Assembling die structure of module diode and heat dissipation aluminum sheet

By designing an assembly mold structure for module diodes and heat sinks, fully automated assembly of diodes and heat sinks is achieved, solving the problem of cumbersome assembly in existing technologies, reducing costs and improving efficiency.

CN223847936UActive Publication Date: 2026-01-30ZERUN CO LTD
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Patent Information

Application Number
CN202520062768.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-10
Publication Date
2026-01-30
Estimated Expiration
2035-01-10

AI Technical Summary

Technical Problem

The existing assembly process for module diodes and heat sinks is cumbersome, resulting in high production costs, low efficiency, and inconsistent product fit.

Method used

Design an assembly mold structure for modular diodes and heat sinks. Through the combination of slide rails, sliders and support blocks, fully automatic assembly of diodes and heat sinks is achieved, and bending and forming are performed using springs and stamping components.

Benefits of technology

Simplify production processes, reduce production costs, improve production efficiency, and ensure stable product connection and efficient assembly.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an assembling die structure of a module diode and a heat dissipation aluminum sheet, which comprises a die base, a groove is clamped in the die base, sliding rail seats which are symmetrically arranged are transversely embedded in the groove, a sliding block is slidably arranged on the sliding rail seats, and the sliding block is fixedly connected with the die base. A first supporting block arranged between the two sets of sliding rail seats and a second supporting block tightly attached to the first supporting block are longitudinally embedded in the groove, a third supporting block embedded in the mold base is arranged on the side, away from the second supporting block, of the first supporting block, and diode assemblies are arranged on the surface of the first supporting block and the surface of the second supporting block. According to the utility model, the heat dissipation aluminum sheet is fully automatically assembled with the module diode while being bent and formed, so that the heat dissipation device has remarkable economic benefits, reduces processing procedures, reduces the production cost of products, and improves the production efficiency.
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Description

TECHNICAL FIELD

[0001] The utility model relates to diode assembly technical field, especially a kind of assembling mould structure of module diode and heat dissipation aluminium sheet. BACKGROUND

[0002] With the large-scale use of photovoltaic junction box, market competition leads to higher requirements for the production efficiency and cost of junction box, the existing module diode and heat dissipation aluminium sheet assembly process is complicated, the consistency problem such as product adhesion degree of high technology requirement appears, production cost is increased due to complex production procedure, which affects production efficiency. UTILITY MODEL CONTENT

[0003] To solve the above technical problems, a kind of assembling mould structure of module diode and heat dissipation aluminium sheet is provided, which simplifies production procedure, reduces product production cost and improves production efficiency.

[0004] To achieve the above purpose, the utility model discloses a kind of assembling mould structure of module diode and heat dissipation aluminium sheet, including mould base, the recess is clamped in the mould base, recess is embedded and installed with the slide rail seat of symmetric setting transversely, slide rail seat is slidably installed with slider, recess is embedded and installed with the first support block being arranged between two groups of slide rail seats and the second support block being arranged in close contact with the first support block vertically, the third support block embedded and installed in the mould base is arranged on the side of the first support block away from the second support block, diode assembly is arranged on the surface of the first support block and the second support block.

[0005] Further, the first support block top is provided with first surface and second surface with height lower than first surface, and the edge of second support block is provided with limiting stop edge.

[0006] Further, the second support block top is provided with third surface higher than second surface and fourth surface arranged at the same height with first surface.

[0007] Further, the third surface places module diode in diode assembly, the second surface places conductive sheet in diode assembly, the conductive sheet is positioned by limiting stop edge, and the first surface and the fourth surface place U-shaped heat dissipation aluminium sheet.

[0008] Further, the first support block both sides are respectively provided with the first spring connected with the bottom of slider.

[0009] Further, the bottom of slider is provided with fixed part connected with first spring and bending part with circular-arc groove cross section, and the bending part is abutted with the edge of first support block when first spring is in compression state.

[0010] Further, the third support block horizontally extends the middle plate arranged in the U-shaped heat dissipation aluminum sheet, the top of the third support block is provided with a mounting hole, a second spring is arranged in the mounting hole, and the second spring connects the stamping assembly to stamp the U-shaped heat dissipation aluminum sheet.

[0011] Further, the heat dissipation aluminum sheet is provided with a bending edge of 75° on the side, and the bending edge is clamped and fixed with the conductive sheet through a sliding block.

[0012] Compared with the prior art, the module diode and the heat dissipation aluminum sheet are assembled together at the same time of the heat dissipation aluminum sheet bending forming, and the diode assembly and the mold structure have remarkable economic benefits, reduce the processing procedure, reduce the product production cost, and improve the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0013] The utility model will be further explained in detail in combination with the drawings and specific embodiments.

[0014] Figure 1 It is the installation schematic view of diode assembly and mold of the utility model.

[0015] Figure 2 It is the mold structure schematic view of the utility model.

[0016] Figure 3 It is the diode assembly bending state schematic view of the utility model.

[0017] Figure 4 It is the structure schematic view of the first support block and the second support block of the utility model.

[0018] Figure 5 It is the mold structure schematic view of the utility model Figure 1 The local enlarged view of A in the middle.

[0019] In the drawing: 1 is a mold base, 2 is a sliding rail seat, 3 is a sliding block, 31 is a fixed part, 32 is a bending part, 4 is a first support block, 41 is a first surface, 42 is a second surface, 43 is a limiting baffle, 5 is a second support block, 51 is a third surface, 52 is a fourth surface, 6 is a third support block, 61 is a middle plate, 62 is a second spring, 7 is a diode assembly, 71 is a module diode, 72 is a conductive sheet, 73 is a heat dissipation aluminum sheet, and 8 is a first spring. Specific embodiments

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] An embodiment of the utility model, as shown in Figure 1 and Figure 2 The groove is embedded with the slide rail seat 2 which is symmetrically arranged and is transversely installed in the groove, the slide rail seat surface is provided with a sliding groove which is inclined to the first supporting block, the slide block 3 is slidingly installed on the slide rail seat 2, the groove is longitudinally embedded with the first supporting block 4 which is arranged between the two groups of slide rail seats 2 and the second supporting block 5 which is arranged close to the first supporting block 4, the side of the first supporting block 4 away from the second supporting block 5 is provided with the third supporting block 6 which is embeddedly installed in the mold base 1, the first supporting block 4 and the second supporting block 5 surface are provided with the diode assembly 7, the heat dissipation aluminum sheet is bent and formed at the same time and is assembled with the module diode together, which has significant economic benefits, reduces the processing procedure, reduces the product production cost and improves the production efficiency.

[0022] As shown in Figure 3 and Figure 4 The first supporting block 4 top is provided with the first surface 41 and the second surface 42 which is lower than the first surface 41, the second surface 42 edge close to the second supporting block 5 is provided with the limiting stop edge 43, the second supporting block 5 top is provided with the third surface 51 which is lower than the second surface 42 and the fourth surface 52 which is arranged at the same height with the first surface 41, the third surface 51 places the module diode 71 in the diode assembly 7, since the heat dissipation aluminum sheet is fixed on the conductive sheet surface, there is a height difference between the heat dissipation aluminum sheet and the conductive sheet, the second surface and the second surface make the diode assembly better adhere to the mold, which is convenient for subsequent processing, the second surface 42 places the conductive sheet 72 in the diode assembly 7, the conductive sheet 72 is positioned through the limiting stop edge 43, the conductive sheet is clamped on the second surface through the limiting stop edge to prevent deviation, the first surface 41 and the fourth surface 52 place the U-shaped heat dissipation aluminum sheet 73.

[0023] The first supporting block 4 both sides are respectively provided with the first spring 8 which is connected with the slide block 3 bottom, each group of slide block bottom is provided with at least two groups of first springs, the slide block is separated from the heat dissipation aluminum sheet through the action force of the first spring after being bent, which is convenient for demolding.

[0024] As shown in Figure 5As shown, the slider 3 bottom is provided with a fixed part 31 connected with the first spring 8 and a bending part 32 in circular arc groove cross section, the bending part 32 abuts against the edge of the first support block 4 when the first spring 8 is in compression state, ensuring.

[0025] The third support block 6 extends horizontally and is provided with a middle plate 61 arranged in the U-shaped heat dissipation aluminum sheet 73, and the top of the third support block 6 is provided with a mounting hole, and the second spring 62 is arranged in the mounting hole, and the second spring 62 is connected with the stamping assembly to stamp the U-shaped heat dissipation aluminum sheet 73.

[0026] The side of the heat dissipation aluminum sheet 73 is provided with a bending edge of 75°, which is clamped and fixed with the conductive sheet 72 through the bending of the slider 3, and the structure of the side of the bending edge is buckled together with the first support block to form a 90° bending edge, ensuring the connection stability of the heat dissipation aluminum sheet and the diode assembly.

[0027] The working principle of the embodiment is as follows: the module diode is placed on the third surface of the second support block, and the heat dissipation aluminum sheet to be processed is placed on the first surface, the conductive sheet connected with the heat dissipation aluminum sheet to be processed is clamped and fixed to complete the preliminary positioning and installation of the diode assembly through the limiting baffle, at this time, the middle plate of the third support block is located above the heat dissipation aluminum sheet, the stamping assembly at the top of the third support block stamps the heat dissipation aluminum sheet to become a U-shaped structure, and the sliders on both sides move downward to bend the bending edge of the heat dissipation aluminum sheet to be fixed with the protruding position of the conductive sheet, and the heat dissipation aluminum sheet is bent and formed at the same time as the module diode is automatically assembled together.

[0028] The points to be explained are as follows: first, in the description of the present application, it is necessary to explain that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to represent the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change; secondly, in this paper, the relationship terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between the entities.

[0029] The above examples are only illustrative of the present application and do not constitute a limitation on the protection scope of the present application, and any design identical or similar to the present application belongs to the protection scope of the present application.

Claims

1. A mold structure for assembling a module diode and a heat dissipating aluminum sheet, comprising a mold base (1), characterized in that, The mold base (1) is provided with a groove, and symmetrically arranged slide rail seats (2) are transversely embedded and installed in the groove; slide blocks (3) are slidably installed on the slide rail seats (2); a first supporting block (4) is longitudinally embedded and installed between the two groups of slide rail seats (2); a second supporting block (5) is arranged close to the first supporting block (4); the first supporting block (4) is provided with a third supporting block (6) embedded and installed in the mold base (1) on the side away from the second supporting block (5); and diode assemblies (7) are arranged on the surfaces of the first supporting block (4) and the second supporting block (5).

2. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 1, wherein The first supporting block (4) is provided with a first surface (41) and a second surface (42) with a lower height than the first surface (41) on the top; and a limiting baffle (43) is arranged on the edge of the second surface (42) close to the second supporting block (5).

3. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 1, wherein The second supporting block (5) is provided with a third surface (51) with a lower height than the second surface (42) and a fourth surface (52) with the same height as the first surface (41) on the top.

4. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 3, wherein The third surface (51) is arranged to place module diodes (71) in the diode assemblies (7); the second surface (42) is arranged to place conductive sheets (72) in the diode assemblies (7); the conductive sheets (72) are positioned by the limiting baffle (43); and the first surface (41) and the fourth surface (52) are arranged to place U-shaped heat dissipation aluminum sheets (73).

5. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 1, wherein The first supporting block (4) is provided with first springs (8) connected to the bottoms of the slide blocks (3) on both sides.

6. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 5, wherein The slide blocks (3) are provided with fixed portions (31) connected to the first springs (8) and bending portions (32) with a circular arc groove in cross section on the bottoms; and the bending portions (32) abut against the edges of the first supporting block (4) when the first springs (8) are in a compressed state.

7. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 1, wherein The third supporting block (6) is provided with a middle plate (61) arranged in the U-shaped heat dissipation aluminum sheet (73) and extending in the horizontal direction; the third supporting block (6) is provided with mounting holes on the top; and second springs (62) are arranged in the mounting holes to press the U-shaped heat dissipation aluminum sheet (73) by stamping components.

8. The assembly mold structure of a module diode and a heat dissipating aluminum sheet according to claim 7, wherein The heat dissipation aluminum sheet (73) is provided with a bending edge with an angle of 75° on the side; and the bending edge is clamped and fixed with the conductive sheet (72) by the slide block (3).