Semiconductor chip finished product detection device

By adjusting the combination structure of the shaft, support plate and rubber plate, combined with buffer spring and damping bushing, the problem of tight contact between the chip and the electrode plate is solved, and the accuracy and safety of semiconductor chip detection are achieved.

CN223857351UActive Publication Date: 2026-01-30JIANGSU UNION CHIP SEMICON CO LTD
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Patent Information

Application Number
CN202520266745.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-19
Publication Date
2026-01-30
Estimated Expiration
2035-02-19

AI Technical Summary

Technical Problem

Existing semiconductor chip testing equipment is prone to damaging chips when subjected to power-on testing if the external force is too great, while if the external force is too small, the chip and the electrode plate testing probe cannot fit tightly together, resulting in inaccurate testing data.

Method used

A semiconductor chip finished product testing device was designed. Through the combination structure of adjusting shaft, support plate, positioning plate and rubber plate, buffer spring and damping bushing are used to buffer and ensure that the chip is in close contact with the testing probe. The external force is controlled by gravity sensor to avoid excessive pressure.

Benefits of technology

This achieves a tight fit between the semiconductor chip and the detection probe, ensuring the accuracy of the detection data and preventing chip damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor chips, in particular to a semiconductor chip finished product detection device, which comprises a mounting shell, a detection copper seat and a detection probe, a pair of supporting blocks is fixedly connected to each of the left side and the right side in the mounting shell, and the detection copper seat is fixedly connected between the two pairs of supporting blocks. A circuit board is fixedly connected to the lower portion of the inner side of the detection copper base, detection probes are fixedly connected to the four corners of the upper side of the circuit board, and a limiting frame is fixedly connected to the upper side of the detection copper base. The device can drive a bearing plate and a third transmission plate to rotate at different speeds through a rotatable adjusting shaft, a to-be-detected semiconductor chip is pressed down through a positioning plate and a rubber plate, buffering is performed through a buffer spring, a damping shaft and a damping sleeve, it can be guaranteed that the to-be-detected semiconductor chip and a detection probe are tightly attached, the chip cannot be crushed, and the detection efficiency is improved. And the accuracy of detection data can be ensured.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip, concretely to a semiconductor chip finished product detection device. BACKGROUND

[0002] The semiconductor chip is a kind of semiconductor chip that can realize certain function by etching and wiring on semiconductor sheet, and the chip finished product needs to be detected to ensure whether the chip is qualified after production.

[0003] Part of the existing semiconductor chip finished product detection device usually adopts external force to press chip on detection electrode plate to carry out power detection, and chip is easily damaged when external force is too large, and chip and electrode plate detection probe cannot be closely attached when external force is too small, leading to inaccurate detection data, therefore, a kind of semiconductor chip finished product detection device is provided for the above problems. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of semiconductor chip finished product detection device, to solve the problem that part of the existing semiconductor chip finished product detection device usually adopts external force to press chip on detection electrode plate to carry out power detection, and chip is easily damaged when external force is too large, and chip and electrode plate detection probe cannot be closely attached when external force is too small, leading to inaccurate detection data.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of semiconductor chip finished product detection device, including installation shell, detection copper base and detection probe, the inside left and right sides of installation shell are all fixedly connected with a pair of support blocks, two pairs of support blocks are fixedly connected with detection copper base between, the inner side of detection copper base is fixedly connected with circuit board in lower part, the upper side of circuit board is all fixedly connected with detection probe in four corners, the upper side of detection copper base is fixedly connected with limit frame, the rotating slot hole of each pair of installation shell is all rotatably connected with adjusting shaft, the upper side of installation shell is fixedly connected with two drive motors, the lower side main shaft of drive motor is all fixedly connected with adjusting shaft, the lower part of adjusting shaft is all screw-connected with first transmission plate, the upper side of first transmission plate is fixedly connected with support plate, the upper part of adjusting shaft is all screw-connected with second transmission plate, two second transmission plates are fixedly connected with third transmission plate between, the lower side of third transmission plate is fixedly connected with two pairs of gravity sensors that are distributed symmetrically left and right, the lower side of gravity sensor is all fixedly connected with buffer spring, the lower side of each pair of buffer spring is all fixedly connected with positioning plate, the lower side of gravity sensor is all fixedly connected with damping shaft, the upper side of positioning plate is all fixedly connected with a pair of damping sleeve, the inner side of damping sleeve is all slidably connected with damping shaft, the lower side of positioning plate is all fixedly connected with rubber plate.

[0007] Preferably, the left half and the right half of the mounting shell are provided with a pair of rotating grooves, the middle position of the circuit board is provided with a groove, the limiting frame is a rectangular frame, and the inner sides of the limiting frame are inclined surfaces.

[0008] Preferably, the lower parts of the adjusting shafts are provided with first threaded protrusions, the upper parts of the adjusting shafts are provided with second threaded protrusions, the interiors of the first transmission plates are provided with first threaded grooves, and the interiors of the second transmission plates are provided with second threaded grooves.

[0009] Preferably, the pitch of the first threaded protrusions of the adjusting shafts is smaller than the pitch of the second threaded protrusions, the first transmission plates are all 'L'-shaped bent plates, the first transmission plates all pass through the groove of the circuit board, and the height of the supporting plate is higher than the height of the detection copper base.

[0010] Preferably, the buffer springs are all vertically distributed, the positioning plates are all horizontally distributed, and the damping shafts and the damping sleeves are all located on the inner sides of the buffer springs.

[0011] Compared with the prior art, the device has the beneficial effects that:

[0012] In the utility model, the device can drive the supporting plate and the third transmission plate to rotate at different speeds through the rotatable adjusting shaft, press the semiconductor chip to be detected through the positioning plate and the rubber plate, and buffer through the buffer spring and the damping shaft and the damping sleeve, so that the semiconductor chip to be detected and the detection probe can be tightly attached, the chip can not be damaged, and the accuracy of detection data can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a whole structure schematic view of the utility model;

[0014] Figure 2 It is a whole structure sectional view of the utility model;

[0015] Figure 3 It is a circuit board mounting structure sectional view of the utility model;

[0016] Figure 4 It is an adjusting shaft mounting structure schematic view of the utility model;

[0017] Figure 5 It is a damping shaft mounting structure schematic view of the utility model;

[0018] Figure 6 It is a damping sleeve mounting structure schematic view of the utility model.

[0019] In the figure: 1, installation shell; 2, support block; 3, detection copper base; 4, circuit board; 5, detection probe; 6, limiting frame; 7, adjusting shaft; 8, driving motor; 9, first transmission plate; 10, bearing plate; 11, second transmission plate; 12, third transmission plate; 13, gravity sensor; 14, buffer spring; 15, positioning plate; 16, damping shaft; 17, damping sleeve; 18, rubber plate. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0021] In the description of the present application, it should be understood that the orientation words such as "front, rear, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and in the absence of the opposite description, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component.

[0022] In addition, it should be noted that the use of "first", "second" and the like to limit parts is only for the convenience of distinguishing the corresponding parts, and if no further declaration is made, the above words have no special meaning, and therefore cannot be understood as a limitation on the scope of protection of the present application.

[0023] Please refer to Figures 1-6 The present application provides a technical solution:

[0024] The utility model provides a semiconductor chip finished product detection device, including installation shell 1, detection copper base 3 and detection probe 5, the inside left and right sides of installation shell 1 are fixedly connected with a pair of support block 2, and a pair of support block 2 is fixedly connected with detection copper base 3 between, and the inner side of detection copper base 3 is fixedly connected with circuit board 4 in the lower part, and the upper side four corners of circuit board 4 are fixedly connected with detection probe 5, and the upper side of detection copper base 3 is fixedly connected with limiting frame 6, and the rotating slot hole of every pair of installation shell 1 is rotatably connected with adjusting shaft 7, and the upper side of installation shell 1 is fixedly connected with two drive motors 8, and the lower side spindle of drive motor 8 is fixedly connected with adjusting shaft 7, and the lower part of adjusting shaft 7 is helically connected with first transmission plate 9, and the upper side of first transmission plate 9 is fixedly connected with bearing plate 10, and the upper part of adjusting shaft 7 is helically connected with second transmission plate 11, and the second transmission plate 11 is fixedly connected with third transmission plate 12 between, and the lower side of third transmission plate 12 is fixedly connected with two pairs of gravity sensors 13 that are distributed left and right symmetry, and the lower side of gravity sensor 13 is fixedly connected with buffer spring 14, and the lower side of every pair of buffer spring 14 is fixedly connected with positioning plate 15, and the lower side of gravity sensor 13 is fixedly connected with damping shaft 16, and the upper side of positioning plate 15 is fixedly connected with a pair of damping sleeve 17, and the inner side of damping sleeve 17 is slidably connected with damping shaft 16, and the lower side of positioning plate 15 is fixedly connected with rubber plate 18.

[0025] The left half and the right half of installation shell 1 are equipped with a pair of rotating slot holes, the middle position of circuit board 4 is provided with a groove, limiting frame 6 is a rectangular frame, the inner side of limiting frame 6 is an inclined surface, the semiconductor chip to be detected can be guided to move down to detection copper base 3 accurately through limiting frame 6; the lower part of adjusting shaft 7 is provided with a first threaded protrusion, the upper part of adjusting shaft 7 is provided with a second threaded protrusion, the inside of first transmission plate 9 is provided with a first threaded slot hole, the inside of second transmission plate 11 is provided with a second threaded slot hole, first transmission plate 9 can move down with bearing plate 10, second transmission plate 11 can drive third transmission plate 12 to move down at a faster speed; the pitch of the first threaded protrusion of adjusting shaft 7 is less than the pitch of the second threaded protrusion, first transmission plate 9 is an "L" shaped bending plate, first transmission plate 9 passes through the groove of circuit board 4, the height of bearing plate 10 is higher than the height of detection copper base 3, the semiconductor chip to be detected can be moved down through bearing plate 10; buffer spring 14 is vertically distributed, positioning plate 15 is horizontally distributed, damping shaft 16 and damping sleeve 17 are located inside buffer spring 14, the rubber plate 18 can be prevented from generating greater pressure on the semiconductor chip to be detected through the cooperation of buffer spring 14, damping shaft 16 and damping sleeve 17.

[0026] Workflow: turn on the power before use, the device is equipped with an external controller, the external controller of the device is respectively electrically connected with the circuit board 4, the detection probe 5, the driving motor 8, the gravity sensor 13, the running state of the circuit board 4, the detection probe 5, the driving motor 8 and the gravity sensor 13 can be adjusted manually by operating the external controller, all of the above are prior art; when using the device, first place the semiconductor chip to be detected on the supporting plate 10, then start the driving motor 8 through the external controller, the driving motor 8 can drive the adjusting shaft 7 installed in the shell 1 to rotate, because the first transmission plate 9 and the second transmission plate 11 cannot rotate, the rotating adjusting shaft 7 can drive the first transmission plate 9 and the second transmission plate 11 to move downward, because the pitch of the first threaded protrusion of the adjusting shaft 7 is smaller than the pitch of the second threaded protrusion, the downward speed of the first transmission plate 9 is smaller than the downward speed of the second transmission plate 11, the first transmission plate 9 can drive the supporting plate 10 to move downward, so that the semiconductor chip to be detected moves downward to the inside of the limiting frame 6, because the inner side of the limiting frame 6 is inclined, the limiting frame 6 can guide the semiconductor chip to be detected to accurately move downward to the detection copper base 3 fixed by the supporting block 2, at the same time, the second transmission plate 11 can drive the third transmission plate 12 to move downward at a faster speed, when the height of the supporting plate 10 is lower than the height of the detection copper base 3, the lower side of the rubber plate 18 contacts the semiconductor chip to be detected, the positioning plate 15 on the lower side of the third transmission plate 12 and the rubber plate 18 can press the semiconductor chip to be detected, the damping shaft 16 on the lower side of the gravity sensor 13 and the damping sleeve 17 on the upper side of the positioning plate 15 are slidingly connected and have damping, through the cooperation of the buffer spring 14, the damping shaft 16 and the damping sleeve 17, it can prevent the rubber plate 18 from generating a large pressure on the semiconductor chip to be detected, at the same time, through the gravity sensor 13, the force conducted by the buffer spring 14 can be detected, when the gravity sensor 13 detects that the force of the buffer spring 14 is large, the external controller can automatically control the driving motor 8 to stop rotating, at this time, the semiconductor chip to be detected and the detection probe 5 on the circuit board 4 are in full contact, through the circuit board 4 and the detection probe 5, the semiconductor chip can be detected, after the detection is completed, the driving motor 8 is started and reversed through the external controller, so that the semiconductor chip after detection can be ejected through the supporting plate 10; the device can drive the supporting plate 10 and the third transmission plate 12 to rotate at different speeds through the rotatable adjusting shaft 7, the semiconductor chip to be detected can be pressed downward through the positioning plate 15 and the rubber plate 18, and the buffer spring 14, the damping shaft 16 and the damping sleeve 17 can be buffered, so that the semiconductor chip to be detected and the detection probe 5 can be tightly attached, and the chip will not be damaged, which can ensure the accuracy of the detection data.

[0027] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art. The standard parts used in the utility model can be purchased from the market, and the special-shaped parts can be ordered according to the description and the drawings, the specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, which will not be described in detail here.

[0028] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip finished product detecting device, comprising a mounting shell (1), a detecting copper base (3) and a detecting probe (5), characterized in that: The left and right sides of the mounting shell (1) are fixedly connected with a pair of supporting blocks (2), and two pairs of supporting blocks (2) are fixedly connected with a detection copper base (3), the inner side of the lower part of the detection copper base (3) is fixedly connected with a circuit board (4), the upper side of the four corners of the circuit board (4) is fixedly connected with a detection probe (5), the upper side of the detection copper base (3) is fixedly connected with a limiting frame (6), each pair of rotating groove holes of the mounting shell (1) is rotatably connected with an adjusting shaft (7), the upper side of the mounting shell (1) is fixedly connected with two drive motors (8), the lower side of the main shaft of the drive motor (8) is fixedly connected with the adjusting shaft (7), the lower part of the adjusting shaft (7) is spirally connected with a first transmission plate (9), the upper side of the first transmission plate (9) is fixedly connected with a supporting plate (10), the upper part of the adjusting shaft (7) is spirally connected with a second transmission plate (11), two second transmission plates (11) are fixedly connected with a third transmission plate (12), the lower side of the third transmission plate (12) is fixedly connected with two pairs of gravity sensors (13) which are symmetrically distributed, the lower side of the gravity sensor (13) is fixedly connected with a buffer spring (14), the lower side of each pair of buffer springs (14) is fixedly connected with a positioning plate (15), the lower side of the gravity sensor (13) is fixedly connected with a damping shaft (16), the upper side of the positioning plate (15) is fixedly connected with a pair of damping sleeves (17), the inner side of the damping sleeve (17) is slidably connected with the damping shaft (16), and the lower side of the positioning plate (15) is fixedly connected with a rubber plate (18).

2. The semiconductor chip product inspection apparatus according to claim 1, characterized by: The left half and the right half of the mounting shell (1) are each provided with a pair of rotating groove holes, the middle position of the circuit board (4) is provided with a groove, the limiting frame (6) is a rectangular frame, and the inner side surface of the limiting frame (6) is an inclined surface.

3. The semiconductor chip product inspection apparatus according to claim 1, characterized by: The lower part of the adjusting shaft (7) is provided with a first threaded protrusion, the upper part of the adjusting shaft (7) is provided with a second threaded protrusion, the inside of the first transmission plate (9) is provided with a first threaded groove hole, and the inside of the second transmission plate (11) is provided with a second threaded groove hole.

4. The semiconductor chip product inspection apparatus according to claim 1, characterized by: The pitch of the first threaded protrusion of the adjusting shaft (7) is smaller than the pitch of the second threaded protrusion, the first transmission plate (9) is an "L"-shaped bent plate, the first transmission plate (9) passes through the groove of the circuit board (4), and the height of the supporting plate (10) is higher than the height of the detection copper base (3).

5. The semiconductor chip product inspection apparatus according to claim 1, characterized by: The buffer springs (14) are vertically distributed, the positioning plates (15) are horizontally distributed, and the damping shaft (16) and the damping sleeve (17) are located on the inner side of the buffer spring (14).