Air inlet device and semiconductor equipment

Abstract

The utility model discloses a gas inlet device and a semiconductor device, the gas inlet device comprises a gas inlet member and a gas uniformizing member, the gas inlet member is provided with at least two gas inlet channels, the gas inlet member and the gas uniformizing member are laminated, the gas uniformizing member is provided with gas uniformizing cavities communicated with the gas inlet channels, and the gas uniformizing cavities are communicated with the gas inlet channels. And a plurality of air uniformizing holes communicated with the air uniformizing cavities are formed in the bottoms of the air uniformizing cavities. According to the gas inlet device disclosed by the utility model, at least two process gases can be conveyed in an isolated manner, so that different process gases are prevented from chemical reaction due to mixing in the gas inlet device, and particles generated in the gas inlet device can be reduced; due to the arrangement of the uniform gas holes, the reverse flow resistance of the gas is increased, the possibility of reverse flow of different process gases is reduced, and the uniformity of a coating film can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment more particularly, relate to a kind of air intake device and semiconductor equipment. BACKGROUND

[0002] The air intake device for the atomic layer deposition (ALD) process of semiconductor equipment, as shown in the figure, includes a first gas passage 101, a second gas passage 102 and a mixing chamber 103. Different precursors enter the mixing chamber 103 through the corresponding gas passages alternately, and then enter the process chamber through the spray plate 104. In this process, different gases cannot meet before entering the reaction area, so a multi-layer structure and a layer plate inner channel are used to form mutually isolated gas passages, and dense gas guide columns and other parts are welded between the layer plates, which can cause uneven gas flow. At the same time, when the precursor with large gas flow and pressure enters the mixing chamber 103, it can cause backflow of another precursor, which can also cause uneven mixing of gases. Figure 1

[0003] Therefore, how to reduce the occurrence of backflow and improve the uniformity of coating has become a technical problem to be solved by those skilled in the art. SUMMARY

[0004] Therefore, the utility model discloses an air intake device to reduce the occurrence of backflow and improve the uniformity of coating.

[0005] Another core of the utility model is to disclose a semiconductor equipment comprising the above-mentioned air intake device.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] An air intake device comprises:

[0008] An air intake member is provided with at least two air intake passages.

[0009] An air uniformizing member is arranged in layers with the air intake member, and is provided with air uniformizing cavities in communication with the air intake passages. The bottom of each air uniformizing cavity is provided with a plurality of air uniformizing holes in communication with the air uniformizing cavity.

[0010] Optionally, in the above-mentioned air intake device, the diameter of the air uniformizing hole is smaller than that of the corresponding air intake passage.

[0011] Optionally, in the above-mentioned air intake device, the diameter of the air uniformizing hole is constant or tapered along the flow direction of the gas.

[0012] ​Optionally, in the above-mentioned air inlet device, the air inlet channel comprises at least one inclined section channel and at least one vertical section channel, and the inclined directions of the inclined section channels are the same or different.

[0013] Optionally, in the above-mentioned air inlet device, the air uniformizing member comprises a fixed plate and an air uniformizing part arranged on the fixed plate, and the air uniformizing cavity is arranged on the air uniformizing part.

[0014] Optionally, in the above-mentioned air inlet device, the bottom of the air uniformizing part is in the shape of a circular truncated cone, a hemisphere, a truncated prism, a plane or a cone.

[0015] Optionally, in the above-mentioned air inlet device, the air inlet member and the air uniformizing member are detachably connected.

[0016] Optionally, in the above-mentioned air inlet device, the air inlet member is sealingly connected to the air uniformizing member through a sealing ring, and the air uniformizing member is provided with a sealing groove capable of mounting the sealing ring.

[0017] Optionally, in the above-mentioned air inlet device, the air inlet member is in an integrated structure; or,

[0018] The air inlet member comprises a plurality of air inlet blocks, and each air inlet block is detachably connected or non-detachably connected.

[0019] A semiconductor device comprising the above-mentioned air inlet device.

[0020] As can be seen from the above solutions, the air inlet device disclosed in the embodiments of the present application can make different process gases flow into the air uniformizing cavity along respective air inlet channels and then flow out through the air uniformizing holes, so that at least two kinds of process gases can be isolated and delivered, chemical reactions of the two different process gases caused by backflow in the air inlet device can be prevented, and particles generated in the air inlet device during the atomic layer deposition process can be reduced; the air uniformizing holes increase the resistance of the reverse flow of the gases and reduce the possibility of backflow of the different process gases, so that the uniformity of the film coating can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0022] Figure 1 FIG. 1 is a structural schematic view of a prior art air inlet device;

[0023] Figure 2The overall structure schematic diagram of the air inlet device is disclosed for the utility model embodiment.

[0024] Figure 3 The bottom view of the air inlet device is disclosed for the utility model embodiment.

[0025] Figure 4 The front view of the air inlet device is disclosed for the utility model embodiment.

[0026] Figure 5 The sectional view of the air inlet device is disclosed for the utility model embodiment.

[0027] Figure 6 The overall structure schematic diagram of the air uniforming member is disclosed for the utility model embodiment.

[0028] Figure 7 The front view of the air uniforming member is disclosed for the utility model embodiment Figure 1 .

[0029] Figure 8 The front view of the air uniforming member is disclosed for the utility model embodiment Figure 2 .

[0030] Figure 9 The front view of the air uniforming member is disclosed for the utility model embodiment Figure 3 .

[0031] Figure 10 The front view of the air uniforming member is disclosed for the utility model embodiment Figure 4 .

[0032] Figure 11 The front view is disclosed for Figure 10 .

[0033] Wherein, 10 is air inlet member, 11 is air inlet channel, 111 is first air inlet channel, 112 is second air inlet channel;

[0034] 20 is air uniforming member, 201 is fixed plate, 202 is air uniforming part, 21 is air uniforming cavity, 211 is first air uniforming cavity, 212 is second air uniforming cavity, 22 is air uniforming hole, 221 is first air uniforming hole, 222 is second air uniforming hole, 23 is sealing groove;

[0035] 101 is reaction gas inlet, 102 is precursor inlet, 103 is air mixing cavity, 104 is spray plate. DETAILED DESCRIPTION

[0036] The core of the utility model lies in disclosing an air inlet device to reduce the occurrence of reflux phenomenon and improve the uniformity of coating.

[0037] Another core of the utility model lies in disclosing a semiconductor equipment comprising the above air inlet device.

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0039] As shown in the drawings, Figures 2-5 The utility model discloses an air inlet device, including air inlet piece 10 and uniform gas piece 20.

[0040] Among them, at least two air inlet channels 11 are arranged on the air inlet piece 10, the air inlet piece 10 is stacked with the uniform gas piece 20, the uniform gas piece 20 is provided with uniform gas cavities 21 communicated with each air inlet channel 11, and the bottom of each uniform gas cavity 21 is provided with a plurality of uniform gas holes 22 communicated with the uniform gas cavity 21, one end of the uniform gas hole 22 is communicated with the uniform gas cavity 21, and the other end is communicated with a spray plate.

[0041] Different process gases enter the air inlet piece 10 through the corresponding air inlet channels 11, then enter the respective uniform gas cavities 21, and then are discharged through the corresponding uniform gas holes 22, and are sprayed out through the spray plate and then enter the process chamber. It should be noted that the channel size of each air inlet channel 11 can be determined according to actual needs.

[0042] The air inlet device disclosed in the embodiments of the present application is provided with the uniform gas cavities 21 and the uniform gas holes 22, so that different process gases can flow into the uniform gas cavities 21 along the respective air inlet channels 11, and then flow out through the uniform gas holes 22. At least two kinds of process gases can be isolated and delivered, so as to prevent the two different process gases from reacting due to backflow in the air inlet device, reduce the generation of particles in the air inlet device during the atomic layer deposition process, increase the resistance of gas backflow, reduce the possibility of backflow of different process gases, and improve the uniformity of the coating.

[0043] Figure 2 And Figure 5With two of the gas inlets 11 as an example, specifically, the gas inlets 11 include a first gas inlet 111 and a second gas inlet 112, the uniform gas cavities 21 include a first uniform gas cavity 211 and a second uniform gas cavity 212, the first uniform gas cavity 211 communicates with the first gas inlet 111, the second uniform gas cavity 212 communicates with the second gas inlet 112, the uniform gas holes 22 include a first uniform gas hole 221 and a second uniform gas hole 222, each of the first uniform gas holes 221 and the second uniform gas holes 222 includes a plurality of holes, and each of the first uniform gas holes 221 respectively communicates with the first uniform gas cavity 211, and each of the second uniform gas holes 222 respectively communicates with the second uniform gas cavity 212. The first gas inlet 111 is used for inputting a first process gas, and the second gas inlet 112 is used for inputting a second process gas. It should be noted that the number of the gas inlets 11 is only an example, and more gas inlets 11 can be provided in actual application.

[0044] In actual work, the first process gas flows through the first gas inlet 111 into the first uniform gas cavity 211, and then is discharged through the first uniform gas hole 221, the second process gas flows through the second gas inlet 112 into the second uniform gas cavity 212, and then is discharged through the second uniform gas hole 222, and then enters the process chamber after being sprayed by the spray plate. The first process gas and the second process gas can be isolated in the gas inlet device.

[0045] Further, in order to further reduce the possibility of reverse flow of the process gas, the diameter of the uniform gas hole 22 is smaller than the diameter of the corresponding gas inlet 11, and this arrangement can increase the resistance of the reverse flow of the gas and reduce the possibility of the reverse flow of the process gas. Specifically, with two of the gas inlets 11 as an example, the diameter of the first uniform gas hole 221 is smaller than the diameter of the first gas inlet 111, and the diameter of the second uniform gas hole 222 is smaller than the diameter of the second gas inlet 112.

[0046] Further, along the flow direction of the gas, the diameter of the uniform gas hole 22 is constant or is a tapered hole, and the tapered hole can further increase the resistance of the reverse flow of the gas and reduce the occurrence of the reverse flow of the process gas. The uniform gas hole 22 is in a strip shape or a spiral shape, and the spiral arrangement can further increase the resistance of the reverse flow of the gas and reduce the occurrence of the reverse flow of the process gas. Preferably, the shapes of the uniform gas holes 22 are the same, and the uniform gas holes 22 are uniformly arranged along the circumference of the uniform gas piece 20. Of course, the uniform gas holes 22 can also be arranged in a non-uniform manner.

[0047] Further, the gas inlet channel 11 comprises at least one inclined segment channel and at least one vertical segment channel, the inclined direction of each inclined segment channel can be the same or different, the inclined segment channels and the vertical segment channels can be arranged alternately or sequentially, the inclined segment channels can increase the resistance of reverse flow of the gas and reduce the possibility of reverse flow of the process gas. It should be noted that the number and arrangement of the inclined segment channels and the vertical segment channels can be the same or different for different gas inlet channels 11.

[0048] Specifically, as shown in Figure 5 , the first gas inlet channel 111 comprises a first inclined segment channel and a first vertical segment channel, the first vertical segment channel is in communication with the first uniform gas cavity 211, the second gas inlet channel 112 comprises a second inclined segment channel and a second vertical segment channel, the second vertical segment channel is in communication with the second uniform gas cavity 212. The connection between the first inclined segment channel and the first vertical segment channel is transitioned by a circular arc, and the connection between the second inclined segment channel and the second vertical segment channel is transitioned by a circular arc. The inclined directions of the first inclined segment channel and the second inclined segment channel shown in the figure are different, the first inclined segment channel and the second inclined segment channel are close to each other, the first inclined segment channel and the second inclined segment channel can also be arranged in a manner of being away from each other, or the inclined directions of the first inclined segment channel and the second inclined segment channel are the same.

[0049] Further, the uniform gas cavity 21 comprises at least one uniform gas groove. As shown in Figure 6 , the first uniform gas cavity 211 and the second uniform gas cavity 212 shown in the figure each comprise one uniform gas groove, the first uniform gas cavity 211 shown in the figure is an annular groove, and the second uniform gas cavity 212 is a semispherical groove. It should be noted that the second uniform gas cavity 212 can also be arranged as an annular groove, and in other embodiments, the first uniform gas cavity 211 and the second uniform gas cavity 212 can comprise a plurality of uniform gas grooves in communication with each other, and the bottom of at least part of the uniform gas grooves is provided with a uniform gas hole 22.

[0050] Further, as shown in Figures 6-11 , the uniform gas part 202 is arranged on the fixing plate 201, and the uniform gas cavity 21 is arranged on the uniform gas part 202. The uniform gas part 202 and the fixing plate 201 can be an integrated structure or a split structure, and when being a split structure, the two are combined into a whole through detachable connection or non-detachable connection. For example, the uniform gas part 202 can be welded to the fixing plate 201 or connected through a connecting piece, and the fixing plate 201 is connected to other equipment. Figure 6 As shown in , in some embodiments, the two opposite sides of the uniform gas part 202 are in a circular arc shape.

[0051] Figures 7-11As shown, the bottom of the gas distribution section 202 is frustum-shaped (e.g., Figure 9 (as shown) or hemispherical (as shown) Figure 7 (as shown) or frustum-shaped (such as) Figure 8 (as shown) or planar (such as) Figures 10-11 (As shown) or conical, of course, it can also be other shapes, such as an irregular arc surface. The specific shape can be determined according to the equipment connected to the rear end of the air distribution component 20.

[0052] Furthermore, the air intake component 10 and the air distribution component 20 are detachably connected, for example, by means of bolt connection or by means of snap-fit ​​connection. The detachable connection method facilitates disassembly and assembly.

[0053] Furthermore, to ensure the airtight connection between the air intake component 10 and the air distribution component 20, the air intake component 10 is sealed to the air distribution component 20 via a sealing ring, such as... Figure 6 As shown, the gas distribution component 20 is provided with a sealing groove 23 for installing a sealing ring.

[0054] Furthermore, the air intake component 10 is a one-piece structure, or the air intake component 10 includes multiple air intake blocks, including two, three or more air intake blocks, each air intake block can be detachably connected or non-detachably connected, for example, each air intake block can be connected by welding or by connecting parts.

[0055] In addition, this utility model also discloses a semiconductor device, including the air intake device of the above embodiment.

[0056] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0057] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0058] Unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0059] The principle and implementation mode of the present application are described by using specific examples in the present application, and the above examples are only used for helping to understand the core idea of the present application. It should be pointed out that, for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principle of the present application, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. An air intake device characterized by, The application relates to an air inlet device. The air inlet device comprises an air inlet part (10) provided with at least two air inlet channels (11); and a uniform air part (20) stacked with the air inlet part (10), wherein the uniform air part (20) is provided with uniform air cavities (21) communicated with the air inlet channels (11), and the bottom of each uniform air cavity (21) is provided with a plurality of uniform air holes (22) communicated with the uniform air cavity (21). The diameter of the uniform air hole (22) is smaller than that of the corresponding air inlet channel (11).

2. The air intake device of claim 1, wherein The diameter of the uniform air hole (22) is constant or gradually reduced along the flow direction of the gas.

3. The air intake device of claim 2, wherein The air inlet channel (11) comprises at least one inclined section channel and at least one vertical section channel, and the inclined direction of each inclined section channel is the same or different.

4. The air intake device of claim 1, wherein The uniform air part (20) comprises a fixed plate (201) and a uniform air part (202) arranged on the fixed plate (201), and the uniform air cavity (21) is arranged on the uniform air part (202).

5. The air intake device of claim 1, wherein The bottom of the uniform air part (202) is in the shape of a circular truncated cone, a hemisphere, a truncated prism, a plane or a cone.

6. The air intake device of claim 5, wherein The air inlet part (10) and the uniform air part (20) are detachably connected.

7. The air intake device of claim 1, wherein The air inlet part (10) and the uniform air part (20) are sealingly connected through a sealing ring, and the uniform air part (20) is provided with a sealing groove (23) capable of mounting the sealing ring.

8. The air intake device of claim 7, wherein The air inlet part (10) is in an integrated structure; or 9. The air intake device of any one of claims 1-8, wherein, The air inlet part (10) comprises a plurality of air inlet blocks, and each air inlet block is detachably connected or non-detachably connected. The application further relates to an air inlet device comprising the air inlet device as claimed in any one of claims 1-9.

10. A semiconductor device, characterized by comprising: ​

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