Wafer processing equipment

Abstract

The utility model discloses wafer processing equipment, comprising an equipment main body which is provided with a control unit; the measuring device comprises a measuring arm, a mounting block, a reflecting part, an optical sensor and a light source, one end of the measuring arm is rotatably connected with the equipment main body, the mounting block is arranged at the other end of the measuring arm, the optical sensor is electrically connected with the control unit, a cleaning pipeline is arranged on the mounting block, and a mounting cavity is formed in the mounting block; the optical sensor and the light reflecting part are arranged at intervals in the first direction, a light collecting hole communicated with the mounting cavity is formed in one side of the mounting block in the second direction, and the light reflecting part and the light collecting hole are oppositely arranged at intervals in the second direction; the measuring device is configured in such a way that light reflected by the wafer enters from the daylighting hole and is collected by the optical sensor after being reflected by the reflective member. According to the wafer processing equipment provided by the utility model, non-contact detection of the thickness and morphology of the wafer can be realized, so that the measurement efficiency in the processing process is improved, and the production efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer thinning technology, and in particular to a wafer processing equipment. Background Technology

[0002] Wafer thinning is one of the key processes in the semiconductor industry. In order to obtain wafers with ideal thickness and high flatness, it is necessary to measure the thickness / morphology of the wafer during the wafer thinning process. In related technologies, contact measurement methods are often used, which have low measurement efficiency and affect production efficiency. Utility Model Content

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a wafer processing apparatus that can improve the measurement efficiency during the wafer thinning process.

[0004] According to the present invention, a wafer processing equipment includes: a main body having a control unit; a measuring device including a measuring arm, a mounting block, a reflector, an optical sensor, and a light source. One end of the measuring arm is rotatably connected to the main body, the mounting block is disposed at the other end of the measuring arm, the optical sensor is electrically connected to the control unit, the mounting block is provided with a cleaning pipeline, the outlet end of the cleaning pipeline is adapted to spray a cleaning medium for cleaning the wafer, a mounting cavity is formed inside the mounting block, the optical sensor and the reflector are both disposed in the mounting cavity, the optical sensor and the reflector are spaced apart in a first direction, a light-collecting hole communicating with the mounting cavity is formed on one side of the mounting block in a second direction, the first direction is perpendicular to the second direction, the reflector and the light-collecting hole are spaced apart and opposite to each other in the second direction, the light-collecting hole is adapted to face the wafer, the light source is adapted to emit light illuminating the wafer, and the measuring device is configured such that the light reflected by the wafer enters through the light-collecting hole and is collected by the optical sensor after being reflected by the reflector.

[0005] According to the wafer processing equipment of this utility model, on the one hand, by rotating the measuring arm, the light-collecting aperture is aligned with different positions on the radial side of the wafer, allowing for the non-contact acquisition of thickness and morphology data during wafer processing, resulting in high measurement efficiency and improved production efficiency. Furthermore, the main body of the equipment can be adjusted accordingly based on the thickness and morphology data, thereby improving the yield and accuracy of wafer processing. On the other hand, the staggered arrangement of the light-collecting aperture and the optical sensor reduces the probability of contamination of the optical sensor, improving the reliability of the measuring device during operation. In addition, the integrated cleaning pipeline on the mounting block allows for wafer cleaning during measurement, further enhancing measurement accuracy.

[0006] According to some embodiments of this utility model, the mounting cavity is provided with an emitting light path, one end of which is connected to the light source, and the other end of which guides light toward the reflector so that the reflector reflects the light emitted by the light source to the wafer.

[0007] According to some embodiments of the present invention, a beam splitter is provided in the light emission path between the light source and the reflector. The beam splitter and the reflector are arranged opposite to each other in the first direction so that the light emitted by the light source passes through the beam splitter and illuminates the reflector. The optical sensor has a receiving part, and the receiving part and the beam splitter are arranged opposite to each other in the second direction so that the light reflected by the wafer is reflected by the reflector and the beam splitter to the receiving part.

[0008] According to some embodiments of the present invention, a cleaning hole is formed on the inner wall of the light-collecting hole, and the outlet end of the cleaning pipeline is located in the cleaning hole.

[0009] According to some embodiments of the present invention, the mounting block has a light-transmitting protrusion on one side in the second direction, the light-transmitting hole penetrates the light-transmitting protrusion in the second direction, one end of the cleaning hole communicates with the light-transmitting hole, and the other end of the cleaning hole penetrates the outer side wall of the light-transmitting protrusion.

[0010] According to some embodiments of the present invention, the wafer processing equipment further includes: a driving member, the driving member being disposed on the main body of the equipment, the driving member being used to drive the measuring arm to rotate relative to the main body of the equipment.

[0011] According to some embodiments of the present invention, the wafer processing equipment further includes: a support platform, which is rotatably disposed on the main body of the equipment, the support platform being used to support the wafer, and the light-collecting hole being adapted to be opposite to the wafer on the support platform.

[0012] According to some embodiments of the present invention, the main body of the equipment has a grinding station, the grinding station is provided with at least one grinding element, the grinding element is used to grind the wafer, and the light-collecting hole is adapted to be opposite to the wafer located at the grinding station.

[0013] According to some embodiments of the present invention, the mounting block is further provided with an adjustment hole communicating with the mounting cavity, the adjustment hole being used to adjust the position of the optical sensor within the mounting cavity.

[0014] According to some embodiments of the present invention, the main body of the equipment is further provided with a cleaning station for cleaning the wafer; the main body of the equipment also includes a measuring component, which is disposed at the cleaning station, and includes a swing arm and a first optical sensor, wherein the first optical sensor is disposed on the swing arm, the swing arm is rotatably connected to the main body of the equipment, and the first optical sensor is adapted to be opposite to the wafer.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a wafer processing equipment according to an embodiment of the present utility model;

[0017] Figure 2 yes Figure 1 A schematic diagram of the measuring device shown;

[0018] Figure 3 yes Figure 2 A schematic diagram of the mounting block, reflector, optical sensor, and cleaning pipeline shown;

[0019] Figure 4 This is a schematic diagram of the mounting box, support platform, and measuring components according to an embodiment of the present utility model;

[0020] Figure 5 This is an optical path diagram of the measuring device according to an embodiment of the present utility model.

[0021] Figure label:

[0022] 100. Wafer processing equipment;

[0023] 10. Main body of the equipment;

[0024] 20. Measuring device; 21. Measuring arm; 22. Mounting block; 221. Mounting cavity; 222. Light-collecting hole; 223. Cleaning pipeline; 224. Light-collecting protrusion; 225. Adjustment hole; 23. Reflector; 24. Optical sensor; 241. Receiving unit; 25. Driving unit; 26. Beam splitter;

[0025] 30. Support platform;

[0026] 40. Grinding station; 41. Grinding part;

[0027] 50. Storage station;

[0028] 60. Positioning station;

[0029] 70. Cleaning station; 71. Mounting box; 72. Support column; 73. Measuring component; 731. Swing arm; 732. Drive motor; 733. First optical sensor; 734. Mounting bracket;

[0030] 80. Film loading robotic arm; 81. Film retrieval robotic arm; 82. Film retrieval robot;

[0031] 90. Light source;

[0032] 200. Wafer. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0034] The following is for reference. Figures 1-5 Describes a wafer processing apparatus 100 according to an embodiment of the present invention.

[0035] like Figures 1-3 As shown, the wafer processing equipment 100 according to an embodiment of the present invention includes: equipment body 10 and measuring device 20.

[0036] Specifically, the main body 10 of the equipment has a control unit, and the measuring device 20 includes a measuring arm 21, a mounting block 22, a reflector 23, an optical sensor 24, and a light source 90. One end of the measuring arm 21 is rotatably connected to the main body 10 of the equipment, and the mounting block 22 is located at the other end of the measuring arm 21. The optical sensor 24 is electrically connected to the control unit. The mounting block 22 is provided with a cleaning pipe 223, and the outlet end of the cleaning pipe 223 is suitable for spraying a cleaning medium for cleaning the wafer 200. A mounting cavity 221 is formed inside the mounting block 22. The optical sensor 24 and the reflector 23 are both located in the mounting cavity. In cavity 221, optical sensor 24 and reflector 23 are arranged at intervals in a first direction. Mounting block 22 has a light-collecting hole 222 on one side in a second direction that communicates with mounting cavity 221. The first direction is perpendicular to the second direction. Reflector 23 and light-collecting hole 222 are arranged at intervals and opposite to each other in the second direction. Light-collecting hole 222 is adapted to be opposite to wafer 200. Light source 90 is adapted to emit light that shines on wafer 200. Measurement device 20 is configured such that light reflected from wafer 200 enters through light-collecting hole 222 and is collected by optical sensor 24 after being reflected by reflector 23.

[0037] During the operation of the wafer processing equipment 100, when the measuring device 20 measures the thickness of the wafer 200, the measuring arm 21 is first rotated so that the light-collecting hole 222 is aligned with the designated position of the wafer 200. Then, the light source 90 emits light that shines on the wafer 200. At the same time, the cleaning pipeline 223 sprays cleaning medium to clean the wafer 200. When the light shines on the wafer 200, the two surfaces of the wafer 200 in the thickness direction reflect the light towards the light-collecting hole 222. The two reflected beams are reflected by the reflector 23 and collected by the optical sensor 24. The optical sensor 24 transmits the collected light information to the control unit. The control unit calculates the thickness of the wafer 200 at the designated position based on the interference of the two beams of light. Among them, the interferometric method for calculating the thickness of wafer 200 is a commonly used technique in this field, which will not be described in detail here. The light reflected by the reflector 23 can directly illuminate the optical sensor 24 and be collected by the optical sensor 24. The light reflected by the reflector 23 can also be reflected or transmitted to the optical sensor 24 through other components and be collected by the optical sensor 24.

[0038] The inlet end of the cleaning pipeline 223 is suitable for connection to a pressure source that drives the cleaning medium. The cleaning medium can be air, and the pressure source of the cleaning medium is an air compressor or air pump. During measurement, the cleaning pipeline 223 blows away the impurities on the wafer 200. The cleaning medium can also be a cleaning liquid, and the pressure source of the cleaning medium is a water pump. During measurement, the cleaning liquid flushes away the impurities on the wafer 200. The pressure source of the cleaning medium can be set on the main body 10 of the equipment, or it can be located outside the main body 10 of the equipment.

[0039] By rotating the measuring arm 21, the light-collecting hole 222 is aligned with different positions of the wafer 200 at different radial distances from the center. By repeating the above steps, the thickness of the wafer 200 at different radial positions can be obtained, thus obtaining data on the thickness and morphology of the wafer 200. Furthermore, the measuring device 20 does not need to contact the wafer 200 during the measurement process, resulting in high measurement efficiency and improved production efficiency.

[0040] The control unit adjusts the processing parameters of each process of the wafer processing equipment 100 based on the obtained thickness and morphology data of the wafer 200. In this way, the processing parameters of each process can be dynamically adjusted during the wafer 200 processing, thereby improving the yield and accuracy of the wafer 200 after processing.

[0041] When measuring wafer 200, impurities on the surface of wafer 200 may affect the measurement accuracy. In this embodiment, by integrating cleaning pipeline 223 on mounting block 22, wafer 200 is cleaned during the measurement process, which can improve the measurement accuracy.

[0042] It is understandable that the optical sensor 24 has high requirements for surface cleanliness. During the wafer 200 processing, dust and liquid splashes are inevitable on the main body 10 of the equipment. In this embodiment, on the one hand, the optical sensor 24 is placed in the mounting cavity 221, which can protect the optical sensor 24. On the other hand, the light-collecting hole 222 and the optical sensor 24 are arranged at intervals, and the extension direction of the light-collecting hole 222 does not face the optical sensor 24. The light entering through the light-collecting hole 222 is transmitted to the optical sensor 24 through the reflector 23. During the operation of the wafer processing equipment 100, the probability of dust or liquid contaminating the optical sensor 24 through the light-collecting hole 222 can be reduced. Thus, the reliability of the measuring device 20 during operation can be improved.

[0043] Among them, the light source 90 can emit light directly toward the wafer 200, and the light source 90 can also guide the light to the wafer 200 through the optical path. The parameters of the light emitted by the light source 90 can be adjusted according to the measurement needs. The main body of the equipment 10 can be equipped with a measuring device 20 at one station, or the main body of the equipment 10 can be equipped with a measuring device 20 at multiple stations.

[0044] According to the wafer processing equipment 100 of this utility model embodiment, on the one hand, by rotating the measuring arm 21, the light-collecting hole 222 is positioned relative to different radial positions of the wafer 200, allowing the thickness and morphology data of the wafer 200 to be obtained without contact, resulting in high measurement efficiency and improved production efficiency. Furthermore, the main body 10 of the equipment makes corresponding adjustments based on the thickness and morphology data, which can improve the yield and accuracy of the wafer 200 processing. On the other hand, the light-collecting hole 222 is staggered from the optical sensor 24, which can reduce the probability of the optical sensor 24 being contaminated and improve the reliability of the measuring device 20 during operation. In addition, a cleaning pipeline 223 is integrated on the mounting block 22, which can clean the wafer 200 during measurement, improving measurement accuracy.

[0045] In some embodiments of this utility model, the mounting cavity 221 is provided with an emitting light path, one end of which is connected to the light source 90, and the other end of which guides light toward the reflector 23 so that the reflector 23 reflects the light emitted by the light source 90 to the wafer 200.

[0046] During the measurement process of the measuring device 20 on the wafer 200, when the light-collecting aperture 222 is aligned with the wafer 200, the light emitted by the light source 90 shines on the reflector 23 through the light-emitting path. The reflector 23 reflects the light through the light-collecting aperture 222 onto the wafer 200. Thus, the light shining on the wafer 200 is more easily reflected onto the reflector 23, and the arrangement of the light source 90 is more flexible, thereby reducing the design difficulty of the measuring device 20.

[0047] In some embodiments of this utility model, such as Figure 5 As shown, a beam splitter 26 is provided in the light path between the light source 90 and the reflector 23. The beam splitter 26 and the reflector 23 are arranged opposite to each other in the first direction so that the light emitted by the light source 90 passes through the beam splitter 26 and illuminates the reflector 23. The optical sensor 24 has a receiving part 241. The receiving part 241 and the beam splitter 26 are arranged opposite to each other in the second direction so that the light reflected by the wafer 200 is reflected by the reflector 23 and the beam splitter 26 to the receiving part 241.

[0048] When light shines on the beam splitter 26, part of it can pass through the beam splitter 26 and continue to be transmitted, while the other part is reflected by the beam splitter 26. The beam splitter 26 is a component that can realize the beam splitting function in the prior art, and will not be discussed further here.

[0049] During the measurement process, the light emitted by the light source 90 is transmitted through the emission light path. A portion of the light passes through the beam splitter 26 and illuminates the reflector 23. The reflector 23 reflects the emitted light onto the wafer 200. Then, the wafer 200 reflects the light back onto the reflector 23. The reflector 23 reflects the reflected light back onto the beam splitter 26. The beam splitter 26 reflects a portion of the light back to the receiver 241. Thus, the thickness of the wafer 200 is measured.

[0050] Therefore, by adjusting the angle or position of the beam splitter 26 during the product design process, more measurement scenarios can be met, thereby improving the adaptability of the measuring device 20.

[0051] In some embodiments of this utility model, the emitting light path and the light source 90 are connected by a light guide path. That is, the light source 90 is located on the outside of the mounting block 22, which makes it easier to arrange the light source 90 during the product design process and reduces the design difficulty.

[0052] In some embodiments of this utility model, such as Figure 2 and Figure 3 As shown, a cleaning hole is formed on the inner wall of the light-transmitting hole 222, and the outlet end of the cleaning pipe 223 is located in the cleaning hole.

[0053] During the operation of the measuring device 20, the cleaning medium ejected from the cleaning pipeline 223 is sprayed onto the wafer 200 through the light-collecting hole 222. The measuring device 20 can detect the thickness of the wafer 200 during the cleaning process and after cleaning is completed. This further improves the compactness of the measuring device 20's structure, and the cleaning pipeline 223 can more accurately clean the measurement location.

[0054] In some embodiments of this utility model, such as Figure 2 and Figure 3 As shown, the mounting block 22 has a light-transmitting protrusion 224 formed on one side in the second direction, and the light-transmitting hole 222 penetrates the light-transmitting protrusion 224 in the second direction. One end of the cleaning hole is connected to the light-transmitting hole 222, and the other end of the cleaning hole penetrates the outer wall of the light-transmitting protrusion 224.

[0055] Therefore, the difficulty of arranging the cleaning pipe 223 in the mounting block 22 can be reduced, and the length of the light-transmitting hole 222 is relatively long, which can reduce the probability of the cleaning medium being sprayed towards the reflector 23 during the process of the cleaning medium being sprayed out.

[0056] In some embodiments of this utility model, such as Figure 1 and Figure 2 As shown, the wafer processing equipment 100 also includes a drive unit 25, which is mounted on the equipment body 10 and is used to drive the measuring arm 21 to rotate relative to the equipment body 10. Therefore, during the operation of the wafer processing equipment 100, the measuring arm 21 can be automatically rotated, thereby improving the automation level of the wafer processing equipment 100 and increasing production efficiency.

[0057] In some embodiments of this utility model, such as Figure 1 As shown, the wafer processing equipment 100 also includes a support platform 30, which is rotatably mounted on the equipment body 10. The support platform 30 is used to support the wafer 200, and the light-collecting hole 222 is adapted to be opposite to the wafer 200 on the support platform 30.

[0058] During the measurement process of the measuring device 20 on the wafer 200, the measuring arm 21 is first rotated so that the light-collecting hole 222 is aligned with the wafer 200 notch on the radial outer side of the wafer 200, and the thickness at the wafer 200 notch is measured. Then, the support stage 30 drives the wafer 200 to rotate, and the thickness at multiple positions on the same circumference of the wafer 200 notch is collected. Subsequently, the measuring arm 21 is rotated so that the light-collecting hole 222 is aligned with the positions at multiple radial dimensions on the wafer 200, and the above process is repeated. Thus, the thickness information at multiple positions on multiple circumferences of different sizes of the wafer 200 can be obtained, thereby improving the accuracy of the total thickness variation of the wafer 200 obtained by the control unit, and further improving the accuracy of the wafer 200 after processing.

[0059] Preferably, the support platform 30 is driven to rotate by a servo motor.

[0060] In some embodiments of this utility model, such as Figure 1As shown, the main body 10 of the equipment has a grinding station 40, which is provided with at least one grinding element 41 for grinding wafer 200. The light-transmitting hole 222 is adapted to be opposite to the wafer 200 located at the grinding station 40. For example, there may be one, two, three or four grinding elements 41.

[0061] During the processing, multiple grinding parts 41 grind the wafer 200 in sequence, and the measuring device 20 can measure the total thickness change of the wafer 200 after processing any one of the multiple grinding parts 41.

[0062] Preferably, there are three grinding parts 41, namely the first grinding part, the second grinding part, and the third grinding part. The first grinding part, the second grinding part, and the third grinding part perform rough grinding, fine grinding, and polishing on the wafer 200 in sequence. The grinding station 40 is provided with four support platforms 30, namely the first support platform, the second support platform, the third support platform, and the fourth support platform. The first support platform, the second support platform, and the third support platform correspond to the first grinding part, the second grinding part, and the third grinding part, respectively, to support the wafer 200 during grinding. The fourth support platform is used for the transfer of the wafer 200 during the processing.

[0063] In some embodiments of this utility model, such as Figure 2 and Figure 3 As shown, the mounting block 22 also has an adjustment hole 225 that communicates with the mounting cavity 221. The adjustment hole 225 is used to adjust the position of the optical sensor 24 in the mounting cavity 221.

[0064] During the operation of the wafer processing equipment 100, the position of the optical sensor 24 in the mounting cavity 221 can be adjusted, as can the reflection angle of the reflector 23, thereby adjusting the angle of the light emitted by the light source 90 and the reflected light from the wafer 200. This improves the collection efficiency of the optical sensor 24 of the reflected light from the wafer 200, thus improving the measurement accuracy.

[0065] In some embodiments of this utility model, the main body 10 of the device is further provided with a cleaning station 70, which is used to clean the wafer 200. The main body 10 of the device also includes a measuring component 73, which is disposed at the cleaning station 70. The measuring component 73 includes a swing arm 731 and a first optical sensor 733. The first optical sensor 733 is disposed on the swing arm 731, which is rotatably connected to the main body 10 of the device. The first optical sensor 733 is adapted to be opposite to the wafer 200.

[0066] Among them, cleaning station 70 can clean wafer 200 before processing, and cleaning station 70 can also clean wafer 200 after processing.

[0067] For example, such as Figure 4 As shown, the cleaning station 70 is equipped with a mounting box 71 and a support column 72. The support column 72 is located in the mounting box 71, and the wafer 200 is supported on the support column 72. The measuring component 73 also includes a drive motor 732 and a mounting bracket 734. The mounting bracket 734 is located in the mounting box 71. One end of the swing arm 731 is rotatably connected to the mounting box 71. The first optical sensor 733 is located at the other end of the swing arm 731. The drive motor 732 is used to drive the swing arm 731 to rotate. During measurement, the first optical sensor 733 collects the light reflected from both sides of the wafer 200 on the support column 72 of the cleaning station 70 and transmits the light information to the control unit. The control unit determines the thickness and morphological changes of the wafer 200 based on the interference. The control unit adjusts the processing parameters of the previous process based on the thickness and morphological changes of the wafer 200 on the cleaning station 70, thereby further improving the yield and accuracy of the wafer 200 processing.

[0068] In some embodiments of this utility model, such as Figure 1 As shown, the main body 10 of the equipment also includes a storage station 50, a positioning station 60, a cleaning station 70, a loading robot arm 80, a wafer picking robot arm 81, and a wafer picking robot 82. The storage station 50 is used to store wafers 200. During the operation of the wafer processing equipment 100, the wafer picking robot 82 moves the wafers 200 from the storage station 50 to the positioning station 60. The positioning station 60 adjusts the posture of the wafers 200. Then, the loading robot arm 80 moves the wafers 200 from the positioning station 60 to the grinding station 40. After processing at the grinding station 40, the wafer picking robot arm 81 moves the wafers 200 to the cleaning station 70. The cleaning station 70 cleans the wafers 200. Then, the wafer picking robot 82 moves the cleaned wafers 200 back to the storage station 50.

[0069] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0071] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0073] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer processing equipment, characterized in that, include: The main body of the equipment includes a control unit; The measuring device includes a measuring arm, a mounting block, a reflector, an optical sensor, and a light source. One end of the measuring arm is rotatably connected to the main body of the device, the mounting block is located at the other end of the measuring arm, and the optical sensor is electrically connected to the control unit. The mounting block is provided with a cleaning pipeline, the outlet end of which is adapted to spray a cleaning medium for cleaning the wafer. A mounting cavity is formed inside the mounting block, and the optical sensor and the reflector are both disposed in the mounting cavity. The optical sensor and the reflector are arranged at intervals in a first direction. A light-collecting hole communicating with the mounting cavity is formed on one side of the mounting block in a second direction. The first direction is perpendicular to the second direction. The reflector and the light-collecting hole are arranged at intervals and opposite to each other in the second direction. The light-collecting hole is adapted to be opposite the wafer. The light source is adapted to emit light that shines on the wafer. The measuring device is configured such that the light reflected by the wafer enters through the light-collecting hole and is reflected by the reflector before being collected by the optical sensor.

2. The wafer processing equipment according to claim 1, characterized in that, The mounting cavity is provided with an emitting light path. One end of the emitting light path is connected to the light source, and the other end of the emitting light path is directed toward the reflector so that the reflector reflects the light emitted by the light source to the wafer.

3. The wafer processing equipment according to claim 2, characterized in that, A beam splitter is provided in the light emission path between the light source and the reflector. The beam splitter and the reflector are arranged opposite to each other in the first direction so that the light emitted by the light source passes through the beam splitter and illuminates the reflector. The optical sensor has a receiving part, which is arranged opposite to the beam splitter in the second direction, so that the light reflected by the wafer is reflected by the reflector and the beam splitter to the receiving part.

4. The wafer processing equipment according to claim 1, characterized in that, A cleaning hole is formed on the inner wall of the light-collecting hole, and the outlet end of the cleaning pipeline is located in the cleaning hole.

5. The wafer processing equipment according to claim 4, characterized in that, The mounting block has a light-transmitting protrusion on one side in the second direction, the light-transmitting hole penetrates the light-transmitting protrusion in the second direction, one end of the cleaning hole is connected to the light-transmitting hole, and the other end of the cleaning hole penetrates the outer wall of the light-transmitting protrusion.

6. The wafer processing equipment according to claim 1, characterized in that, Also includes: A driving component is disposed on the main body of the device, and the driving component is used to drive the measuring arm to rotate relative to the main body of the device.

7. The wafer processing equipment according to claim 1, characterized in that, Also includes: A support platform is rotatably mounted on the main body of the equipment. The support platform is used to support the wafer, and the light-collecting hole is adapted to be opposite to the wafer on the support platform.

8. The wafer processing equipment according to claim 1, characterized in that, The main body of the equipment has a grinding station, the grinding station is provided with at least one grinding element, the grinding element is used to grind the wafer, and the light-collecting hole is adapted to be opposite to the wafer located at the grinding station.

9. The wafer processing equipment according to claim 1, characterized in that, The mounting block also has an adjustment hole that communicates with the mounting cavity, and the adjustment hole is used to adjust the position of the optical sensor in the mounting cavity.

10. The wafer processing equipment according to claim 1, characterized in that, The main body of the equipment is also provided with a cleaning station, which is used to clean the wafer; The main body of the equipment also includes a measurement component, which is located at the cleaning station. The measurement component includes a swing arm and a first optical sensor. The first optical sensor is located on the swing arm, which is rotatably connected to the main body of the equipment. The first optical sensor is adapted to be opposite to the wafer.

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