Drying device
By designing a convection structure for the ventilation openings in the drying device, the problem of uneven force during the drying of silicon wafers with hot air knives was solved, achieving uniform drying of silicon wafers, reducing the risk of microcracks and fragmentation, and improving the yield of silicon wafers.
Patent Information
- Application Number
- CN202520103661.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-16
AI Technical Summary
When existing drying equipment dries solar silicon wafers using hot air knives, the concentrated force of the hot air can easily cause microcracks and fragmentation of the silicon wafers, affecting the yield.
Design a drying device that uses a drying box with corresponding first and second ventilation openings. Hot air forms convection inside the box and is evenly blown onto the surface of the silicon wafer. Moisture is discharged through the exhaust vent, reducing uneven stress on the silicon wafer.
This achieves uniform stress on the upper and lower surfaces of the silicon wafer, reduces the risk of microcracks and fragmentation, and improves drying efficiency and yield.
Smart Images
Figure CN223856016U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of solar energy, in particular to a drying device. BACKGROUND
[0002] In the production process of solar silicon wafer, a chain cleaning machine is used to etch and clean the solar silicon wafer, and then the cleaned solar silicon wafer enters a sorting machine for sorting. Before that, the solar silicon wafer coming out of the cleaning machine is wet and cannot directly enter the sorting machine for sorting, so the wet solar silicon wafer needs to be dried.
[0003] In the related art, a drying device blows hot air to the upper and lower surfaces of the solar silicon wafer through three groups of up-down air knives, so as to achieve the purpose of chasing water and drying the solar silicon wafer. However, since the drying air knives blow hot air to the surface of the solar silicon wafer through air holes with a certain inclination angle to dry the solar silicon wafer, the solar silicon wafer is subjected to the force of the hot air blown by the air knives, which is relatively concentrated, and is prone to hidden cracks and fragments, thereby affecting the yield.
[0004] It should be noted that the above content is not necessarily prior art, and is not used to limit the patent protection scope of the present application. CONTENT OF THE UTILITY MODEL
[0005] The embodiments of the present application provide a drying device to solve or alleviate one or more technical problems proposed above.
[0006] The embodiments of the present application provide a drying device, comprising:
[0007] A drying box, which has a drying cavity inside, is used to place the silicon wafer to be dried;
[0008] The drying box comprises a first box body and a second box body which are opened and closed, a plurality of first ventilation openings are formed on the first box body, a plurality of second ventilation openings are formed on the second box body, and the silicon wafer is arranged between the first ventilation openings and the second ventilation openings;
[0009] A plurality of exhaust openings are further formed on the first box body;
[0010] The exhaust openings, the first ventilation openings and the second ventilation openings are in communication with the drying cavity, and the first ventilation openings and the second ventilation openings are correspondingly arranged.
[0011] Optionally, at least one first air inlet is formed on the first box body, the first air inlet is in communication with the first ventilation opening; at least one second air inlet is formed on the second box body, and the second air inlet is in communication with the second ventilation opening.
[0012] Optionally, a first cavity is arranged on a side of the first box body facing the second box body, and a second cavity is arranged on a side of the second box body facing the first box body, and the first cavity and the second cavity are closed to form a drying cavity.
[0013] A first communication plate is arranged on the first box body and located in the first cavity, and a second communication plate is arranged on the first box body and located in the second cavity; a plurality of first air vents are arranged on the first communication plate, and a plurality of second air vents are arranged on the second communication plate.
[0014] Among them, a plurality of first air vents are in communication with the first air inlet, and a plurality of second air vents are in communication with the second air inlet.
[0015] Optionally, the first cavity includes a ventilation cavity and a communication cavity in communication with each other, the ventilation cavity is located between the top wall of the first box body for forming the first cavity and the first communication plate, and the communication cavity is located between the ventilation cavity and the second cavity; a plurality of air outlets are arranged on the side wall of the first box body, and a plurality of air outlets are in communication with the communication cavity.
[0016] Optionally, the drying box further comprises a conveying part for conveying the silicon wafer; the first box body is provided with an inlet and an outlet, and the inlet and the outlet are in communication with the communication cavity.
[0017] Among them, the inlet and the outlet are arranged opposite to each other.
[0018] Optionally, the conveying part includes a driving member and a plurality of transmission rollers arranged side by side, the driving member is arranged on the drying box for driving a plurality of transmission rollers to rotate synchronously, and a plurality of transmission rollers are respectively and independently connected with the first box body and the second box body.
[0019] Optionally, a plurality of first air vents are uniformly arranged on the first communication plate; and a plurality of second air vents are uniformly arranged on the second communication plate.
[0020] Optionally, a plurality of heating pipes are arranged in the second box body, and a plurality of heating pipes are located between the silicon wafer and the second air vent.
[0021] Optionally, a plurality of heating pipes are uniformly arranged in the second box body.
[0022] Optionally, the second box body is further provided with a temperature meter for testing the temperature in the drying box.
[0023] The technical scheme can have the following advantages:
[0024] By continuously inputting hot air to the drying box, and due to the corresponding first air vents and second air vents formed on the drying box, the hot air can form a convection in the drying box, so that the hot air can fully contact the surface of the silicon wafer and take away the moisture remaining after cleaning, and then be discharged through the exhaust port, thereby completing the drying of the silicon wafer; and the plurality of first air vents and the plurality of second air vents can uniformly blow the hot air to the silicon wafer, so that the upper and lower surfaces of the silicon wafer are uniformly stressed, thereby reducing the risk of silicon wafer cracking and fragmentation. BRIEF DESCRIPTION OF DRAWINGS
[0025] In the drawings, like reference numerals will be used to refer to like or similar elements throughout several views. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the application. It should be understood that the drawings are merely depictions of some embodiments of the application and should not be interpreted in a limiting sense.
[0026] Figure 1 is a structural schematic diagram of a drying device provided by an embodiment of the application.
[0027] Figure 2 is an exploded view of the drying device provided by the embodiment of the application.
[0028] Figure 3 is a structural schematic diagram of a first box body of the drying device provided by the embodiment of the application.
[0029] Figure 4 is a structural schematic diagram of a second box body of the drying device provided by the embodiment of the application.
[0030] BRIEF DESCRIPTION OF DRAWINGS
[0031] 1, drying box; 11, first box body; 111, first air vent; 112, exhaust port; 113, first air inlet; 114, first cavity; 115, feeding port; 116, discharging port; 117, first air inlet pipe; 118, exhaust pipe; 12, second box body; 121, second air vent; 122, second air inlet; 123, second cavity; 124, heating pipe; 125, temperature gauge; 126, second air inlet pipe; 2, first communication plate; 3, second communication plate; 4, transmission roller; 5, silicon wafer. DETAILED DESCRIPTION
[0032] In order to make the purpose, technical solutions and advantages of the application more clear, the application will be further described in detail below in combination with the drawings and embodiments. It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other without conflict. The application will be described in detail below with reference to the drawings and in combination with the embodiments.
[0033] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; for example, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It must be noted that as used herein:
[0034] In the following, exemplary embodiments according to this application will be described in more detail with reference to the accompanying drawings. It should be noted that these exemplary embodiments can be carried out in various different ways, and are not to be construed as being limited to the embodiments set forth herein.
[0035] As shown in Figures 1-4 The drying device according to the embodiments of the present application can comprise:
[0036] The drying box 1 has a drying cavity for placing the silicon wafer 5 to be dried.
[0037] The drying box 1 comprises a first box body 11 and a second box body 12 which are arranged to be opened and closed, the first box body 11 is provided with a plurality of first air vents 111, the second box body 12 is provided with a plurality of second air vents 121, and the silicon wafer 5 is arranged between the first air vents 111 and the second air vents 121; the first box body 11 is further provided with a plurality of exhaust vents 112; wherein the exhaust vents 112, the first air vents 111 and the second air vents 121 are in communication with the drying cavity, and the first air vents 111 and the second air vents 121 are arranged correspondingly.
[0038] In the present embodiment, hot air is continuously input into the drying box 1, and due to the corresponding first air vents 111 and second air vents 121 provided on the drying box 1, the hot air can form a convection in the drying box 1, so that the hot air can fully contact the surface of the silicon wafer 5 and take away the water residues after cleaning, and then be discharged through the exhaust vents 112, thereby completing the drying of the silicon wafer 5; and the plurality of first air vents 111 and the plurality of second air vents 121 can uniformly blow the hot air to the silicon wafer 5, so that the upper and lower surfaces of the silicon wafer 5 are uniformly stressed, thereby reducing the risk of hidden cracking and fragmentation of the silicon wafer 5.
[0039] In an optional embodiment, the first box body 11 is provided with at least one first air inlet 113, and the first air inlet 113 is in communication with the first air vent 111; the second box body 12 is provided with at least one second air inlet 122, and the second air inlet 122 is in communication with the second air vent 121. In the embodiment of the present application, the number of the first air inlets 113 is two, and the first box body 11 is further provided with a first air inlet pipe 117. The first air inlet pipe 117 has two first communication openings and a first air outlet, one of the first communication openings is in sealed communication with one of the first air inlets 113, and the other first communication opening is in sealed communication with the other first air inlet 113. Therefore, hot air can enter the first air inlet pipe 117 from the first air outlet, and then enter the drying box 1 through the two first air inlets 113. The number of the second air inlets 122 is two, and the second box body 12 is further provided with a second air inlet pipe 126. The second air inlet pipe 126 has two second communication openings and a second air outlet, one of the second communication openings is in sealed communication with one of the second air inlets 122, and the other second communication opening is in sealed communication with the other second air inlet 122. Therefore, hot air can enter the second air inlet pipe 126 from the second air outlet, and then enter the drying box 1 through the two second air inlets 122.
[0040] In the embodiment, the hot air enters the drying box 1 from the first air inlets 113 and the second air inlets 122 respectively, and then the hot air entering from the first air inlets 113 is dispersed through the first air vents 111 to form a relatively uniform hot air flow; and the hot air entering from the second air inlets 122 is dispersed through the second air vents 121 to form a relatively uniform hot air flow, and the two relatively uniform hot air flows can form a convection, so that the upper and lower surfaces of the silicon wafer 5 can be uniformly blown, the hot air can be in full contact with the surface of the silicon wafer 5, and the water on the surface of the silicon wafer 5 can be removed more quickly, thereby improving the drying efficiency of the silicon wafer 5.
[0041] In an optional embodiment, the side of the first box body 11 facing the second box body 12 is provided with a first cavity 114, the side of the second box body facing the first box body 11 is provided with a second cavity 123, and the first cavity 114 and the second cavity 123 are closed to form a drying cavity; the first box body 11 is provided with a first communication plate 2, and the first communication plate 2 is located in the first cavity 114; the first box body 11 is provided with a second communication plate 3, and the second communication plate 3 is located in the second cavity 123; the first air vents 111 are arranged on the first communication plate 2, and the second air vents 121 are arranged on the second communication plate 3.
[0042] In the embodiment, the first cavity 114 and the second cavity 123 are closed to form the drying cavity, that is, the first box body 11 and the second box body 12 are closed to form the drying box 1, so that the whole drying box 1 forms a semi-sealed air box body, which can reduce the loss of heat inside the drying box 1 and improve the drying efficiency of the silicon wafer 5 and reduce the energy consumption. Since the plurality of first air vents 111 are arranged on the first communication plate 2, the hot air entering through the first air inlet 113 can be uniformly dispersed, and the plurality of second air vents 121 are arranged on the second communication plate 3, so that the hot air entering through the second air inlet 122 can be uniformly dispersed, so that the hot air is uniformly blown to the upper and lower surfaces of the silicon wafer 5, reducing the risk of silicon wafer 5 hidden cracks and fragments.
[0043] In an optional embodiment, the first cavity 114 includes a ventilation cavity and a communication cavity which are in communication with each other, the ventilation cavity is located between the top wall of the first box body 11 for forming the first cavity 114 and the first communication plate 2, and the communication cavity is located between the ventilation cavity and the second cavity 123; a plurality of exhaust vents 112 are arranged on the side wall of the first box body 11, and the plurality of exhaust vents 112 are in communication with the communication cavity; wherein the first air inlet 113 is in communication with the plurality of first air vents 111 through the ventilation cavity. In the embodiment, the number of exhaust vents 112 is eight, and the eight exhaust vents 112 are divided into two groups, one group of four exhaust vents 112 is uniformly distributed on one side of the first box body 11, and the other group of four exhaust vents 112 is uniformly distributed on the other side of the first box body 11, that is, the two groups of exhaust vents 112 are oppositely arranged. And each exhaust vent 112 is communicated with an exhaust pipe 118 to facilitate exhaust.
[0044] In the embodiment, since the exhaust vent 112 is not in communication with the ventilation cavity, the loss of hot air entering through the first air inlet 113 can be reduced, so that the hot air entering through the first air inlet 113 can be fully dispersed by the plurality of first air vents 111, and the hot air in the drying box 1 is blown to the upper and lower surfaces of the silicon wafer 5 and carries away the water, and the hot air carrying water is then exhausted from the exhaust vent 112.
[0045] In an optional embodiment, the drying box 1 further comprises a conveying part for conveying the silicon wafer 5; the first box body 11 is provided with a feeding port 115 and a discharging port 116, and the feeding port 115 and the discharging port 116 are in communication with the communication cavity; wherein the feeding port 115 and the discharging port 116 are oppositely arranged.
[0046] In the embodiment, the silicon wafer 5 enters the drying cavity of the drying box 1 from the feeding port 115, and then the conveying part gradually conveys the silicon wafer 5 entering from the feeding port 115 to the direction of the discharging port 116, and in this process, the drying of the silicon wafer 5 can be completed, realizing the automatic drying of the silicon wafer 5 and improving the drying efficiency of the silicon wafer 5.
[0047] In an optional embodiment, the conveying part comprises a driving member and a plurality of transmission rollers 4 arranged side by side, the driving member is arranged on the drying box 1 for driving the plurality of transmission rollers 4 to rotate synchronously, and the plurality of transmission rollers 4 are respectively and independently connected with the first box body 11 and the second box body 12. In the embodiment, the two ends of the plurality of transmission rollers 4 are located between the first box body 11 and the second box body 12, and are rotatably connected with the first box body 11 and the second box body 12. The transmission rollers 4 arranged side by side can rotate synchronously under the action of the driving member, for conveying the silicon wafer 5 out of the discharge port 116.
[0048] In an optional embodiment, the plurality of first ventilation openings 111 are uniformly arranged on the first communication plate 2, and the plurality of second ventilation openings 121 are uniformly arranged on the second communication plate 3.
[0049] In the embodiment, the uniformly arranged first ventilation openings 111 can more evenly disperse the hot air entering from the first air inlet 113, and the uniformly arranged second ventilation openings 121 can more evenly disperse the hot air entering from the second air inlet 122, thereby greatly reducing the risk of cracks and fragments caused by the convective hot air to the silicon wafer 5.
[0050] In an optional embodiment, a plurality of heating pipes 124 are arranged in the second box body 12, and the plurality of heating pipes 124 are located between the silicon wafer 5 and the second ventilation opening 121.
[0051] In the embodiment, while using hot air drying, by arranging a plurality of heating pipes 124, the radiation energy emitted by the heating pipes 124 can produce a thermal radiation drying effect on the silicon wafer 5, that is, the auxiliary use of thermal radiation drying further improves the drying efficiency of the drying device on the silicon wafer 5.
[0052] In an optional embodiment, the number of heating pipes 124 is four, and the four heating pipes 124 are uniformly arranged in the second box body 12. The uniformly arranged heating pipes 124 can evenly dry the heat on the surface of the silicon wafer 5.
[0053] In an optional embodiment, the second box body 12 is further provided with a thermometer 125, and the thermometer 125 is used for testing the temperature in the drying box 1.
[0054] In the embodiment, the thermometer 125 can monitor the temperature of the drying cavity in real time, and the drying device can accurately control the drying temperature and the drying time by controlling the hot air flow and the temperature of the heating pipe 124.
[0055] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.
[0056] For ease of description, the positional words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the positional or locational relationship based on the positional or locational relationship shown in the drawings, which are merely for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate and imply that the devices or elements referred to must have a particular orientation or be constructed and operated in a particular orientation, unless the opposite is stated, and therefore cannot be understood as a limitation on the scope of protection of the present application; the positional words "inner, outer" refer to the inner and outer relative to the contour of each component itself. For example, if the device in the drawing is inverted, the device described as "above" or "on" other devices or structures will be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.
[0057] Unless specifically stated and defined otherwise, the terms "mount", "connect", "connection", "fixed", and the like, should be construed broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection, and can also be communication; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0058] Unless specifically stated and defined otherwise, "on" or "under" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "on" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. "Below", "below" and "below" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0059] The foregoing is a summary and thus contains only the most basic embodiment. The application can be practiced with the specific embodiments and options described herein, and it can also be practiced without such specific embodiments and options. Furthermore, the preceding description and drawings should not be construed as limiting the application but as merely representative. Certain embodiments can be further understood by the following clauses:
[0060] It is also to be understood that the terminology used herein is for the purpose of describing the embodiments only and the scope of the application should not be limited. A reference to an element in the singular is not intended to mean "one and only one" unless specifically so stated, but rather "one or more." All structural and functional examples so described can also be entirely separate items or otherwise independently carried out, or alternatively, the same item or process performed on the same item.
[0061] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an overly literal sense unless expressly so defined herein.
[0062] It is also to be understood that the terminology used herein is for the purpose of describing the embodiments only and the scope of the application should not be limited. A reference to an element in the singular is not intended to mean "one and only one" unless specifically so stated, but rather "one or more." All structural and functional examples so described can also be entirely separate items or otherwise independently carried out, or alternatively, the same item or process performed on the same item. It is also to be understood that the terminology used herein is for the purpose of describing the embodiments only and the scope of the application should not be limited. A reference to an element in the singular is not intended to mean "one and only one" unless specifically so stated, but rather "one or more." All structural and functional examples so described can also be entirely separate items or otherwise independently carried out, or alternatively, the same item or process performed on the same item.
Claims
1. A drying apparatus, characterized by, The drying device comprises a drying box (1) having a drying cavity for placing silicon wafers (5) to be dried. The drying box (1) comprises a first box body (11) and a second box body (12) which are opened and closed, a plurality of first ventilation openings (111) are formed on the first box body (11), a plurality of second ventilation openings (121) are formed on the second box body (12), and the silicon wafers (5) are arranged between the first ventilation openings (111) and the second ventilation openings (121). A plurality of exhaust openings (112) are formed on the first box body (11). The exhaust openings (112), the first ventilation openings (111) and the second ventilation openings (121) are all in communication with the drying cavity, and the first ventilation openings (111) and the second ventilation openings (121) are arranged correspondingly.
2. The drying device according to claim 1, wherein at least one first air inlet (113) is formed on the first box body (11), the first air inlet (113) is in communication with the first ventilation openings (111), at least one second air inlet (122) is formed on the second box body (12), and the second air inlet (122) is in communication with the second ventilation openings (121).
3. The drying device according to claim 2, wherein a first cavity (114) is arranged on one side of the first box body (11) facing the second box body (12), a second cavity (123) is arranged on one side of the second box body (12) facing the first box body (11), and the first cavity (114) and the second cavity (123) are closed to form the drying cavity. A first communication plate (2) is arranged on the first box body (11) and located in the first cavity (114), a second communication plate (3) is arranged on the first box body (11) and located in the second cavity (123), a plurality of the first ventilation openings (111) are formed on the first communication plate (2), and a plurality of the second ventilation openings (121) are formed on the second communication plate (3).
4. The drying device according to claim 3, wherein the first cavity (114) comprises a ventilation cavity and a communication cavity which are in communication with each other, the ventilation cavity is located between a top wall of the first box body (11) for forming the first cavity (114) and the first communication plate (2), the communication cavity is located between the ventilation cavity and the second cavity (123), a plurality of the exhaust openings (112) are arranged on the side wall of the first box body (11), and a plurality of the exhaust openings (112) are in communication with the communication cavity. The first air inlet (113) is in communication with a plurality of the first ventilation openings (111) through the ventilation cavity.
5. The drying device according to claim 4, wherein The drying box (1) is internally provided with a conveying part for conveying the silicon wafer (5); the first box body (11) is provided with an inlet (115) and an outlet (116), and the inlet (115) and the outlet (116) are communicated with the communication cavity. The inlet (115) and the outlet (116) are oppositely arranged.
6. The drying device according to claim 5, characterized in that, The conveying part comprises a driving member and a plurality of transmission rollers (4) arranged side by side, the driving member is arranged on the drying box (1) for driving the plurality of transmission rollers (4) to rotate synchronously, and the plurality of transmission rollers (4) are respectively and independently connected with the first box body (11) and the second box body (12).
7. The drying device according to claim 3, characterized in that, The plurality of first ventilation openings (111) are uniformly arranged on the first communication plate (2), and the plurality of second ventilation openings (121) are uniformly arranged on the second communication plate (3).
8. The drying device according to claim 1, characterized in that, The second box body (12) is internally provided with a plurality of heating pipes (124), and the plurality of heating pipes (124) are located between the silicon wafer (5) and the second ventilation opening (121).
9. The drying device according to claim 8, characterized in that, The plurality of heating pipes (124) are uniformly arranged in the second box body (12).
10. The drying device according to claim 8, characterized in that, The second box body (12) is further provided with a temperature meter (125), and the temperature meter (125) is used for testing the temperature in the drying box (1).