Combined sensor, microphone and electronic equipment

Abstract

The utility model discloses a combined sensor, a microphone and electronic equipment. The combined sensor comprises a shell which comprises a substrate, and the substrate is provided with a sound hole; the metal isolation piece is arranged in the shell and is connected to the substrate, and the metal isolation piece is connected to a ground wire of the substrate; the functional chip unit comprises a first MEMS chip and a first ASCI chip, the first MEMS chip is electrically connected to the first ASCI chip, and the first ASCI chip is located on the side, facing the substrate, of the metal isolation piece; the microphone chip unit comprises a second MEMS chip and a second ASIC chip, the second MEMS chip is located in the shell, the second MEMS chip is electrically connected to the second ASIC chip, and the second MEMS chip corresponds to the sound hole. The metal isolation piece is electrically connected to the ground wire of the substrate, and the first ASIC chip is arranged on the side, facing the substrate, of the metal isolation piece, so that electromagnetic shielding and heat shielding effects can be achieved on the second ASCI chip, and the pickup effect of the microphone chip unit is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroacoustic conversion technical field more particularly, relate to a kind of combination sensor, microphone and electronic equipment. BACKGROUND

[0002] In the related art, the combination sensor includes a microphone chip and a sensor with other functions, such as a barometric pressure sensor. When the combination sensor is working, the ASIC chip of the barometric pressure sensor and the like generates heat and electromagnetic waves. The heat causes air disturbance in the inner cavity of the device, and the electromagnetic waves affect the reception of signals by the microphone chip, thereby affecting the normal operation of the microphone chip and resulting in poor reception effect of the microphone chip.

[0003] Therefore, there is a need to provide a new technical solution to solve the above technical problems. SUMMARY

[0004] An object of the utility model is to provide a new technical solution for a combination sensor.

[0005] According to a first aspect of the utility model, a combination sensor is provided. The combination sensor includes:

[0006] A housing includes a substrate, and the substrate is provided with an acoustic hole.

[0007] A metal isolation member is provided in the housing and connected to the substrate. The metal isolation member is connected to the ground line of the substrate.

[0008] A functional chip unit includes a first MEMS chip and a first ASIC chip. The first MEMS chip is electrically connected to the first ASIC chip. The first ASIC chip is located on the side of the metal isolation member facing the substrate.

[0009] A microphone chip unit includes a second MEMS chip and a second ASIC chip. The second MEMS chip is located in the housing. The second MEMS chip is electrically connected to the second ASIC chip. The second MEMS chip corresponds to the acoustic hole.

[0010] Optionally, the metal isolation member and the substrate have a gap therebetween, and the gap is communicated with the acoustic hole.

[0011] Optionally, the first ASIC chip is provided in the substrate, and the first ASIC chip is electrically connected to the substrate.

[0012] Optionally, the first MEMS chip is mounted on the side of the metal isolation member away from the substrate.

[0013] Optionally, the metal isolation piece is provided with an avoiding hole, the metal isolation piece cover is arranged on the sound hole, the avoiding hole is communicated with the sound hole, and the second MEMS chip is arranged on the side of the metal isolation piece away from the substrate.

[0014] Optionally, the second ASIC chip is arranged in the substrate, and the second ASIC chip is electrically connected to the substrate.

[0015] Optionally, the second ASIC chip at least partially corresponds to the metal isolation piece.

[0016] Optionally, the metal isolation piece comprises a metal plate, and the metal plate is sealingly connected to the substrate at the outer end of the surface of the substrate.

[0017] Optionally, the metal isolation piece is welded or bonded to the substrate.

[0018] According to a second aspect of the present application, a microphone is provided. The microphone comprises the combined sensor according to the above embodiments.

[0019] According to a third aspect of the present application, an electronic device is provided. The electronic device comprises the microphone according to the above embodiments.

[0020] One technical effect of the present application is that the metal isolation piece is electrically connected to the ground of the substrate, and the first ASIC chip is arranged on the side of the metal isolation piece facing the substrate, so that the second ASIC chip can be electromagnetically shielded and thermally shielded, thereby improving the pickup effect of the microphone chip unit.

[0021] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0023] Figure 1 is a structural schematic view of a combined sensor according to an embodiment of the present application.

[0024] Reference Signs:

[0025] 1, housing; 11, substrate; 111, sound hole; 12, shell; 2, metal isolation piece; 21, avoiding hole; 3, gap; 4, functional chip unit; 41, first MEMS chip; 42, first ASIC chip; 5, microphone chip unit; 51, second MEMS chip; 52, second ASIC chip. DETAILED DESCRIPTION

[0026] Various exemplary embodiments of the present application will now be described in detail with reference to the drawings. Note that the relative arrangement, numerical expressions, and numerical values of components and steps set forth in these embodiments are not limiting to the scope of the present application unless specifically stated otherwise.

[0027] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the application, its application, or uses.

[0028] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and apparatus can be considered part of the specification.

[0029] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Thus, other examples of the exemplary embodiments can have different values.

[0030] It should be noted that like reference numerals and letters in the various figures indicate similar items, and thus, once an item is defined in one figure, it is not necessary to discuss it further in subsequent figures.

[0031] According to one embodiment of the present application, a combined sensor is provided. As shown in Figure 1 The combined sensor includes a housing 1, a metal isolation piece 2, a functional chip unit 4, and a microphone chip unit 5. The housing 1 includes a substrate 11 provided with an acoustic hole 111. The metal isolation piece 2 is disposed in the housing 1 and connected to the substrate 11. The metal isolation piece 2 is connected to a ground wire of the substrate 11. The functional chip unit 4 includes a first MEMS chip 41 and a first ASIC chip 42. The first MEMS chip 41 is electrically connected to the first ASIC chip 42. The first ASIC chip 42 is located on a side of the metal isolation piece 2 facing the substrate 11. The microphone chip unit 5 includes a second MEMS chip 51 and a second ASIC chip 52. The second MEMS chip 51 is located in the housing 1. The second MEMS chip 51 is electrically connected to the second ASIC chip 52. The second MEMS chip 51 corresponds to the acoustic hole 111.

[0032] As shown in Figure 1As shown, in this example, the metal isolator 2 can be connected to the ground wire of the substrate 11 through wires such as gold wires, so that the metal isolator 2 is grounded. The first ASIC chip is located on the side of the metal isolator 2 facing the substrate 11, so that it can play the role of electromagnetic shielding and thermal shielding for the second ASIC chip, which is conducive to improving the sound pickup effect of the microphone chip unit 5 and enhancing the anti-crosstalk effect of the combined sensor.

[0033] In this example, the first ASIC chip 42 generates heat during operation. The metal isolator 2 provides some heat insulation, thereby reducing the impact of the heat generated by the first ASIC chip 42 on the gas inside the housing 1, and thus reducing the impact on the second MEMS chip 51. Furthermore, the metal isolator 2 is connected to the ground line of the substrate 11, thereby providing electromagnetic shielding to reduce the influence of the first ASIC chip 42 on the second ASIC chip.

[0034] In this example, functional chip unit 4 can be a pressure sensor or a temperature sensor, etc. Functional chip unit 4 can also generate a clock signal, which can be used to synchronize the various parts of the circuit combining the sensors. The specific structure of functional chip unit 4 can be determined by those skilled in the art based on the actual situation, and is not specifically limited here.

[0035] Furthermore, the microphone chip unit 5 can be used for electroacoustic rotation, that is, the second MEMS chip 51 corresponds to the sound hole 111, thereby being able to receive sound signals entering from the sound hole 111. The second ASIC chip 52 is connected to the second MEMS chip 51 and the substrate 11 respectively.

[0036] In this example, the metal spacer 2 can be made of metal such as brass or steel. Those skilled in the art can decide based on the actual situation, and no specific limitation is made here.

[0037] In this example, the substrate 11 can be a PCB board, and the first MEMS chip 41, the first ASIC chip 42, the second MEMS chip 51, and the second ASIC chip 52 are all electrically connected to the PCB board. The metal isolator 2 is connected to the GND (ground) of the PCB board.

[0038] like Figure 1 As shown, in this example, the housing 1 further includes an outer shell 12, which covers one surface of the substrate 11, thereby surrounding the inner cavity forming the housing 1. The functional chip unit 4 and the microphone chip unit 5 can be disposed in the inner cavity. The open end of the outer shell 12 can be fixedly connected to the substrate 11 by means of welding, bonding, or screwing, etc., as can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0039] In one example, such as Figure 1As shown, there is a gap 3 between the metal isolator 2 and the substrate 11, and the gap 3 is connected to the sound hole 111.

[0040] In this example, the first ASIC chip is located on the side of the metal isolator 2 facing the substrate 11, and there is a gap 3 between the metal isolator 2 and the substrate 11. When the first ASIC chip heats up, it can affect the air in the gap 3, for example, causing the air in the gap 3 to expand. Since the gap 3 is connected to the sound hole 111, pressure can be released through the sound hole 111, which can reduce the impact of the heat generated by the first ASIC chip on the gas in the cavity of the housing 1, thereby avoiding any impact on the second MEMS chip 51.

[0041] like Figure 1 As shown, in this example, the first ASIC chip is disposed within the substrate 11 and electrically connected to the substrate 11. The first ASIC chip can be embedded within the substrate 11, which facilitates further electromagnetic and thermal shielding of the first ASIC chip. Furthermore, since the first ASIC chip is disposed within the substrate 11, it can be directly electrically connected to the substrate 11, eliminating the need for wire connections and thus reducing electromagnetic interference from wires. Additionally, embedding the first ASIC chip within the substrate 11 also saves installation space, which is beneficial for the miniaturization design of the combined sensor.

[0042] Alternatively, the first ASIC chip can be disposed in the gap 3 between the metal isolator 2 and the substrate 11, or the first ASIC chip can be partially embedded in the substrate 11. Of course, the specific arrangement of the first ASIC chip can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0043] In one example, such as Figure 1 As shown, the metal spacer 2 includes a metal plate, the outer end of which is sealed to the substrate 11 facing the surface of the substrate 11.

[0044] like Figure 1 As shown, in this example, the metal spacer 2 can be a plate structure, i.e., a metal plate. The outer end of the metal plate facing the substrate 11 is sealed to the substrate 11, thereby ensuring the airtightness of the inner cavity of the housing 1. By setting the metal spacer 2 as a plate structure, the space occupied by the metal spacer 2 can be saved, thereby ensuring the compactness of the overall structure of the combined sensor and facilitating the miniaturization design of the combined sensor.

[0045] In this example, the metal isolation member 2 is welded or bonded to the substrate 11, which can be determined by those skilled in the art, and is not specifically limited here. For example, the surface of the metal plate facing the substrate 11 can be welded to the substrate 11 by soldering, and the soldering points can support the metal plate so that the metal plate can have a gap 3 with the substrate 11.

[0046] As shown in Figure 1 In this example, the metal isolation member 2 is provided with a relief hole 21, the metal isolation member 2 covers the sound hole 111, the relief hole 21 communicates with the sound hole 111, and the second MEMS chip 51 is mounted on the side of the metal isolation member 2 away from the substrate 11. The external sound signal can pass through the sound hole 111 and the relief hole 21 in turn, and then be transmitted to the second MEMS chip 51. The outer end of the metal isolation gap is sealingly connected to the surface of the substrate 11, and the metal isolation member 2 covers the sound hole 111, so as to ensure the sealing effect and facilitate the assembly of the second MEMS chip 51. That is, the second MEMS chip 51 can be directly welded or bonded to the surface of the metal isolation member 2 away from the substrate 11, and correspond to the relief hole 21.

[0047] Among them, the shape of the sound hole 111 and the relief hole 21 can be circular, square, oval or other reasonable shape, which can be determined by those skilled in the art according to the actual situation, and is not specifically limited here.

[0048] In this example, the metal isolation member 2 can be a square metal plate, and the edges of the surface of the metal plate facing the substrate 11 are sealingly connected to the substrate 11. The connection between the metal plate and the substrate 11 surrounds the outer periphery of the sound hole 111. The metal isolation member 2 can also be a circular or oval structure, which can be determined by those skilled in the art according to the actual situation, and is not specifically limited here.

[0049] Alternatively, the metal isolation member 2 can also be a shell structure, the metal isolation member 2 is arranged on the surface of the substrate 11 in the inner cavity of the shell 1, the open end of the metal isolation member 2 can cover the sound hole 111, and is sealingly connected to the surface of the substrate 11. The metal isolation member 2 can form a gap 3 with the substrate 11, and the gap 3 extends to communicate with the sound hole 111. Of course, the specific structure of the metal isolation member 2 can be determined by those skilled in the art according to the actual situation, and is not specifically limited here.

[0050] In one example, as shown in Figure 1 The first MEMS chip 41 is mounted on the side of the metal isolation member 2 away from the substrate 11.

[0051] As shown in Figure 1As shown, in this example, the first MEMS chip 41 can be fixedly connected to the metal isolation member 2 on the side away from the substrate 11 by means of welding or bonding, so as to make reasonable use of space, ensure the compactness of the overall structure of the combined sensor, and facilitate the miniaturization design of the combined sensor.

[0052] Of course, the specific installation method of the first MEMS chip 41 can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0053] In one example, such as Figure 1 As shown, the second ASIC chip is disposed within the substrate 11, and the second ASIC chip 52 is electrically connected to the substrate 11.

[0054] like Figure 1 As shown, in this example, the second ASIC chip 52 can be embedded within the substrate 11, which further improves the anti-interference capability of the second ASIC chip 52. Furthermore, the second ASIC chip 52 can be directly electrically connected to the substrate 11, eliminating the need for wire connections and thus reducing electromagnetic interference from wires. Additionally, embedding the second ASIC chip 52 within the substrate 11 also saves installation space, facilitating the miniaturization design of the combined sensor.

[0055] Alternatively, the second ASIC chip 52 may be at least partially embedded in the substrate 11. This can be determined by those skilled in the art based on the actual situation, and no specific limitation is made here.

[0056] In one example, such as Figure 1 As shown, the second ASIC chip 52 corresponds at least partially to the metal isolator 2.

[0057] In this example, the second ASIC chip 52 is embedded within the substrate 11. The second ASIC chip 52 at least partially corresponds to the metal isolator 2. That is, the projection of the metal isolator 2 onto the substrate 11 can cover at least a portion of the second ASIC chip 52. This helps to reduce the impact of the heat generated by the second ASIC chip 52 during operation on the internal gas of the housing 1, enabling the second MEMS chip 51 to sense external sound signals more promptly, sensitively, and quickly.

[0058] According to another embodiment of the utility model, provide a kind of microphone.The microphone includes the combined sensor described in the above embodiment.The combined sensor includes shell 1, metal isolation piece 2, functional chip unit 4 and microphone chip unit 5.Wherein, shell 1 includes substrate 11, the substrate 11 is equipped with sound hole 111.The metal isolation piece 2 is located in the shell 1, and is connected to the substrate 11, and the metal isolation piece 2 is connected to the ground wire of the substrate 11.The functional chip unit 4 includes first MEMS chip 41 and first ASCI chip 42, the first MEMS chip 41 is electrically connected to the first ASCI chip 42, and the first ASCI chip 42 is located at the side of the metal isolation piece 2 towards the substrate 11.The microphone chip unit 5 includes second MEMS chip 51 and second ASIC chip 52, the second MEMS chip 51 is located in the shell 1, the second MEMS chip 51 is electrically connected to the second ASIC chip 52, and the second MEMS chip 51 corresponds to the sound hole 111.Metal isolation piece 2 can be connected to the ground wire of substrate 11 by gold wire or other conductive wire, so that metal isolation piece 2 is grounded, and the first ASIC chip is located at the side of metal isolation piece 2 towards the substrate 11, so that the second ASCI chip can be electromagnetically shielded and heat shielded, to facilitate improving the pickup effect of microphone chip unit 5, and improving the anti-crosstalk effect of combined sensor.

[0059] Of course, since the microphone adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0060] According to another embodiment of the utility model, an electronic device is provided.The electronic device includes the microphone described in the above embodiment.The electronic device can be selected as smart wearable device, such as smart watch or smart bracelet etc., or the electronic device can be mobile phone etc., since the electronic device adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0061] In the above embodiment, the difference between each embodiment is mainly described, and the different optimization features between each embodiment can be combined to form a better embodiment without contradiction.Considering the brevity of writing, it will not be repeated here.

[0062] Although some specific embodiments of the utility model have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the utility model.Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the utility model.The scope of the utility model is defined by the appended claims.

Claims

1. A combination sensor characterized by, The application relates to a microphone, comprising: a housing comprising a substrate provided with a sound hole; a metal isolation piece arranged in the housing and connected to the substrate, the metal isolation piece being connected to a ground wire of the substrate; a functional chip unit comprising a first MEMS chip and a first ASIC chip, the first MEMS chip being electrically connected to the first ASIC chip, the first ASIC chip being located on a side of the metal isolation piece facing the substrate; a microphone chip unit comprising a second MEMS chip and a second ASIC chip, the second MEMS chip being arranged in the housing, the second MEMS chip being electrically connected to the second ASIC chip, the second MEMS chip corresponding to the sound hole.

2. The combination sensor of claim 1, wherein, The metal isolation piece and the substrate have a gap therebetween, the gap being communicated with the sound hole.

3. The combination sensor of claim 1, wherein, The first ASIC chip is arranged in the substrate, and the first ASIC chip is electrically connected to the substrate.

4. The combination sensor of claim 1, wherein, The first MEMS chip is mounted on a side of the metal isolation piece away from the substrate.

5. The combination sensor of claim 1, wherein, The metal isolation piece is provided with a relief hole, the metal isolation piece covers the sound hole, the relief hole is communicated with the sound hole, and the second MEMS chip is mounted on a side of the metal isolation piece away from the substrate.

6. The combination sensor of claim 1, wherein, The second ASIC chip is arranged in the substrate, and the second ASIC chip is electrically connected to the substrate.

7. The combination sensor of claim 6, wherein, The second ASIC chip at least partially corresponds to the metal isolation piece.

8. The combination sensor of claim 2, wherein, The metal isolation piece comprises a metal plate, and an outer end of the metal plate facing a surface of the substrate is sealingly connected to the substrate.

9. A microphone, characterized by The application further relates to a combination sensor comprising the microphone according to any one of claims 1 to 8.

10. An electronic device, comprising: The application further relates to a microphone comprising the microphone according to claim 9.

Images