System for testing mechanical properties of material in low-temperature environment

Abstract

The utility model discloses a material low-temperature environment mechanical property testing system which comprises a pressure head assembly for applying pressure to a material to be tested, an experimental platform which is spatially corresponding to the pressure head assembly and is used for placing the material to be tested, and a shell which is arranged at the periphery of the experimental platform and is used for introducing cold air into an experimental cavity, the top of the shell is provided with a press-in hole for the pressure head assembly to extend into and pass through, the refrigeration unit is communicated with the experiment chamber through a heat insulation pipeline, and a refrigeration chamber for accommodating to-be-cooled gas is arranged in the refrigeration unit; and a semiconductor refrigeration assembly for cooling gas in the refrigeration chamber is arranged on the side wall in the refrigeration unit. According to the system for testing the mechanical properties of the material in the low-temperature environment, the semiconductor refrigeration assembly is arranged in the refrigeration chamber for refrigeration, the refrigeration cost is low, the device vibration is small, the stability is good, the refrigeration is relatively gentle, and the problem of frosting is not easy to occur in the experiment chamber.

Description

TECHNICAL FIELD

[0001] The utility model relates to material low temperature environment mechanics characteristic test technical field, more specifically, the utility model relates to a material low temperature environment mechanics characteristic test system. BACKGROUND

[0002] The icing phenomenon of the aircraft in the flight process can bring unstable factors for the aviation flight safety, causes the functions of the aircraft to be unable to normally operate, and threatens the flight safety. The mechanical property parameters of ice and ice / base system can provide basic theoretical data for the ice prevention. Due to the particularity of ice material, the research on the ice mechanical property test is less at home and abroad at present. The mechanical property parameters of ice can be obtained by using the indentation technology, and the low-temperature test environment is mainly created by circulating nitrogen or helium into the test cavity. The problems of high refrigeration cost and frost in the test cavity caused by rapid cooling during refrigeration exist.

[0003] The utility model with patent No. CN205538440U discloses a material low temperature mechanics performance testing arrangement, including universal material testing machine, refrigerator, gas storage tank, sample cavity, vacuum pump, vacuum heat preservation bucket, the helium of this device can be recycled, avoids the massive waste of helium resources, but the cost of the refrigeration assembly of this device is relatively high, and when helium is circulated during refrigeration, the sample cavity is rapidly cooled, frost appears in the sample cavity, and the test result is affected. UTILITY MODEL CONTENT

[0004] One object of the utility model is to solve the above problems and / or defects, and provide the advantages to be explained later.

[0005] In order to realize these objects and other advantages of the utility model, a material low temperature environment mechanics characteristic test system is provided, which comprises: a pressure head assembly for applying pressure to the material to be tested, an experimental platform corresponding to the pressure head assembly in space for placing the material to be tested, a shell arranged on the periphery of the experimental platform for circulating cold air into the experimental chamber, and a pressure hole is formed in the top of the shell for the pressure head assembly to extend in, and further comprising: a refrigeration unit communicated with the experimental chamber through a heat insulation pipeline, and a refrigeration chamber for containing the gas to be cooled is arranged in the refrigeration unit.

[0006] The side wall in the refrigeration unit is provided with a semiconductor refrigeration assembly for cooling the gas in the refrigeration chamber.

[0007] Preferably, a temperature sensor is arranged in the experimental chamber.

[0008] The temperature sensor is in communication connection with the semiconductor refrigeration assembly through a temperature controller.

[0009] Preferably, the experimental platform is configured as an electric displacement experimental platform.

[0010] Preferably, the experimental chamber and the inner surface of the refrigeration chamber are each provided with a vacuum insulation board layer.

[0011] Preferably, the outer side of the heat insulation pipeline is provided with a foam insulation layer.

[0012] Preferably, the semiconductor refrigeration assembly is provided with a matched refrigeration fan at one end close to the refrigeration sheet.

[0013] Preferably, the refrigeration chamber is provided with a partition plate to separate the air inlet and the air outlet of the refrigeration fan to form a hot flow cavity and a cold flow cavity.

[0014] The heat insulation pipeline is configured as two pipelines to communicate the experimental chamber with the hot flow cavity and the cold flow cavity respectively.

[0015] The utility model at least includes the following beneficial effects: through setting up semiconductor refrigeration assembly in the refrigeration chamber to carry out refrigeration, its refrigeration cost is low, the device vibration is small, stability is good, and the refrigeration is relatively slow, and the problem that the frost is not easy to appear in the experimental chamber.

[0016] The other advantages, objects and features of the utility model will be embodied partly through the following description, and will be understood by the person skilled in the art partly through the research and practice of the utility model. DRAWINGS

[0017] Fig. 1 It is the structure schematic view of material low temperature environment mechanical property testing system in an embodiment of the utility model;

[0018] Fig. 2 It is the sectional view of material low temperature environment mechanical property testing system in an embodiment of the utility model.

[0019] Mark in the drawing: 1, shell, 11, press into the hole, 2, experimental platform, 3, heat insulation pipeline, 4, refrigeration unit, 41, semiconductor refrigeration assembly, 411, refrigeration sheet, 412, refrigeration fan, 42, partition plate, 421, hot flow cavity, 422, cold flow cavity. DETAILED DESCRIPTION

[0020] The utility model will be further explained in detail in combination with the drawings, so that the person skilled in the art can implement according to the description text.

[0021] It should be understood that the terms such as "have", "contain" and "include" used herein do not list the presence or addition of one or more other elements or combinations thereof.

[0022] It should be noted that, in the description of the utility model, the orientation or position relationship indicated by the terms is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be understood broadly, for example, "connected" can be fixedly connected, can be detachably connected, or integrally connected, can be mechanically connected, can be electrically connected, can be directly connected, can be indirectly connected through an intermediate medium, can be internal communication of two elements, and for ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] In addition, in the utility model, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact of the first and second features, or indirect contact of the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0025] Embodiment 1

[0026] A material low-temperature environmental mechanical property testing system, which has a structure as shown in Figs. 1-2 The utility model discloses a material low-temperature environmental mechanical property testing system, which comprises a pressure head assembly for applying pressure to a material to be tested, an experimental platform 2 corresponding to the pressure head assembly in space for placing the material to be tested, a shell 1 arranged at the periphery of the experimental platform 2 for passing cold gas into an experimental chamber, and a pressure inlet hole 11 is formed in the top of the shell 1 for the pressure head assembly to extend through, further comprising a refrigeration unit 4 communicated with the experimental chamber through a heat insulation pipeline 3, and a refrigeration chamber for containing the gas to be cooled is arranged in the refrigeration unit 4.

[0027] A semiconductor refrigeration assembly 41 for cooling the gas in the refrigeration chamber is arranged on the side wall in the refrigeration unit 4.

[0028] Working principle: the device is mainly used to create a controllable low temperature environment, applied to low temperature indentation device. Through the semiconductor refrigeration assembly 41, to make the temperature inside the refrigeration chamber is reduced, the semiconductor refrigeration assembly 41 can make the temperature to-20℃-30℃. When working, first move the pressure head assembly into the pressure hole 11, and then start the semiconductor refrigeration assembly 41 to refrigerate; The low temperature air in the refrigeration chamber is transferred to the experimental chamber through the heat insulation pipeline 3 to reduce the temperature in the experimental chamber, so as to meet the temperature requirement of low temperature indentation test; Finally, carry out indentation test. The advantages of the device are that the temperature can be controlled, the precision is high, the cost is low, the application range is wide (modular design is adopted), the vibration is small, the stability is good and other advantages, and the vibration of the semiconductor refrigeration assembly 41 itself will not affect the test result of the indentation test. By setting the semiconductor refrigeration assembly 41 in the refrigeration chamber to refrigerate, the refrigeration cost is low, the device vibration is small, the stability is good, and the refrigeration is relatively slow, and the problem of frost in the experimental chamber is avoided to avoid affecting the accuracy of the test.

[0029] Embodiment 2

[0030] This embodiment 2 is a preferred embodiment of the utility model, and the specific structure is as shown in Figs. 1-2 The experimental chamber is provided with a temperature sensor.

[0031] The temperature sensor is in communication connection with the semiconductor refrigeration assembly 41 through the temperature controller.

[0032] Working principle: the temperature sensor measures the temperature in the experimental chamber and transmits the temperature information to the temperature controller, and when the temperature is lower than the set value, the temperature controller controls the semiconductor refrigeration assembly 41 to start working and refrigerate; When the temperature is higher than the set value, stop working.

[0033] Embodiment 3

[0034] This embodiment 3 is a preferred embodiment of the utility model, which discloses the following improvements on the basis of embodiment 1: the experimental platform 2 is configured as an electric displacement experimental platform 2.

[0035] In actual application, the electric displacement experimental platform 2 can realize two degrees of freedom movement of the sample in the horizontal direction.

[0036] Working principle: the electric displacement experimental platform 2 can move the sample and realize the test of the mechanical properties of different parts of the sample.

[0037] Embodiment 4

[0038] This embodiment 4 is a preferred embodiment of the utility model, which discloses the following improvements on the basis of embodiment 1: the inner surfaces of the experimental chamber and the refrigeration chamber are both provided with a vacuum insulation board layer.

[0039] The heat insulation pipeline 3 is provided with a foam heat insulation layer outside.

[0040] Working principle: The vacuum heat insulation plate layer and the foam heat insulation layer can prevent heat exchange with the external environment and prevent temperature rise.

[0041] Embodiment 5

[0042] Embodiment 5 is a preferred embodiment of the utility model, and the specific structure is shown in the figure, which discloses the following improvements on the basis of embodiment 1: the semiconductor refrigeration assembly 41 is provided with a matched refrigeration fan 412 at one end close to the refrigeration fin 411. Figs. 1-2

[0043] The refrigeration chamber is provided with a partition plate 42 to separate the air inlet and the air outlet of the refrigeration fan 412, forming a hot flow cavity 421 and a cold flow cavity 422.

[0044] The heat insulation pipeline 3 is configured as two, respectively connecting the experimental chamber with the hot flow cavity 421 and the cold flow cavity 422.

[0045] Working principle: The refrigeration end of the semiconductor refrigeration assembly 41 is equipped with the refrigeration fan 412, which is beneficial to the rapid transfer of cold quantity of the refrigeration end; the partition plate 42 is arranged and matched with the heat insulation pipeline 3 to form a refrigeration air loop between the experimental chamber and the refrigeration chamber; the air in the hot flow cavity 421 is blown out by the refrigeration fan 412 and then enters the cold flow cavity 422, and at the same time, the air in the experimental chamber is introduced into the hot flow cavity 421 through the heat insulation pipeline 3 connected with the hot flow cavity 421, and then is cooled by the refrigeration fin 411 of the semiconductor refrigeration assembly 41 and is driven by the refrigeration fan 412 to enter the cold flow cavity 422, forming a circulating refrigeration of cold air; the uniformity of cold air in the experimental chamber and the refrigeration chamber is improved, which is beneficial to the transfer of cold air in the interior, reduces the local temperature difference, and improves the refrigeration effect.

[0046] The above schemes are only a description of a preferred example, but are not limited thereto. In the implementation of the utility model, appropriate replacement and / or modification can be made according to the needs of the user.

[0047] The number of devices and the scale of processing described herein are used to simplify the description of the utility model. The application, modification and change of the utility model are obvious to those skilled in the art.

[0048] ​While the embodiments of the application have been disclosed as above, it is not limited to the use listed in the specification and the embodiments. It can be fully applied to various fields suitable for the application. For those skilled in the art, other modifications can be easily realized. Therefore, the application is not limited to specific details and the figures shown and described herein without departing from the general concept defined by the claims and the equivalent scope.

Claims

1. A system for testing the mechanical properties of a material in a cryogenic environment, comprising: A pressure head assembly for applying pressure to a material to be tested, an experimental platform corresponding to the pressure head assembly in space for placing the material to be tested, a shell provided at the periphery of the experimental platform for introducing cold air into the experimental chamber, and a pressure inlet hole is formed at the top of the shell for the pressure head assembly to extend through, characterized in that it further comprises: a refrigeration unit in communication with the experimental chamber through an insulation pipeline, and a refrigeration chamber inside the refrigeration unit for containing gas to be cooled; The side wall in the refrigeration unit is provided with a semiconductor refrigeration assembly for cooling the gas in the refrigeration chamber.

2. The system for testing mechanical properties of materials in cryogenic environments of claim 1, wherein, The experimental chamber is provided with a temperature sensor. The temperature sensor is in communication connection with the semiconductor refrigeration assembly through a temperature controller.

3. The system for testing mechanical properties of materials in a cryogenic environment of claim 1, wherein, The experimental platform is configured as an electric displacement experimental platform.

4. The system for testing mechanical properties of materials in a cryogenic environment of claim 1, wherein, The inner surfaces of the experimental chamber and the refrigeration chamber are provided with a vacuum insulation board layer.

5. The system for testing mechanical properties of materials in a cryogenic environment of claim 1, wherein, The outer side of the insulation pipeline is provided with a foam insulation layer.

6. The system for testing mechanical properties of materials in a cryogenic environment of claim 1, wherein, The semiconductor refrigeration assembly is provided with a matching refrigeration fan at one end close to the refrigeration fin.

7. The system for testing mechanical properties of materials in a cryogenic environment of claim 6, wherein, The refrigeration chamber is provided with a partition to separate the air inlet and outlet of the refrigeration fan to form a hot flow cavity and a cold flow cavity. The insulation pipeline is configured as two pipelines to communicate the experimental chamber with the hot flow cavity and the cold flow cavity respectively.

Images