Automatic crystal grain testing equipment
By designing an automated die testing device, automated electrical testing of chip dies under different temperature environments was achieved, solving the problems of increased time and cost and accuracy caused by manual operation, and improving production efficiency and testing accuracy.
Patent Information
- Application Number
- CN202423174294.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In the semiconductor industry, the electrical parameters of chip chips need to be tested under different temperature environments. Current technology relies on manual operation, which leads to increased time consumption, higher costs, and reduced production efficiency, and the accuracy of the tests is difficult to guarantee.
Design an automated grain testing device, including a sealed enclosure, a grain placement tray, a grain testing tray, a robotic arm, a heating device, and a cryogenic liquid nitrogen device, to achieve automated temperature control and electrical testing of the grains within the sealed enclosure, ensuring the airtightness and accuracy of the testing environment.
It improved production efficiency, reduced production costs, and ensured the accuracy of testing.
Smart Images
Figure CN223857339U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to semiconductor testing technical field especially relates to an automatic grain test equipment. BACKGROUND
[0002] In the semiconductor industry, after the chip grain is produced, it is packaged into the warehouse after cleaning, and the quality management personnel need to test the electrical parameters of the grain at normal temperature, high temperature and low temperature before warehousing, and estimate the yield, in the testing process, it is usually necessary for artificial to move a grain to the normal temperature test environment, high temperature test environment and low temperature test environment respectively, and then carry out artificial test, which greatly occupies the working time of quality management personnel, leads to the increase of manufacturing process time, the increase of manufacturing cost and the reduction of production capacity efficiency, and also cannot guarantee the accuracy of test. SUMMARY
[0003] Therefore, in view of the above technical problems, the utility model provides an automatic grain test equipment.
[0004] To solve the above technical problems, the utility model adopts the following technical scheme:
[0005] An automatic grain test equipment, characterized in that it comprises:
[0006] A sealing cover, wherein the sealing cover is provided with a cover door;
[0007] A grain placement disc for placing the grain to be tested;
[0008] A grain test disc, wherein the grain test disc is provided with a plurality of grain placement grooves, and the grain placement grooves are provided with conductive structures for establishing electrical connection with the grain;
[0009] A mechanical arm for moving the grain between the grain placement disc and the grain test disc, wherein the mechanical arm is provided with a vacuum suction head and a test pen;
[0010] A heating device and a low-temperature liquid nitrogen device for respectively heating and cooling the grain, wherein the heating device and the low-temperature liquid nitrogen device are in contact with the grain test disc;
[0011] Among them, the grain placement disc, the grain test disc, the mechanical arm, the heating device and the low-temperature liquid nitrogen device are all sealed in the sealing cover.
[0012] The utility model discloses that all components are sealed in the sealing cover, and the grain can be tested at normal temperature, high temperature and low temperature respectively in the sealing cover, and the testing process can be carried out automatically, which improves the production efficiency, reduces the production cost, and also guarantees the accuracy of test. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1The utility model discloses a structure schematic view.
[0014] Figure 2 The utility model discloses a top structure schematic view of the crystal grain test tray. Specific embodiments
[0015] The embodiments of the utility model will be described below in conjunction with the drawings in the specification. It should be noted that the embodiments involved in the specification are not exhaustive, and do not represent the only embodiment of the utility model. The following examples are only for the purpose of clearly explaining the utility model content of the utility model patent, and are not limited to the embodiments. For ordinary skilled persons in the art, different forms of changes and modifications can be made on the basis of the example description, and any changes or modifications that are within the scope of the technical concept and utility model content of the utility model are also within the protection scope of the utility model.
[0016] As Figure 1 shown, the application embodiment provides an automatic crystal grain test equipment, including base 110, sealing cover 120, crystal grain placement tray 130, crystal grain test tray 140, mechanical arm 150, heating device 160, low temperature liquid nitrogen device 170, nitrogen gas conveying device 180 and prompting device 190.
[0017] The base 110 has a test table 111 and a support frame 112.
[0018] The sealing cover 120 is fixed on the base 110, forms a closed cavity, so as to guarantee the closed of test environment, ensures the accuracy of test, and the sealing cover 120 has electric control cover door and nitrogen gas conveying hole.
[0019] The crystal grain placement tray 130 is used for placing the crystal grain to be tested, which is arranged on the support frame 112.
[0020] The crystal grain test tray 140 is arranged on the test table 111, and a plurality of crystal grain placement grooves 141 are arranged on the crystal grain test tray 140 in an array, as shown in Figure 2 The crystal grain placement groove 141 has a conductive structure for establishing electrical connection with the crystal grain.
[0021] The bottom of the crystal grain test tray 140 has a heat-conducting bottom disc 142 located in the test table 111.
[0022] The mechanical arm 150 is an industrial robot arm, which is used for moving the crystal grain between the crystal grain placement tray 130 and the crystal grain test tray 140. The mechanical arm 150 is arranged on the support frame 112, and a vacuum suction head 151 and a test pen 152 are arranged on the mechanical arm 150.
[0023] The heating device 160 and the low-temperature liquid nitrogen device 170 are respectively used for heating and cooling the crystal grains, and are arranged in the test table 111 and are in contact with the heat-conducting base plate 142 of the crystal grain test disc 140. The low-temperature liquid nitrogen device 170 can be a liquid nitrogen cryostat.
[0024] The nitrogen conveying device 180 is used for conveying normal-temperature nitrogen into the sealed cover 120, so that the sealed cavity of the sealed cover 120 is an oxygen-free and dry environment, further ensuring the accuracy of the test, and is connected with the nitrogen conveying hole through a pipeline.
[0025] The prompting device 190 is used for prompting the test result, and is arranged on the support frame 112, for example, a three-color warning light can be used.
[0026] The specific process of using the test equipment of the embodiment of the application to test the electrical properties of the crystal grains is as follows:
[0027] 1. The cover door of the sealed cover 120 is opened, and the crystal grains are placed in the crystal grain placing disc 130.
[0028] 2. Under the control of the controller, the nitrogen conveying device 180 conveys normal-temperature nitrogen into the sealed cover 120, and the cover door is automatically closed. The mechanical arm 150 conveys the crystal grains from the to-be-tested area of the crystal grain placing disc 130 to the crystal grain placing groove 141 of the crystal grain test disc 140 through the vacuum suction head 151. The number of crystal grains to be tested and the electrical property standard parameters are pre-set in the controller.
[0029] In order to facilitate the mechanical arm 150 to take the materials, the crystal grains are generally placed in the crystal grain placing disc 130 with the front surface upward.
[0030] 3. The mechanical arm 150 moves the test pen 152 to test the electrical properties of the crystal grains in the crystal grain placing groove 141.
[0031] When the normal-temperature test is performed, the heating device 160 and the low-temperature liquid nitrogen device 170 do not work. When the high-temperature or low-temperature test is performed, the heating device 160 or the low-temperature liquid nitrogen device 170 works under the control of the controller.
[0032] Under the control of the controller, if the test is qualified, the green light of the three-color warning light is displayed, otherwise, the red light is displayed.
[0033] 4. After the test is completed, the mechanical arm 150 conveys the crystal grains back to the tested area of the crystal grain placing disc 130.
[0034] 5. After all the crystal grains are tested, the sealed cover 120 is opened to take out the crystal grains.
[0035] From above, the automatic die test equipment provided by the embodiment of the application can seal each component in the sealing cover, can perform normal temperature test, high temperature test and low temperature test on the die respectively in the sealing cover, and the test can be automatically performed, thereby improving production efficiency, reducing production cost, and ensuring test accuracy.
[0036] Obviously, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application, and are not used as a limitation to the present application, and as long as the changes and modifications of the above described embodiments are within the scope of the spirit of the present application, they will fall within the scope of the claims of the present application.
Claims
1. An automatic die testing apparatus characterized by comprising: The utility model relates to a kind of sealed test device for semiconductor wafer, including: Sealing cover, the sealing cover has cover door on it; Wafer placement tray for placing wafer to be tested; Wafer test tray, the wafer test tray has a plurality of wafer placement slots on it, and the wafer placement slots have conductive structure for establishing electrical connection with wafer in it; Mechanical arm for moving wafer between the wafer placement tray and wafer test tray, the mechanical arm is equipped with vacuum suction head and test pen; Heating device and low-temperature liquid nitrogen device for respectively heating and cooling wafer, the heating device and low-temperature liquid nitrogen device are in contact with the wafer test tray; Wherein, the wafer placement tray, wafer test tray, mechanical arm, heating device and low-temperature liquid nitrogen device are all sealed in the sealing cover.
2. The automatic die testing apparatus according to claim 1, wherein It also includes base, the base has test table and support frame on it, the wafer test tray is arranged on the test table, the wafer placement tray and mechanical arm are arranged on the support frame, the heating device and low-temperature liquid nitrogen device are arranged in the test table, and the sealing cover is fixed on the base.
3. The automatic die testing apparatus according to claim 2, wherein The bottom of the wafer test tray has heat-conducting bottom disc in the test table, and the heat-conducting bottom disc is in contact with the heating device and low-temperature liquid nitrogen device.
4. The automatic die testing apparatus according to claim 1, wherein It also includes nitrogen delivery device for delivering normal-temperature nitrogen into the sealing cover, and the sealing cover has nitrogen delivery hole, and the nitrogen delivery device is connected with the nitrogen delivery hole through pipeline.
5. The automatic die testing apparatus according to claim 1, wherein It also includes prompting device for prompting test result.
6. The automatic die testing apparatus according to claim 5, wherein The prompting device is three-color warning light.