Embedded heat dissipation structure

Abstract

The utility model provides an embedded heat dissipation structure, which relates to the technical field of panel accessories and comprises a heat dissipation structure cover body, a first heat dissipation groove is formed in the side face of the heat dissipation structure cover body, a key hole is formed in the top of the heat dissipation structure cover body, and a heat conduction plate is installed on the inner side face of the heat dissipation structure cover body. Heat dissipation holes are formed in the surface of the heat conduction plate, a cover plate is installed on the back face of the heat dissipation structure cover body, a second heat dissipation groove is formed in the back face of the cover plate, fixing rotary knobs are installed at the positions, close to the corners, of the back face of the cover plate, and a connecting shaft is installed at the position, close to the bottom of the second heat dissipation groove, of the back face of the cover plate; a supporting plate is installed on the surface of the connecting shaft, a cooling fan is installed in a cavity formed by the back face of the cooling structure cover body and the cover plate, and a sliding groove is formed in the back face of the cooling structure cover body, so that the convenience of the cooling structure is improved, the cooling structure can be better assembled and disassembled with a flat plate, and the cooling efficiency is improved through external cooling.

Description

TECHNICAL FIELD

[0001] The utility model relates to panel accessory technical field especially relates to a built -in heat dissipation structure. BACKGROUND

[0002] The panel is the electronic product that modern life often uses, and the panel and the mobile phone structure are different, and the whole is light and thin, and the heat dissipation performance is poor.

[0003] The panel can only rely on the internal heat dissipation structure when using, and due to the poor heat dissipation performance, if it is used excessively, it is prone to overheating, thereby affecting the user's use experience, and the long time overheating can affect the service life of the panel itself, therefore, we propose a built -in heat dissipation structure. UTILITY MODEL CONTENT

[0004] The utility model discloses a built -in heat dissipation structure, which can solve the problems of the prior art, and can improve the heat dissipation performance of the panel.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A built -in heat dissipation structure, including heat dissipation structure cover, the side surface of heat dissipation structure cover is equipped with first heat dissipation groove, the top of heat dissipation structure cover is equipped with key hole, the inner side of heat dissipation structure cover is installed with heat conduction plate, the surface of heat conduction plate is equipped with heat dissipation hole, the back of heat dissipation structure cover is installed with cover plate, the back of cover plate is equipped with second heat dissipation groove, the back of cover plate is installed with fixed knob near the corner, the back of cover plate is installed with connecting shaft near the bottom of second heat dissipation groove, the surface of connecting shaft is installed with support plate, the cavity formed by the back of heat dissipation structure cover and cover plate is installed with heat dissipation fan, the back of heat dissipation structure cover is equipped with sliding slot, the back of heat dissipation structure cover is equipped with fixed hole near the top of sliding slot.

[0007] As a preferred scheme of the utility model, the heat dissipation structure cover is made of acrylic material, the length-width ratio of the heat dissipation structure cover is the same as that of the panel computer, the first heat dissipation groove is equidistantly and symmetrically provided with a plurality of first heat dissipation grooves, and the shape of the first heat dissipation groove includes square and circular.

[0008] As the preferred scheme of the utility model, the key hole is correspondingly set on the keyboard of the tablet computer, the heat conduction plate is made of copper material, the heat conduction plate is plastic welded in the heat dissipation structure cover body, the thickness of the heat conduction plate is less than or equal to 2cm, and the heat dissipation holes are symmetrically provided with two groups.

[0009] As the preferred scheme of the utility model, the cover plate is made of copper material, the cover plate is sprayed with the same paint as the color of the heat dissipation structure cover body, the back of the cover plate is provided with a sliding block corresponding to the sliding groove, the width of the sliding block is the same as the width of the sliding groove, and the cover plate can slide in the sliding groove.

[0010] As the preferred scheme of the utility model, the second heat dissipation groove is provided with a plurality of equidistant heat dissipation grooves, the second heat dissipation groove is on the same Y axis with the heat dissipation fan, two equidistant fixing knobs are provided, the fixing hole is correspondingly provided with the fixing knob, and the fixing knob penetrates the cover plate and the fixing hole and is screwed and fixed.

[0011] As the preferred scheme of the utility model, the connecting shaft is welded on the cover plate, the support plate can rotate in the connecting shaft, the maximum rotation angle of the support plate is 90 degrees, the support plate is made of plastic, and the heat dissipation fan is driven by a motor.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] In the utility model, through the design of the heat dissipation structure, the heat dissipation structure cover body, the heat conduction plate, the heat dissipation hole, the cover plate, the second heat dissipation groove and the heat dissipation fan are arranged, the convenience of the heat dissipation structure is improved, the heat dissipation structure can be better installed and disassembled with the tablet computer, and the heat dissipation efficiency is improved through external heat dissipation. ACCURACY OF DRAWINGS

[0014] Fig. 1 The utility model provides a whole structure schematic diagram of an embedded heat dissipation structure;

[0015] Fig. 2 The utility model provides a back structure schematic diagram of an embedded heat dissipation structure;

[0016] Fig. 3 The utility model provides a cover plate disassembly structure schematic diagram of an embedded heat dissipation structure.

[0017] Legend: 1, heat dissipation structure cover body;2, first heat dissipation groove;3, key hole;4, heat conduction plate;5, heat dissipation hole;6, cover plate;7, second heat dissipation groove;8, fixing knob;9, connecting shaft;10, support plate;11, heat dissipation fan;12, sliding groove;13, fixing hole. CONCRETE IMPLEMENTATION

[0018] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments, and based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings, and several embodiments of the present application are given, however, the present application can be realized in many different forms, and is not limited to the embodiments described herein, on the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element, and when an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be a middle element, the terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs, the terms used in the specification of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application, the term "and / or" used herein includes any and all combinations of one or more related listed items. Embodiment 1

[0022] As shown in Figs. 1-3 The utility model provides a kind of technical scheme: a built-in heat dissipation structure, first heat dissipation groove 2 is set in the side surface of heat dissipation structure cover body 1, key hole 3 is set in the top of heat dissipation structure cover body 1, heat conduction plate 4 is installed in the inner side surface of heat dissipation structure cover body 1, heat dissipation hole 5 is set in the surface of heat conduction plate 4, cover plate 6 is installed in the back of heat dissipation structure cover body 1, second heat dissipation groove 7 is set in the back of cover plate 6, fixed knob 8 is installed in the back of cover plate 6 near corner, connecting shaft 9 is installed in the back of cover plate 6 near the bottom of second heat dissipation groove 7, support plate 10 is installed on the surface of connecting shaft 9, heat dissipation fan 11 is installed in the cavity formed by the back of heat dissipation structure cover body 1 and cover plate 6, sliding groove 12 is set in the back of heat dissipation structure cover body 1, fixed hole 13 is set in the top of the back of heat dissipation structure cover body 1 near sliding groove 12. Embodiment 2

[0023] AsFigs. 1-3 As shown, the heat dissipation structure cover 1 is made of acrylic material, the length-width ratio of the heat dissipation structure cover 1 is the same as that of the tablet computer, the heat dissipation structure cover 1 can better fit the tablet computer, a plurality of first heat dissipation grooves 2 are symmetrically and equidistantly arranged, the shape of the first heat dissipation groove 2 includes a square and a circle, a key hole 3 is arranged corresponding to the key on the tablet computer, facilitating pressing the tablet, the heat conduction plate 4 is made of copper material, the heat conduction plate 4 is plastic welded in the heat dissipation structure cover 1, the thickness of the heat conduction plate 4 is less than or equal to 2cm, the heat dissipation holes 5 are symmetrically arranged in two groups, the cover plate 6 is made of copper material, the heat conduction effect is good, the cover plate 6 is sprayed with paint of the same color as the heat dissipation structure cover 1, the appearance is increased, the back surface of the cover plate 6 is provided with a sliding block corresponding to the sliding groove 12, the width of the sliding block is the same as that of the sliding groove 12, the cover plate 6 can slide in the sliding groove 12, a plurality of second heat dissipation grooves 7 are equidistantly arranged, the second heat dissipation groove 7 is on the same Y axis as the heat dissipation fan 11, the heat export efficiency is increased, two fixing knobs 8 are equidistantly arranged, a fixing hole 13 is arranged corresponding to the fixing knob 8, the fixing knob 8 penetrates the cover plate 6 and the fixing hole 13 and is screw-tightly fixed, a connecting shaft 9 is welded on the cover plate 6, a supporting plate 10 can rotate in the connecting shaft 9, the maximum rotation angle of the supporting plate 10 is 90 degrees, facilitating supporting the tablet, the supporting plate 10 is made of plastic, and the heat dissipation fan 11 is driven by a motor.

[0024] The working process of the utility model: when using the embedded heat dissipation structure to dissipate heat of the tablet, first, the heat dissipation structure cover 1 is installed on the tablet, then the heat dissipation fan 11 is started, the heat generated by the tablet is exported from the first heat dissipation groove 2 and the heat dissipation hole 5, and the heat conduction plate 4 conducts the heat of the tablet, the heat exported by the heat conduction plate 4 and the heat dissipation hole 5 is inhaled by the heat dissipation fan 11 and exported through the second heat dissipation groove 7, when the heat of the tablet is high, the fixing knob 8 can be screwed out, and the cover plate 6 can be slid down, the heat export amount of the heat dissipation fan 11 is increased, using the embedded heat dissipation structure to dissipate heat of the tablet, the convenience of the heat dissipation structure is increased, the tablet can be better installed and dismounted, and the heat dissipation efficiency is increased through external heat dissipation.

[0025] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An embedded heat dissipation structure, comprising a heat dissipation structure cover (1), characterized in that: The side of the heat dissipation structure cover (1) is provided with a first heat dissipation groove (2), the top of the heat dissipation structure cover (1) is provided with a key hole (3), the inner side of the heat dissipation structure cover (1) is provided with a heat conduction plate (4), the surface of the heat conduction plate (4) is provided with a heat dissipation hole (5), the back of the heat dissipation structure cover (1) is provided with a cover plate (6), the back of the cover plate (6) is provided with a second heat dissipation groove (7), the back of the cover plate (6) is provided with a fixed knob (8) near the corner, the back of the cover plate (6) is provided with a connecting shaft (9) near the bottom of the second heat dissipation groove (7), the surface of the connecting shaft (9) is provided with a support plate (10), the back of the heat dissipation structure cover (1) is provided with a heat dissipation fan (11) in the cavity formed by the heat dissipation structure cover (1) and the cover plate (6), the back of the heat dissipation structure cover (1) is provided with a sliding groove (12), and the back of the heat dissipation structure cover (1) is provided with a fixed hole (13) at the top near the sliding groove (12).

2. The embedded heat dissipation structure according to claim 1, wherein: The heat dissipation structure cover (1) is made of acrylic material, the length-width ratio of the heat dissipation structure cover (1) is the same as that of the tablet computer, the first heat dissipation groove (2) is provided with a plurality of equidistant symmetrical ones, and the shape of the first heat dissipation groove (2) includes square and circular.

3. The embedded heat dissipation structure of claim 1, wherein: The key hole (3) is provided corresponding to the keys on the tablet computer, the heat conduction plate (4) is made of copper material, the heat conduction plate (4) is plastic welded in the heat dissipation structure cover (1), the thickness of the heat conduction plate (4) is less than or equal to 2cm, and the heat dissipation hole (5) is provided with two groups of symmetrical ones.

4. The embedded heat dissipation structure of claim 1, wherein: The cover plate (6) is made of copper material, the cover plate (6) is sprayed with paint of the same color as the heat dissipation structure cover (1), the back of the cover plate (6) is provided with a sliding block corresponding to the sliding groove (12), the width of the sliding block is the same as the width of the sliding groove (12), and the cover plate (6) can slide in the sliding groove (12).

5. The embedded heat dissipation structure of claim 1, wherein: The second heat dissipation groove (7) is provided with a plurality of equidistant ones, the second heat dissipation groove (7) is located on the same Y axis as the heat dissipation fan (11), the fixed knob (8) is provided with two equidistant ones, the fixed hole (13) is provided corresponding to the fixed knob (8), and the fixed knob (8) penetrates the cover plate (6) and the fixed hole (13) and is screwed tightly.

6. The embedded heat dissipation structure of claim 1, wherein: The connecting shaft (9) is welded on the cover plate (6), the support plate (10) can rotate in the connecting shaft (9), the maximum rotation angle of the support plate (10) is 90 degrees, the support plate (10) is made of plastic, and the heat dissipation fan (11) is driven by a motor.

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