Bonding production line

Abstract

The utility model provides a bonding production line. The bonding production line comprises a crystal bar feeding device which comprises a first conveying structure, a second conveying structure and a bar splicing device, the first conveying structure conveys crystal bars with the length larger than or equal to the preset length, the second conveying structure conveys crystal bars with the length smaller than the preset length, and the bar splicing device splices the crystal bars located on the second conveying structure; the bonding device comprises a third conveying structure and is provided with a crystal support feeding position, a resin plate bonding position and a crystal bar bonding position; when the crystal support is conveyed from the crystal support feeding position to the resin plate gluing position by the third conveying structure, the crystal support is glued by the gluing machine, and the glued crystal support is bonded with the resin plate at the resin plate gluing position and is pressed by the jacking and clamping mechanism; and the crystal bar is adhered to the crystal bar conveyed by the first conveying structure or the second conveying structure at the crystal bar adhesive position and is pressed by the jacking and clamping mechanism. According to the utility model, the problem that the gluing effect on the crystal support, the resin plate and the crystal bar is poor in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the field of solar photovoltaic technology, and more specifically, to an adhesive bonding production line. Background Technology

[0002] In related technologies, the ingot bonding process in the photovoltaic industry mainly relies on manual operation or rudimentary automated equipment. These devices have obvious limitations and shortcomings in bonding ingots to resin plates.

[0003] Specifically, during the crystal ingot bonding process, it is often impossible to precisely splice crystal ingots of different lengths, resulting in low utilization of the ingots in subsequent cutting processes and increased production costs. Furthermore, the bonding of crystal ingots, resin plates, and crystal holders is usually carried out under non-constant pressure conditions, making it impossible to ensure uniform distribution of the adhesive among the three components. This leads to unstable bonding results and a high void rate, which not only reduces production efficiency but also severely affects the precision and strength of the bonding, thereby impacting the quality of the final product. Utility Model Content

[0004] The main purpose of this invention is to provide an adhesive bonding production line to solve the problem of poor adhesive bonding effect on crystal trays, resin plates and crystal rods in the prior art, which affects product quality.

[0005] To achieve the above objectives, this utility model provides a bonding production line, comprising: a crystal rod feeding device, including a first conveying structure, a second conveying structure, and a rod splicing device; the first conveying structure is used to convey crystal rods with a length greater than or equal to a preset length; the second conveying structure is used to convey crystal rods with a length less than the preset length; and the rod splicing device is used to splice at least two crystal rods located on the second conveying structure; a resin plate feeding device; a crystal tray feeding device; and a bonding device, including a third conveying structure, a glue applicator, and a lifting and clamping mechanism; the third conveying structure has a crystal tray feeding position, a resin plate bonding position, and a crystal rod bonding position arranged sequentially along its conveying direction. The device is configured to correspond to the discharge port of the crystal tray feeding device. When the third conveying structure transports the crystal tray from the crystal tray feeding position to the resin board bonding position, a glue applicator is used to apply glue to the crystal tray. After glue application, the crystal tray adheres to the resin board at the resin board bonding position to form an intermediate product. When the third conveying structure transports the intermediate product from the resin board bonding position to the crystal rod bonding position, a glue applicator is used to apply glue to the intermediate product, and a lifting and clamping mechanism is used to press the glued intermediate product. The glued intermediate product adheres to the crystal rod conveyed by the first or second conveying structure at the crystal rod bonding position, and the lifting and clamping mechanism presses the intermediate product and the crystal rod together to form a finished product.

[0006] Furthermore, the bonding production line also includes: multiple support structures, which are spaced apart along the conveying direction of the third conveying structure to move synchronously with the third conveying structure; multiple support structures are arranged one-to-one with multiple crystal holders, and each support structure carries its corresponding crystal holder to bond with the resin plate and crystal rod; multiple mating components, which are arranged one-to-one with multiple support structures, and each support structure is limited and mated with the crystal holder through its corresponding mating component.

[0007] Furthermore, the bonding device also includes: a clamping structure having a clamping space with adjustable dimensions, used to clamp the resin plate when it is placed on the glue-coated crystal holder and moves synchronously with the third conveying structure; used to clamp the crystal rod when it is placed on the glue-coated resin plate and moves synchronously with the third conveying structure; wherein, the lifting and clamping mechanism includes a movably configured lifting part and a pressing part, the lifting part being used to lift the intermediate product or finished product to detach it from the third conveying structure, and the pressing part being used to apply a downward clamping force to the intermediate product or finished product.

[0008] Furthermore, the bonding production line also includes a control module electrically connected to the pressing section. The bonding device further includes: a timing module electrically connected to the control module, used to time the pressing time of the pressing section; when the timing value of the timing module reaches a preset time value, the pressing section is stopped by the control module; and / or, a pressure detection device electrically connected to the control module, used to detect the clamping force between the pressing section and the intermediate or finished product; when the pressure detection value of the pressure detection device reaches a preset pressure value, the pressing section is stopped by the control module.

[0009] Furthermore, the ingot feeding device also includes: an ingot wiping mechanism, including a first driving device, a driving roller, a driven roller, and an abutting part; the first driving device is driven to the driving roller to drive the driving roller to rotate; during the rotation of the driving roller, the abutting part abuts against the ingot so that the lint-free paper wound on the driving roller and the driven roller wipes the surface of the ingot; a first centering mechanism, including two oppositely arranged stops, forming an ingot centering space between the two stops; the two stops move toward or away from each other to adjust the size of the ingot centering space; each stop is used to limit and stop the ingot.

[0010] Furthermore, the resin board feeding device includes: a resin board feeding mechanism; a flatness detection mechanism, including a detection platform and multiple distance sensors mounted on the detection platform; a gantry robotic arm for transferring the resin board stored in the resin board feeding mechanism to the detection platform, wherein each distance sensor is used to detect the distance between itself and the resin board, so as to determine whether the flatness of the resin board is within a preset range based on the detection values ​​of all distance sensors; an NG stage, for transferring the resin board to the NG stage by means of the gantry robotic arm when the flatness of the resin board exceeds the preset range; a fourth conveying structure, for transferring the resin board to the fourth conveying structure by means of the gantry robotic arm when the flatness of the resin board is within the preset range; a cleaning mechanism for cleaning the surface of the resin board; and a second centering mechanism, including two opposing centering structures, each centering structure including a centering protrusion, the centering protrusion being movably disposed for contacting the resin board, thereby limiting and stopping the resin board.

[0011] Furthermore, the crystal tray loading device includes: a fifth conveying structure for conveying the crystal tray, the fifth conveying structure having a positioning station; a positioning component including a second driving device and a positioning pin driven and connected to the second driving device, the second driving device driving the positioning pin to extend into the positioning hole of the crystal tray to limit the engagement with the positioning hole; and a first robotic arm for transferring the crystal tray, after being positioned by the positioning component, to the support structure.

[0012] Furthermore, the bonding production line also includes an outbound device located downstream of the bonding unit. The outbound device includes: a second robotic arm; a sixth conveyor structure, wherein the second robotic arm is used to transfer finished products onto the sixth conveyor structure; and a stacker crane, used to stack the finished products buffered on the sixth conveyor structure to a designated location.

[0013] Furthermore, there are two lifting and clamping mechanisms, which are spaced apart along the conveying direction of the third conveying structure. The first lifting and clamping mechanism is located between the resin plate adhesive position and the crystal rod adhesive position, and the second lifting and clamping mechanism is located downstream of the crystal rod adhesive position. There are two clamping structures, with the first clamping structure located at the resin plate adhesive position and the second clamping structure located at the crystal rod adhesive position.

[0014] Furthermore, the third conveying structure includes: a first sub-conveyor structure; two second sub-conveyor structures, each with its input end connected to the first sub-conveyor structure; four third sub-conveyor structures, corresponding to the first lifting and clamping mechanism, each with its output end connected to the input ends of the two third sub-conveyor structures; two fourth sub-conveyor structures, each with its output end connected to the input end of one fourth sub-conveyor structure; four fifth sub-conveyor structures, corresponding to the second lifting and clamping mechanism, each with its output end connected to the input ends of the two fifth sub-conveyor structures; and a sixth sub-conveyor structure, with the output ends of all fifth sub-conveyor structures connected to the sixth conveying structure.

[0015] The bonding production line, utilizing the technical solution of this utility model, includes a crystal rod feeding device, a resin plate feeding device, a crystal tray feeding device, and a bonding device. The crystal rod feeding device comprises a first conveying structure, a second conveying structure, and a rod splicing device. The first conveying structure is used to convey crystal rods with a length greater than or equal to a preset length, the second conveying structure is used to convey crystal rods with a length less than the preset length, and the rod splicing device is used to splice at least two crystal rods located on the second conveying structure. The bonding device includes a third conveying structure, a glue applicator, and a lifting and clamping mechanism. The third conveying structure has a crystal tray feeding position, a resin plate bonding position, and a crystal rod bonding position arranged sequentially along its conveying direction. The crystal tray feeding position corresponds to the discharge port of the crystal tray feeding device. Thus, the crystal rod feeding device processes crystal rods with a length greater than or equal to the preset length and crystal rods with a length less than the preset length through the first and second conveying structures respectively, enabling the bonding production line to adapt to crystal rods of different lengths. The rod splicing device achieves the splicing of short rods, improving the flexibility and production efficiency of the equipment. When bonding crystal trays, resin plates, and crystal rods is required, the third conveying structure transports the crystal trays from the crystal tray loading position to the resin plate bonding position. Adhesive is applied to the crystal trays using a glue applicator. The glued crystal trays then bond with the resin plate at the resin plate bonding position to form an intermediate product. When the third conveying structure transports the intermediate product from the resin plate bonding position to the crystal rod bonding position, adhesive is applied to the intermediate product using a glue applicator, and a lifting and clamping mechanism presses the glued intermediate product to improve bonding quality and reduce empty glue rate. The glued intermediate product then bonds with the crystal rods transported via the first or second conveying structure at the crystal rod bonding position. The lifting and clamping mechanism presses the intermediate product and crystal rods together to form the finished product. This solves the problem of poor adhesion between crystal trays, resin plates, and crystal rods in the prior art, which affects product quality, and improves the bonding strength of the three components. Meanwhile, in the bonding device, the setting of the crystal tray loading position, resin plate adhesive position, and crystal rod adhesive position in the third conveying structure ensures the accuracy of the bonding process, facilitates precise glue application by the glue applicator, and ensures the accuracy of the bonding process by bonding the crystal tray to the resin plate adhesive position after glue application, as well as bonding the intermediate product to the crystal rod at the crystal rod adhesive position, thereby reducing the risk of void glue rate and poor bonding. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 A schematic diagram of an embodiment of the bonding production line according to the present invention is shown;

[0018] Figure 2 It shows Figure 1 A schematic diagram of the crystal rod feeding device in the bonding production line;

[0019] Figure 3 It shows Figure 1 A schematic diagram of the resin board loading device in the bonding production line.

[0020] Figure 4 It shows Figure 1 A schematic diagram of the assembled bonding device and load-bearing structure in the bonding production line.

[0021] Figure 5 It shows Figure 1 A schematic diagram of the outbound device of the bonding production line in the middle;

[0022] Figure 6 It shows Figure 1 A schematic diagram of the crystal tray feeding device in the bonding production line.

[0023] The above figures include the following reference numerals:

[0024] 10. Crystal rod feeding device; 11. First conveying structure; 12. Second conveying structure; 13. Rod splicing device; 14. Crystal rod wiping mechanism;

[0025] 20. Resin board loading device; 21. Resin board feeding mechanism; 22. Flatness detection mechanism; 23. Gantry robotic arm; 24. NG table; 25. Fourth conveying structure; 26. Cleaning mechanism; 27. Second centering mechanism;

[0026] 30. Crystal tray loading device; 31. Fifth conveying structure; 32. Positioning component; 33. First robotic arm;

[0027] 40. Adhesive bonding device; 41. Third conveying structure; 411. First sub-conveying structure; 412. Second sub-conveying structure; 413. Third sub-conveying structure; 414. Fourth sub-conveying structure; 415. Fifth sub-conveying structure; 416. Sixth sub-conveying structure; 42. Glue applicator; 43. Clamping structure; 44. Lifting and clamping mechanism;

[0028] 50. Load-bearing structure;

[0029] 60. Outbound device; 61. Second robotic arm; 62. Sixth conveying structure. Detailed Implementation

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0032] In this utility model, unless otherwise stated, directional terms such as "upper" and "lower" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" are generally used in relation to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0033] To address the problem of poor adhesion of crystal holders, resin plates, and crystal rods in existing technologies, which affects product quality, this application provides an adhesive bonding production line.

[0034] like Figures 1 to 6 As shown, the bonding production line includes a crystal rod feeding device 10, a resin plate feeding device 20, a crystal tray feeding device 30, and a bonding device 40. The crystal rod feeding device 10 includes a first conveying structure 11, a second conveying structure 12, and a rod splicing device 13. The first conveying structure 11 is used to convey crystal rods with a length greater than or equal to a preset length, the second conveying structure 12 is used to convey crystal rods with a length less than the preset length, and the rod splicing device 13 is used to splice at least two crystal rods located on the second conveying structure 12. The bonding device 40 includes a third conveying structure 41, a glue applicator 42, and a lifting and clamping mechanism 44. The third conveying structure 41 has a crystal tray feeding position, a resin plate bonding position, and a crystal rod bonding position arranged sequentially along its conveying direction. The crystal tray feeding position corresponds to the discharge port of the crystal tray feeding device 30. In this process, when the third conveying structure 41 conveys the crystal tray from the crystal tray loading position to the resin plate bonding position, the crystal tray is glued by the glue applicator 42. After glue application, the crystal tray is bonded to the resin plate at the resin plate bonding position to form an intermediate product. When the third conveying structure 41 conveys the intermediate product from the resin plate bonding position to the crystal rod bonding position, the intermediate product is glued by the glue applicator 42 and pressed by the lifting and clamping mechanism 44. After glue application, the intermediate product is bonded to the crystal rod conveyed by the first conveying structure 11 or the second conveying structure 12 at the crystal rod bonding position. The lifting and clamping mechanism 44 presses the intermediate product and the crystal rod together to form a finished product.

[0035] Applying the technical solution of this embodiment, the crystal rod feeding device 10 processes crystal rods with a length greater than or equal to a preset length and crystal rods with a length less than a preset length through the first conveying structure 11 and the second conveying structure 12, so that the bonding production line can adapt to crystal rods of different lengths. The splicing of short rods is realized through the splicing device 13, which improves the flexibility and production efficiency of the equipment. When bonding crystal trays, resin plates, and crystal rods is required, the third conveying structure transports the crystal trays from the crystal tray loading position to the resin plate bonding position. A glue applicator applies glue to the crystal trays, and a lifting and clamping mechanism 44 presses the glued intermediate product to improve bonding quality and reduce empty glue rate. The glued crystal trays are then bonded to the resin plate at the resin plate bonding position to form an intermediate product. When the third conveying structure transports the intermediate product from the resin plate bonding position to the crystal rod bonding position, a glue applicator applies glue to the intermediate product. The glued intermediate product is then bonded to the crystal rods transported via the first or second conveying structure at the crystal rod bonding position. The lifting and clamping mechanism 44 presses the intermediate product and the crystal rods together to form the finished product. This solves the problem of poor bonding effect between crystal trays, resin plates, and crystal rods in the prior art, which affects product quality, and improves the bonding strength of the three components. Meanwhile, in the bonding device 40, the setting of the crystal tray loading position, resin plate adhesive position, and crystal rod adhesive position of the third conveying structure 41 ensures the accuracy of the bonding process, which facilitates the glue applicator 42 to perform precise glue application. After glue application, the crystal tray is bonded to the resin plate at the resin plate adhesive position, and the intermediate product is bonded to the crystal rod at the crystal rod adhesive position. All of these ensure the accuracy of the bonding process and reduce the risk of empty glue rate and poor bonding.

[0036] like Figure 4 As shown, the bonding production line also includes multiple support structures 50 and multiple mating components. The multiple support structures 50 are spaced apart along the conveying direction of the third conveying structure 41 to move synchronously with it. Each support structure 50 corresponds to a specific crystal tray, and each support structure 50 carries its corresponding crystal tray to bond with the resin plate or crystal rod. The multiple mating components also correspond to each support structure 50, and each support structure 50 engages with the crystal tray through its corresponding mating component. In this way, the support structure 50 not only carries the crystal tray but also, through its engagement with the mating components, positions and limits the crystal tray, ensuring its stability during the bonding process and preventing displacement that may occur during conveying and bonding, thereby improving bonding accuracy and product quality. Meanwhile, the bearing structure 50 moves synchronously with the third conveying structure 41, enabling the crystal tray, resin plate and crystal rod to be transferred smoothly and quickly during the bonding process. Furthermore, through the cyclic movement of the bearing structure 50, a continuous automated process is realized, which includes automatic feeding of the crystal tray, gluing, bonding with the resin plate, re-gluing, and bonding with the crystal rod, significantly improving production efficiency.

[0037] Specifically, the one-to-one correspondence between the components and the supporting structure 50 makes the bonding process between the crystal holder and the resin plate and crystal rod on each supporting structure 50 relatively independent. This not only facilitates the maintenance and cleaning of the production line, but also makes it easier to target a specific supporting structure 50 when a fault occurs or an adjustment is needed, without having to stop the entire production line.

[0038] like Figure 4 As shown, the bonding device 40 also includes a clamping structure 43. The clamping structure 43 has an adjustable clamping space. During the process of placing the resin plate on the glue-coated crystal holder and moving synchronously with the third conveying structure 41, the clamping space clamps the resin plate; during the process of placing the crystal rod on the glue-coated resin plate and moving synchronously with the third conveying structure 41, the clamping space clamps the crystal rod. The lifting and clamping mechanism 44 includes a movable lifting part and a pressing part. The lifting part is used to lift the intermediate product or finished product to detach it from the third conveying structure 41, and the pressing part is used to apply a downward clamping force to the intermediate product or finished product. Thus, the adjustable size of the clamping structure 43 allows it to adapt to resin plates and crystal rods of different specifications, ensuring precise clamping of materials during the bonding process. This guarantees the stable position of the resin plate and crystal rod on the third conveying structure 41, avoids displacement during the bonding process, thereby improving bonding accuracy and reducing empty glue rate and poor bonding. Meanwhile, the lifting and clamping mechanism 44 separates the bonded intermediate or finished product from the third conveying structure 41 through the lifting part, avoiding unnecessary pressure on the bonded product by the conveying structure, which would affect the curing effect. The pressing part applies a uniform downward pressing force to the intermediate or finished product, ensuring close contact at the bonding interface during the curing process, which is beneficial for uniform distribution and curing of the adhesive, and improves the bonding strength and product reliability.

[0039] In this embodiment, as the resin plate and crystal rod move synchronously with the third conveying structure 41, the clamping structure 43 can automatically clamp them and complete the pressing and curing under the action of the lifting clamping mechanism 44, realizing the automation and continuity of the bonding process, reducing intermediate stops and manual intervention, and significantly improving the operating efficiency of the production line.

[0040] Specifically, the carrier structure 50, carrying the crystal tray, flows through the third conveying structure 41 to the resin plate bonding position. The positioning mechanism then positions the carrier structure 50 again. After positioning, the mixing machine begins mixing the AB adhesives in proportion, and a robot applies the adhesive to the surface of the crystal tray along a specific trajectory. After the adhesive application is complete, another robot quickly grabs the positioned resin plate and places it on the glued crystal tray. Then, the clamping structure 43 moves to position and tighten the resin plate. The carrier structure 50 then quickly flows through the third conveying structure 41 to the area below the lifting and clamping mechanism 44. Once in position, the lifting and clamping mechanism 44 first lifts the carrier structure 50, detaching it from the third conveying structure 41. Then, the lowering part descends, applying pressure evenly to the resin plate. The clamping force can be adjusted according to process requirements. The components are queued and processed sequentially. Each resin plate is clamped under constant pressure for a certain time, which can be adjusted according to process requirements. Once the process conditions are met, the lifting and clamping mechanism 44 releases the clamping action sequentially, and the components are then transferred sequentially through the third conveying structure 41 to the crystal rod bonding position. After the resin board is glued, it flows along the supporting structure 50 to the crystal rod gluing position. The positioning mechanism positions the supporting structure 50. After positioning, the glue mixer starts to mix the AB glue in proportion, and the robot arm applies the glue to the surface of the resin board according to a certain trajectory. The length of the glue application is based on the rod length data given by the front-end rod assembly device. After the glue application is completed, another robot quickly grabs the positioned crystal rod and places it on the glued resin board. Then the clamping structure 43 moves to position and tighten the crystal rod. Then the supporting structure 50 quickly flows through the third conveying structure 41 to the bottom of the lifting and clamping mechanism 44. Once in position, the lifting and clamping mechanism 44 first lifts the supporting structure 50 to detach it from the third conveying structure 41. Then, the lowering part descends, applying pressure evenly to the crystal rods. The clamping force can be adjusted according to process requirements. At this point, the crystal rods are queued and operated sequentially, with each rod clamped under constant pressure for a certain time, which can be adjusted according to process requirements. After the process conditions are met, the lifting and clamping mechanism 44 releases the clamping action sequentially, and the rods are transferred to the next station via the third conveying structure 41. From here to the unloading station, the adhesive undergoes initial curing. At the unloading station, the supporting structure 50 is first positioned, then the crystal rod positioning and clamping mechanism is unlocked. Finally, a robotic arm picks up the finished product with the glued rods and places it on the unloading device 60.

[0041] Optionally, the bonding production line also includes a control module electrically connected to the pressing section. The bonding device 40 also includes a timing module electrically connected to the control module. The timing module is used to time the pressing time of the pressing section. When the timing value of the timing module reaches a preset time value, the pressing section is stopped by the control module. And / or, the bonding production line also includes a pressure detection device electrically connected to the control module. The pressure detection device is used to detect the clamping force between the pressing section and the intermediate or finished product. When the pressure detection value of the pressure detection device reaches a preset pressure value, the pressing section is stopped by the control module. In this way, the above configuration automates the lifting and clamping mechanism 44, thereby improving the intelligence level of the bonding production line.

[0042] like Figure 2 As shown, the ingot feeding device 10 also includes an ingot wiping mechanism 14 and a first centering mechanism. The ingot wiping mechanism 14 includes a first driving device, a driving roller, a driven roller, and an abutting part. The first driving device is driven by the driving roller to rotate it. During the rotation of the driving roller, the abutting part abuts against the ingot, allowing the lint-free paper wound on the driving and driven rollers to wipe the surface of the ingot. The first centering mechanism includes two opposing stops forming an ingot centering space. The two stops move towards or away from each other to adjust the size of the ingot centering space; each stop is used to limit and stop the ingot. Thus, the ingot wiping mechanism 14 drives the driving roller to rotate via the first driving device, causing the lint-free paper wound on the driving and driven rollers to abut against the surface of the ingot, effectively removing dust and impurities from the ingot surface. Simultaneously, the cleaning work performed before bonding can significantly reduce poor bonding results caused by impurities during bonding, improving the surface quality and bonding strength of the finished product. In addition, the first centering mechanism forms a crystal rod centering space by two opposing baffles. By adjusting the distance between the baffles, the position of the crystal rod can be precisely controlled to ensure the centering accuracy of the crystal rod during the conveying and subsequent bonding process.

[0043] In this embodiment, the crystal ingot wiping mechanism 14 uses rolls of lint-free paper to wipe the surface of the crystal ingot. It consists of two rotatable rollers, a drive roller and a driven roller. During use, the roll of lint-free paper is mounted on and fixed to the driven roller. New lint-free paper is wound along a specific path and fixed to the drive roller. The drive roller rotates via a motor, rotating a certain length each time (feedback is provided by a contact encoder) to ensure that the lint-free paper used for each wipe is unused. The contact part is made of a soft material such as sponge, which generates a certain amount of compression upon contact with the crystal ingot, providing pressure without damaging it. A six-axis robotic arm grips the crystal ingot and completes the wiping along a specific path. An alcohol spray mechanism is installed before the wiping point to spray alcohol onto the crystal ingot. After wiping, an air knife dries the ingot. Simultaneously, the contact between the contact part and the crystal ingot surface, combined with the rotation of the drive roller, ensures complete coverage of the crystal ingot surface by the lint-free paper, thus ensuring consistent wiping results.

[0044] In this embodiment, the first centering mechanism uses two sets of symmetrical stop bars (with rubber-coated rollers installed on the stop bars to avoid damaging the silicon rod) to move synchronously inward and outward, bringing the transported crystal rod close to the center position of the conveying structure. The symmetrical stop bars are installed on linear guide rails and slide on the linear guide rails. A set of racks is installed on each side, and the two racks are connected by a driven gear in the middle. When one stop bar moves, the other stop bar will move in the opposite direction through gear transmission.

[0045] Specifically, the incoming material is a whole tray of crystal rods. With the assistance of a crane, the crystal rods are placed sequentially on the first conveying structure 11 or the second conveying structure 12. The first conveying structure 11 or the second conveying structure 12 is used to transport the crystal rods to the crystal rod gripping position. A first centering mechanism is set at the crystal rod gripping position to center and position the crystal rods. Then, the crystal rods are gripped onto the splicing device by a gantry robot. The splicing device performs precise positioning of crystal rods of different lengths, which can realize the splicing of 2 to 3 short rods. Finally, the crystal rods are gripped to the gluing position by the robot.

[0046] like Figure 3As shown, the resin board feeding device 20 includes a resin board feeding mechanism 21, a flatness detection mechanism 22, a gantry robotic arm 23, an NG table 24, a fourth conveying structure 25, a cleaning mechanism 26, and a second centering mechanism 27. The flatness detection mechanism 22 includes a detection platform and multiple distance sensors mounted on the platform. The gantry robotic arm 23 transfers the resin boards stored in the resin board feeding mechanism 21 to the detection platform. Each distance sensor detects its distance from the resin board, and the flatness of the resin board is determined based on the detection values ​​of all distance sensors to determine whether the flatness of the resin board is within a preset range. When the flatness of the resin board exceeds the preset range, the resin board is transferred to the NG table 24 via the gantry robotic arm 23. When the flatness of the resin board is within the preset range, the resin board is transferred to the fourth conveying structure 25 via the gantry robotic arm 23. The cleaning mechanism 26 is used to clean the surface of the resin board. The second centering mechanism 27 includes two opposing centering structures, each including a centering protrusion that is movably disposed to contact the resin board and thereby limit and stop the resin board. This arrangement simplifies the structure of the resin board loading device 20, making it easier to manufacture and reducing the processing cost and difficulty of the bonding production line.

[0047] In this embodiment, the flatness detection mechanism 22 utilizes multiple distance sensors on the detection platform to accurately detect the flatness of the resin board, ensuring it is within a preset range. This effectively filters out resin boards that do not meet flatness requirements, preventing them from entering the subsequent bonding process, thereby improving the flatness quality and bonding effect of the finished product. The gantry robotic arm 23 is responsible for picking up the resin board from the resin board feeding mechanism 21 and automatically transferring it to the detection platform, NG station 24, or fourth conveying structure 25, realizing the automation of resin board processing, reducing manual operation, and improving feeding speed and production efficiency. The cleaning mechanism 26 ensures the cleanliness of the resin board surface before bonding, effectively avoiding problems such as weak bonding and bubbles caused by surface impurities, thus improving the reliability and aesthetics of the finished product. The centering structure of the second centering mechanism 27, through its movable centering protrusion, can accurately contact the resin board and limit and stop it, ensuring the precise position of the resin board in the subsequent bonding process, improving bonding accuracy and product consistency. By using flatness detection and the NG station 24, defective resin boards can be identified and removed promptly, avoiding waste in subsequent processes, reducing the defect rate, and contributing to cost control and quality management. The use of the fourth conveying structure 25 enables a continuous automated process for resin boards from feeding, inspection, cleaning to bonding, standardizing and streamlining the entire production process and improving the stability and efficiency of the production line. Thus, the resin board loading device 20 achieves efficient space utilization and a compact production line design through the rational layout of its various mechanisms and structures. Furthermore, the flatness detection mechanism 22 removes materials with unacceptable flatness, reducing the risk of empty glue rate and poor bonding. Clamping and positioning the resin boards after bonding and before pressing, and clamping and positioning the crystal rods after bonding and before pressing, improves positioning accuracy and also reduces the risk of poor bonding.

[0048] Specifically, firstly, the resin boards are manually unpacked and stacked according to specifications on the resin board feeding mechanism 21 (storage trolley). Each resin board feeding mechanism 21 has 3 compartments, which can store resin boards of different specifications. The operator delivers the stacked resin board feeding mechanism 21 to the designated position, clicks the start button, and the positioning and clamping mechanism automatically pulls the resin board feeding mechanism 21 closer and locks it. The operator inputs the resin board specifications for each compartment, and the gantry robot retrieves the material from the corresponding compartment according to the current production model. After retrieval, the material is placed on the flatness detection mechanism 22. The flatness detection mechanism 22 pushes the resin board to the reference surface through a linear motion mechanism. Data from 9 distance sensors (laser rangefinders) in the flatness detection mechanism 22 is used to fit an approximate plane, measuring whether the maximum and minimum points exceed the specified deviation. If they do, the gantry robot arm 23 grabs the material. The resin board is taken to the NG table 24. If it passes inspection, it is picked up and placed onto the fourth conveyor structure 25. The fourth conveyor structure 25 uses a linear motion mechanism to push the resin board past the cleaning mechanism 26. The cleaning mechanism 26 consists of a brush, air knife, vacuum cleaner, and protective cover. After being cleaned by the brush, the air knife blows away the dust, and then an industrial vacuum cleaner removes the dust, achieving a dust removal and cleaning effect. The fourth conveyor structure 25 then transports the resin board to the gripping position. The gripping position has a second centering mechanism 27 that centers the resin board, and a lifting and pushing mechanism at the rear pushes the resin board from the rear to the end reference surface. At this point, the resin board is fully positioned and gripped by a robotic arm to the designated position. Simultaneously, the second centering mechanism 27 is equipped with a pull rope length sensor, which can accurately measure the stroke of the second centering mechanism 27 to calculate the width of the resin board for distinguishing different specifications.

[0049] like Figure 6 As shown, the crystal tray loading device 30 includes a fifth conveying structure 31, a positioning component 32, and a first robotic arm 33. The fifth conveying structure 31 is used to convey the crystal tray and has a positioning station. The positioning component 32 includes a second driving device and a positioning pin driven by the second driving device. The second driving device drives the positioning pin to extend into the positioning hole of the crystal tray for a limiting engagement with the positioning hole. The first robotic arm 33 is used to transfer the crystal tray, after being positioned by the positioning component 32, to the supporting structure 50. Thus, the crystal tray loading device 30 includes the fifth conveying structure 31, the positioning component 32, and the first robotic arm 33. The use of the fifth conveying structure 31 achieves automated crystal tray conveying, reduces manual handling, and improves loading speed and continuity. Meanwhile, the precise fit between the positioning pin in the positioning component 32 and the positioning hole of the crystal tray enables high-precision positioning of the crystal tray. The extension and retraction of the positioning pin is driven by the second driving device to ensure that the position of the crystal tray is stable and accurate before it is grasped by the first robotic arm 33, thus avoiding displacement of the crystal tray during the bonding process and improving the stability and yield of the bonding.

[0050] In this embodiment, the first robotic arm 33 is responsible for automatically transferring the positioned crystal tray to the support structure 50, replacing the traditional manual handling. This not only improves production efficiency but also significantly reduces the labor intensity and risks for operators, and enhances workplace safety.

[0051] like Figure 5 As shown, the bonding production line also includes an outbound device 60 located downstream of the bonding unit 40. The outbound device 60 includes a second robotic arm 61, a sixth conveyor structure 62, and a stacker crane. The second robotic arm 61 is used to transfer finished products onto the sixth conveyor structure 62. The stacker crane is used to stack the finished products buffered on the sixth conveyor structure 62 to designated locations. Thus, the second robotic arm 61 is responsible for picking up finished products from the output end of the bonding unit 40 and automatically placing them onto the sixth conveyor structure 62. This process avoids manual handling of finished products, improving handling efficiency and safety. The stacker crane further automatically stacks the finished products from the sixth conveyor structure 62 to designated locations, achieving a high degree of automation in finished product processing, reducing manual intervention at the end of the production line, and increasing the speed of finished product processing.

[0052] Specifically, the use of the sixth conveyor structure 62 ensures stable transportation of finished products within the transition area from the bonding device 40 to the palletizer. Precise path and speed control prevent collisions and damage during handling, guaranteeing the integrity of the finished products. The layout design of the outbound device 60, especially the integration of the sixth conveyor structure 62 with the stacker crane, optimizes the path of finished products from the bonding device to the final palletizing, reduces the floor space occupied at the end of the production line, and improves the utilization rate of production space.

[0053] In this embodiment, there are two lifting and clamping mechanisms 44, which are arranged at intervals along the conveying direction of the third conveying structure 41. The first lifting and clamping mechanism is located between the resin plate adhesive position and the crystal rod adhesive position, and the second lifting and clamping mechanism is located downstream of the crystal rod adhesive position. There are two clamping structures 43, with the first clamping structure 43 located at the resin plate adhesive position and the second clamping structure 43 located at the crystal rod adhesive position.

[0054] like Figure 4As shown, the third conveying structure 41 includes a first sub-conveyor structure 411, two second sub-conveyor structures 412, four third sub-conveyor structures 413, two fourth sub-conveyor structures 414, four fifth sub-conveyor structures 415, and a sixth sub-conveyor structure 416. The input end of each second sub-conveyor structure 412 is connected to the first sub-conveyor structure 411. The four third sub-conveyor structures 413 are correspondingly configured with the first lifting and clamping mechanism, and the output end of each second sub-conveyor structure 412 is connected to the input end of one of the two third sub-conveyor structures 413. The output ends of the two third sub-conveyor structures 413 are connected to the input end of one fourth sub-conveyor structure 414. The four fifth sub-conveyor structures 415 are correspondingly configured with the second lifting and clamping mechanism, and the output end of each fourth sub-conveyor structure 414 is connected to the input end of one of the two fifth sub-conveyor structures 415. The output ends of all fifth sub-conveyor structures 415 are connected to the sixth sub-conveyor structure 416. This multi-stage sub-conveyor structure design allows for phased and segmented material processing, ensuring rapid and accurate material transfer between each critical process. This design reduces the load on individual conveyor lines, increases the speed and efficiency of material flow, thereby shortening the overall production cycle and improving production efficiency.

[0055] Specifically, by subdividing the conveying structure into multiple substructures and rationally arranging them in space, the limited space of the production line can be effectively utilized, reducing the equipment's footprint. The docking of the first sub-conveying structure 411 with the two second sub-conveying structures 412, as well as the connections between subsequent substructures, forms a compact and orderly material flow path, helping to maximize the utilization of production space. Thus, the multi-level substructure design of the third conveying structure 41 allows the equipment to flexibly adjust the material flow path according to different production needs and process flows.

[0056] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0057] The bonding production line includes a crystal ingot feeding device, a resin plate feeding device, a crystal tray feeding device, and a bonding device. The crystal ingot feeding device includes a first conveying structure, a second conveying structure, and a splicing device. The first conveying structure is used to convey crystal ingots with a length greater than or equal to a preset length, the second conveying structure is used to convey crystal ingots with a length less than the preset length, and the splicing device is used to splice at least two crystal ingots located on the second conveying structure. The bonding device includes a third conveying structure and a glue applicator. The third conveying structure has a crystal tray feeding position, a resin plate bonding position, and a crystal ingot bonding position arranged sequentially along its conveying direction. The crystal tray feeding position is correspondingly set to the discharge port of the crystal tray feeding device. In this way, the crystal ingot feeding device processes crystal ingots with a length greater than or equal to the preset length and crystal ingots with a length less than the preset length through the first and second conveying structures, respectively, so that the bonding production line can adapt to crystal ingots of different lengths. The splicing device enables the splicing of short ingots, improving the flexibility and production efficiency of the equipment. When bonding crystal trays, resin plates, and crystal rods is required, the third conveying structure transports the crystal trays from the crystal tray loading position to the resin plate bonding position. Adhesive is applied to the crystal trays using a glue applicator. The glued crystal trays then bond with the resin plate at the resin plate bonding position to form an intermediate product. When the third conveying structure transports the intermediate product from the resin plate bonding position to the crystal rod bonding position, adhesive is applied to the intermediate product using a glue applicator, and a lifting and clamping mechanism presses the glued intermediate product to improve bonding quality and reduce empty glue rate. The glued intermediate product then bonds with the crystal rods transported via the first or second conveying structure at the crystal rod bonding position. The lifting and clamping mechanism presses the intermediate product and crystal rods together to form the finished product. This solves the problem of poor adhesion between crystal trays, resin plates, and crystal rods in the prior art, which affects product quality, and improves the bonding strength of the three components. Meanwhile, in the bonding device, the setting of the crystal tray loading position, resin plate adhesive position, and crystal rod adhesive position in the third conveying structure ensures the accuracy of the bonding process, facilitates precise glue application by the glue applicator, and ensures the accuracy of the bonding process by bonding the crystal tray to the resin plate adhesive position after glue application, as well as bonding the intermediate product to the crystal rod at the crystal rod adhesive position, thereby reducing the risk of void glue rate and poor bonding.

[0058] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0059] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0060] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0061] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A bonding line, characterized in that The application relates to a production line for bonding crystal rods, which comprises the following components: a crystal rod loading device (10) comprising a first conveying structure (11) for conveying crystal rods with a length greater than or equal to a preset length, a second conveying structure (12) for conveying crystal rods with a length less than the preset length, and a crystal rod splicing device (13) for splicing at least two crystal rods located on the second conveying structure (12); a resin plate loading device (20); a crystal holder loading device (30); a bonding device (40) comprising a third conveying structure (41) having a crystal holder loading position, a resin plate gluing position and a crystal rod gluing position arranged in sequence along the conveying direction of the third conveying structure (41), and a glue spraying machine (42) and a jacking clamping mechanism (44), wherein the crystal holder loading position is arranged in correspondence with the discharge port of the crystal holder loading device (30); wherein when the third conveying structure (41) conveys the crystal holder from the crystal holder loading position to the resin plate gluing position, the crystal holder is sprayed with glue by the glue spraying machine (42), the crystal holder after being sprayed with glue is bonded with a resin plate at the resin plate gluing position to form an intermediate product; when the third conveying structure (41) conveys the intermediate product from the resin plate gluing position to the crystal rod gluing position, the intermediate product is sprayed with glue by the glue spraying machine (42) and is pressed by the jacking clamping mechanism (44), the intermediate product after being sprayed with glue is bonded with a crystal rod conveyed by the first conveying structure (11) or the second conveying structure (12) at the crystal rod gluing position and is pressed by the jacking clamping mechanism (44) to form a finished product.

2. The bonding line according to claim 1, characterized in that The bonding production line further comprises: a plurality of bearing structures (50) arranged at intervals along the conveying direction of the third conveying structure (41) and moving synchronously with the third conveying structure (41), wherein the plurality of bearing structures (50) are arranged in one-to-one correspondence with a plurality of crystal holders, and each bearing structure (50) bears the crystal holder corresponding thereto and bonds the crystal holder with the resin plate and the crystal rod; a plurality of matching assemblies arranged in one-to-one correspondence with the plurality of bearing structures (50), wherein each bearing structure (50) is limited and matched with a crystal holder by the matching assembly corresponding thereto.

3. The bonding line according to claim 1, characterized in that The bonding device (40) further comprises: a clamping structure (43) having a clamping space with an adjustable size, which clamps the resin plate during the process that the resin plate is placed on the crystal holder sprayed with glue and moves synchronously with the third conveying structure (41), and clamps the crystal rod during the process that the crystal rod is placed on the resin plate sprayed with glue and moves synchronously with the third conveying structure (41); The jacking and clamping mechanism (44) comprises a jacking part and a pressing part, the jacking part is used for jacking the intermediate product or the finished product to separate from the third conveying structure (41), and the pressing part is used for applying a downward pressing force to the intermediate product or the finished product.

4. The bonding line according to claim 3, characterized in that The adhesive production line further comprises a control module electrically connected with the pressing part, and the adhesive device (40) further comprises: a timing module electrically connected with the control module, the timing module is used for timing the pressing time of the pressing part; when the timing value of the timing module reaches a preset time value, the pressing part is controlled to stop running by the control module; and / or a pressure detection device electrically connected with the control module, the pressure detection device is used for detecting the pressing force between the pressing part and the intermediate product or the finished product; when the pressure detection value of the pressure detection device reaches a preset pressure value, the pressing part is controlled to stop running by the control module.

5. The bonding line according to claim 1, characterized in that The crystal bar loading device (10) further comprises: a crystal bar wiping mechanism (14) comprising a first driving device, a driving roller, a driven roller and an abutting part, the first driving device is drivingly connected with the driving roller to drive the driving roller to rotate; during the rotation of the driving roller, the abutting part abuts against the crystal bar to enable the dust-free paper wound on the driving roller and the driven roller to wipe the surface of the crystal bar; a first centering mechanism comprising two oppositely arranged blocking rods, a crystal bar centering space is formed between the two blocking rods, and the two blocking rods move towards or away from each other to adjust the size of the crystal bar centering space; each blocking rod is used for limiting and stopping the crystal bar.

6. The bonding line according to claim 1, characterized in that The resin plate loading device (20) comprises: a resin plate feeding mechanism (21); a flatness detection mechanism (22) comprising a detection platform and a plurality of distance sensors arranged on the detection platform; a truss mechanical arm (23) for transferring the resin plate stored in the resin plate feeding mechanism (21) to the detection platform, each distance sensor is used for detecting the distance between itself and the resin plate to determine whether the flatness of the resin plate is within a preset range according to the detection values of all the distance sensors; an NG table (24) for transferring the resin plate whose flatness exceeds the preset range to the NG table (24) by the truss mechanical arm (23); a fourth conveying structure (25) for transferring the resin plate whose flatness is within the preset range to the fourth conveying structure (25) by the truss mechanical arm (23); a cleaning mechanism (26) for cleaning the surface of the resin plate; a second centering mechanism (27) comprising two oppositely arranged centering structures, each centering structure comprises a centering convex part movably arranged for contacting the resin plate to limit and stop the resin plate.

7. The bonding production line according to claim 2, characterized in that, The crystal holder loading device (30) comprises: A fifth conveying structure (31) for conveying the wafer boat, the fifth conveying structure (31) having a positioning station; A positioning assembly (32) including a second driving device and a positioning pin in driving connection with the second driving device, the second driving device driving the positioning pin to extend into a positioning hole of the wafer boat to limit the positioning hole; A first mechanical arm (33) for transferring the wafer boat after positioning by the positioning assembly (32) to the carrying structure (50).

8. The bonding line according to claim 1, characterized in that The bonding production line further includes an outlet device (60) located downstream of the bonding device (40), the outlet device (60) including: A second mechanical arm (61); A sixth conveying structure (62), the second mechanical arm (61) being used for transferring the finished product to the sixth conveying structure (62); A stacker for stacking the finished product buffered on the sixth conveying structure (62) to a designated position.

9. The bonding line according to claim 3, characterized in that The two lifting clamping mechanisms (44) are arranged at intervals along the conveying direction of the third conveying structure (41), the first lifting clamping mechanism (44) is located between the resin plate bonding position and the crystal bar bonding position, and the second lifting clamping mechanism (44) is located downstream of the crystal bar bonding position; the two clamping structures (43) are located at the resin plate bonding position and the crystal bar bonding position, respectively.

10. The bonding line according to claim 9, characterized in that The third conveying structure (41) includes: A first sub-conveying structure (411); Two second sub-conveying structures (412), the input end of each second sub-conveying structure (412) being in abutment with the first sub-conveying structure (411); Four third sub-conveying structures (413) corresponding to the first lifting clamping mechanism, the output end of each second sub-conveying structure (412) being in abutment with the input end of two third sub-conveying structures (413); Two fourth sub-conveying structures (414), the output end of each third sub-conveying structure (413) being in abutment with the input end of one fourth sub-conveying structure (414); Four fifth sub-conveying structures (415) corresponding to the second lifting clamping mechanism, the output end of each fourth sub-conveying structure (414) being in abutment with the input end of two fifth sub-conveying structures (415); A sixth sub-conveying structure (416), the output end of each fifth sub-conveying structure (415) being in abutment with the sixth sub-conveying structure (416).

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