Water source supply system of scribing machine and scribing machine

Abstract

The utility model discloses a water source supply system of a scribing machine and the scribing machine, and relates to the technical field of photovoltaic manufacturing. The water source supply system comprises a deionized water device and a heating device, the deionized water device is used for preparing deionized water, and the heating device is used for receiving the deionized water prepared by the deionized water device for heating treatment. A water source of the water source supply system is sequentially subjected to deionization operation of the deionized water device to prepare deionized water, the deionized water is heated by the heating device, the deionized water is adopted, ion types and concentration are very small, corrosion to a battery piece can be avoided, oxygen in water is reduced or eliminated by heating the deionized water, and the service life of the battery piece is prolonged. And the water source and the battery piece are prevented from reacting oxides, so that the influence of supplied water on the cutting quality of the battery piece is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic manufacturing technical field, especially relate to a water supply system of wafer sawing machine and wafer sawing machine. BACKGROUND

[0002] In photovoltaic module manufacturing, wafer sawing machine is a kind of silicon wafer cutting equipment, its principle is lossless laser wafering, utilize high-energy laser beam to material partial rapid heating, cause material surface to generate uneven temperature field, and this temperature will produce temperature gradient on material surface, to induce the generation of thermal stress. The partial area in laser spot is in pressure state, and the area before and after laser spot is in tensile stress state. Because the compression strength of brittle material is far greater than tensile strength, when tensile stress reaches the fracture strength of material, material will be broken.

[0003] At present, wafer sawing machine produces a large amount of cutting chips and cutting fluid in the process of battery piece production, usually uses tap water to clean, but, because some components in tap water can react with material, form oxide, can cause the cutting surface of battery piece to be not smooth, influence cutting quality.

[0004] Therefore, how to reduce the influence of water supply on battery piece cutting quality is the technical problem to be solved by the person skilled in the art at present. UTILITY MODEL CONTENT

[0005] Therefore, the utility model discloses a kind of water supply system of wafer sawing machine and wafer sawing machine, which can reduce the influence of water supply on battery piece cutting quality.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A kind of water supply system of wafer sawing machine, including deionized water device and heating device, the deionized water device is used to prepare deionized water, the heating device is used to receive the deionized water prepared by the deionized water device and is heated to handle.

[0008] Preferably, the heating device includes heating equipment and closed water container, and the heating equipment is used to heat the water in the water container.

[0009] Preferably, it further includes cooling device, for cooling the water after heating of the heating device.

[0010] Preferably, it further includes ion content detection device, for obtaining the ion content of the deionized water prepared by the deionized water device;The ion content detection device includes resistivity meter or conductivity meter.

[0011] Preferably, the deionized water device further comprises a backflow port connected to the inlet of the deionized water device, so that the deionized water prepared by the deionized water device can flow back to the inlet of the deionized water device for circulation deionization operation.

[0012] Preferably, the deionized water device comprises a high-pressure reverse osmosis membrane filtration device.

[0013] Preferably, the deionized water device further comprises an ion exchange resin treatment device connected to the outlet of the high-pressure reverse osmosis membrane filtration device.

[0014] Preferably, the deionized water device further comprises an ultraviolet sterilization device connected to the outlet of the ion exchange resin treatment device.

[0015] Preferably, a filtration device having a quartz sand filtering part is further included, and the deionized water device is used for receiving water from the outlet of the filtration device.

[0016] A wafer scribing machine comprises a laser cutting device and a water supply system as described above, which is used to supply water to the laser cutting device.

[0017] The water supply system of the wafer scribing machine comprises a deionized water device and a heating device, the deionized water device is used to prepare deionized water, and the heating device is used to receive the deionized water prepared by the deionized water device for heating treatment.

[0018] The water source of the water supply system is sequentially subjected to deionization operation by the deionized water device to prepare deionized water, and the deionized water is heated by the heating device. The deionized water has very few ion types and concentrations, which can avoid corrosion of the battery piece. The deionized water is heated to reduce or eliminate oxygen in the water, avoid the reaction of the water source with the battery piece to produce oxides, and thus reduce the influence of the supplied water on the cutting quality of the battery piece. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0020] Figure 1 The schematic diagram of the first embodiment of the water supply system provided by the present application.

[0021] Reference signs:

[0022] Deionized water device 1, high pressure reverse osmosis membrane filtering device 11, ion exchange resin treatment device 12, ultraviolet sterilization device 13;

[0023] Ion content detection device 2;

[0024] Heating device 3;

[0025] Cooling device 4;

[0026] Filtering device 5. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] The core of the present application is to provide a water supply system of a slicing machine and the slicing machine, which can reduce the influence of water supply on the cutting quality of battery pieces.

[0029] The specific embodiment one of the water supply system of the slicing machine provided by the present application is described below with reference to Figure 1 , which comprises a deionized water device 1 and a heating device 3. The deionized water device 1 is used for performing deionization operation on the received water to prepare deionized water, and the heating device 3 is used for receiving the water discharged from the outlet of the deionized water device 1 and performing heating treatment on the deionized water prepared by the deionized water device 1, which usually needs to be heated to boiling to remove oxygen.

[0030] Among them, the water source of the water supply system can be tap water, specifically the water produced after purification and disinfection by a tap water treatment plant and meeting the corresponding standards for people's life and production.

[0031] Among them, the deionized water device 1 can remove ions in tap water to generate deionized water (DI water). Deionization refers to removing all ions generated by electrolyte dissolved in water except hydrogen ions and hydroxyl ions in water, that is, removing electrolyte substances dissolved in water. The ion species and concentration in deionized water are very small, which will not cause corrosion to silicon wafers (battery pieces). At the same time, the conductivity of deionized water is very low, which can avoid electromagnetic interference caused by impurities in water.

[0032] The deionized water obtained after the treatment of the deionized water device 1 can effectively remove the molten material and debris when washing the cutting area of the battery piece. Specifically, a large amount of heat is generated during the laser scribing process. When the laser beam irradiates the metal surface, the metal is rapidly evaporated and melted due to the high energy density heat. At the same time, the gas generated on the metal surface is also blown out by the laser beam, forming "gas mist". These gases mainly include oxygen and nitrogen. These heat will cause the water molecules to decompose and produce hydrogen and oxygen, forming bubbles, which will affect the precision of laser scribing. The solubility of oxygen in water changes with factors such as temperature, pressure, salinity, and water flow rate. High temperature will cause water molecules to move faster, and oxygen is more likely to escape from water, forming bubbles. In this embodiment, by providing deionized water, the influence of these gases can be eliminated. At the same time, it can also play a role in cooling the laser, preventing the laser from overheating and damaging, and protecting the laser due to the good heat conductivity of deionized water. The deionized water has good heat conductivity, which can quickly transfer the heat generated by the laser cutting machine to the cooling system, thereby effectively reducing the temperature of the laser, effectively protecting the laser, and prolonging its service life.

[0033] The heating device 3 can heat and boil the deionized water generated by the deionized water device 1 to remove the gas and prevent the oxidation of the precipitate, thereby avoiding the influence of oxygen in the deionized water on the cutting quality, and avoiding the reaction between oxygen and the molten material to form oxides, resulting in a rough cutting surface, and causing corrosion and blockage inside the equipment.

[0034] Specifically, removing the gas mainly includes: effectively removing the gas in the deionized water, especially oxygen, by heating and boiling. Through heating, the dissolved gas (such as oxygen) in the water is released, thereby reducing the gas content in the water.

[0035] Specifically, preventing the oxidation of the precipitate mainly includes: heating and boiling the deionized water can prevent the oxidation of the precipitate, especially during the preparation of the precipitate. By heating, the oxygen in the water can be removed, thereby preventing the oxidation of the precipitate during the formation process, ensuring the quality and purity of the precipitate; boiling reduces the water adsorbed by the precipitate, making the precipitate condense tightly, and obtaining a tight-grained precipitate, which is easier to filter.

[0036] In addition, heating and boiling can also help remove other impurities in the deionized water, such as microorganisms and bacteria.

[0037] In this embodiment, the water source of the water supply system is sequentially subjected to deionization operation by the deionization device 1, heating and boiling operation by the heating device, and then deionized water with very low ion species and concentration is obtained, which can avoid corrosion to the battery sheet and reduce or eliminate oxygen in the water, thereby avoiding reaction of the water source with the battery sheet to form oxidation and reducing the influence of the supplied water on the cutting quality of the battery sheet.

[0038] Further, the heating device 3 comprises a heating apparatus and a sealed water container, and the heating apparatus is used to heat the water in the water container.

[0039] In this embodiment, the heating device 3 is not connected with the deionization device 1, and the specific steps of the operation of the heating device 3 are as follows: the deionized water at the outlet of the deionization device 1 is poured into the water container, and attention should be paid to not fill it up, leaving about 1-2 inches of space to prevent water from overflowing when boiling; the water container is placed on the heating apparatus, and the heating apparatus is turned on to gradually heat the deionized water to boiling state; the deionized water is kept boiling for about 10-15 minutes to sufficiently remove oxygen in the water; the heating apparatus is turned off, the water container is taken off from the heating apparatus, and it is naturally cooled; after the deionized water is cooled, it can be stored in a sealed container for subsequent use.

[0040] In other embodiments, the heating device 3 can also be connected with the deionization device 1 through a pipeline, and the water at the outlet of the deionization device 1 can be timely introduced into the heating device 3 through the pipeline under the control of a pump or a valve, and the heating device 3 can be an integrated heating apparatus with a heating cavity.

[0041] It should be noted that when the deionized water is heated and boiled, the water temperature should be gradually increased, the heating temperature should not be higher than 60℃, and the heating time should not be longer than 30 minutes, so as to avoid sudden high temperature change to cause the water container to be broken or the water quality to be changed. At the same time, the state of the water should be closely observed during the boiling process to prevent dry burning or excessive evaporation of water. In addition, the storage condition of the deionized water is usually under the protection of inert gas such as nitrogen or argon, and the temperature can be controlled at 2-8℃.

[0042] Further, the water supply system further comprises a cooling device 4 for cooling the water treated by the heating device 3. The deionized water after heating needs to be cooled, and the cooling device 4 can be used to cool the water container and the water heated therein.

[0043] It should be noted that the deionized water after heating treatment should be slowly cooled, and the cooling temperature is 25℃. In order to avoid the breakage of the water container or the change of water quality caused by sudden temperature drop, the water container can be slowly cooled, and the water container containing the water after heating treatment can be sprayed or air-cooled. Alternatively, natural cooling or using cold water to gently flush the outside of the water container can also be used to accelerate the cooling process, but the water temperature should not be too low.

[0044] It should be noted that the same container can be used for heating and cooling of the water container. The water container should be suitable for high temperature environment, such as glass or stainless steel container, and plastic container which may release harmful substances at high temperature should be avoided. In addition, during heating and cooling, the water container should be sealed well to prevent dust and microorganisms from entering the water. Specifically, the method for checking the air tightness of the water container is to close the device, and when the syringe is pulled out, the volume of gas in the water container decreases, and the pressure decreases (less than the external pressure), and the atmospheric pressure makes the syringe piston return to the original position. At the same time, the environment should be kept clean during operation to avoid introducing new pollution sources.

[0045] Further, the water source supply system further comprises an ion content detection device 2 for obtaining the ion content of the deionized water prepared by the deionized water device 1.

[0046] Among them, the resistivity is an important indicator to measure the purity of deionized water. The higher the resistivity, the less the ion content in the water, and the purer the water quality. The resistivity detection can detect the ion content in the water and ensure the purity of the water. The resistivity can usually reach more than 1MΩ·cm, and can be controlled between 1-18MΩ·cm according to different water quality and use requirements.

[0047] Among them, the ion content detection device 2 can be a resistivity meter or a conductivity meter. The resistivity meter calculates the resistivity of the water sample by measuring the resistance value of the water sample, and the conductivity meter indirectly calculates the resistivity by measuring the conductivity value of the water. If the resistivity does not meet the requirements, additional ion exchange or reverse osmosis treatment can be performed again, such as circulating treatment through the deionized water device 1 again, to ensure that the resistivity of the water meets the requirements.

[0048] Further, the deionized water device 1 also has a backflow port connected to the inlet of the deionized water device 1. Specifically, the backflow port allows the water after deionization operation of the deionized water device 1 to flow back to the inlet of the deionized water device 1 for circulating deionization operation.

[0049] The deionized water device 1 comprises a main outlet for discharging water after deionization operation out of the deionized water device 1, the main outlet comprises an outlet and a backflow port, the outlet is used for discharging deionized water supplied to the heating device 3, the backflow port is connected to the inlet of the deionized water device 1 through a branch pipeline, a backflow pump and a first valve can be arranged on the branch pipeline, the outlet can also be provided with a second valve, and the opening and closing of the second valve is controlled through the ion content detection device 2; according to the detection result of the ion content detection device 2, when the deionization operation needs to be recycled, the first valve and the backflow pump are controlled to be opened, and the second valve is controlled to be closed, so that the deionization operation is recycled; when the deionization operation is not needed, the first valve and the backflow pump are controlled to be closed, and the second valve is controlled to be opened, so that the deionized water can be supplied to the heating device 3.

[0050] Further, the deionized water device 1 comprises a high-pressure reverse osmosis membrane filtration device 11, an ion exchange resin treatment device 12 connected to the outlet of the high-pressure reverse osmosis membrane filtration device 11, and an ultraviolet sterilization device 13 connected to the outlet of the ion exchange resin treatment device 12.

[0051] The high-pressure reverse osmosis membrane filtration device 11 can remove most of the ions and microorganisms through high-pressure reverse osmosis membrane filtration. The reverse osmosis membrane can effectively remove the dissolved substances, heavy metal ions and other impurities in the water.

[0052] The ion exchange resin treatment device 12 can remove cations in the water through cation exchange resin, and then remove anions in the water through anion exchange resin. This operation is the key to deionized water treatment, which can significantly reduce the conductivity of the water.

[0053] The ultraviolet sterilization device 13 can perform ultraviolet sterilization. The ultraviolet sterilization treatment can make bacteria unable to survive, further remove microorganisms in the water, and achieve the purpose of sterilization. In addition, the ultraviolet sterilization device 13 can also comprise a microporous filter. The microporous filter is used to filter various particles with a size of 0.5 μm or more in the water after ultraviolet sterilization. Thus, deionized water with general cleanliness can be obtained.

[0054] The ion content detection device 2 is used to detect the ion content of the deionized water produced by the ultraviolet sterilization device 13. If the ion content does not meet the requirements, the deionized water is re-introduced into the high-pressure reverse osmosis membrane filtration device 11 through the branch pipeline for recycling treatment.

[0055] Further, the water supply system further comprises a filtration device 5 for receiving tap water and performing preliminary filtration treatment on the tap water. The filtration device 5 comprises a quartz sand filtration part. The deionized water device 1 is used to receive water from the outlet of the filtration device 5.

[0056] The filtering device 5 can sequentially perform coarse filtering and fine filtering on the received tap water, and the tap water is filtered by the quartz sand filtering part to remove particulate matter, suspended matter, colloidal matter and other impurities in the water.

[0057] In addition, it should be noted that, according to actual needs, different devices in the water source supply system can be connected and communicated along the water flow and treatment direction through pipelines, or can not be connected through pipelines.

[0058] The working process of the water source supply system in the embodiment includes the following steps in sequence: adding tap water; coarse filtering and fine filtering by the filtering device 5; filtering by the high-pressure reverse osmosis membrane filtering device 1 through the high-pressure reverse osmosis membrane; treatment by the ion exchange resin treatment device 12; sterilization by the ultraviolet sterilization device 13; detection of the ion content of the deionized water by the ion content detection device 2, and re-entering the high-pressure reverse osmosis membrane filtering device 11 if the deionized water is unqualified, or otherwise being transported to the heating device 3; cooling the deionized water after heating treatment; and flowing into a container or being used by corresponding equipment.

[0059] In addition to the above water source supply system, the utility model also provides a wafer dicing machine, which comprises the water source supply system, and the water source supply system can be the water source supply system provided in any one of the above embodiments, and the beneficial effects can be correspondingly referred to the above embodiments.

[0060] In the wafer dicing machine, the whole process can specifically include the following steps in sequence: battery piece feeding; appearance detection and positioning; laser cutting device cutting, water supply to the laser cutting device by the water source attack system during cutting; splitting; drying; appearance detection and positioning; discharging and wafer collecting.

[0061] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be intervening elements. Furthermore, in the description of the utility model, unless otherwise stated, the meaning of "a plurality of", "a plurality of", "a plurality of" is two or more than two.

[0062] The orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the orientations or positional relationships shown in the drawings, and are merely intended to facilitate description of the utility model and simplify description, and are not indicative or implied that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third" are only for description purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0064] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the various embodiments can be mutually referred to.

[0065] The wafer scriber and the water supply system of the wafer scriber provided by the application are described in detail. The principle and implementation mode of the application are described by applying specific examples. The description of the above embodiments is only used to help understand the method and core idea of the application. It should be pointed out that, for ordinary skilled in the art, without departing from the principle of the application, the application can be improved and modified in several ways. These improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. A water supply system for a dicing saw, characterized by, The system comprises a deionized water device (1) for preparing deionized water and a heating device (3) for receiving the deionized water prepared by the deionized water device (1) for heating treatment.

2. The water supply system according to claim 1, characterized in that The heating device (3) comprises a heating equipment and a closed water container, and the heating equipment is used for heating the water in the water container.

3. The water supply system according to claim 1, characterized by The system further comprises a cooling device (4) for cooling the water heated by the heating device (3).

4. Water supply system according to any one of claims 1 to 3, characterized in that The system further comprises an ion content detection device (2) for obtaining the ion content of the deionized water prepared by the deionized water device (1), and the ion content detection device (2) comprises a resistivity meter or a conductivity meter.

5. The water supply system according to claim 4, characterized in that The deionized water device (1) further comprises a backflow port connected to the inlet of the deionized water device (1) so that the deionized water prepared by the deionized water device (1) can flow back to the inlet of the deionized water device (1) for circulation deionization operation.

6. The water supply system according to any one of claims 1 to 3, characterized in that The deionized water device (1) comprises a high-pressure reverse osmosis membrane filtration device (11).

7. The water supply system according to claim 6, characterized in that The deionized water device (1) further comprises an ion exchange resin treatment device (12) connected to the outlet of the high-pressure reverse osmosis membrane filtration device (11).

8. The water supply system according to claim 7, characterized in that The deionized water device (1) further comprises an ultraviolet sterilization device (13) connected to the outlet of the ion exchange resin treatment device (12).

9. The water supply system according to any one of claims 1 to 3, characterized by The system further comprises a filtration device (5) having a quartz sand filtration part therein, and the deionized water device (1) is used for receiving the water at the outlet of the filtration device (5).

10. A scribe machine characterized by, The system comprises a laser cutting device and the water supply system according to any one of claims 1 to 9, and the water supply system is used for supplying water to the laser cutting device.

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