing lateral etching of the first source / drain metal layer when it lacks passivation layer protection.
[0030] Figure 6 for Figure 1 A partial schematic diagram of the central region S;
[0031] Figure 7 for Figure 6 A partially enlarged schematic diagram of the second power line in the diagram;
[0032] Figure 8A for Figure 6 A partially enlarged schematic diagram of the first and second power lines in the diagram;
[0033] Figure 8B for Figure 6 A schematic diagram showing the edge of the overlapping area between the first sidewall of the first power line and the organic tank in the orthographic projection of the substrate, and the edge of the overlapping area between the second sidewall of the second power line and the organic tank in the orthographic projection of the substrate.
[0034] Figure 9A for Figure 6 A partial cross-sectional view along the QQ' direction;
[0035] Figure 9B for Figure 6 A partial cross-sectional view along the RR' direction;
[0036] Figure 10A for Figure 1 Another partial schematic diagram of the central region S;
[0037] Figure 10B for Figure 10A A partially enlarged schematic diagram of the second power line in the diagram;
[0038] Figure 11 for Figure 1 Another partial schematic diagram of the central region S;
[0039] Figure 12 for Figure 1 Another partial schematic diagram of the central region S;
[0040] Figure 13 for Figure 1 Another partial schematic diagram of the central region S;
[0041] Figure 14 for Figure 1 Another partial schematic diagram of the central region S;
[0042] Figure 15 This is a schematic diagram of a display device according to at least one embodiment of the present invention. Detailed Implementation
[0043] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings. The embodiments can be implemented in many different forms. Those skilled in the art will readily understand that the methods and content can be transformed into other forms without departing from the spirit and scope of this utility model. Therefore, this utility model should not be construed as limited to the contents described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this utility model can be arbitrarily combined with each other.
[0044] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, one aspect of the invention is not necessarily limited to these dimensions, and the shape and size of one or more components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of the invention is not limited to the shapes or values shown in the drawings.
[0045] The ordinal numbers "first," "second," and "third" used in this specification are provided to avoid confusion among the constituent elements, not to limit the quantity. In this utility model, "multiple" refers to two or more items.
[0046] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the described constituent elements. Therefore, the description is not limited to the terms used in the specification and may be appropriately replaced as needed.
[0047] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or a joint; they can refer to a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art can understand the meaning of these terms in this utility model according to the context. "Joining" can include "electrical connection," which can include situations where constituent elements are connected together by a component having a certain electrical function. There are no particular limitations on the term "component having a certain electrical function," as long as it allows for the transmission of electrical signals between the connected constituent elements. Examples of "components having a certain electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with multiple functions.
[0048] In this specification, a transistor is a device that includes at least three terminals: a gate (gate electrode), a drain, and a source. A transistor has a channel region between its drain (drain electrode terminal, drain region, or drain electrode) and its source (source electrode terminal, source region, or source electrode), and current can flow through the drain, the channel region, and the source. In this specification, the channel region refers to the region through which current primarily flows.
[0049] In this specification, the first terminal can be the drain and the second terminal can be the source, or vice versa. Additionally, the gate can also be called the control terminal. In cases where transistors with opposite polarities are used or where the current direction changes during circuit operation, the functions of the "source" and "drain" are sometimes interchanged. Therefore, in this specification, the "source" and "drain" can be interchanged.
[0050] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.
[0051] In this specification, circles, ellipses, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined. They can be approximate circles, ellipses, triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, such as chamfers, curved edges, and other variations.
[0052] In this specification, "approximately" and "about" refer to situations where there are no strict limits and the process and measurement errors are allowed. In this utility model, "same" includes cases where the numerical values differ by less than 10%, such as cases where the numerical values differ by less than 5%.
[0053] In this specification, "A extends along direction B" means that A may include a main part and a secondary part connected to the main part. The main part is a line, line segment, or strip-shaped solid. The main part extends along direction B, and the length of the main part extending along direction B is greater than the length of the secondary part extending along other directions. In this specification, "A extends along direction B" refers to "the main part of A extends along direction B".
[0054] The phrase "A and B are of the same layer" in this specification means that A and B are formed simultaneously through the same patterning process, or that the surfaces of A and B closest to the substrate are at approximately the same distance from the substrate, or that the surfaces of A and B closest to the substrate are in direct contact with the same film layer. "Same layer" does not always mean that the layer thickness or height is the same in a cross-sectional view. "The orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection area of A, or the orthographic projection of A covers the orthographic projection of B.
[0055] Figure 1 This is a schematic diagram of a display panel according to at least one embodiment of the present invention. In some examples, such as... Figure 1As shown, the display panel may include a display area AA and a peripheral area BB located around the display area AA. The peripheral area BB may include a first border area B1 located on one side of the display area AA along a first direction D1, and other border areas located on other sides of the display area AA. The other border areas may include a second border area B2 located on the side of the display area AA away from the first border area B1 along the first direction D1, a third border area B3 located on both sides of the display area AA along a second direction D2, and a fourth border area B4. The first border area B1 may be the bottom border area of the display panel, the second border area B2 may be the top border area of the display panel, the third border area B3 may include the left border area of the display panel, a corner area connecting the first border area B1, and a corner area connecting the second border area B2, and the fourth border area B4 may include the right border area of the display panel, a corner area connecting the first border area B1, and a corner area connecting the second border area B2. In some other examples, the peripheral area BB may surround at least one side of the display area AA.
[0056] In some examples, the display area AA can be a rectangle, such as a rounded rectangle. However, this embodiment is not limited to this. For example, the display area AA can be other shapes such as a circle or an ellipse.
[0057] In some examples, the display area AA can be a flat area, which may include multiple sub-pixels PX, multiple gate lines GL, and multiple data lines DL forming a pixel array. The multiple sub-pixels PX can be configured to display dynamic or still images. The multiple gate lines GL can extend along a second direction D2 and be arranged along a first direction D1; the multiple data lines DL can extend along the first direction D1 and be arranged along the second direction D2. The orthographic projections of the multiple gate lines GL and the multiple data lines DL onto the substrate can intersect to form multiple sub-pixel regions, each of which can contain one sub-pixel PX. The multiple data lines DL can be electrically connected to the multiple sub-pixels PX, and can be configured to provide data signals to the multiple sub-pixels PX. The multiple gate lines GL can be electrically connected to the multiple sub-pixels PX, and can be configured to provide pixel control signals to the multiple sub-pixels PX. In some examples, the pixel control signals may include scan signals and emission control signals, or may include scan signals, or may include scan signals, reset control signals, and emission control signals.
[0058] In some examples, such as Figure 1 As shown, the second direction D2 can be the extension direction of the grid line GL in the display area AA (e.g., the row direction), and the first direction D1 can be the extension direction of the data line DL in the display area AA (e.g., the column direction). The first direction D1 and the second direction D2 can intersect each other, for example, they can be perpendicular to each other.
[0059] In some examples, a pixel unit of the display area AA may include three sub-pixels, namely a red sub-pixel, a green sub-pixel, and a blue sub-pixel. However, this embodiment is not limited to this. In some examples, a pixel unit may include four sub-pixels, namely a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel.
[0060] In some examples, a sub-pixel may include a pixel circuit and a light-emitting element electrically connected to the pixel circuit. The pixel circuit may include multiple transistors and at least one capacitor. For example, the pixel circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, 8T1C, 8T2C, or 9T2C structure. In these circuit structures, T refers to a thin-film transistor, C refers to a capacitor, the number before T represents the number of thin-film transistors in the circuit, and the number before C represents the number of capacitors in the circuit. In some examples, the multiple transistors in the pixel circuit may be P-type transistors or N-type transistors. Using the same type of transistors in the pixel circuit can simplify the manufacturing process, reduce the manufacturing difficulty of the display panel, and improve product yield. In other examples, the multiple transistors in the pixel circuit may include both P-type and N-type transistors.
[0061] In some examples, the multiple transistors in the pixel circuit can be low-temperature polysilicon (LTPS) thin-film transistors (TFTs), oxide thin-film transistors (OPTs), or a combination of both. The active layer of the LTPS TFT is made of low-temperature polysilicon (LTPS), while the active layer of the OPT TFT is made of oxide. LTPS TFTs offer advantages such as high mobility and fast charging, while OPTs offer advantages such as low leakage current. Integrating LTPS and OPTs onto a single display panel—an LTPS+Oxide (LTPO) display panel—leverages the advantages of both, enabling low-frequency driving, reducing power consumption, and improving display quality.
[0062] In some examples, the light-emitting element can be any of the following: a light-emitting diode (LED), an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), or a micro-LED (including mini-LED or micro-LED). For example, the light-emitting element can be an OLED, which can emit red, green, blue, or white light under the drive of its corresponding pixel circuit. The color of the light emitted by the light-emitting element can be determined as needed. In some examples, the light-emitting element can include an anode, a cathode, and an organic light-emitting layer located between the anode and the cathode. The anode of the light-emitting element can be electrically connected to the corresponding pixel circuit. However, this embodiment is not limited to this. In other examples, the cathode of the light-emitting element can be electrically connected to the corresponding pixel circuit.
[0063] In some examples, the orthographic projection of the light-emitting element of a sub-pixel onto the substrate can be rectangular, rhomboid, pentagonal, or hexagonal. When a pixel unit includes three sub-pixels, the light-emitting elements of the three sub-pixels can be arranged horizontally side-by-side, vertically side-by-side, or in a triangular arrangement; when a pixel unit includes four sub-pixels, the light-emitting elements of the four sub-pixels can be arranged horizontally side-by-side, vertically side-by-side, or in a square arrangement. However, this embodiment is not limited in this respect.
[0064] Figure 2 This is a partial cross-sectional schematic diagram of the display area of the display panel in at least one embodiment of the present invention. Figure 2 This example illustrates the structure of a sub-pixel in the display area. In this example, multiple transistors in the pixel circuit are of the same type; for example, all transistors in the pixel circuit can be low-temperature polycrystalline silicon (LTPS) thin-film transistors (LTPS) or all can be oxide (OPS) thin-film transistors (OSTs). In other examples, the multiple transistors in the pixel circuit can be both LTPS and OPS. Furthermore, this example illustrates a display panel integrating a mutual capacitance touch structure to form an FMLOC structure.
[0065] In some examples, such as Figure 2As shown, in a direction perpendicular to the display panel, the display panel may include: a substrate 100, and a circuit structure layer 12, a light-emitting structure layer 13, an encapsulation structure layer 14, and a touch structure layer 15 sequentially disposed on the substrate 100. The circuit structure layer 12 may include pixel circuits for multiple sub-pixels located in the display area AA, each pixel circuit including multiple transistors and at least one capacitor. The light-emitting structure layer 13 may include light-emitting elements for multiple sub-pixels. The touch structure layer 15 uses the encapsulation structure layer 14 as the touch substrate. In some possible implementations, the display panel may include other film layers, such as spacers, color filters, etc., which are not limited in this embodiment.
[0066] In some examples, substrate 100 may be a flexible substrate. The flexible substrate may include one or more of polyethylene terephthalate, polyethylene terephthalate, polyetheretherketone, polystyrene, polycarbonate, polyarylate, polyarylate, polyimide, polyvinyl chloride, polyethylene, and textile fibers. In some examples, the flexible substrate may include a stacked first flexible material layer, a first inorganic material layer, a second flexible material layer, and a second inorganic material layer. The materials of the first and second flexible material layers may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film, etc. The materials of the first and second inorganic material layers may be silicon nitride (SiNx, x>0) or silicon oxide (SiOy, y>0), etc., to improve the substrate's resistance to water and oxygen.
[0067] In some examples, Figure 2The diagram illustrates an example where each sub-pixel includes a transistor 17 and a capacitor 16. The circuit structure layer 12 may include: a semiconductor layer, a gate metal layer (e.g., including a first gate metal layer and a second gate metal layer), and a source / drain metal layer (e.g., including a first source / drain metal layer and a second source / drain metal layer) disposed on the substrate 100. A first insulating layer (also referred to as a first gate insulating layer) 101 may be disposed between the semiconductor layer and the first gate metal layer; a second insulating layer (also referred to as a second gate insulating layer) 102 may be disposed between the first gate metal layer and the second gate metal layer; a third insulating layer (also referred to as an interlayer insulating layer) 103 may be disposed between the second gate metal layer and the first source / drain metal layer; a fourth insulating layer (also referred to as a passivation layer) 104 and a fifth insulating layer (also referred to as a first planarization layer) 105 may be disposed between the first source / drain metal layer and the second source / drain metal layer; and a sixth insulating layer (also referred to as a second planarization layer) 106 may be disposed on the side of the second source / drain metal layer away from the substrate 100. In this embodiment, the first insulating layer 101, the second insulating layer 102, the third insulating layer 103, and the fourth insulating layer 104 can be made of inorganic materials, while the fifth insulating layer 105 and the sixth insulating layer 106 can be made of organic materials. However, this embodiment is not limited to these methods. In other examples, a buffer layer can be provided on the side of the semiconductor layer near the substrate. The buffer layer can prevent harmful substances in the substrate from penetrating the interior of the display panel and can also increase the adhesion of the film layers in the display panel to the substrate. In other examples, a bottom shielding metal layer (BSM) can be provided on the side of the buffer layer near the substrate. The bottom shielding metal layer can be configured to at least partially cover the active layer of the thin-film transistor of the pixel circuit to avoid external light affecting the performance of the thin-film transistor. In other examples, the passivation layer between the first source / drain metal layer and the second source / drain metal layer can be omitted, and only a first planarization layer can be provided between the first source / drain metal layer and the second source / drain metal layer.
[0068] In some examples, the first gate metal layer, the second gate metal layer, the first source / drain metal layer, and the second source / drain metal layer can be made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). These can be single-layer structures or multi-layer composite structures, such as Ti / Al / Ti. The semiconductor layer can be made of amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, or polythiophene, etc. Therefore, this invention is applicable to transistors manufactured based on oxide technology, silicon technology, or organic technology.
[0069] In some examples, the active layer of each transistor may include a first region, a second region, and a channel region located between the first and second regions. The semiconductor layer material may, for example, include polysilicon. The channel region may be undoped and possess semiconductor properties. The first and second regions may be doped regions on either side of the channel region and are doped with impurities, thus possessing conductivity. The impurities may vary depending on the type of transistor. In some examples, the doped regions of the active layer may be interpreted as the source or drain electrodes of the transistor. The portion of the active layer between transistors may be interpreted as doped wiring that can be used to electrically connect the transistors. This embodiment is not limited in this respect.
[0070] In some examples, such as Figure 2 As shown, the semiconductor layer of the display area may include at least the active layer 170 of transistor 17. The active layer 170 of transistor 17 may include a first region 1701, a second region 1702, and a channel region 1700 located between the first region 1701 and the second region 1702. The first gate metal layer may include at least the gate 173 of transistor 17 and the first electrode 161 of capacitor 16. The orthographic projection of the gate 173 of transistor 17 onto the substrate 100 may cover the orthographic projection of the channel region 1700 of the active layer 170 onto the substrate 100. The second gate metal layer may include at least the second electrode 162 of capacitor 16. The orthographic projections of the second electrode 162 and the first electrode 161 of capacitor 16 onto the substrate 100 may at least partially overlap; for example, they may coincide. The first source-drain metal layer may include at least the source 171 and the drain 172 of transistor 17. The third insulating layer 103 may have multiple vias (e.g., including a first pixel via and a second pixel via) in the display area. The third insulating layer 103, the second insulating layer 102, and the first insulating layer 101 within the first pixel via can be removed, exposing at least a portion of the surface of the first region 1701 of the active layer 170. The third insulating layer 103, the second insulating layer 102, and the first insulating layer 101 within the second pixel via can be removed, exposing at least a portion of the surface of the second region 1702 of the active layer 170. The source 171 of the transistor 17 can be electrically connected to the first region 1701 of the active layer 170 through the first pixel via, and the drain 172 can be electrically connected to the second region 1702 of the active layer 170 through the second pixel via. The second source-drain metal layer may include an anode transition electrode 181. The anode transition electrode 181 can be electrically connected to the drain 172 of the transistor 17 of the pixel circuit through the third pixel via formed by the fourth insulating layer 104 and the fifth insulating layer 105. This example demonstrates the electrical connection between the pixel circuitry and the light-emitting element via the anode adapter electrode 181.
[0071] In some examples, the gate line GL of the display area may be located, for example, in the first gate metal layer; the data line DL of the display area may be located, for example, in the second source-drain metal layer; and the high-potential power line of the display area may be located, for example, in the second source-drain metal layer. This embodiment is not limited in this respect. In other examples, the circuit structure layer may include three source-drain metal layers, which can avoid arranging too many traces in a single source-drain metal layer, thereby facilitating the realization of a narrow bezel structure.
[0072] In some examples, such as Figure 2 As shown, the light-emitting structure layer 13 may include a pixel definition layer 134 and multiple light-emitting elements. For example, each light-emitting element may include a stacked first electrode 131, an organic light-emitting layer 132, and a second electrode 133. The first electrode 131 of the light-emitting element can be an anode, and the first electrode 131 can be disposed on the sixth insulating layer 106 and electrically connected to the anode transition electrode 181 through a third pixel via formed in the sixth insulating layer 106. The pixel definition layer 134 is disposed on the first electrode 131 and the sixth insulating layer 106, and the pixel definition layer 134 may have multiple pixel openings, one pixel opening exposing at least a portion of the surface of a corresponding first electrode 131. At least a portion of the organic light-emitting layer 132 can be disposed within a pixel opening and connected to the corresponding first electrode 131. The second electrode 133 can be a cathode, and can be disposed on and in contact with the organic light-emitting layer 132. The organic light-emitting layer 132 can emit light of a corresponding color under the drive of the first electrode 131 and the second electrode 133. An isolation pillar layer can also be set on the side of the pixel definition layer 134 away from the substrate 100. The isolation pillar layer can include multiple isolation pillars (PS).
[0073] In some examples, the organic light-emitting layer 132 of the light-emitting element may include an emitting layer (EML) and one or more films selected from the following: a hole injection layer (HIL), a hole transport layer (HTL), a hole block layer (HBL), an electron block layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first electrode 131 and the second electrode 133, the light-emitting properties of the organic material can be utilized to emit light at the required grayscale.
[0074] In some examples, the light-emitting layers of different colored light-emitting elements can be different. For example, a red light-emitting element includes a red light-emitting layer, a green light-emitting element includes a green light-emitting layer, and a blue light-emitting element includes a blue light-emitting layer. To reduce process complexity and improve yield, the hole injection layer and hole transport layer on one side of the light-emitting layer can be common layers, as can the electron injection layer and electron transport layer on the other side. In some examples, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer can be fabricated in a single process (single vapor deposition process or single inkjet printing process), and isolation can be achieved through surface steps of the formed film layers or through surface treatment. For example, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer corresponding to adjacent sub-pixels can be isolated. In some examples, the organic light-emitting layer can be formed by vapor deposition using a fine metal mask (FMM) or an open mask, or by inkjet printing.
[0075] In some examples, such as Figure 2 As shown, the encapsulation structure layer 14 may include a first encapsulation layer 141, a second encapsulation layer 142, and a third encapsulation layer 143 stacked together. The first encapsulation layer 141 and the third encapsulation layer 143 may be made of inorganic materials, while the second encapsulation layer 142 may be made of organic materials. The second encapsulation layer 142 may be disposed between the first encapsulation layer 141 and the third encapsulation layer 143 to prevent external moisture from entering the light-emitting element. The first encapsulation layer 141 and the third encapsulation layer 143 may also be referred to as inorganic encapsulation layers. However, this embodiment is not limited to this. For example, the encapsulation structure layer may adopt a five-layer stacked structure of inorganic / organic / inorganic / organic / inorganic.
[0076] In some examples, the touch structure layer 15 may include: a touch barrier layer (TBL, Touch Barrier Layer) 150, a first touch conductive layer (TMA, Touch Metal A) 151, a touch interlayer insulating layer (TLD) 153, a second touch conductive layer (TMB, Touch Metal B) 152, and a touch optical cover layer (TOC, Touch Optical Cover) 154, sequentially disposed. The touch barrier layer 150 and the touch interlayer insulating layer 153 may be made of inorganic materials, while the touch optical cover layer 154 may be made of organic materials. For example, the touch barrier layer 150 and the touch interlayer insulating layer 153 may be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multiple layers, or composite layers. The touch optical cover layer 154 may be made of polyimide (PI), etc. The first touch conductive layer 151 and the second touch conductive layer 152 may be made of metallic materials.
[0077] In some examples, the first touch conductive layer 151 may include a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of first touch connection portions, with adjacent first touch electrodes connected to form a single structure via the first touch connection portions; the second touch conductive layer 152 may include a plurality of second touch connection portions, and the second touch electrodes may be connected to adjacent second touch connection portions via vias formed in the interlayer insulating layer 153. In other examples, the second touch conductive layer may include the aforementioned first touch electrodes, second touch electrodes, and first touch connection portions, and the first touch conductive layer may include the aforementioned second touch connection portions.
[0078] In some examples, the first touch electrode may be a driving (Tx) electrode and the second touch electrode may be a sensing (Rx) electrode. Alternatively, the first touch electrode may be a sensing (Rx) electrode and the second touch electrode may be a driving (Tx) electrode. This embodiment is not limited in this respect.
[0079] In some examples, such as Figure 1 As shown, the first border area B1 may include: a first wiring area B11, a bending area B12, and a second wiring area B13 arranged sequentially along a direction away from the display area AA. The first wiring area B11 can be connected to the display area AA. The first wiring area B11 may be provided with at least a first power line 31, second power lines 32a and 32b, multiple display leads, and multiple touch leads. The first power line 31 can be configured to connect to a high-potential power line in the display area AA, and the second power lines 32a and 32b can be configured to connect to low-potential power lines 33 in the remaining border areas. The second power line 32a can extend to the third border area B3 and connect to one end of the low-potential power line 33, and the second power line 32b can extend to the fourth border area B4 and connect to the other end of the low-potential power line 33. The first power signal transmitted by the first power line 31 can be greater than the second power signal transmitted by the second power lines 32a and 32b. For example, the first power line 31 can be electrically connected to the pixel circuit of multiple sub-pixels of the display area AA through the high-potential power line of the display area AA, and the second power lines 32a and 32b can be electrically connected to the cathodes of the light-emitting elements of multiple sub-pixels of the display area AA through the low-potential power line 33.
[0080] In some examples, the multiple display leads may include multiple data leads and multiple drive leads. The multiple data leads can be electrically connected to multiple data lines in the display area; for example, multiple data leads and multiple data lines DL can be electrically connected in a one-to-one correspondence. The multiple data leads can extend from the first routing area B11 to the bending area B12 using a fan-out routing method. The multiple drive leads can extend from the third bezel area B3 and the fourth bezel area B4 to the first routing area B11. The multiple drive leads can be electrically connected to the gate drive circuitry within the third bezel area B3 and the fourth bezel area B4. The multiple drive leads can be configured to provide control signals to the gate drive circuitry; for example, the control signals may include start signals, clock signals, etc. The multiple touch leads can extend from the third bezel area B3 and the fourth bezel area B4 to the first routing area B11 and can be located on the side of the multiple display leads away from the substrate.
[0081] In some examples, the bending area B12 connects between the first wiring area B11 and the second wiring area B13, and can be configured such that the second wiring area B13 bends to the back of the display area AA. The bending area B12 can have multiple bent connection lines, such as multiple data bent connection lines, multiple drive bent connection lines, multiple touch bent connection lines, multiple first power bent connection lines, and multiple second power bent connection lines. The multiple first power bent connection lines can be electrically connected to the first power line 31, and the multiple second power bent connection lines can be electrically connected to the second power lines 32a and 32b. The multiple data bent connection lines can be electrically connected to multiple data leads, the multiple drive bent connection lines can be electrically connected to multiple drive leads, and the multiple touch bent connection lines can be electrically connected to multiple touch leads.
[0082] In some examples, the second wiring area B13 may include at least one first signal access area B131 and at least one second signal access area B132. This example illustrates one first signal access area B131 and one second signal access area B132. In other examples, the display panel may be a large-size panel, which may include multiple first signal access areas B131 and multiple second signal access areas B132. The multiple first signal access areas B131 may be arranged sequentially along the second direction D2, and the multiple second signal access areas B132 may be arranged sequentially along the second direction D2. The first signal access area B131 may be located on the side of the second signal access area B132 closer to the display area AA. In other words, the second signal access area B132 may be located on the side of the first signal access area B131 away from the bending area B12 in the first direction D1.
[0083] In some examples, the first signal access area B131 may be provided with multiple first contact pads configured to be electrically connected to an integrated circuit (IC). The first signal access area B131 may also be referred to as a driver chip setting area. The second signal access area B132 may be provided with multiple second contact pads configured to be bonded to an external flexible printed circuit (FPC).
[0084] In some examples, the second routing area B13 may be provided with a first power lead 41, and second power leads 42a and 42b. The first power lead 41 may be located between the second power leads 42a and 42b along the second direction D2. The portion of the first power lead 41 extending along the second direction D2 may be located on the side of the first signal access area B131 near the bend area B12, and the portion of the first power lead 41 extending along the first direction D1 may be located on opposite sides of the first signal access area B131 along the second direction D2. The second power lead 42a can be connected to the second power line 32a located in the first wiring area B11 via multiple second power bend connecting lines in the bend area B12. The second power lead 42b can be connected to the second power line 32b located in the first wiring area B11 via multiple second power bend connecting lines in the bend area B12. The first power lead 41 can be connected to the first power line 31 located in the first wiring area B11 via multiple first power bend connecting lines in the bend area B12. The first power lead 41, the second power leads 42a and 42b can extend to the second signal access area B132 and be electrically connected to the corresponding second contact pad in the second signal access area B132.
[0085] Studies have shown that when the encapsulation structure layer fails, such as by creating gaps or breaking, moisture and oxygen from the air can enter the light-emitting element along these gaps. This causes the organic materials within the light-emitting element to oxidize and fail, forming a non-luminous failure area. As moisture and oxygen continue to invade the light-emitting element along these gaps, the failure area gradually expands, leading to display defects on the display panel, a condition known as growing dark spots (GDS).
[0086] Figure 3 for Figure 1 A schematic diagram of the central region S. Figure 4 for Figure 3 A partial cross-sectional view along the OO' direction. In some examples, such as... Figure 3 and Figure 4As shown, the first power line 31 and the second power line 32a can be in the same layer, for example, both located in the first source / drain metal layer. The organic insulating layer of the first trace area B11 can be located on the side of the first source / drain metal layer away from the substrate 100. For example, the organic insulating layer can include a first planarization layer 105, a second planarization layer 106, and a pixel definition layer 134 stacked sequentially. Since the organic insulating layer uses organic materials and is hydrophilic, in order to isolate water and oxygen, the organic insulating layer of the first trace area B11 can be provided with an organic trench 50 extending along the second direction D2. The organic insulating layer in the organic trench 50 can be removed; in other words, the organic trench 50 can penetrate the organic insulating layer of the first trace area B11.
[0087] In some examples, the first routing area B11 is also provided with a first isolation dam DAM1 and a second isolation dam DMA2. The first isolation dam DAM1 and the second isolation dam DAM2 may be located on the side of the organic tray 50 near the display area AA. The first isolation dam DAM1 may be located on the side of the second isolation dam DAM2 near the display area AA. The first isolation dam DAM1 may include a first dam base prepared in the same layer as the second planarization layer 106 and a second dam base prepared in the same layer as the pixel definition layer 134; the second isolation dam DAM2 may include a third dam base prepared in the same layer as the first planarization layer 105, a fourth dam base prepared in the same layer as the second planarization layer 106, and a fifth dam base prepared in the same layer as the pixel definition layer 134.
[0088] In some examples, such as Figure 3 and Figure 4As shown, the touch blocking layer 150, the touch interlayer insulating layer 153, and the touch protective layer 154 can sequentially cover the organic groove 50. The display area of the display panel can be covered by a polarizer (POL) 191, and the bending area B12 can be coated with an MCL adhesive layer 192. The junction of the polarizer 191 and the MCL adhesive layer 192 is near the organic groove 50. When the polarizer 191 shrinks under high temperature and high humidity conditions, the polarizer 191 and the MCL adhesive layer 192 will separate, creating a gap. This causes the touch protective layer 154, made of organic materials, to come into contact with the air. Under high temperature and high humidity conditions, moisture and oxygen in the air will enter the organic groove 50 through the gap between the polarizer 191 and the MCL adhesive layer 192. Since the touch protective layer 154 made of organic materials is hygroscopic, moisture and oxygen will penetrate the underlying encapsulation structure layer through the touch protective layer 154. When the boundary of the inorganic encapsulation layer (including the first encapsulation layer 141 and the third encapsulation layer 143) of the encapsulation structure layer is located within the range of the organic groove 50, moisture can easily penetrate into the display area through the inorganic encapsulation layer, thus easily leading to GDS. Moreover, as narrow bezel designs gradually become the mainstream in the market, the size of the first bezel area (i.e., the bottom bezel area) of the display panel along the first direction D1 is continuously compressed, and the distance between the organic groove 50 near the boundary of the inorganic encapsulation layer and the display area AA is getting smaller and smaller, which gradually increases the risk of GDS.
[0089] Figure 5A This is a schematic diagram showing that the first source / drain metal layer is protected by a passivation layer and no lateral etching (undercut) has occurred; Figure 5B This is a schematic diagram illustrating lateral etching of the first source / drain metal layer without passivation protection. In some examples, such as... Figure 5A and Figure 5B As shown, the first source / drain metal layer can adopt a multi-layer composite structure, such as including a first sub-metal layer SD-1, a second sub-metal layer SD-2, and a third sub-metal layer SD-3 stacked sequentially. The first sub-metal layer SD-1 and the third sub-metal layer SD-3 can be made of the same material, such as Ti. The material of the second sub-metal layer SD-2 is different from that of the first sub-metal layer SD-1, such as Al. The metal material of the second sub-metal layer SD-2 (e.g., Al) has high activity and is easily corroded by aqueous liquids.
[0090] like Figure 5A As shown, when the first source / drain metal layer is covered and encapsulated by the passivation layer 104, since the passivation layer 104 is made of inorganic material, it is not affected by the etching solution of other film layers, and can play a good protective role for the first source / drain metal layer. Figure 5BAs shown, the first source / drain metal layer is not protected by the passivation layer 104. After the first source / drain metal layer undergoes self-etching, development of the subsequent planarization layer, etching of the anode layer, and development of the pixel definition layer, due to the material property differences between the second sub-metal layer SD-2 and the first sub-metal layer SD-1 and the third sub-metal layer SD-3 (the activity of the second sub-metal layer SD-2 is higher than that of the first sub-metal layer SD-1), a deeper groove UC will be formed on the side of the first source / drain metal layer.
[0091] When a deep groove exists on the side of the first source / drain metal layer, during the fabrication of the inorganic encapsulation layer in the encapsulation structure layer, due to the poor leveling and density of the inorganic encapsulation layer, it cannot be completely deposited into the groove on the side of the first source / drain metal layer, resulting in reduced density in the side region of the first source / drain metal layer. During high-temperature and high-humidity reliability testing, moisture will continuously infiltrate into the touch protection layer and inorganic encapsulation layer through the gaps created by the separation of the polarizer and the MCL adhesive layer. Due to the reduced density of the inorganic encapsulation layer in the side region of the first source / drain metal layer, moisture can penetrate the inorganic encapsulation layer into the display area, oxidizing the organic material of the light-emitting element and forming growth black spots. Therefore, Figure 3 The circled location OY is usually the starting point of water and oxygen intrusion.
[0092] While using a passivation layer to protect the traces of the first source / drain metal layer in the bezel area can effectively improve GDS (Gas Displacement Detection), to increase production capacity and reduce the material and process costs of the display panel, a design scheme that removes the passivation layer and correspondingly reduces the passivation layer mask is usually adopted. This embodiment provides a display panel that, by patterning the sidewalls of the power lines in the first bezel area that overlap with the orthographic projection of the organic trench on the substrate, can improve the GDS problem caused by film encapsulation failure at the power lines in the first bezel area after high temperature and humidity reliability testing. Moreover, the passivation layer can be omitted, which can reduce costs and increase production capacity.
[0093] This embodiment provides a display panel, including: a substrate, a plurality of sub-pixels, power lines, and an organic insulating layer. The substrate includes a display area and a first border area located on one side of the display area along a first direction. The first border area includes a bending area and a first wiring area located on the side of the bending area closer to the display area. The plurality of sub-pixels are located in the display area. The power lines are at least partially located in the first wiring area and are electrically connected to the plurality of sub-pixels. The organic insulating layer may be located on the side of the power lines away from the substrate, and an organic groove extending along a second direction is provided in the first wiring area, the organic groove penetrating the organic insulating layer. The power lines have at least one sidewall extending along the first direction, the orthographic projection of the at least one sidewall onto the substrate partially overlapping the orthographic projection of the organic groove onto the substrate, and the edge length of the overlapping area of the at least one sidewall and the orthographic projection of the organic groove onto the substrate is greater than the minimum length of the organic groove along the first direction.
[0094] In some examples, the at least one sidewall of the power cord may pass through the organic groove along a first direction, and the orthographic projection of the at least one sidewall onto the substrate is a non-straight edge, which may have a patterned design.
[0095] In some examples, the edge length of the overlapping area between the sidewall of the power cord and the orthographic projection of the organic slot onto the substrate can refer to the total length extending from the end of the organic slot furthest from the display area to the end of the organic slot closest to the display area. The minimum length of the organic slot along the first direction can be the width of the organic slot.
[0096] The display panel provided in this embodiment is designed such that the edge length of the overlapping area between at least one sidewall of the power line and the organic groove on the substrate is greater than the minimum length of the organic groove along the first direction. This effectively extends the propagation path of water and oxygen from the sidewall of the power line into the display area, thereby ensuring that the display panel will not experience water vapor intrusion into the display area and form generative black spots due to inorganic encapsulation layer failure during high temperature and high humidity reliability verification. This can greatly improve the reliability and dependability of the display panel and enhance its market competitiveness.
[0097] In some exemplary embodiments, at least one sidewall of the power cord may include a main body extending along a first direction, and may further include at least one of the following: at least one protrusion protruding from the main body and at least one recessed portion recessed into the main body. In some examples, the angle between the plane containing the main body of the power cord's sidewall and the plane containing the substrate may be greater than 0 degrees and less than or equal to 90 degrees. The orthographic projection of the main body of the power cord's sidewall onto the substrate may include a plurality of straight line segments extending along the first direction. This example, by patterning the sidewall of the power cord, can avoid GSD (Geometric Surface Defects) without increasing the number of photomasks and process flows, thereby improving the reliability and dependability of the display panel.
[0098] The following provides an example of the solution in this embodiment. In the example below, the power cord may include a first power cord and a second power cord, and the patterned sidewall of the power cord may include at least one of the following: a first sidewall of the first power cord and a second sidewall of the second power cord.
[0099] Figure 6 for Figure 1 A partial schematic diagram of region S in the middle. Figure 7 for Figure 6 A partially enlarged schematic diagram of the second power line. Figure 8A for Figure 6 A partially enlarged schematic diagram of the first and second power lines in the diagram. Figure 8B for Figure 6A schematic diagram showing the edge of the overlapping area between the first sidewall of the first power line and the organic tank in the orthographic projection of the substrate, and the edge of the overlapping area between the second sidewall of the second power line and the organic tank in the orthographic projection of the substrate. Figure 9A for Figure 6 A partial cross-sectional view along the QQ' direction. Figure 9B for Figure 6 A partial cross-sectional view along the RR' direction.
[0100] In some examples, such as Figures 6 to 9B As shown, within the first trace area B11, the second power line 32a and the first power line 31 can be on the same layer, for example, both located in the first source / drain metal layer. The orthographic projections of the second power line 32a and the first power line 31 onto the substrate can partially overlap with the orthographic projection of the organic trench 50 onto the substrate. The organic insulating layer within the organic trench 50 can be removed; for example, the organic insulating layer may include a stacked first planarization layer 105, a second planarization layer 106, and a pixel definition layer 134. The inorganic encapsulation layer 140 can fill the organic trench 50. For example, the inorganic encapsulation layer 140 may include a first encapsulation layer and a third encapsulation layer made of inorganic materials. The orthographic projection of the inorganic encapsulation layer 140 onto the substrate can cover the orthographic projection of the organic trench 50 onto the substrate. In this example, the boundary of the inorganic encapsulation layer 140 can be on the side of the organic trench 50 away from the display area AA, which can improve the situation where water vapor directly invades due to the failure of the inorganic encapsulation layer 140.
[0101] In some examples, such as Figures 6 to 8B As shown, the second power line 32a may have a second sidewall 320 passing through the organic groove 50 along the first direction D1, and the first power line 31 may have a first sidewall 310 passing through the organic groove 50 along the first direction D1. The second sidewall 320 of the second power line 32a may face the first sidewall 310 of the first power line 31 along the second direction D2. The orthographic projections of the first sidewall 310 and the second sidewall 320 onto the substrate may overlap with a portion of the organic insulating layer and a portion of the organic groove 50.
[0102] The following explanation uses the second sidewall 320 of the second power line 32a as an example. Figure 7 As shown, the second sidewall 320 of the second power line 32a may include a main body 3200 and a plurality of protrusions 321 extending from the main body 3200. The plurality of protrusions 321 may be arranged at intervals along a first direction D1. The orthographic projection of the main body 3200 of the second sidewall 320 onto the substrate may include a plurality of spaced straight segments extending along the first direction D1.
[0103] In some examples, the protrusion 321 of the second sidewall 320 may include: a first sub-protrusion 3211 protruding from the main body 3200 along a second direction D2, and a plurality (e.g., six) second sub-protrusions 3212 protruding from the first sub-protrusion 3211 along a first direction D1 towards the side closer to the display area AA, and three second sub-protrusions 3212 protruding from the first sub-protrusion 3211 away from the display area AA along the first direction D1. The three second sub-protrusions 3212 on the side of the first sub-protrusion 3211 closer to the display area AA and the three second sub-protrusions 3212 on the side away from the display area AA may be aligned one by one. The surface of the second sub-protrusions 3212 away from the first sub-protrusion 3211 may be curved or arc-shaped. For example, the orthographic projection of the first sub-protrusion 3211 onto the substrate can be a straight strip extending along the second direction D2; the orthographic projection of the second sub-protrusion 3212 onto the substrate can be a semicircle. The orthographic projection of a single protrusion 321 of the second sidewall 320 onto the substrate can be approximately in the shape of a gourd string.
[0104] In some examples, the spacing between the first sub-protrusions 3211 of two adjacent protrusions 321 of the second sidewall 320 may be approximately the same; the spacing between the second sub-protrusions 3212 of the protrusions 321 adjacent along the second direction D2 may also be approximately the same. This embodiment is not limited in this respect.
[0105] In some examples, the first sidewall 310 may include three protrusions 311 extending from the main body, the three protrusions 311 being spaced apart along a first direction D1. The protrusions 311 of the first sidewall 310 may include a first sub-protrusion extending from the main body along a second direction D2 and multiple (e.g., four) second sub-protrusions extending from the first sub-protrusion along the first direction D1. For example, the length of the protrusions 311 of the first sidewall 310 along the second direction D2 may be less than the length of the protrusions 321 of the second sidewall 320 along the second direction D2.
[0106] In some examples, the orthographic projections of the three protrusions 321 of the second sidewall 320 and the three protrusions 311 of the first sidewall 310 onto the substrate may lie within the orthographic projection range of the organic groove 50 onto the substrate. In other words, the orthographic projection of the organic groove 50 onto the substrate may cover the orthographic projection of the three protrusions 311 of the first sidewall 310 onto the substrate. This embodiment is not limited in this respect. For example, the orthographic projections of at least one protrusion of the second sidewall and at least one protrusion of the first sidewall onto the substrate may lie within the orthographic projection range of the organic groove onto the substrate.
[0107] In some examples, Figure 8BThe diagram illustrates the edge E1 of the overlapping area of the second sidewall 320 and the organic groove 50 in the orthographic projection onto the substrate, and the edge E2 of the overlapping area of the first sidewall 310 and the organic groove 50 in the orthographic projection onto the substrate. The length of the edge E1 of the overlapping area of the second sidewall 320 and the organic groove 50 in the orthographic projection onto the substrate may include the sum of the following two items: the length of the main body portion 3200 within the orthographic projection range of the organic groove 50 along the first direction D1, and the sum of the edge lengths of the protrusions 321 within the orthographic projection range of the organic groove 50 (e.g., the sum of the edge lengths of the three protrusions 321). The length of the edge E2 of the overlapping area of the first sidewall 310 and the organic groove 50 in the orthographic projection onto the substrate may include the sum of the following two items: the length of the main body portion within the orthographic projection range of the organic groove 50 along the first direction D1, and the sum of the edge lengths of the protrusions 311 within the orthographic projection range of the organic groove 50 (e.g., the sum of the edge lengths of the three protrusions 311). The length of the edge E1 of the overlapping area of the second sidewall 320 and the organic groove 50 in the orthographic projection on the substrate, and the length of the edge E2 of the overlapping area of the first sidewall 310 and the organic groove 50 in the orthographic projection on the substrate, are both greater than the width W0 of the organic groove 50.
[0108] In some examples, such as Figure 9A and Figure 9B As shown, the second power line 32 may include a first sublayer 32-1, a second sublayer 32-2, and a third sublayer 32-3 stacked sequentially along a direction away from the substrate. The first sublayer 32-1 and the third sublayer 32-3 may be made of the same material, while the material of the second sublayer 32-2 may be different from that of the first sublayer 32-1. For example, the activity of the material of the second sublayer 32-2 may be greater than that of the material of the first sublayer 32-1. For instance, the material of the second sublayer 32-2 may include Al, and the materials of the first sublayer 32-1 and the third sublayer 32-3 may include Ti. At the second sidewall of the second power line 32, the first sublayer 32-1 and the third sublayer 32-3 may protrude from the second sublayer 32-2, forming a lateral groove 300. The lateral groove 300 at the second sidewall may be continuous along the extending direction of the second sidewall.
[0109] In some examples, due to the lateral grooves formed by the sidewalls of the second and first power lines, the organic insulating material within the lateral grooves 300 cannot be completely etched away during the fabrication of the organic insulating layer, leaving organic residue 400 within the lateral grooves 300. Since the lateral grooves extend from the sidewall furthest from the display area to the side closest to the display area, the organic residue 400 remaining in the lateral grooves 300 may also be continuous. When moisture... Figure 9AAs shown by the dotted arrow, the residual organic adhesive 400 within the lateral groove 300 forms a water-oxygen path, allowing moisture to slowly penetrate into the display area. In this example, the second sidewall of the second power line, which overlaps with the orthographic projection of the organic groove onto the substrate, and the first sidewall of the first power line are designed as non-straight edges. Both the second and first sidewalls have gourd-shaped protrusions, effectively extending the water-oxygen path. Figure 8A As shown, the water-oxygen path at the second sidewall 320 of the second power line 32a is the first path L1, which extends around the edge of the second sidewall 320; the water-oxygen path at the first sidewall 310 of the first power line 31 is the second path L2, which extends around the edge of the first sidewall 310. The lengths of both the first path L1 and the second path L2 are greater than the width of the organic tank 50, which can effectively extend the water-oxygen path.
[0110] Figure 10A for Figure 1 Another partial schematic diagram of the central region S. Figure 10B for Figure 10A A partially enlarged schematic diagram of the second power line. In some examples, such as... Figure 10A and Figure 10BAs shown, the second sidewall 320 of the second power line 32a may include a main body 3200 and a plurality of recesses 331 recessed within the main body 3200. The plurality of recesses 331 may be arranged at intervals along a first direction D1. The orthographic projection of the main body 3200 of the second sidewall 320 onto the substrate may include a plurality of spaced straight segments extending along the first direction D1. The recesses 331 of the second sidewall 320 may include a first sub-recess 3311 recessed within the main body 3200 along a second direction D2, and a plurality (e.g., four) second sub-recesses 3312 recessed within the first sub-recess 3311 along the first direction D1. Two second sub-recesses 3312 may extend from the first sub-recess 3311 along the first direction D1 toward the side closer to the display area AA, and two second sub-recesses 3312 may extend from the first sub-recess 3311 along the first direction D1 toward the side farther from the display area AA. The two second sub-recesses 3312 on the side of the first sub-recess 3311 closest to the display area AA and the two second sub-recesses 3312 on the side furthest from the display area AA can be aligned one by one. The surface of the second sub-recesses 3312 furthest from the first sub-recesses 3311 can be curved or arc-shaped. For example, the orthographic projection of the first sub-recess 3311 onto the substrate can be a straight strip extending along the second direction D2; the orthographic projection of the second sub-recesses 3312 onto the substrate can be a semicircle. The orthographic projection of a single recess 331 of the second sidewall 320 onto the substrate can be approximately in the shape of a string of gourds. The shape of the first sidewall 310 of the first power line 31 is similar to the shape of the second sidewall 320. Further descriptions of the display panel of this example can be found in the description of the foregoing embodiments, and will not be repeated here.
[0111] Figure 11 for Figure 1 Another partial schematic diagram of region S. In some examples, such as... Figure 11 As shown, the second sidewall 320 of the second power line 32a may include a main body 3200 and a plurality of protrusions 321 extending from the main body 3200. The orthographic projection of the main body 3200 of the second sidewall 320 onto the substrate may include a plurality of spaced arc segments extending along a first direction D1. The protrusions 321 of the second sidewall 320 may include a first sub-protrusion 3211 extending from the main body 3200 along a second direction D2, and a plurality (e.g., four) second sub-protrusions 3212 extending from the first sub-protrusion 3211 along the first direction D1. For example, the orthographic projection of the first sub-protrusion 3211 onto the substrate may be a straight strip extending along the second direction D2; the orthographic projection of the second sub-protrusion 3212 onto the substrate may be a combination of a semicircle and a rectangle. The orthographic projection of a single protrusion 321 of the second sidewall 320 onto the substrate may be approximately mushroom-shaped.
[0112] In some examples, the first sidewall 310 of the first power line 31 may include four protrusions 311 extending from the main body, the four protrusions 311 being spaced apart along a first direction D1. The orthographic projection of the protrusions 311 onto the substrate may be approximately ear-shaped. Further description of the display panel of this example can be found in the description of the foregoing embodiments, and will not be repeated here.
[0113] Figure 12 for Figure 1 Another partial schematic diagram of region S. In some examples, such as... Figure 12 As shown, the second sidewall 320 of the second power line 32a may include a main body portion and a plurality of protrusions 321 protruding from the main body portion. Each protrusion 321 may include a first sub-protrusion 3211 protruding from the main body portion along a second direction D2, and a second sub-protrusion 3212 protruding from the first sub-protrusion 3211 along a first direction D1. The second sub-protrusion 3212 is connected at the middle position of the first sub-protrusion 3211. The orthographic projection of a single protrusion 321 onto the substrate may be approximately cross-shaped. The first sidewall 310 of the first power line 31 may include three protrusions 311, the orthographic projection of which may also be approximately cross-shaped. Further descriptions of the display panel of this example can be found in the description of the foregoing embodiments, and will not be repeated here.
[0114] Figure 13 for Figure 1 Another partial schematic diagram of region S. In some examples, such as... Figure 13 As shown, the second sidewall 320 of the second power line 32a may include a main body portion and a plurality (e.g., three) protrusions 321 extending from the main body portion. The orthographic projection of the protrusions 321 onto the substrate may be X-shaped. The first sidewall 310 of the first power line 31 may include three protrusions 311, the orthographic projection of which may be approximately X-shaped. Further description of the display panel in this example can be found in the description of the foregoing embodiments, and will not be repeated here.
[0115] Figure 14 for Figure 1 Another partial schematic diagram of region S. In some examples, such as... Figure 14 As shown, the second sidewall 320 of the second power line 32a may include a main body and a plurality (e.g., four) protrusions 321 extending from the main body. The orthographic projection of the protrusions 321 onto the substrate may be ear-shaped. The first sidewall 310 of the first power line 31 may include four protrusions 311, the orthographic projection of which may be approximately ear-shaped. Further description of the display panel in this example can be found in the description of the foregoing embodiments, and will not be repeated here.
[0116] In other examples, the above embodiments can be combined with each other. For instance, the first sidewall of the first power line may include multiple recesses, and the second sidewall of the second power line may include multiple protrusions; or, the first sidewall of the first power line may include multiple protruding lines, and the second sidewall of the second power line may include multiple recesses. As another example, the first sidewall of the first power line may include at least one protrusion and at least one recess; or, the second sidewall of the second power line may include at least one protrusion and at least one recess.
[0117] Figure 15 This is a schematic diagram of a display device according to at least one embodiment of the present invention. In some examples, such as... Figure 15 As shown, the display device 91 may include a display panel 910. The display panel 910 may be an OLED display panel. The display device 91 may be any product or component with display function, such as an OLED display device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. However, this embodiment is not limited to this.
[0118] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0119] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A display panel, characterized in that, include: The substrate includes a display area and a first border area located on one side of the display area along a first direction; The first border area includes: a bending area and a first trace area located on the side of the bending area closer to the display area; Multiple sub-pixels are located in the display area; The power line is at least partially located in the first trace area and is electrically connected to the plurality of sub-pixels; An organic insulating layer is located on the side of the power line away from the substrate, and an organic groove extending in a second direction is provided in the first wiring area. The organic groove penetrates the organic insulating layer, and the second direction intersects the first direction. The power cord has at least one sidewall extending along the first direction, the orthographic projection of the at least one sidewall onto the substrate overlaps with the orthographic projection of the organic groove onto the substrate, and the edge length of the overlapping area of the at least one sidewall and the orthographic projection of the organic groove onto the substrate is greater than the minimum length of the organic groove along the first direction.
2. The display panel according to claim 1, characterized in that, The at least one sidewall includes: a main body portion extending along the first direction, and further includes at least one of the following: at least one protrusion protruding from the main body portion, and at least one recessed portion recessed into the main body portion.
3. The display panel according to claim 2, characterized in that, The at least one sidewall includes a plurality of protrusions extending from the main body, the plurality of protrusions being arranged along the first direction, and at least one of the plurality of protrusions having its orthographic projection onto the substrate located within the orthographic projection range of the organic groove onto the substrate.
4. The display panel according to claim 2, characterized in that, The at least one protrusion includes: a first sub-protrusion protruding from the main body portion, and at least one second sub-protrusion protruding from the first sub-protrusion, wherein the first sub-protrusion and the at least one second sub-protrusion extend in different directions.
5. The display panel according to claim 4, characterized in that, The first sub-protrusion extends along the second direction, and the second sub-protrusion extends along the first direction.
6. The display panel according to claim 5, characterized in that, The at least one protrusion includes: a first sub-protrusion protruding from the main body along the second direction, and a plurality of second sub-protrusions protruding from the first sub-protrusion along the first direction, the plurality of second sub-protrusions being spaced apart along the second direction.
7. The display panel according to claim 5, characterized in that, The at least one protrusion includes: a first sub-protrusion protruding from the main body in the second direction, and at least one second sub-protrusion protruding from the first sub-protrusion in the first direction, wherein the second sub-protrusion covers the end of the first sub-protrusion away from the main body, or the second sub-protrusion is connected to the middle position of the first sub-protrusion.
8. The display panel according to claim 2, characterized in that, The at least one protrusion has an X-shaped orthogonal projection onto the substrate.
9. The display panel according to claim 2, characterized in that, The at least one sidewall includes: a plurality of recesses recessed into the main body, the plurality of recesses being arranged along the first direction, and at least one of the plurality of recesses having its orthographic projection onto the substrate located within the orthographic projection range of the organic groove onto the substrate.
10. The display panel according to claim 2, characterized in that, The at least one recessed portion includes: a first sub-recessed portion recessed within the main body portion, and at least one second sub-recessed portion recessed within the first sub-recessed portion, wherein the first sub-recessed portion and the at least one second sub-recessed portion extend in different directions.
11. The display panel according to any one of claims 1 to 10, characterized in that, The power line includes: a first power line located in the first wiring area and at least one second power line, wherein the first power line and the at least one second power line are in the same layer; The first power line has at least one first sidewall extending along the first direction, and the edge length of the overlapping area of the first sidewall and the organic groove in the orthographic projection of the substrate is greater than the minimum length of the organic groove along the first direction. The second power line has a second sidewall extending along the first direction, and the edge length of the overlapping area of the second sidewall and the organic groove in the orthographic projection of the substrate is greater than the minimum length of the organic groove along the first direction. The first sidewall of the first power line faces the second sidewall of the second power line along the second direction.
12. The display panel according to any one of claims 1 to 10, characterized in that, The display panel further includes an inorganic encapsulation layer located on the side of the organic insulating layer away from the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic groove on the substrate.
13. The display panel according to any one of claims 1 to 10, characterized in that, The power line includes a first sublayer, a second sublayer, and a third sublayer stacked along a direction away from the substrate, wherein the materials of the first sublayer and the third sublayer are different from the material of the second sublayer.
14. The display panel according to claim 13, characterized in that, The first and third sub-layers of the at least one sidewall of the power line protrude from the second sub-layer, forming a lateral groove.
15. The display panel according to claim 14, characterized in that, The display panel also includes organic residue located in the lateral groove of the power cord.
16. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 15.