Battery thermal management device
By incorporating cooling fins, a heat dissipation plate, and a heat sink within the housing, the limitation of battery pack thermal management systems in vehicle configuration is resolved. This achieves uniform battery temperature management, improved heat dissipation efficiency, and enhanced structural strength at the bottom of the housing.
Patent Information
- Application Number
- CN202520003818.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-02
AI Technical Summary
Existing battery pack thermal management systems are limited by vehicle configuration and cannot effectively solve the heat dissipation problem of the battery system.
The system employs a structure consisting of a cooling chip assembly, a heat spreader, and a heat sink within the enclosure. By combining the semiconductor cooling chip assembly with the heat spreader, uniform battery temperature management is achieved, and the heat sink enhances the structural strength of the bottom of the enclosure.
It achieves effective regulation and heat dissipation of battery temperature, improves the heat dissipation efficiency of the battery system, and enhances the structural strength of the bottom of the casing.
Smart Images

Figure CN223858220U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to battery heat management technical field, especially relate to a battery heat management device. BACKGROUND
[0002] With the rise of new energy industry and the attention of the country to new energy industry, the battery provides power for electric vehicles, and plays a decisive role in the performance and endurance mileage of electric vehicles. Temperature has a greater impact on the performance and safety of power batteries. Most battery pack heat management methods on the market currently use natural cooling and liquid cooling. The heat management system of natural cooling is often limited by the configuration of the vehicle, and liquid cooling cannot be added. Therefore, a battery heat management device scheme is needed to solve the above problems and solve the heat dissipation problem of the battery system. SUMMARY
[0003] In view of the above problems, the utility model provides a kind of battery heat management device, including box and lid, box and lid form sealed space;The bottom of the inside of the box is equipped with refrigeration piece group;The inside of the box is fixedly installed with module, and the bottom of module is equipped with cold plate, and cold plate is in contact with refrigeration piece group;
[0004] The bottom of the outside of the box is equipped with mounting groove, and the mounting groove is equipped with radiating plate;
[0005] The number of refrigeration piece group, module, cold plate and radiating plate is set according to battery demand.
[0006] Further, the refrigeration piece group is a semiconductor refrigeration piece group, and the semiconductor refrigeration piece group is composed of a plurality of semiconductor refrigeration pieces in series or parallel.
[0007] Further, the cold plate is fixedly connected with the module through a heat-conducting medium.
[0008] Further, the semiconductor refrigeration piece group has a cold face and a hot face, the cold face is attached to the cold plate, and the hot face is attached to the radiating plate.
[0009] Further, the radiating plate and the cold plate are connected with the box by bolts.
[0010] Further, sealing cotton is arranged between the cold plate and the radiating plate, and refrigeration holes are formed in the sealing cotton;The semiconductor refrigeration piece group is fixed in the refrigeration holes.
[0011] Further, the cold face and the hot face of the refrigeration piece group are coated with a heat-conducting medium.
[0012] Further, the radiating plate adopts a fin structure, and the fin structure utilizes air convection or forced convection for heat dissipation.
[0013] Further, the box bottom is provided with a mounting hole, and the hot surface of the semiconductor refrigeration piece group is in contact with the heat dissipation plate through the mounting hole.
[0014] Further, the uniform cooling plate and the heat dissipation plate are made of a metal material with a large thermal conductivity.
[0015] Advantages
[0016] The advantages of the present application over the prior art are as follows:
[0017] 1. The application can transfer the cold energy to the bottom of the module through the uniform cooling plate when the module temperature is high, and the battery cells in the module are cooled; the heat dissipation plate is in contact with the refrigeration piece group to dissipate heat, and the heat dissipation plate is installed at the bottom of the box to improve the structural strength of the bottom of the box.
[0018] 2. The application can effectively isolate the cold energy loss of the uniform cooling plate and isolate the energy transmission between the cold surface and the hot surface of the semiconductor refrigeration piece group by installing heat insulation sealing cotton between the bottom of the box and the uniform cooling plate, and wrapping the semiconductor refrigeration piece group with the sealing cotton.
[0019] Other features and advantages of the present application will be described in the following description, and some of them will become apparent from the description, or will be understood by those skilled in the art through implementation of the present application. The purpose and other advantages of the present application can be achieved and obtained by the structure indicated in the description, claims and drawings. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.
[0021] Figure 1 An exploded view in the embodiment of the present application is shown.
[0022] Figure 2 A sectional view in the embodiment of the present application is shown.
[0023] Figure 3 A partial enlarged view of the bottom of the box is shown. Figure 2
[0024] In the figure, 1 is a box cover, 2 is a module, 3 is a uniform cooling plate, 4 is a semiconductor refrigeration piece group, 5 is sealing cotton, 6 is a box, 7 is a heat dissipation plate, and 8 is a heat conducting medium. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely explained in combination with the drawings in the embodiments of the utility model below, obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.
[0026] The application provides a battery thermal management device, referring to Figure 1 , comprising a box body 6 and a box cover 1, the box body 6 and the box cover 1 form a sealed space; the bottom of the inside of the box body 6 is provided with a refrigerating fin group; the inside of the box body 6 is fixedly provided with a module 2, the bottom of the module 2 is provided with an equal cooling plate 3, and the equal cooling plate 3 is in contact with the refrigerating fin group;
[0027] The bottom of the outside of the box body 6 is provided with a mounting groove, and the mounting groove is provided with a heat dissipation plate 7;
[0028] The number of the refrigerating fin group, the module 2, the equal cooling plate 3 and the heat dissipation plate 7 is set according to the battery demand. A sealed cavity is formed through the box body 6 and the box cover 1, the cavity can isolate the temperature inside and outside while ensuring the sealing performance of the battery; the equal cooling plate 3 is used for the effect of uniform temperature and heat transfer, when the temperature of the module 2 is relatively high, the refrigerating fin group transmits cold to the bottom of the module 2 through the equal cooling plate 3, and the battery cell in the module 2 is cooled; when the temperature of the module 2 is relatively low, the refrigerating fin group transmits heat to the bottom of the module 2 through the equal cooling plate 3, and the battery cell in the module 2 is heated;
[0029] In the process that the refrigerating fin group cools the module 2, the heat dissipation plate 7 is attached to the refrigerating fin group, the refrigerating fin group is cooled, and meanwhile the heat dissipation plate 7 is installed at the bottom of the box body 6 through the mounting groove, and the effect of enhancing the structural strength of the bottom of the box body 6 is achieved.
[0030] The inside of the box body 6 can be provided with one module 2, one refrigerating fin group, one equal cooling plate 3 and one heat dissipation plate 7; or three modules 2, one refrigerating fin group, one equal cooling plate 3 and one heat dissipation plate 7; the specific number can be adjusted according to the demand.
[0031] The application cools the battery cell in the module 2 through the equal cooling plate 3 when the temperature of the module 2 is relatively high; the heat dissipation plate 7 is in contact with the refrigerating fin group to cool the refrigerating fin group, and meanwhile the heat dissipation plate 7 is installed at the bottom of the box body 6 to improve the structural strength of the bottom of the box body 6.
[0032] In an embodiment of the utility model, the refrigerating piece group is a semiconductor refrigerating piece group 4, and the semiconductor refrigerating piece group 4 is composed of a plurality of semiconductor refrigerating pieces in series or parallel.
[0033] In an embodiment of the utility model, referring to Figure 3 The uniform cold plate 3 is fixedly connected with the module 2 through the heat conduction medium 8.
[0034] In an embodiment of the utility model, the semiconductor refrigerating piece group 4 has a cold face and a hot face, the cold face is attached to the uniform cold plate 3, and the hot face is attached to the heat dissipation plate 7.
[0035] In an embodiment of the utility model, the heat dissipation plate 7 and the uniform cold plate 3 are connected with the box body 6 through bolts.
[0036] In an embodiment of the utility model, referring to Figure 2 The uniform cold plate 3 and the heat dissipation plate 7 are provided with sealing cotton 5, the sealing cotton 5 is provided with refrigeration holes, and the semiconductor refrigerating piece group 4 is fixed in the refrigeration holes.
[0037] In an embodiment of the utility model, the cold face and the hot face of the refrigerating piece group are coated with heat conduction medium 8.
[0038] In an embodiment of the utility model, the fin structure utilizes air convection or forced convection to dissipate heat.
[0039] In an embodiment of the utility model, the box 6 is provided with mounting holes at the bottom, and the hot surface of the semiconductor refrigeration fin group 4 is in contact with the heat dissipation plate 7 through the mounting holes. By providing the mounting holes, the hot surface of the semiconductor refrigeration fin group 4 is in contact with the heat dissipation plate 7 through the mounting holes, so that the semiconductor refrigeration fin group 4 is cooled by the heat dissipation plate 7, and at the same time, the semiconductor refrigeration fin group 4 seals the mounting holes, further ensuring the heat insulation effect of the internal cavity of the box 6, and improving the structural strength of the bottom of the box 6 through the heat dissipation plate 7.
[0040] In an embodiment of the utility model, the uniform cooling plate 3 and the heat dissipation plate 7 are made of metal materials with large thermal conductivity. Preferably, the thermal conductivity of aluminum alloy is large, and the heat conduction performance is good, so that the overall heat conduction effect can be improved.
[0041] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced equivalently, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.
Claims
1. A battery thermal management device, characterized by, Including box (6) and box cover (1), the box (6) and the box cover (1) form a sealed space;The bottom of the box (6) is provided with a refrigeration fin group;The box (6) is fixedly provided with a module (2) inside, and the bottom of the module (2) is provided with an equal cooling plate (3), and the equal cooling plate (3) is in contact with the refrigeration fin group; The bottom of the box (6) is provided with a mounting groove, and the mounting groove is provided with a heat dissipation plate (7); The number of the refrigeration fin group, the module (2), the equal cooling plate (3) and the heat dissipation plate (7) is set according to the demand of the battery.
2. The battery thermal management device of claim 1, wherein, The refrigeration fin group is a semiconductor refrigeration fin group (4), and the semiconductor refrigeration fin group (4) is composed of a plurality of semiconductor refrigeration fins in series or parallel.
3. The battery thermal management device of claim 1, wherein, The equal cooling plate (3) is fixedly connected with the module (2) through a heat conducting medium (8).
4. The battery thermal management device of claim 2, wherein, The semiconductor refrigeration fin group (4) has a cold face and a hot face, the cold face is attached to the equal cooling plate (3), and the hot face is attached to the heat dissipation plate (7).
5. The battery thermal management device of claim 1, wherein, The heat dissipation plate (7) and the equal cooling plate (3) are connected with the box (6) through bolts.
6. The battery thermal management device of claim 2, wherein, The equal cooling plate (3) and the heat dissipation plate (7) are provided with sealing cotton (5), and the sealing cotton (5) is provided with a refrigeration hole;The semiconductor refrigeration fin group (4) is fixed in the refrigeration hole.
7. The battery thermal management device of claim 1, wherein, The cold face and the hot face of the refrigeration fin group are coated with a heat conducting medium (8).
8. The battery thermal management device of claim 1, wherein, The heat dissipation plate (7) adopts a fin structure, and the fin structure utilizes air convection or forced convection for heat dissipation.
9. The battery thermal management device of claim 4, wherein, The bottom of the box (6) is provided with a mounting hole, and the hot face of the semiconductor refrigeration fin group (4) is in contact with the heat dissipation plate (7) through the mounting hole.
10. The battery thermal management device of claim 1, wherein, The equal cooling plate (3) and the heat dissipation plate (7) adopt a metal material with large heat conductivity.