Terahertz micro-convex packaging equipment
By using an electric push rod and a symmetrically distributed discharge tube design, the problem of uneven stress on the packaging medium in terahertz micro-convex packaging equipment is solved, achieving uniform stress on components and improved packaging efficiency.
Patent Information
- Application Number
- CN202520467024.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-03-18
AI Technical Summary
Existing terahertz micro-convex packaging equipment, when used manually or through single-channel injection molding of the packaging medium, is prone to uneven stress on the components at the initial stage, resulting in poor packaging effect.
The design employs an electric push rod and symmetrically distributed discharge tubes. The electric push rod drives the slide rod and movable tube to inject the encapsulation medium from both sides, ensuring uniform force on the component. The cooperation of the movable block and connecting frame enables rapid encapsulation of the cover plate and the main body of the component.
This achieves uniform force distribution on components, avoids tilting during the packaging process, and improves packaging efficiency and effectiveness.
Smart Images

Figure CN223849776U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to terahertz micro convex packaging technical field especially relates to a terahertz micro convex packaging equipment. BACKGROUND
[0002] With the development of science and technology, terahertz is one of wave frequency units, also called terahertz, or terahertz, equal to 1,000,000,000,000Hz, usually used to express electromagnetic wave frequency, and terahertz is a new kind of radiation source with many unique advantages, and terahertz technology is a very important cross frontier field, and needs to be packaged by packaging equipment terahertz micro convex parts.
[0003] The existing terahertz micro convex packaging equipment, in the using process, often through manual operation or single pipeline injection packaging medium, so that the packaging medium no matter from which side injection, all easy to cause the stress uneven of part initial time, cause the phenomenon of poor packaging effect. UTILITY MODEL CONTENT
[0004] The utility model discloses a terahertz micro convex packaging equipment, which solves the problem of uneven stress of parts at the initial time caused by manual operation or single pipeline injection of packaging medium in the using process of the existing terahertz micro convex packaging equipment, and improves the packaging effect.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A terahertz micro convex packaging equipment, comprising:
[0007] The inner side top end of the main body is connected with an electric push rod, the output end outer wall of the electric push rod is connected with a sliding rod, the output end outer wall of the electric push rod is installed with a connecting frame, the output end bottom of the electric push rod is connected with a push plate, the end of the sliding rod is slidingly connected with a movable pipe, the outer wall of the movable pipe is installed with a convex block, the convex block and the sliding rod are slidingly arranged, the inner side of the movable pipe is installed with a discharge pipe, the front upper side of the main body is inserted with a second movable frame, the front lower side of the main body is inserted with a first movable frame, the inner side of the second movable frame is provided with a through groove, the outer wall of the second movable frame is penetratingly provided with a movable block, the surface of the movable block is provided with a reserved hole, the outer wall of the movable block is connected with a sliding block, the sliding block and the second movable frame are slidingly arranged, one end of the sliding block extending into the second movable frame is connected with an elastic piece, the other end of the elastic piece is connected with the second movable frame, and the surface of the second movable frame is provided with a reserved groove on both sides.
[0008] Preferably, the top of the main body is slidingly arranged between the movable pipe, and the movable pipe is symmetrical about the central axis of the main body.
[0009] Preferably, the connecting frame and the main body form a lifting structure through the electric push rod.
[0010] Preferably, the protruding block is integrated with the movable pipe through welding.
[0011] Preferably, the movable block is provided in three groups, and the movable block and the second movable frame form a sliding structure through the sliding block.
[0012] Preferably, the inner diameter of the reserved hole is greater than the bottom width of the connecting frame.
[0013] As described above, due to the adoption of the above technical scheme, the beneficial effects of the present application are:
[0014] 1、In the present application, through the setting of the movable pipe, the discharge pipe and the sliding rod, the symmetrically distributed discharge pipe can inject the encapsulating medium into the component from both sides, so that the component is evenly stressed and is not easy to produce inclination phenomenon, and the distance between the cover plate to be installed on the top of the component and the main body of the component is short, which facilitates the rapid completion of the encapsulation work. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is a schematic view of the partial structure inside the main body in the present application;
[0016] Figure 2 is a schematic view of the front structure of the main body in the present application;
[0017] Figure 3 is a schematic view of the overhead structure of the second movable frame in the present application;
[0018] Figure 4 is a schematic view of the enlarged structure at A in the present application.
[0019] LEGEND:
[0020] 1, main body;2, electric push rod;3, sliding rod;4, push plate;5, connecting frame;6, movable pipe;7, protruding block;8, discharge pipe;9, first movable frame;10, second movable frame;11, through slot;12, movable block;13, reserved hole;14, reserved slot;15, sliding block. DETAILED DESCRIPTION
[0021] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.
[0022] With reference to Figures 1-4 A terahertz micro convex packaging device, including main body 1, the inner side top of main body 1 is connected with electric push rod 2, and the output end outer wall of electric push rod 2 is connected with slide bar 3, the output end outer wall of electric push rod 2 is installed with connecting frame 5, and the output end bottom of electric push rod 2 is connected with push plate 4, the end of slide bar 3 is slidingly connected with movable tube 6, and the outer wall of movable tube 6 is installed with convex block 7, convex block 7 is slidingly arranged between slide bar 3, convex block 7 is integrated with movable tube 6 by welding, slide bar 3 slides along the outer wall of movable tube 6 and moves to convex block 7, so that movable tube 6 moves to both sides, then discharge pipe 8 leaves the injection area, which facilitates the packaging work between terahertz micro convex parts, the inner side of movable tube 6 is installed with discharge pipe 8, the front upper side of main body 1 is inserted with second movable frame 10, and the front lower side of main body 1 is inserted with first movable frame 9, the inner side of second movable frame 10 is provided with through slot 11, and the outer wall of second movable frame 10 is penetrated by movable block 12, movable block 12 is provided with three groups, and movable block 12 forms a sliding structure with second movable frame 10 by sliding block 15, movable block 12 extends into through slot 11, which mainly supports the top cover arranged in through slot 11, the surface of movable block 12 is provided with reserved hole 13, and the outer wall of movable block 12 is connected with sliding block 15, sliding block 15 and second movable frame 10 are slidingly arranged, and one end of sliding block 15 extending into second movable frame 10 is connected with elastic element, the other end of elastic element is connected with second movable frame 10, and the surface of second movable frame 10 is provided with reserved slot 14 on both sides, the top of main body 1 and movable tube 6 are slidingly arranged, and movable tube 6 is symmetrical about the central axis of main body 1, movable tube 6 can move relatively with main body 1 after being pushed by external force;
[0023] The connecting frame 5 forms a lifting structure with the main body 1 through the electric push rod 2, the electric push rod 2 is started, the connecting frame 5 is pushed to move downwards and is inserted into the reserved hole 13, and the outer wall of the connecting frame 5 is arranged in an inclined manner, so that the movable block 12 can be pushed to move, the movable block 12 is moved out of the through groove 11, the top cover of the terahertz micro convex can move downwards, and the components are encapsulated.
[0024] Working principle: in use, firstly, the main part and the top cover part of the terahertz micro convex are arranged at the first movable frame 9 and the second movable frame 10 respectively, then the movable frame is inserted into the main body 1, the discharge pipe 8 can inject the encapsulating medium, the encapsulating medium enters the main part of the terahertz micro convex, then the electric push rod 2 is started, the slide rod 3 is driven to move downwards, the slide rod 3 slides along the outer wall of the movable pipe 6 and moves to the convex block 7, the movable pipe 6 moves to the two sides, the discharge pipe 8 arranged in the movable pipe 6 moves away from the injection area, at this time, the connecting frame 5 moves downwards synchronously and is inserted into the reserved hole 13, and the outer wall of the connecting frame 5 is arranged in an inclined manner, so that the movable block 12 can be pushed to move, the movable block 12 is moved out of the through groove 11, the top cover of the terahertz micro convex can move downwards, and the components are encapsulated under the pushing and pressing of the pushing plate 4.
[0025] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A terahertz micro convex packaging device, comprising: A main body (1), characterized in that: the inner side top end of the main body (1) is connected with an electric push rod (2), and the output end outer wall of the electric push rod (2) is connected with a sliding rod (3); the output end outer wall of the electric push rod (2) is installed with a connecting frame (5), and the output end bottom of the electric push rod (2) is connected with a push plate (4); the tail end of the sliding rod (3) is slidingly connected with a movable pipe (6), and the outer wall of the movable pipe (6) is installed with a convex block (7); the convex block (7) and the sliding rod (3) are slidingly arranged; the inner side of the movable pipe (6) is installed with a discharge pipe (8); the front upper side of the main body (1) is inserted with a second movable frame (10), and the front lower side of the main body (1) is inserted with a first movable frame (9); the inner side of the second movable frame (10) is provided with a through slot (11), and the outer wall of the second movable frame (10) penetrates an activity block (12); the surface of the activity block (12) is provided with a reserved hole (13), and the outer wall of the activity block (12) is connected with a sliding block (15); the sliding block (15) and the second movable frame (10) are slidingly arranged, and one end of the sliding block (15) extending into the second movable frame (10) is connected with an elastic member; the other end of the elastic member is connected with the second movable frame (10), and the surface of the second movable frame (10) is provided with a reserved slot (14) on both sides.
2. The terahertz micro-protrusion packaging device according to claim 1, wherein: The top of the main body (1) and the movable pipe (6) are slidingly arranged, and the movable pipe (6) is symmetric about the central axis of the main body (1).
3. The terahertz micro-protrusion packaging device according to claim 1, wherein: The connecting frame (5) and the main body (1) constitute a lifting structure through the electric push rod (2).
4. The terahertz micro-protrusion packaging device according to claim 1, wherein: The convex block (7) and the movable pipe (6) constitute an integrated structure through welding.
5. The terahertz micro-protrusion packaging device according to claim 1, wherein: The activity block (12) is provided with three groups, and the activity block (12) and the second movable frame (10) constitute a sliding structure through the sliding block (15).
6. The terahertz micro-lens package device according to claim 1, wherein: The inner diameter of the reserved hole (13) is greater than the bottom width of the connecting frame (5).