Heat dissipation assembly, case assembly and equipment

Abstract

The heat dissipation assembly comprises a cold row and a cold head, the cold row comprises a first heat dissipation part and a second heat dissipation part, an included angle is formed between the first heat dissipation part and the second heat dissipation part, the first heat dissipation part and the second heat dissipation part are communicated to jointly form an integrated flow guide channel, and the cold head is communicated with the flow guide channel. The heat generated by the heat source is conducted to the cold radiator, and the heat is quickly discharged through the first heat dissipation part and the second heat dissipation part, so that efficient heat dissipation is realized. The utility model further provides a case assembly comprising the heat dissipation assembly. The utility model further provides equipment comprising the case assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation assembly, a case assembly and equipment. BACKGROUND

[0002] With the wide application of high-performance computers and electronic equipment, while the equipment is constantly pursuing high-power operation and miniaturization and light weight, the heat dissipation problem is increasingly prominent, which becomes an important factor affecting the system stability and equipment life.

[0003] In the process of conceiving and implementing the present application, the inventors found that at least the following problems exist: The cold row of the heat dissipation assembly mostly adopts a long strip structure and is equipped with multiple fans, so that the overall assembly has a large volume, resulting in a large overall size of the case, which is not conducive to miniaturization design.

[0004] The foregoing narrative is to provide general background information and does not necessarily constitute the prior art. CONTENT OF THE UTILITY MODEL

[0005] In view of the above technical problems, the present application provides a heat dissipation assembly, a case assembly and equipment, which have a small volume and / or high heat dissipation efficiency.

[0006] The present application provides a heat dissipation assembly, comprising a cold row and a cold head, the cold row comprising a first heat dissipation part and a second heat dissipation part arranged at an angle with the first heat dissipation part, the first heat dissipation part and the second heat dissipation part being in communication and forming an integrated flow guide channel, and the cold head being in communication with the flow guide channel.

[0007] Optionally, the first heat dissipation part comprises a first heat dissipation fin group and a first fan for air inlet arranged on the first heat dissipation fin group.

[0008] Optionally, the second heat dissipation part comprises a second heat dissipation fin group and a second fan for air outlet arranged on the second heat dissipation fin group.

[0009] Optionally, the first fan and the second fan jointly constitute a heat dissipation air duct.

[0010] Optionally, the heat dissipation assembly further comprises a heat dissipation support, a water tank and a water pump arranged on the heat dissipation support.

[0011] Optionally, the water tank is filled with cooling liquid.

[0012] Optionally, the water tank is in communication with the flow guide channel.

[0013] Optionally, the water pump is configured to drive the cooling liquid in the water tank to circulate between the flow guide channel and the cold head.

[0014] The application also provides a case assembly comprising the heat dissipation assembly as any of the above.

[0015] Optionally, the case assembly further comprises a case body, and a CPU assembly and a GPU assembly arranged in the case body.

[0016] Optionally, the CPU assembly and the GPU assembly are arranged in parallel.

[0017] Optionally, the CPU assembly and the GPU assembly are electrically connected.

[0018] Optionally, the first heat dissipation part of the heat dissipation assembly is arranged at the top of the case body.

[0019] Optionally, the second heat dissipation part of the heat dissipation assembly is arranged at one side of the case body.

[0020] Optionally, the cold head is arranged between the CPU assembly and the GPU assembly.

[0021] Optionally, the cold head is configured to dissipate heat from the CPU assembly and the GPU assembly.

[0022] Optionally, the case body comprises a shell assembly, and an upper cover assembly and a lower cover assembly detachably mounted at two ends of the shell assembly.

[0023] Optionally, the upper cover assembly comprises an upper cover body, and a dust screen, a key plate and a display screen arranged on the upper cover body.

[0024] Optionally, the key plate is electrically connected with the CPU assembly.

[0025] Optionally, the shell assembly comprises a main shell, and an upper shell and a lower shell detachably mounted at two ends of the main shell.

[0026] Optionally, the heat dissipation assembly is arranged in the main shell.

[0027] Optionally, the CPU assembly and the GPU assembly are arranged in the lower shell.

[0028] The application also provides a device comprising the case assembly as any of the above.

[0029] As described above, the application optimizes the flow path of the cooling liquid by designing the cold row as a first heat dissipation part and a second heat dissipation part arranged at an included angle and making them communicate to form a flow channel, thereby improving the heat dissipation efficiency; and / or the structure makes the cold row occupy less space while maintaining high heat dissipation efficiency, thereby effectively reducing the overall volume and improving the layout flexibility of the device. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application. In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed to be used in the description of the embodiments will be briefly introduced. As is evident from the drawings, other drawings can also be obtained by those of ordinary skill in the art without any creative effort, based on these drawings.

[0031] Figure 1 A schematic diagram of a hardware structure of a mobile terminal for implementing various embodiments of the application;

[0032] Figure 2 A schematic diagram of a structure of a heat dissipation assembly according to an embodiment;

[0033] Figure 3 A schematic diagram of an internal structure of a case assembly according to an embodiment;

[0034] Figure 4 A schematic diagram of a mounting position of a cold head according to an embodiment;

[0035] Figure 5 A schematic diagram of a structure of a case main body according to an embodiment;

[0036] Figure 6 A schematic diagram of a structure of an upper cover assembly according to an embodiment;

[0037] Figure 7 A schematic diagram of a structure of a lower cover assembly according to an embodiment.

[0038] The implementation, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. The above-described drawings have shown the specific embodiments of the application, and more detailed descriptions will be given hereinafter. These drawings and the written description are not intended to limit the scope of the concept of the application in any way, but to illustrate the concept of the application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0039] The exemplary embodiments will be described in detail herein below with reference to the drawings. Unless otherwise indicated, the same numbers on different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments are not meant to represent all implementations consistent with the application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the application as detailed in the appended claims.

[0040] It should be noted that, as used in this document, the terms "include," "includes," "including," "has," "have," "having," or the like are used in the sense of "including but not limited to." The phrase "consisting of" is used herein to mean the listed items and nothing more, unless otherwise indicated. The phrase "consisting essentially of" is used herein to mean the listed items, and things additional to those listed that do not materially change the basic and novel characteristics of what is being described. The term "comprising" is used herein to mean the recited elements "at least," that is, including, but not limited to, the recited elements.

[0041] It should be understood that, although terms such as first, second, third, etc. can be used herein to describe various information, the information should not be limited to these terms. These terms are only used to distinguish one category of information from another category of information. For example, first information can also be referred to as second information, and similarly, second information can also be referred to as first information, without departing from the scope of this document. Depending on the context, the word "if' as used herein can be interpreted to mean "when" or "in response to determining" or "in response to detecting." Also, as used herein, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "have," "having," or the like, when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. The term "or," "and / or," "at least one of," and the like as used herein can be interpreted to be inclusive, or as meaning any one of the listed items, or any combination of the listed items. For example, "A, B, or C" or "A, B, and / or C" can mean "A; B; C; A and B; A and C; B and C; A, B, and C." The definition of "or" as used herein is similar to that of "and / or" as used herein, i.e., the term "or" as used herein means "any of the items listed, or any combination of the items listed." The term "comprising" as used herein is to be construed as meaning "including, but not limited to."

[0042] Depending on the context, the word "if' as used herein can be interpreted to mean "when" or "in response to determining" or "in response to detecting." Similarly, depending on the context, the phrase "if determined" or "if detecting (a stated condition or event)" can be interpreted to mean "when determined" or "in response to determining" or "when detecting (a stated condition or event)" or "in response to detecting (a stated condition or event)."

[0043] It should be understood that the specific embodiments described herein are merely illustrative of the application and should not be used to limit the scope of the application.

[0044] In the following description, the suffixes "module", "part", or "unit" used for components are merely intended for facilitating a description of the present application, and are not intended to limit the application otherwise. Therefore, "module", "part", or "unit" can be mixedly used.

[0045] The device can be a smart terminal, a server, or a vehicle-to-everything (V2X) device, a smart home device, or the like, and the smart terminal can be implemented in various forms. For example, the smart terminal described in the present application can include a smart terminal such as a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a personal digital assistant (PDA), a portable media player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a digital TV, a desktop computer, or the like.

[0046] In the following description, a mobile terminal will be exemplified, and it will be understood by those skilled in the art that the configuration according to the embodiments of the present application can be applied to a fixed type terminal, except for elements particularly used for mobile purposes.

[0047] Referring to FIG. 1, Figure 1 which is a hardware structure diagram of a mobile terminal to implement various embodiments of the present application, the mobile terminal 100 can include an RF (Radio Frequency) unit 101, a WiFi module 102, an audio output unit 103, an A / V (audio / video) input unit 104, a sensor 105, a display unit 106, a user input unit 107, an interface unit 108, a memory 109, a processor 110, and a power supply 111, etc. Those skilled in the art will appreciate that the mobile terminal structure shown in FIG. 1 does not constitute a limitation on the mobile terminal, and the mobile terminal can include more or less components than those shown, or combine some components, or arrange the components in different arrangements. Figure 1 The mobile terminal structure shown in FIG. 1 does not constitute a limitation on the mobile terminal, and the mobile terminal can include more or less components than those shown, or combine some components, or arrange the components in different arrangements.

[0048] Hereinafter, the components of the mobile terminal will be described in detail with reference to Figure 1 The components of the mobile terminal will be described in detail as follows:

[0049] The radio frequency unit 101 can be used for receiving and transmitting signals in the process of transmitting or receiving information or a call. Specifically, the radio frequency unit 101 receives downlink information from a base station and provides the received information to the processor 110 for processing. In addition, the radio frequency unit 101 transmits uplink data to the base station. Generally, the radio frequency unit 101 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 101 can communicate with a network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to GSM (Global System for Mobile communication), GPRS (General Packet Radio Service), CDMA2000 (Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division Duplexing-Long Term Evolution), TDD-LTE (Time Division Duplexing-Long Term Evolution), 5G, and 6G, and the like.

[0050] WiFi belongs to a short-range wireless transmission technology. The WiFi module 102 can help a user to send and receive e-mails, browse web pages, and access streaming media, and the like. It provides the user with wireless broadband Internet access. Although Figure 1 The WiFi module 102 is shown, but it is understood that it does not belong to the essential components of the mobile terminal, and can be omitted as needed without changing the essence of the application.

[0051] The audio output unit 103 can convert audio data, which is received by the radio frequency unit 101 or the WiFi module 102 or stored in the memory 109, into an audio signal and output the audio signal as sound when the mobile terminal 100 is in a call signal receiving mode, a call mode, a recording mode, a voice recognition mode, a broadcast reception mode, and the like. Moreover, the audio output unit 103 can provide audio output related to a particular function performed by the mobile terminal 100 (e.g., a call signal reception sound, a message reception sound, and the like). The audio output unit 103 can include a speaker, a buzzer, and the like.

[0052] The A / V input unit 104 is configured to receive audio or video signals. The A / V input unit 104 can include a graphics processor (GPU) 1041 and a microphone 1042. The graphics processor 1041 processes image data of a still picture or a video obtained by an image capture device (e.g., a camera) in a video call mode or an image call mode. Processed image frames can be displayed on the display unit 106. Processed image frames can be stored in the memory 109 (or other storage medium) or transmitted via the radio frequency unit 101 or the WiFi module 102. The microphone 1042 can receive sound (audio data) via the microphone 1042 in a phone call mode, a recording mode, a voice recognition mode, and the like, and can process such sound into audio data. Processed audio (voice) data can be converted into a format transmittable to a mobile communication base station in a phone call mode and outputted via the radio frequency unit 101. The microphone 1042 can implement various types of noise cancellation (or suppression) algorithms to cancel (or suppress) noise or interference generated in the process of receiving and transmitting audio signals.

[0053] The mobile terminal 100 also includes at least one sensor 105, such as a light sensor, a motion sensor, and other sensors. The light sensor includes an ambient light sensor and a proximity sensor, which can optionally adjust the brightness of the display panel 1061 according to the brightness of ambient light, and turn off the display panel 1061 and / or the backlight when the mobile terminal 100 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude of acceleration in each direction (generally three axes), and detect the magnitude and direction of gravity when at rest, which can be used for applications that recognize the posture of the mobile terminal (such as switching between landscape and portrait screens, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, knocking), and the like. The mobile terminal can also be configured with a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, and other sensors, which will not be described here.

[0054] The display unit 106 is configured to display information input by a user or information provided to the user. The display unit 106 can include a display panel 1061, which can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.

[0055] The user input unit 107 can be used to receive input numerals or character information, and to generate key signal inputs related to user settings of the mobile terminal and control of functions. Optionally, the user input unit 107 can include a touch panel 1071 and other input devices 1072. The touch panel 1071, also called a touch screen, can collect touch operations of a user on or proximity thereto (e.g., operations by the user using a finger, a touch pen, or any suitable object or accessory on or in proximity to the touch panel 1071) and drive corresponding connection devices according to a pre-set program. The touch panel 1071 can include two parts, a touch detecting device and a touch controller. The touch detecting device detects the user's touch position and detects a signal resulting from the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detecting device and converts it into touch coordinates, which are then transmitted to the processor 110, and can receive commands from the processor 110 and execute them. In addition, the touch panel 1071 can be implemented in various types such as a resistive type, a capacitive type, an infrared type, and a surface acoustic wave type. In addition to the touch panel 1071, the user input unit 107 can include other input devices 1072. Optionally, the other input devices 1072 can include one or more of, but are not limited to, a physical keyboard, a function key (e.g., a volume control button, a switch button, etc.), a trackball, a mouse, a joystick, etc.

[0056] Optionally, the touch panel 1071 can cover the display panel 1061, and when the touch panel 1071 detects a touch operation on or in proximity thereto, it transmits the information to the processor 110 to determine the type of touch event, and then the processor 110 provides a corresponding visual output on the display panel 1061 according to the type of touch event. Although in the above description, the touch panel 1071 and the display panel 1061 are implemented as two separate components to achieve the input and output functions of the mobile terminal, in some embodiments, the touch panel 1071 and the display panel 1061 can be integrated to achieve the input and output functions of the mobile terminal, without being limited in this regard. Figure 1

[0057] The interface unit 108 serves as an interface through which at least one external device can be connected with the mobile terminal 100. For example, the external device can include a wired or wireless headset port, an external power (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input / output (I / O) port, a video I / O port, an earphone port, etc. The interface unit 108 can be used to receive input (e.g., data information, power, etc.) from an external device and to transmit the received input to one or more elements within the mobile terminal 100, or can be used to transmit data between the mobile terminal 100 and the external device. ​

[0058] The memory 109 can be used to store software programs and various data. The memory 109 can mainly include a program storage area and a data storage area, and the program storage area can store an operating system, application programs required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; and the data storage area can store data created according to the use of the mobile terminal (such as audio data, a phone book, etc.), and the like. In addition, the memory 109 can include a high-speed random access memory, and can also include a nonvolatile memory such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state memory device.

[0059] The processor 110 is the control center of the mobile terminal, connects all parts of the mobile terminal through various interfaces and lines, executes various functions of the mobile terminal and processes data by running or executing software programs and / or modules stored in the memory 109 and calling data stored in the memory 109, and thus performs overall monitoring on the mobile terminal. The processor 110 can include one or more processing units; preferably, the processor 110 can integrate an application processor and a modem processor, and the application processor can mainly process an operating system, a user interface, and application programs, and the like, and the modem processor can mainly process wireless communication. It can be understood that the above-mentioned modem processor can also not be integrated into the processor 110.

[0060] The mobile terminal 100 can also include a power supply 111 (such as a battery) for supplying power to various components, and the power supply 111 can be logically connected to the processor 110 through a power management system, so as to realize functions such as management of charging, discharging, and power consumption management through the power management system.

[0061] Although Figure 1 The mobile terminal 100 can also include a Bluetooth module and the like, which are not shown here.

[0062] Based on the above mobile terminal hardware structure, various embodiments of the present application are proposed.

[0063] Figure 2 is a structural schematic diagram of the heat dissipation assembly according to the embodiment, please refer to Figure 2 The embodiment provides a heat dissipation assembly, which comprises a cold row 300 and a cold head 200. Optionally, the cold row 300 comprises a first heat dissipation part 301 and a second heat dissipation part 302 arranged at an included angle with the first heat dissipation part 301, and the first heat dissipation part 301 and the second heat dissipation part 302 are communicated and jointly form an integrated flow guide channel. Optionally, the cold head 200 is communicated with the flow guide channel, and in the working process, the cold head 200 is in contact with a heat source, conducts the heat generated by the heat source to the cold row 300, and rapidly discharges the heat through the first heat dissipation part 301 and the second heat dissipation part 302, so as to realize high-efficiency heat dissipation.

[0064] Optionally, the first heat dissipation part 301 and the second heat dissipation part 302 are arranged vertically, so that the cold row 300 forms an L-shaped structure, forming a more reasonable air inlet and air outlet path. Compared with the traditional plane cold row 300, the L-shaped structure can provide a larger heat dissipation area, so that the heat exchange of the cooling liquid is more sufficient. At the same time, the L-shaped cold row 300 effectively reduces the area occupied by the case by utilizing the vertical height of the internal space of the case, so that the whole machine is more compact.

[0065] Optionally, the first heat dissipation part 301 is arranged horizontally, and the second heat dissipation part 302 forms an angle greater than 90° with the first heat dissipation part 301. Because hot air has the characteristic of rising, this structure can more effectively guide the hot air to flow upward and be discharged, enhance the natural convection effect of the heat dissipation air duct, and thus improve the heat dissipation efficiency.

[0066] Optionally, the first heat dissipation part 301 includes a first heat dissipation fin group 304 and a first fan 306 arranged on the first heat dissipation fin group 304 for air inlet, and the second heat dissipation part 302 includes a second heat dissipation fin group 305 and a second fan 308 arranged on the second heat dissipation fin group 305 for air outlet. During operation, the first fan 306 introduces external cold air into the first heat dissipation part 301, improving the heat exchange efficiency of the cooling liquid, while the second fan 308 discharges the air heated by the heat source, forming a stable heat dissipation air duct, thereby optimizing the heat dissipation effect.

[0067] Optionally, the heat dissipation assembly further includes a heat dissipation bracket 309, a water tank 310 arranged on the heat dissipation bracket 309, and a water pump 307. The water tank 310 is filled with cooling liquid and is in communication with the flow guide channel. The water pump 307 is configured to drive the cooling liquid in the water tank 310 to circulate between the flow guide channel and the cold head 200, so that the cooling liquid can efficiently absorb the heat at the cold head 200 and transport it to the cold row 300, and then be dissipated through the heat dissipation fin groups of the first heat dissipation part 301 and the second heat dissipation part 302 and the second fan 308.

[0068] Optionally, an inlet and outlet water port 303 is formed on the cold row 300 and is in communication with the flow guide channel, and a corresponding inlet and outlet port 201 is arranged on the cold head 200, which is in communication with the inlet and outlet water port 303, so that the cooling liquid can be transported into the cold head 200.

[0069] The application also provides a case assembly, which includes the heat dissipation assembly in any of the above embodiments.

[0070] Figure 3 is a schematic view of the internal structure of the case assembly according to an embodiment, Figure 4 is a schematic view of the installation position of the cold head 200 according to an embodiment, please refer to Figures 3-4In the embodiment, the case assembly further includes a case body 400, and a CPU assembly 402 and a GPU assembly 401 arranged in the case body 400. Optionally, the CPU assembly 402 and the GPU assembly 401 are arranged in parallel.

[0071] Optionally, the heat dissipation assembly is installed in the case body 400 through the heat dissipation support 309, the first heat dissipation part 301 of the heat dissipation assembly is arranged at the top of the case body 400, and the second heat dissipation part 302 is arranged at one side of the case body 400. The first heat dissipation part 301 at the top can improve the air intake efficiency and introduce more cold air, and the second heat dissipation part 302 at the side of the case can facilitate the efficient exhaust of hot air, so as to optimize the air circulation in the case and improve the overall heat dissipation performance.

[0072] Optionally, as shown in Figure 4 The cold head 200 is arranged between the CPU assembly 402 and the GPU assembly 401 and is configured to dissipate heat from the CPU assembly 402 and the GPU assembly 401 at the same time. The conventional case usually configures independent heat dissipation devices for the CPU assembly 402 and the GPU assembly 401, which results in the need for additional space in the case to accommodate the two cold heads 200 and their corresponding heat dissipation pipelines, so that the case has a large volume, a complex layout, and the heat dissipation assemblies may interfere with each other, affecting the overall heat dissipation efficiency. In the embodiment, the single cold head 200 covers the two main heat generating elements at the same time, which reduces the occupied space of the cold head 200, optimizes the internal layout of the case, and effectively reduces the volume of the case, making the whole machine more compact.

[0073] Optionally, the CPU assembly 402 includes a mainboard and accessories such as a CPU, a memory bar, and a hard disk installed on the mainboard. Optionally, the mainboard can adopt a back-plug design, that is, the 24-pin interface (mainboard power supply interface), 16-pin interface (CPU power supply interface), USB interface, and boot interface on the mainboard are arranged on the side of the mainboard away from the cold head 200, and the CPU interface, PCIe interface (hard disk interface), and memory slot are arranged on the side close to the cold head 200. During the operation of the device, the heat generated by the CPU, the hard disk, and the memory bar can be more efficiently conducted to the cold head 200 and further quickly discharged through the cooling row 300, thereby improving the heat dissipation performance.

[0074] Optionally, the GPU assembly 401 includes a PCB board, a GPU core, and accessories installed on the PCB board. The GPU core is arranged on the side of the PCB board close to the cold head 200, so that the heat generated by the GPU core can be directly conducted to the cold head 200 and efficiently dissipated through the cooling liquid circulation, further improving the heat dissipation efficiency of the whole machine.

[0075] Figure 5 is a structural schematic view of the case body 400 according to the embodiment, Figure 6is a structural schematic view of the upper cover assembly 406 according to an embodiment, Figure 7 is a structural schematic view of the lower cover assembly 407 according to an embodiment, as Figures 5-6 shown, in this embodiment, the case body 400 includes a shell assembly, and upper cover assemblies 406 and lower cover assemblies 407 detachably mounted at both ends of the shell assembly. The upper cover assembly 406 includes an upper cover body 409, and a dust screen 410, a key panel 411 and a display screen 412 are provided on the upper cover body 409, the dust screen 410 is configured to prevent dust from entering the case interior, and the display screen 412 and the key panel 411 are electrically connected with the CPU assembly 402. Optionally, the key panel 411 is electrically connected with a power-on interface, facilitating the user to turn on and off the device through the key panel 411. Optionally, a temperature sensor is provided on the cold head 200, and the temperature sensor is electrically connected with the display screen 412, and the temperature information of the CPU assembly 402 and the GPU assembly 401 is displayed on the display screen 412 in real time.

[0076] Optionally, the shell assembly includes a main shell 403, and upper shells 404 and lower shells 405 detachably mounted at both ends of the main shell 403. The heat dissipation assembly is arranged in the main shell 403, and the CPU assembly 402 and the GPU assembly 401 are arranged in the lower shell 405, so that the main heat generating elements are arranged in a concentrated manner, facilitating efficient cooperation between the cold head 200 and the heat dissipation assembly, thereby improving the overall heat dissipation performance.

[0077] Optionally, the main shell 403 is an aluminum shell, which has good heat dissipation performance and structural strength, and can enhance the heat dissipation effect and stability. A ventilation area is formed on one side of the main shell 403 for optimizing the flow of heat dissipation air flow and improving the heat dissipation efficiency, and transparent windows 408 are installed on the other three sides of the main shell 403 to facilitate the user to observe the running state of the internal assemblies 402, 401 of the case.

[0078] Optionally, the upper cover assembly 406 further includes an upper cover bracket 413, and the upper cover body 409 is mounted on the upper shell 404 through the upper cover bracket 413 to ensure stable connection. As Figure 7 shown, the lower cover assembly 407 includes a lower cover body 416 and a lower cover bracket 415, and the lower cover body 416 is mounted on the lower shell 405 through the lower cover bracket 415 to seal the lower shell 405, prevent dust from entering and improve the case.

[0079] Optionally, the GPU assembly 401 is directly mounted on the lower shell 405, and the lower shell 405 is connected with a mainboard bracket 414, and the CPU assembly 402 is mounted on the mainboard bracket 414 to form a compact internal layout.

[0080] The application also provides a device comprising the case assembly in the above embodiments.

[0081] It can be understood that the above scenarios are only as examples and do not constitute a limitation on the application scenarios of the technical solutions provided by the embodiments of the present application. The technical solutions provided by the present application can also be applied to other scenarios. For example, those skilled in the art can know that as the system architecture evolves and new business scenarios emerge, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0082] The above sequence numbers of the embodiments of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0083] The units in the device of the embodiments of the present application can be combined, divided and deleted according to actual needs.

[0084] In the present application, for the same or similar term concept, technical solution and / or application scenario description, generally only the first time is described in detail, and when repeated, in order to be brief, it is generally not repeated, and when understanding the technical solutions of the present application, the same or similar term concept, technical solution and / or application scenario description which is not described in detail can refer to the relevant description before.

[0085] In the present application, the description of each embodiment has its own emphasis, and the parts not described or recorded in a certain embodiment can refer to the relevant description of other embodiments.

[0086] The technical features of the technical solutions of the present application can be combined arbitrarily, in order to make the description simple, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combination of these technical features does not exist contradictory, should be considered as the scope of the present application.

[0087] The above is only the preferred embodiments of the present application, and does not limit the patent scope of the present application, any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipating assembly, characterized by, The cooling assembly comprises a cold row (300) and a cold head (200), the cold row (300) comprises a first heat dissipation part (301) and a second heat dissipation part (302) arranged at an angle with the first heat dissipation part (301), the first heat dissipation part (301) and the second heat dissipation part (302) are communicated and form an integrated flow guide channel, and the cold head (200) is communicated with the flow guide channel.

2. The heat dissipating assembly of claim 1, wherein, The first heat dissipation part (301) comprises a first heat dissipation fin group (304) and a first fan (306) arranged on the first heat dissipation fin group (304) for air inlet, the second heat dissipation part (302) comprises a second heat dissipation fin group (305) and a second fan (308) arranged on the second heat dissipation fin group (305) for air outlet, and the first fan (306) and the second fan (308) jointly constitute a heat dissipation air duct.

3. The heat dissipating assembly of claim 1, wherein, The cooling assembly further comprises a cooling bracket (309), a water tank (310) and a water pump (307) arranged on the cooling bracket (309), the water tank (310) is filled with cooling liquid, the water tank (310) is communicated with the flow guide channel, and the water pump (307) is configured to drive the cooling liquid in the water tank (310) to circulate between the flow guide channel and the cold head (200).

4. A chassis assembly characterized by, The cooling assembly comprises the cooling assembly according to any one of claims 1 to 3.

5. The chassis assembly of claim 4, wherein, The case assembly further comprises a case body (400) and a CPU assembly (401) and a GPU assembly (402) arranged in the case body (400), the CPU assembly (401) and the GPU assembly (402) are arranged in parallel, and the CPU assembly (401) and the GPU assembly (402) are electrically connected.

6. The chassis assembly of claim 5, wherein, The first heat dissipation part (301) of the cooling assembly is arranged at the top of the case body (400), and the second heat dissipation part (302) of the cooling assembly is arranged at one side of the case body (400).

7. The chassis assembly of claim 6, wherein, The cold head (200) is arranged between the CPU assembly (401) and the GPU assembly (402), and the cold head (200) is configured to dissipate heat of the CPU assembly (401) and the GPU assembly (402).

8. The chassis assembly of any one of claims 5 to 7, wherein, The case body (400) comprises a shell assembly, and an upper cover assembly (406) and a lower cover assembly (407) detachably mounted at two ends of the shell assembly, the upper cover assembly (406) comprises an upper cover body (409), and a dustproof screen (410), a key plate (411) and a display screen (412) arranged on the upper cover body (409), and the key plate (411) is electrically connected with the CPU assembly (401).

9. The chassis assembly of claim 8, wherein, The shell assembly comprises a main shell (403), and an upper shell (404) and a lower shell (405) detachably mounted at two ends of the main shell (403), the cooling assembly is arranged in the main shell (403), and the CPU assembly (401) and the GPU assembly (402) are arranged in the lower shell (405).

10. An apparatus, comprising: The enclosure assembly as claimed in any one of claims 4 to 9.

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