Scanning electron microscope apparatus
By using a combination of a claw structure with a chuck and traction components in a scanning electron microscope, the warping and offset problems during wafer fixation are solved, achieving stable wafer clamping and smooth descent, ensuring normal equipment operation.
Patent Information
- Application Number
- CN202520421995.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-03-11
AI Technical Summary
Existing scanning electron microscope equipment is prone to wafer warping or displacement when fixing wafers, causing machine alarms.
The combination of a claw structure with a liftable chuck and traction components allows the claw structure to closely contact the wafer under gravity, helping the wafer to descend smoothly onto the worktable surface and reducing warping and offset.
It effectively fixes the wafer, reduces the chance of warping and shifting, and ensures the normal operation of the scanning electron microscope equipment.
Smart Images
Figure CN223858135U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The embodiment of the present disclosure relates to the technical field of electron microscopy, in particular to a scanning electron microscope device. BACKGROUND
[0002] The scanning electron microscope device is a high-precision instrument specially used for observing and analyzing the micro morphology and composition of a wafer surface. When the wafer falls into the tray with the chuck, the fixing device will clamp the wafer to fix the wafer in the tray. However, the fixing device may cause the wafer to warp or shift during the process of fixing the wafer, resulting in that the wafer cannot be effectively fixed and causing the machine to alarm.
[0003] Therefore, how to provide a technical solution to solve the problem of wafer warping or shifting caused by the fixing device has become a technical problem to be solved urgently. CONTENT OF THE UTILITY MODEL
[0004] Therefore, the embodiment of the present disclosure provides a scanning electron microscope device which can effectively solve the problem of wafer warping or shifting caused by the fixing device.
[0005] To solve the above technical problem, the embodiment of the present disclosure provides a scanning electron microscope device, comprising:
[0006] a workbench;
[0007] a liftable chuck disposed on the workbench and used for carrying a wafer;
[0008] a traction member, a first end of the traction member being coupled with the chuck;
[0009] a plurality of claw structures, the claw structures being partially or entirely located at the periphery of the chuck, a first end of each claw structure being coupled with a second end of the traction member, and the lifting direction of the second end of the claw structure being consistent with the lifting direction of the chuck under the traction of the traction member;
[0010] wherein, in the case that the chuck and the claw structure are lowered to the height of a scanning working state, the second end of the claw structure is in contact with the side surface of the wafer on the chuck.
[0011] Optionally, the workbench comprises a tray having a side wall and a bottom, and the chuck is located at the center of the bottom of the tray.
[0012] Optionally, under the traction of the traction member, the lifting direction of the second end of the traction member is opposite to the lifting direction of the chuck.
[0013] Optionally, the claw structure comprises a base at the first end and a clamping portion at the second end.
[0014] The clamping part has a groove for clamping the wafer;
[0015] The base is connected with the second end of the traction member;
[0016] During the chuck lifting process, the claw structure is rotated along the base by the traction member to lift the clamping part.
[0017] Optionally, the base has a connecting member;
[0018] The connecting member has a first end and a second end, and the first end of the connecting member is connected with the clamping part.
[0019] Optionally, the workbench comprises a tray, the tray has a side wall and a bottom, the bottom has a plurality of openings, and the base further has a movable shaft;
[0020] The movable shaft has a first end and a second end, the first end of the movable shaft is coupled with the second end of the connecting member, the second end of the movable shaft is connected with the traction chain, and the movable shaft is parallel to the connecting member;
[0021] The movable shaft has a fixing hole connected with the inner side wall of the opening, and the fixing hole is used to fix part or all of the movable shaft in the opening;
[0022] The connecting member is partially or entirely arranged outside the opening.
[0023] Optionally, the bottom of the tray further has a stepped portion surrounding the chuck, and the height of the outer peripheral step of the stepped portion is greater than the height of the inner side step;
[0024] When the claw structure fixes the wafer during the lowering to the scanning working state, the wafer is fixed on the surface of one step of the stepped portion.
[0025] Optionally, the depth of the groove of the clamping part is [1mm, 2mm).
[0026] Optionally, the scanning electron microscope device further comprises two groups of sensors;
[0027] Each group of sensors comprises at least one transmitting end and at least one receiving end, and the transmitting end and the receiving end are oppositely arranged;
[0028] The transmitting light of the transmitting end is directed to the receiving end, and the transmitting light is parallel to the bearing surface of the chuck bearing the wafer;
[0029] The height of the transmitting end and the receiving end is higher than the height of the wafer in the scanning working state, wherein the height of the wafer is the height of the wafer contacted by the claw structure when the chuck and the claw structure are lowered to the scanning working state.
[0030] Optionally, the number of the claw structures is three.
[0031] Optionally, the traction member satisfies one or more of the following:
[0032] The traction member includes a traction chain and a traction belt.
[0033] The material of the traction member is an elastic material.
[0034] Compared with the prior art, the technical scheme of the embodiment of the present disclosure has the following advantages:
[0035] In the scanning electron microscope device provided by the embodiment of the present disclosure, the claw structure is arranged to contact and hold the wafer, thereby reducing the probability of wafer warping and deviation. When the wafer is placed, the chuck is raised and drives the traction member connected thereto, and the traction member in turn pulls the claw structure to the preset position. When the wafer falls with the chuck to the claw structure at the preset position, under the action of gravity, the claw structure tightly contacts the wafer and stably falls to the surface of the workbench together with the wafer. During the falling process, the plurality of claw structures can contact and fix the wafer under the interaction force, so as to effectively solve the problem of wafer warping or deviation caused by the fixing device. BRIEF DESCRIPTION OF DRAWINGS
[0036] In order to more clearly illustrate the technical scheme of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments of the present disclosure or the prior art description. Obviously, the drawings described below are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.
[0037] Figure 1 A cross-sectional view of a workbench of a scanning electron microscope device in the embodiment of the present disclosure is shown;
[0038] Figure 2 A schematic view of a claw structure in the embodiment of the present disclosure is shown;
[0039] Figure 3 A top view of a workbench of a scanning electron microscope device in the embodiment of the present disclosure is shown.
[0040] Explanation of reference signs:
[0041] Chuck 100;
[0042] wafer 200;
[0043] traction member 300, fixed rod 310, first end 300a of the traction member, second end 300b of the traction member;
[0044] claw structure 400, base 410, connecting member 411, movable shaft 412, fixed hole 412a, clamping portion 420, first end 400a of the claw structure, second end 400b of the claw structure;
[0045] tray 500, step portion 510, opening 520;
[0046] sensor 600, transmitting end 610, receiving end 620. DETAILED DESCRIPTION
[0047] The technical solutions of the present disclosure will be described in detail below in conjunction with specific embodiments and their accompanying drawings. The embodiments described herein are specific specific embodiments of the present disclosure, which are used to illustrate the concept of the present disclosure; these descriptions are all explanatory and exemplary, and should not be understood as limiting the embodiments of the present disclosure and the protection scope of the present disclosure. In addition to the embodiments described herein, those skilled in the art can also employ other technical solutions that are obvious based on the content disclosed in the claims and the specification of the present application, which include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.
[0048] It should be noted that the drawings in the present embodiment are schematic drawings, which assist in illustrating the concept of the present disclosure and schematically represent the shape of each part and their mutual relationship. It should be understood that in order to clearly show the structure of each component of the present disclosure, the drawings are not drawn according to the same scale, and the same reference signs are used to represent the same parts in the drawings.
[0049] As described in the background, the scanning electron microscope device is a high-precision instrument specially used for observing and analyzing the micro-topography and composition of the wafer surface. When the wafer falls into the tray with the chuck, the fixing device will clamp the wafer to fix the wafer in the tray, but the fixing device may cause the wafer to warp or shift during the process of fixing the wafer, which may cause the wafer to be not effectively fixed, and may easily cause the machine to alarm.
[0050] To solve the above technical problems, the present disclosure provides a scanning electron microscope device, which sets a claw structure to resist and firmly clamp a wafer, thereby reducing the probability of wafer warping and deviation. When the wafer is placed, the chuck will rise and drive the traction member connected thereto, and the traction member will in turn pull the claw structure to the preset position. When the wafer falls with the chuck to the claw structure at the preset position, under the action of gravity, the claw structure will tightly resist the wafer, and the wafer will stably descend to the workbench surface together. During the descending process, the plurality of claw structures can resist and fix the wafer under the interaction force, so as to effectively solve the problem of wafer warping or deviation caused by the fixing device.
[0051] In order to make the above objects, features and advantages of the present disclosure more obvious and easy to understand, the present disclosure will be clearly and completely illustrated below with reference to the drawings.
[0052] Referring to Figure 1 , Figure 1 A cross-sectional view of a workbench of a scanning electron microscope device in an embodiment of the present disclosure is shown. Figure 1 Subgraph a and subgraph b in FIG. 1 are cut along dashed lines A1 and A2. Among them, Figure 1 Subgraph a in FIG. 1 is a cross-sectional view of the workbench when the claw structure resists the wafer to descend to the scanning state; Figure 1 Subgraph b in FIG. 1 is a cross-sectional view of the workbench when the claw structure rises to the preset position.
[0053] In this embodiment, the scanning electron microscope device can include a chuck 100, a traction member 300, a claw structure 400, and a tray 500.
[0054] In some embodiments, the workbench includes a tray 500 having a side wall and a bottom, and the chuck 100 is arranged at the center of the bottom of the tray 500.
[0055] Specifically, the chuck 100 is used to receive the wafer 200, and when the wafer 200 is placed, the chuck 100 will rise to receive the wafer 200, and after receiving the wafer 200, the chuck 100 will slowly descend with the wafer 200. The traction member 300 is used to connect the chuck 100 and the claw structure 400, and pull the claw structure 400 to rise with the chuck 100. The claw structure 400 is used to resist and fix the wafer 200.
[0056] In a specific embodiment, the chuck 100 can use a precision screw mechanism to move up and down by rotating a precision screw (such as a ball screw).
[0057] In another specific embodiment, the chuck 100 can be driven by a linear motor, which directly generates linear motion to drive the chuck 100 to rise and fall.
[0058] In some embodiments, the first end 300a of the traction member 300 is coupled to the chuck 100, and the second end 300b of the traction member 300 is coupled to the claw structure 400 to pull the claw structure 400, and the first end 300a of the traction member 300 rises with the rising of the chuck 100.
[0059] In some embodiments, the traction member 300 corresponds to the claw structure 400 one-to-one.
[0060] In one specific embodiment, the traction member 300 is a traction chain.
[0061] In another specific embodiment, the traction member 300 is a traction belt, and the traction belt is made of rubber.
[0062] In some embodiments, the material of the traction member 300 is an elastic material.
[0063] In some embodiments, the traction member 300 passes around a plurality of fixed rods 310 to change the pulling direction of the traction member 300, thereby changing the stress direction of the chuck 100 and the claw structure 400, so that the traction member 300 is more likely to pull the claw structure 400 to rise with the rising of the chuck 100.
[0064] In one specific embodiment, the number of the fixed rods 310 is 2.
[0065] In some embodiments, the claw structure 400 is partially or entirely located outside the chuck 100.
[0066] Here, the periphery of the chuck 100 refers to the edge position of the wafer 200 when the wafer 200 is lowered to the height of the scanning working state.
[0067] For reference Figure 1 and Figure 2 In some embodiments, the claw structure 400 has a first end 400a and a second end 400b.
[0068] Specifically, the first end 400a of each claw structure 400 is coupled to the second end 300b of the traction member 300, and the second end 400b of the claw structure 400 abuts against the side surface of the wafer 200 on the chuck 100 when the chuck 100 and the claw structure 400 are lowered to the height of the scanning working state.
[0069] Wherein, under the traction of the traction member 300, the lifting direction of the second end 400b of the claw structure 400 is consistent with the lifting direction of the chuck 100 in the direction perpendicular to the surface of the chuck 100 receiving the wafer 200; the lifting direction of the first end 400a of the claw structure 400 and the second end 300b of the traction member 300 is opposite to the lifting direction of the chuck 100.
[0070] In a specific embodiment, the claw structure 400 can have a position fixing point between the first end and the second end, in combination with the description of Figure 1 and Figure 2 The circle between the first end and the second end of the claw structure 400 is shown. Since the circle position is fixed, when the first end of the claw structure 400 is lowered, the second end is raised correspondingly. When the claw structure 400 is lifted to the preset position and abuts against the wafer 200, under the action of gravity, the plurality of claw structures 400 interact with the wafer 200 in the middle, thereby fixing the wafer 200, so as to effectively solve the problem of wafer 200 warping or deviation caused by the fixing device.
[0071] In a specific embodiment, the number of claw structures 400 is 3.
[0072] In some embodiments, the first end 400a of the claw structure 400 has a fixing adjustment device (not shown in the figure).
[0073] Specifically, the fixing adjustment device is connected with the second end 300b of the traction member 300, and the fixing adjustment device can fix the second end 300b of the traction member 300, and can also adjust the length of the traction member 300 by winding the traction member 300 through rotating a knob. Since the lifting height of the chuck 100 is fixed, the lifting height of the claw structure 400 can be adjusted by adjusting the length of the traction member 300.
[0074] Referring to Figure 2 , Figure 2 A schematic diagram of a claw structure in the embodiment of the present disclosure is shown.
[0075] In some embodiments, the claw structure 400 comprises a base 410.
[0076] Specifically, the base 410 is located at the first end 400a of the claw structure 400, and is a main body part of the claw structure 400. The base 410 is coupled with the second end 300b of the traction member 300.
[0077] During the lifting of the chuck 100, the traction member 300 pulls the base 410 to lift the claw structure 400.
[0078] In some embodiments, the base 410 has a first end and a second end, and the first end of the base 410 is coupled with the traction member 300.
[0079] In some embodiments, the claw structure 400 includes a clamping portion 420.
[0080] Specifically, the clamping portion 420 has a groove and is connected with the second end of the base 410 to abut against the wafer 200 and clamp and fix the wafer 200. When the chuck 100 is lifted, the traction member 300 is driven to move, and thus the traction member 300 can pull the first end of the base 410, so that the clamping portion 420 at the second end of the base 410 can be lifted.
[0081] In some embodiments, the groove of the clamping portion 420 has a depth of [1mm, 2mm).
[0082] Specifically, the edge of the wafer 200 has a certain width of the area, which is usually excluded from the effective device area. This is because the edge area is prone to cracks, crystalline defects or mechanical damage; in the processes of photolithography, thin film deposition, etching, etc., the uniformity of the edge area is poor; the edge area is more prone to adsorb particles, chemicals or metal contamination; the mechanical stress of the edge area is higher, which may cause the wafer 200 to be damaged or the device to fail. Therefore, the typical width of the unusable range of the edge of the wafer 200 is usually selected from 2mm to 5mm. Therefore, the depth of the groove of the clamping portion 420 is selected from [1mm, 2mm), which can reduce the possibility of the clamping portion 420 contacting the circuit of the wafer 200 and reduce the probability of damaging the wafer 200.
[0083] In some embodiments, the material of the clamping portion 420 is a silicone rubber material. The soft and elastic texture of the silicone rubber material can protect the wafer 200 from damage as much as possible, and can also abut against and fix the wafer 200, effectively reducing the probability of the wafer 200 from being deviated.
[0084] In some embodiments, the base 410 has a connecting member 411.
[0085] Specifically, the connecting piece 411 is located at the second end of the base 410, the connecting piece 411 has a first end and a second end, and the first end of the connecting piece 411 is connected with the clamping part 420. When the wafer 200 is lowered to the height of the scanning working state, the connecting piece 411 is parallel to the surface of the chuck 100 receiving the wafer 200. In this way, the clamping part 420 connected with the connecting piece 411 can resist and fix the wafer 200, and can make the wafer 200 more uniform in stress and less likely to shift or warp.
[0086] In some embodiments, the base 410 also has a movable shaft 412.
[0087] Specifically, the movable shaft 412 has a first end and a second end, the first end of the movable shaft 412 is coupled with the second end of the connecting piece 411, and the second end of the movable shaft 412 is coupled with the traction piece 300. The fixing adjusting device is located at the second end of the movable shaft 412 and is connected with the traction piece 300. After the fixing adjusting device adjusts and fixes the length of the traction piece 300, the movable shaft 412 can move under the traction of the traction piece 300.
[0088] In some embodiments, the movable shaft 412 has a fixing hole 412a.
[0089] Specifically, the movable shaft 412 can be fixed through the fixing hole 412a, and the movable shaft 412 can rotate along the fixing hole 412a. The traction piece 300 pulls the second end of the movable shaft 412, and the movable shaft 412 rotates along the fixing hole 412a, so that the connecting piece 411 coupled with the first end of the movable shaft 412 drives the clamping part 420 to rise.
[0090] In one specific embodiment, the movable shaft 412 is parallel to the connecting piece 411.
[0091] In combination with reference to Figure 2 and Figure 3 , Figure 3 a top view schematic diagram of a scanning electron microscope equipment workbench in an embodiment of the present disclosure is shown.
[0092] In some embodiments, the workbench comprises a tray 500, the tray 500 has a side wall and a bottom, the bottom has a plurality of openings 520, and the openings 520 correspond one-to-one to the claw structures 400.
[0093] Specifically, the fixing holes 412a on the claw structures 400 are connected with the inner side walls of the openings 520, and the fixing holes 412a are used to fix part or all of the claw structures 400 in the openings 520.
[0094] Part or all of the movable shafts 412 are fixed in the openings 520 by the fixing holes 412a, and the connecting members 411 are partially or entirely arranged outside the openings 520.
[0095] In some embodiments, the bottom of the tray 500 also has a stepped portion 510 surrounding the chuck 100.
[0096] In some embodiments, the height of the outer step of the stepped portion 510 is greater than the height of the inner step.
[0097] In some embodiments, when the claw structures 400 are fixed to the wafer 200 in the scanning state, the wafer 200 is fixed on the surface of one step of the stepped portion 510.
[0098] In some embodiments, the tray 500 with the stepped portion 510 arranged around the chuck 100 has a bottom with three bottom units of different heights, which are respectively: a first bottom unit flush with the chuck 100 in the lowest state; a second bottom unit of the inner step of the stepped portion 510; and a third bottom unit of the outer step of the stepped portion 510.
[0099] In a specific embodiment, the height of the first bottom unit is less than the height of the second bottom unit, and the height of the second bottom unit is less than the height of the third bottom unit, forming steps from low to high from the inside to the outside.
[0100] Specifically, when the chuck 100 is lowered with the wafer 200, the edge of the wafer 200 will contact the claw structures 400. Due to the gravity of the wafer 200 itself, the edge will exert a certain pressure on the claw structures 400, and multiple claw structures 400 can uniformly abut against the edge of the wafer 200 through interaction, thereby achieving preliminary fixation and positioning of the wafer 200.
[0101] When the chuck 100 is lowered, the wafer 200 is moved downward under the guidance and support of the plurality of claw structures 400. During this process, the force of the plurality of claw structures 400 ensures the stability and levelness of the wafer 200, preventing it from warping or deviating. Finally, the wafer 200 is smoothly landed on the second bottom unit under the action of gravity, while the chuck 100 continues to be lowered to the first bottom unit and is flush with the surface of the first bottom unit.
[0102] In some embodiments, the scanning electron microscope device further comprises two groups of sensors 600.
[0103] In particular, each group of sensors comprises at least one transmitting end 610 and at least one receiving end 620, which are oppositely arranged.
[0104] In one specific embodiment, the sensors 600 are optical fiber pair type photoelectric sensors.
[0105] In another specific embodiment, the sensors 600 are laser pair type photoelectric sensors.
[0106] In particular, the transmitting light of the transmitting end 610 is directed to the receiving end 620, and the transmitting light is parallel to the bearing surface of the chuck 100 bearing the wafer 200.
[0107] In particular, the height of the transmitting end 610 and the receiving end 620 is higher than the height of the wafer 200 in the scanning working state, wherein the height of the wafer 200 is the height of the wafer 200 contacted by the claw structure 400 when the chuck 100 and the claw structure 400 are lowered to the scanning working state.
[0108] If the transmitting light of the transmitting end 610 directed to the receiving end 620 is not received, it is determined that the transmitting light is blocked by the wafer 200, and the wafer 200 is deviated or warped.
[0109] It should be understood that "a plurality of" appearing in the embodiments of the present application means two or more.
[0110] The first, second, and the like appearing in the embodiments of the present application are only for illustrative and distinguishing purposes, and do not have any order, nor represent a special limitation on the number of devices in the embodiments of the present application, and cannot constitute any limitation on the embodiments of the present application.
[0111] It should be noted that the serial numbers of the steps in the embodiments do not represent a limitation on the execution order of the steps.
[0112] Although the present disclosure discloses the above, the present disclosure is not limited thereto. Any person skilled in the art, without departing from the spirit and scope of the present disclosure, can make various changes and modifications, therefore the protection scope of the present disclosure should be limited by the scope defined by the claims.
Claims
1. A scanning electron microscope apparatus, characterized by, The application relates to a scanning electron microscope device. The device comprises: a workbench; a liftable chuck arranged on the workbench and used for carrying a wafer; a traction element, a first end of the traction element being coupled with the chuck; a plurality of claw structures, the claw structures being partially or entirely located at the periphery of the chuck, a first end of each claw structure being coupled with a second end of the traction element, and the second end of the claw structure being lifted in the same direction as the chuck under the traction of the traction element; 2. The scanning electron microscope apparatus according to claim 1, characterized by wherein, when the chuck and the claw structure are lowered to a height of a scanning working state, the second end of the claw structure is in contact with the side of the wafer on the chuck.
3. The scanning electron microscope apparatus according to claim 1, characterized by The workbench comprises a tray, the tray having a side wall and a bottom, and the chuck is located at the center of the bottom of the tray.
4. The scanning electron microscope apparatus according to claim 1, characterized by Under the traction of the traction element, the lifting direction of the second end of the traction element is opposite to the lifting direction of the chuck. The claw structure comprises a base at the first end and a clamping part at the second end. The clamping part has a groove for clamping the wafer. The base is connected with the second end of the traction element.
5. The scanning electron microscope apparatus according to claim 4, characterized in that During the lifting of the chuck, the claw structure is rotated along the base under the traction of the traction element, so that the clamping part is lifted.
6. The scanning electron microscope apparatus according to claim 4, characterized by The depth of the groove of the clamping part is (1mm, 2mm). The base has a connecting element.
7. The scanning electron microscope apparatus according to claim 6, characterized in that The connecting element has a first end and a second end, and the first end of the connecting element is connected with the clamping part. The workbench comprises a tray, the tray having a side wall and a bottom, and the bottom has a plurality of openings. The base further has a movable shaft. The movable shaft has a first end and a second end, the first end of the movable shaft is coupled with the second end of the connecting element, and the second end of the movable shaft is coupled with the traction element.
8. The scanning electron microscope apparatus according to claim 7, characterized by The movable shaft has a fixing hole connected with the inner side wall of the opening, and the fixing hole is used for fixing part or all of the movable shaft in the opening. The connecting element is partially or entirely arranged outside the opening.
9. The scanning electron microscope apparatus according to claim 1, characterized by The bottom of the tray further has a stepped part surrounding the chuck, and the height of the outer peripheral step of the stepped part is greater than the height of the inner step. When the claw structure is fixed to the wafer during the lowering to the scanning working state, the wafer is fixed on the surface of one step of the stepped part. The scanning electron microscope device further comprises two groups of sensors. Each group of sensors comprises at least one transmitting end and at least one receiving end, and the transmitting end and the receiving end are oppositely arranged.
10. The scanning electron microscope apparatus of claim 1, wherein, The transmitting light of the transmitting end is directed to the receiving end, and the transmitting light is parallel to the carrying surface of the wafer carried by the chuck.
11. The scanning electron microscope apparatus of claim 1, wherein, The height of the transmitting end and the receiving end is higher than the height of the wafer in the scanning working state. The number of the claw structures is three. The traction element satisfies one or more of the following conditions: The traction element comprises a traction chain and a traction belt. The material of the traction element is an elastic material.