Anti-overheating diode device

Abstract

The utility model relates to the technical field of diodes, and discloses an anti-overheating diode device which comprises a pin, a diode is fixedly installed on the outer side of the pin, a second heat-conducting fin is fixedly connected to the outer side of the diode in a sleeved mode, and first heat dissipation holes are evenly formed in the surface of the second heat-conducting fin. The two ends of the second heat-conducting fin are fixedly provided with first heat-conducting fins, the first heat-conducting fins are attached to the diodes, and second heat dissipation holes are evenly formed in the surfaces of the first heat-conducting fins. According to the anti-overheating diode device, the second heat conducting sheet and the fin ring are arranged on the outer side of the diode to dissipate heat of the diode, the heat dissipation capacity is remarkably enhanced, compared with a traditional diode device, the anti-overheating diode device accelerates heat dissipation through the design of the first heat dissipation holes and the second heat dissipation holes, the diode is effectively prevented from being overheated, and the service life of the diode is prolonged. The stability and the service life of the device are improved, and safe and reliable operation of the circuit is ensured.

Description

Technical Field

[0001] This utility model relates to the field of diode technology, and more specifically, to an overheat-resistant diode device. Background Technology

[0002] A diode, also known as a crystal diode or LED, is an electronic component with two electrodes (anode and cathode) that allows current to flow in only one direction. Its core is a PN junction, composed of P-type and N-type semiconductors, with electrode leads extending from both ends and sealed in a casing.

[0003] Traditional diode devices have the following drawbacks: During operation, the continuous flow of current causes the diode body to gradually heat up. Since the diode primarily dissipates heat through natural heat exchange with the air, its heat dissipation efficiency is relatively low, and its heat dissipation capacity is limited. This heat dissipation method may be sufficient when the current is low or the ambient temperature is not high, but under high current density or high temperature environments, prolonged use can easily lead to diode overheating. Excessive temperature not only accelerates diode aging and degrades its performance but may also directly cause the diode to burn out, thus affecting the normal operation of the entire circuit. Therefore, improvements are needed. Utility Model Content

[0004] To overcome the shortcomings of the prior art, this utility model provides an overheat-resistant diode device with the advantage of easy heat dissipation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an overheat-resistant diode device, comprising a pin, a diode fixedly mounted on the outside of the pin, a second heat-conducting sheet fixedly sleeved on the outside of the diode, a first heat dissipation hole uniformly opened on the surface of the second heat-conducting sheet, a first heat-conducting sheet fixedly mounted on both ends of the second heat-conducting sheet, the first heat-conducting sheet being in contact with the diode, and a second heat dissipation hole uniformly opened on the surface of the first heat-conducting sheet.

[0006] As a preferred embodiment of this utility model, four bumps are fixedly installed on the outer side of the pin.

[0007] As a preferred embodiment of this utility model, a housing is fixedly installed at the front end of the heat-conducting sheet, and the housing is fixedly sleeved on the outside of the pin.

[0008] As a preferred embodiment of this utility model, a convex ring is fixedly sleeved on the outer side of the housing, and the convex ring corresponds to the direction of the current.

[0009] As a preferred embodiment of this utility model, a finned ring is fixedly installed on the outer side of the second heat-conducting sheet, and the number of the finned rings corresponds to the number of the first heat dissipation holes.

[0010] As a preferred embodiment of this utility model, the bump has a hexagonal structure and is made of nickel metal.

[0011] As a preferred embodiment of this utility model, the density of the front end of the second heat dissipation hole is greater than that of the rear end, and the number of the second heat dissipation holes is 10.

[0012] As a preferred embodiment of this utility model, the number of heat dissipation holes is at least two, and a finned ring is provided between every two heat dissipation holes.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] This invention significantly enhances the heat dissipation capacity of the diode by setting a heat-conducting plate and a finned ring on the outside of the diode. Compared with traditional diode devices, this anti-overheating diode device accelerates heat dissipation through the design of heat dissipation hole one and heat dissipation hole two, effectively preventing the diode from overheating, improving the stability and service life of the device, and ensuring the safe and reliable operation of the circuit. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the heat-conducting sheet of this utility model;

[0017] Figure 3 This is a schematic diagram of the heat dissipation holes of this utility model;

[0018] Figure 4 This is a schematic diagram of the diode of this utility model;

[0019] Figure 5 This is a schematic diagram of the protrusion of this utility model.

[0020] In the diagram: 1. Pin; 2. Bump; 3. Diode; 4. Housing; 5. Heat-conducting plate one; 6. Heat-conducting plate two; 7. Heat dissipation hole one; 8. Fin ring; 9. Bump ring; 10. Heat dissipation hole two. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1 to 5 As shown, this utility model provides an overheat-resistant diode device, including a pin 1, a diode 3 fixedly mounted on the outside of the pin 1, a heat-conducting sheet 6 fixedly sleeved on the outside of the diode 3, heat dissipation holes 7 uniformly opened on the surface of the heat-conducting sheet 6, heat-conducting sheets 5 fixedly mounted at both ends of the heat-conducting sheet 6, the heat-conducting sheet 5 being in contact with the diode 3, and heat dissipation holes 10 uniformly opened on the surface of the heat-conducting sheet 5.

[0023] After power is applied, current flows through pin 1 and diode 3. At this time, diode 3 will generate some heat. The heat is absorbed by the heat-conducting plate 5 and heat-conducting plate 6 located on the outside of diode 3. At the same time, the heat is dissipated through the heat dissipation hole 7 and heat dissipation hole 10. In addition, the heat dissipation area is increased by the fin ring 8 located on the outside of heat-conducting plate 6, thus achieving the heat dissipation effect.

[0024] By setting a heat-conducting plate 2 6 and a finned ring 8 on the outside of diode 3 to dissipate heat, the heat dissipation capacity of diode 3 is significantly enhanced. Compared with traditional diode devices, this anti-overheating diode device accelerates heat dissipation through the design of heat dissipation hole 1 7 and heat dissipation hole 2 10, effectively preventing diode 3 from overheating, improving the stability and service life of the device, and ensuring the safe and reliable operation of the circuit.

[0025] Among them, four bumps 2 are fixedly installed on the outside of pin 1.

[0026] This diode device enhances the mechanical stability and heat dissipation efficiency by fixing four bumps 2 on the outside of pin 1. The bumps 2 not only help with heat conduction, but also improve the overall structural strength of the device, ensuring that the device can operate stably under high power or long-term working conditions and effectively preventing overheating problems.

[0027] Among them, the front end of the heat-conducting plate 5 is fixedly installed with a housing 4, and the housing 4 is fixedly sleeved on the outside of the pin 1.

[0028] By installing housing 4 at the front end of heat-conducting sheet 5, housing 4 is made to fit tightly with pin 1, thereby improving the robustness of heat-conducting sheet 5 and heat-conducting sheet 6.

[0029] Among them, a protruding ring 9 is fixedly sleeved on the outer side of the housing 4, and the protruding ring 9 corresponds to the current direction.

[0030] By providing a raised ring 9 on the outside of the housing 4, it is easier for personnel to judge the direction of current movement, which facilitates the installation of the diode 3.

[0031] Among them, a finned ring 8 is fixedly installed on the outer side of the heat-conducting plate 2 6, and the number of finned rings 8 corresponds to the heat dissipation hole 1 7.

[0032] By setting multiple finned rings 8 on the outer side of the heat-conducting plate 2 6, the heat dissipation area is expanded and the heat dissipation effect is improved.

[0033] Among them, bump 2 has a hexagonal structure and is made of nickel metal.

[0034] The hexagonal structure enhances structural stability and improves heat dissipation efficiency. Nickel metal has good thermal conductivity and corrosion resistance, while the hexagonal structure increases the heat dissipation area, which helps to quickly conduct and dissipate the heat generated by diode 3, ensuring long-term stable operation of the device.

[0035] Among them, the density of the front end of the second heat dissipation hole 10 is greater than that of the rear end, and the number of the second heat dissipation hole 10 is 10.

[0036] The denser heat dissipation holes 210 at the front end can effectively concentrate heat dissipation and quickly reduce the temperature of the working area of ​​diode 3; the gradually sparser heat dissipation holes 210 at the rear end help to evenly dissipate heat into the air, thereby improving the overall heat dissipation efficiency and ensuring the stable operation of diode 3.

[0037] The number of heat dissipation holes 7 is at least two, and a finned ring 8 is provided between every two heat dissipation holes 7.

[0038] The heat dissipation hole 7 increases the heat dissipation channel, while the fin ring 8 further expands the heat dissipation area. The combination of the two can more efficiently dissipate the heat generated by the diode 3 into the air, ensuring the stability and lifespan of the device.

[0039] Working principle and usage process of this utility model:

[0040] After power is applied, current flows through pin 1 and diode 3. At this time, diode 3 will generate some heat. The heat is absorbed by the heat-conducting plate 5 and heat-conducting plate 6 located on the outside of diode 3. At the same time, the heat is dissipated through the heat dissipation hole 7 and heat dissipation hole 10. In addition, the heat dissipation area is increased by the fin ring 8 located on the outside of heat-conducting plate 6, thus achieving the heat dissipation effect.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An overheat-resistant diode device, comprising leads (1), characterized in that: A diode (3) is fixedly installed on the outside of the pin (1). A heat-conducting sheet (6) is fixedly sleeved on the outside of the diode (3). Heat dissipation holes (7) are uniformly opened on the surface of the heat-conducting sheet (6). Heat-conducting sheets (5) are fixedly installed at both ends of the heat-conducting sheet (6). The heat-conducting sheet (5) is in contact with the diode (3). Heat dissipation holes (10) are uniformly opened on the surface of the heat-conducting sheet (5).

2. The overheat-resistant diode device according to claim 1, characterized in that: The outer side of the pin (1) is fixedly mounted with a bump (2), and the number of the bumps (2) is four.

3. The overheat-resistant diode device according to claim 1, characterized in that: The front end of the heat-conducting sheet (5) is fixedly mounted with a housing (4), and the housing (4) is fixedly sleeved on the outside of the pin (1).

4. The overheat-resistant diode device according to claim 3, characterized in that: A protruding ring (9) is fixedly sleeved on the outer side of the housing (4), and the protruding ring (9) corresponds to the current direction.

5. The overheat-resistant diode device according to claim 1, characterized in that: A finned ring (8) is fixedly installed on the outer side of the second heat-conducting plate (6), and the number of the finned rings (8) corresponds to the number of heat dissipation holes (7).

6. The overheat-resistant diode device according to claim 2, characterized in that: The bump (2) has a hexagonal structure and is made of nickel metal.

7. The overheat-resistant diode device according to claim 1, characterized in that: The density of the front end of the second heat dissipation hole (10) is greater than that of the rear end, and the number of the second heat dissipation hole (10) is 10.

8. The overheat-resistant diode device according to claim 1, characterized in that: The number of heat dissipation holes (7) is at least two, and a finned ring (8) is provided between every two heat dissipation holes (7).

Images