Microwave heating device

Abstract

The utility model provides a microwave heating device which comprises a cavity structure, one of a top plate and a bottom plate of the cavity structure comprises a plate body and an extension part extending away from the plate body, the extension part is provided with a mounting part and a grounding part, the mounting part is provided with a mounting surface facing the other one of the top plate and the bottom plate, and the cavity structure further comprises a covering part, the covering part is arranged on the mounting surface; and the magnetron grounding plate is arranged on one side, far away from the mounting part, of the covering part, and the magnetron grounding plate is provided with a grounding surface facing the other one of the top plate and the bottom plate. The magnetron grounding plate and the grounding part are arranged on the same side, so that the turn-over operation in the cavity spraying process can be reduced, the powder suction efficiency of cavity spraying is improved, and the overall production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of cooking appliances, in particular to a microwave heating device. BACKGROUND

[0002] The magnetron of the microwave oven is usually in a horizontal lying posture and is arranged on the side plate of the cavity through the magnetron grounding surface, and the grounding part of the microwave oven is generally arranged on the back plate of the cavity. In order to realize the functions of the magnetron grounding surface and the grounding part, the coating materials on the surfaces of the two are removed through the powder suction step in the cavity spraying process. However, due to the long distance between the two, additional manpower is needed to turn over the cavity during the cavity spraying process, resulting in low efficiency of the cavity spraying process. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the technical problem to be solved by the present application is how to improve the efficiency of the cavity spraying process.

[0004] To solve the above technical problem, the first aspect of the present application provides a microwave heating device, which comprises: a cavity structure, one of the top plate and the bottom plate of the cavity structure comprises a plate body and an extension part extending away from the plate body, the extension part has a mounting part and a grounding part, the mounting part has a mounting surface facing the other one of the top plate and the bottom plate, and the cavity structure further comprises a covering part arranged on the mounting surface; and a magnetron grounding plate arranged on the side of the covering part away from the mounting part, the magnetron grounding plate has a grounding surface facing the other one of the top plate and the bottom plate.

[0005] In an embodiment, the mounting part comprises a main body part and an engaging part arranged on the outer edge of the main body part, the mounting surface is located on the engaging part, and the grounding part extends from the engaging part to the side away from the main body part.

[0006] In an embodiment, the grounding part is arranged staggered with the magnetron grounding plate in the direction from the top plate to the bottom plate.

[0007] In an embodiment, the microwave heating device further comprises a magnetron, and the magnetron is arranged on the grounding surface.

[0008] In an embodiment, the emission end of the magnetron faces one of the top plate and the bottom plate.

[0009] In an embodiment, the plate body corresponds to the heating cavity of the microwave heating device.

[0010] In an embodiment, the microwave heating device further comprises a waveguide, and the covering part and the mounting part form a waveguide cavity, and the waveguide is arranged in the waveguide cavity.

[0011] In an embodiment, the cover has a first through hole, the magnetron grounding plate has a second through hole, the first through hole and the second through hole are through, and the magnetron is coupled to the waveguide through the first through hole and the second through hole.

[0012] In an embodiment, the magnetron grounding plate comprises a limiting portion, and the limiting portion extends from the magnetron grounding plate to the other one of the top plate and the bottom plate.

[0013] In an embodiment, the microwave heating device comprises a microwave oven or a micro steam oven.

[0014] The beneficial effects of the present application are: by arranging the grounding portion on the extension of one of the top plate and the bottom plate of the cavity structure, and arranging the magnetron grounding plate on the side of the cover away from the mounting portion, and arranging the cover on the mounting surface facing the other one of the top plate and the bottom plate, the magnetron grounding plate and the grounding portion are integrated on the same side and close to each other. Therefore, during the cavity spraying process, the magnetron grounding plate and the grounding portion do not need to be flipped over during the powder suction step, which improves the efficiency of the cavity spraying process and improves the overall production efficiency. In addition, by arranging the top plate or the bottom plate to have an extension, and changing the grounding portion from being arranged on the back plate of the cavity structure to being arranged on the extension of the top plate or the bottom plate, the overall strength of the cavity structure is improved, and the stability of the microwave heating device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0016] Figure 1 is one of the structure schematic diagrams of the microwave heating device provided by the embodiments of the present application;

[0017] Figure 2 is the second structure schematic diagram of the microwave heating device provided by the embodiments of the present application;

[0018] Figure 3 is Figure 1 is a local enlarged schematic diagram of position A in FIG.

[0019] Explanation of main reference signs:

[0020] Microwave heating device 100; cavity structure 110; top plate 111; bottom plate 112; plate body 113; extension 114; mounting portion 115; mounting surface 1151; main body portion 1152; joint portion 1153; grounding portion 116; grounding hole 1161; protruding portion 1162; cover portion 117; first through hole 1171; back plate 118; avoiding groove 1181; magnetron grounding plate 120; grounding surface 1201; second through hole 1202; limiting portion 1203; mounting hole 1204; magnetron 130; emitting end 131; heating cavity 140; waveguide tube 150; waveguide cavity 151. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] The terms "first", "second", "third" in the present application are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0023] In this document, reference to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. It is expressly understood that the embodiments described herein are merely examples from a much larger number of possible embodiments. It is expressly understood that the descriptions of the embodiments are intended to be illustrative only and are not intended to be limiting in any way.

[0024] In the description of the embodiments of the present application, the term "and / or" is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0025] In the description of the embodiments of the present application, the technical terms "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0026] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanical connection, or it can be electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0027] In the related art, the magnetron of the microwave oven is generally in a horizontal lying posture and is arranged on the side plate of the cavity through the magnetron grounding surface, and the grounding part of the microwave oven is generally arranged on the back plate of the cavity. In order to realize the functions of the magnetron grounding surface and the grounding part, the coating material on the surface of the magnetron grounding surface and the grounding part needs to be removed through the powder suction step during the cavity spraying process. However, since they are not on the same side and are far away, at least two employees are needed to turn over the cavity and perform the powder suction operation during the cavity spraying process, which results in low efficiency of the cavity spraying process, and further affects the overall production efficiency.

[0028] In order to solve the above technical problems, with reference to Figure 1 and Figure 2 , Figure 1 is one of the structure schematic diagrams of the microwave heating device provided by the embodiments of the present application, Figure 2Fig. 2 is a structural schematic diagram of a microwave heating device according to an embodiment of the present application. The first aspect of the present application provides a microwave heating device 100, which comprises: a cavity structure 110, one of a top plate 111 and a bottom plate 112 of the cavity structure 110 comprises a plate body 113 and an extension 114 extending away from the plate body 113, the extension 114 has a mounting portion 115 and a grounding portion 116, the mounting portion 115 has a mounting surface 1151 facing the other one of the top plate 111 and the bottom plate 112, the cavity structure 110 further comprises a cover portion 117, the cover portion 117 is arranged on the mounting surface 1151; and a magnetron grounding plate 120 arranged on a side of the cover portion 117 away from the mounting portion 115, the magnetron grounding plate 120 has a grounding surface 1201 facing the other one of the top plate 111 and the bottom plate 112.

[0029] In the technical scheme of this embodiment, by arranging the grounding portion 116 on the extension 114 of one of the top plate 111 and the bottom plate 112 of the cavity structure 110, and arranging the magnetron grounding plate 120 on a side of the cover portion 117 away from the mounting portion 115, and arranging the cover portion 117 on the mounting surface facing the other one of the top plate 111 and the bottom plate 112, the magnetron grounding plate 120 and the grounding portion 116 are integrated on the same side and close to each other. Therefore, when performing the powder suction step on the magnetron grounding plate 120 and the grounding portion 116 during the cavity spraying process, it is not necessary to spend additional manpower to turn over the cavity structure 110, which is beneficial to improve the efficiency of the cavity spraying process, and further improve the overall production efficiency. In addition, by arranging the top plate 111 or the bottom plate 112 with the extension 114, and changing the grounding portion 116 from the conventional arrangement on the back plate 118 of the cavity structure 110 to the arrangement on the extension 114 of the top plate 111 or the bottom plate 112, it is beneficial to improve the overall strength of the cavity structure 110, and further improve the stability of the microwave heating device 100.

[0030] It can be understood that after the powder suction step is performed on the magnetron grounding plate 120 and the grounding portion 116, the insulating coating material on the surface is also removed, and at this time the surfaces of the magnetron grounding plate 120 and the grounding portion 116 are both conductive metal materials. In addition, the metal can not only conduct electricity, but also shield microwaves inside the metal. Therefore, in addition to the magnetron grounding plate 120 being able to realize grounding of the magnetron 130 and other electronic elements inside the microwave heating device 100, the magnetron grounding plate 120 can also shield the microwaves generated by the magnetron 130, reducing the probability of interference with other electronic elements inside the microwave heating device 100 due to microwave leakage.

[0031] Optionally, the plate body 113 and the extension 114 are in an integrated structure. It can be understood that the integrated structure has good mechanical properties, and by setting the plate body 113 and the extension 114 in an integrated structure, the connection strength of the plate body 113 and the extension 114 can be improved, thereby facilitating the improvement of the overall strength of the cavity structure 110.

[0032] In an embodiment, as shown in FIG. 1, the mounting portion 115 includes a main body portion 1152 and an engaging portion 1153 provided at the outer edge of the main body portion 1152, and the mounting surface 1151 is located at the engaging portion 1153. The grounding portion 116 extends from the engaging portion 1153 toward the side away from the main body portion 1152. Figure 2

[0033] In the technical solution of this embodiment, by setting the main body portion 1152 and the engaging portion 1153 provided at the outer edge of the main body portion 1152, the mounting portion 115 can be precisely positioned through the engaging portion 1153, thereby enabling more accurate connection with the cover portion 117. Furthermore, the main body portion 1152 and the engaging portion 1153 can together form the waveguide cavity 151 with the cover portion 117, thereby facilitating the microwave generated by the magnetron 130 to enter the heating cavity 140 through the extension 114. In addition, by setting the grounding portion 116 to extend from the engaging portion 1153 toward the side away from the main body portion 1152, the grounding portion 116 is combined with the engaging portion 1153. In addition, since the mounting surface 1151 is located at the engaging portion 1153 and the mounting surface 1151 is directed toward one of the top plate 111 and the bottom plate 112, i.e., the engaging portion is also directed toward one of the top plate 111 and the bottom plate 112, it can be understood that the grounding portion 116 is also directed toward one of the top plate 111 and the bottom plate 112. This design of position enables the magnetron grounding plate 120 and the grounding portion 116 to be on the same side and also directed toward the same direction, which facilitates the powder suction operation of the magnetron grounding plate 120 and the grounding portion 116 during the cavity spraying process, thereby facilitating the improvement of the efficiency of the cavity spraying process.

[0034] In an embodiment, the grounding portion 116 is arranged to be staggered with the magnetron grounding plate 120 in the direction from the top plate 111 to the bottom plate 112.

[0035] In the technical solution of this embodiment, the grounding portion 116 is arranged to be staggered with the magnetron grounding plate 120. It can be understood that the grounding portion 116 and the magnetron grounding plate 120 do not overlap in the orthographic projection on the plane where the top plate 111 or the bottom plate 112 is located, and the two are completely staggered. By limiting the positional relationship between the grounding portion 116 and the magnetron grounding plate 120 as described above, the grounding portion 116 and the magnetron grounding plate 120 do not block each other during the powder suction step, which facilitates the powder suction operation of the grounding portion 116 and the magnetron grounding plate 120 during the cavity spraying process, thereby facilitating the improvement of the efficiency of the cavity spraying process. ​

[0036] In an embodiment, as shown in Figure 3 , Figure 3 is Figure 1 a local enlarged view of A in FIG. 1, the grounding portion 116 is provided with at least one grounding hole 1161.

[0037] In the technical solution of this embodiment, by providing the grounding hole 1161 on the grounding portion 116, the grounding wire harness can be connected with the grounding portion 116 through the grounding hole 1161, thereby realizing reliable grounding of the grounding portion 116. It can be understood that the number of the grounding hole 1161 can be multiple, i.e., multiple grounding holes 1161 are provided on the grounding portion 116. By providing multiple grounding holes 1161, not only the grounding of the power line can be realized, but also the grounding of other electronic components inside the microwave heating device 100, such as the filter board and the computer board, can be realized. By providing multiple grounding modes, the use safety of the microwave heating device 100 can be further improved.

[0038] Further, as shown in Figure 3 , the grounding portion 116 includes multiple protruding portions 1162, and each protruding portion 1162 includes one grounding hole 1161. By providing one grounding hole 1161 on each protruding portion 1162, multiple clear and independent grounding paths can be provided for the grounding wire harness. In addition, the grounding holes 1161 are separately provided, which is also helpful to reduce the probability of interference between different grounding wire harnesses, thereby improving the grounding reliability of the grounding portion 116.

[0039] In an embodiment, the microwave heating device 100 further includes a magnetron 130, and the magnetron 130 is arranged on the grounding surface 1201.

[0040] In the technical solution of this embodiment, by arranging the magnetron 130 on the grounding surface 1201, the static electricity generated by the magnetron 130 during operation can be timely introduced into the ground through the grounding surface 1201, which helps to reduce the damage caused by static electricity accumulation to the magnetron 130 and other electronic components, and is conducive to improving the stability and reliability of the microwave heating device 100. In addition, by arranging the magnetron 130 on the grounding surface 1201, the shielding effect of the magnetron grounding plate 120 on microwaves can be utilized, thereby reducing the electromagnetic interference radiated outward by the magnetron 130 and reducing the probability of disturbing other electronic components due to microwave leakage.

[0041] In an embodiment, the emission end 131 of the magnetron 130 faces one of the top plate 111 and the bottom plate 112.

[0042] In the technical scheme of the embodiment, the emission end 131 of the magnetron 130 is arranged to face one of the top plate 111 and the bottom plate 112, i.e., the emission end 131 of the magnetron 130 faces the magnetron grounding plate 120 and the extension 114. It can be understood that the microwaves generated by the magnetron 130 enter the waveguide 150 through the emission end 131 and the magnetron grounding plate 120, and are then transmitted into the heating cavity 140 through the waveguide 150.

[0043] In an embodiment, the plate body 113 corresponds to the heating cavity 140 of the microwave heating device 100.

[0044] In the technical scheme of the embodiment, since the top plate 111 or the bottom plate 112 includes the plate body 113 and the extension 114, by taking the plate body 113 as a part of the heating cavity 140, the overall structural layout of the cavity structure 110 can be optimized, for example, the material and structure of the plate body 113 can be specially designed to better reflect and scatter microwaves, so that the distribution of microwaves in the heating cavity 140 is more uniform.

[0045] In an embodiment, as shown in Figure 1 The microwave heating device 100 further includes a waveguide 150, and the cover portion 117 and the mounting portion 115 surround to form a waveguide cavity 151, and the waveguide 150 is arranged in the waveguide cavity 151.

[0046] In the technical scheme of the embodiment, by surrounding the cover portion 117 and the mounting portion 115 to form the waveguide cavity 151, and arranging the waveguide 150 in the waveguide cavity 151, a closed transmission channel can be provided for microwaves, so that the microwaves can be more concentratedly propagated in the process of being transmitted from the magnetron 130 to the heating cavity 140, the scattering and leakage of microwaves are reduced, the microwave transmission efficiency is improved, and thus the microwave energy can be better transmitted to the area to be heated.

[0047] It can be understood that the heating cavity 140 is in communication with the magnetron 130 through the waveguide 150, and when it is necessary to cook food, the magnetron 130 emits the microwaves generated thereby into the heating cavity 140 through the waveguide 150, and then the food in the heating cavity 140 is cooked by the microwaves. The microwaves can enter the inside of the food to heat the food, so that the heating effect of the food and the cooking efficiency can be improved.

[0048] Optionally, the cover portion 117 is connected to the mounting portion 115 by welding. The connection of the cover portion 117 and the mounting portion 115 by welding can effectively improve the connection strength between the cover portion 117 and the mounting portion 115, and improve the fixing effect of the cover portion 117, so as to further improve the sealing performance and stability of the waveguide cavity 151.

[0049] In an embodiment, as shown in Figure 3 The cover 117 has a first through hole 1171, and the magnetron grounding plate 120 has a second through hole 1202, the first through hole 1171 and the second through hole 1202 are through, and the magnetron 130 is coupled to the waveguide 150 through the first through hole 1171 and the second through hole 1202.

[0050] In the technical scheme of this embodiment, the magnetron 130 is directly and closely coupled to the waveguide 150 through the first through hole 1171 and the second through hole 1202, so that the microwave energy generated by the magnetron 130 is transmitted into the waveguide 150 through the first through hole 1171 and the second through hole 1202, and meanwhile, the connection between the components is more compact, the complex connection structure and the additional adapter component are avoided, the internal structure of the microwave heating device 100 is simplified, and the difficulty and cost of the manufacturing process are reduced.

[0051] In an embodiment, as shown in Figure 3 The magnetron grounding plate 120 includes a limiting portion 1203, and the limiting portion 1203 extends from the magnetron grounding plate 120 to the other one of the top plate 111 and the bottom plate 112.

[0052] In the technical scheme of this embodiment, by setting the magnetron grounding plate 120 to include the limiting portion 1203, the magnetron grounding plate 120 can be limited to cooperate with the magnetron 130, and it can be understood that when the magnetron 130 is installed, the limiting portion 1203 can be used to limit the magnetron 130, so as to reduce the installation difficulty and improve the installation efficiency.

[0053] Further, the magnetron grounding plate 120 further includes a mounting hole 1204. By setting the magnetron grounding plate 120 to include the mounting hole 1204, the magnetron 130 can be connected to the magnetron grounding plate 120 through the mounting hole 1204. Specifically, the number of the mounting hole 1204 can be multiple, and by allowing the fastener to pass through the magnetron 130 and the mounting hole 1204, the magnetron 130 can be fixedly installed to the magnetron grounding plate 120.

[0054] In an embodiment, as shown in Figure 1 The back plate 118 is provided with an avoiding groove 1181 at one end close to the extending portion 114, and the avoiding groove 1181 is used for setting a grounding wire harness. By setting the avoiding groove 1181 at one end of the back plate 118 close to the extending portion 114, the grounding wire harness can be placed and connected to the grounding portion 116 on the extending portion 114 through the avoiding groove 1181, the occupied space of the grounding wire harness inside the microwave heating device 100 is reduced, and the complexity of the wire harness connection inside the microwave heating device 100 is also reduced.

[0055] Further, as shown in Figure 1and Figure 2 As shown, the grounding portion 116 extends from the joint portion 1153 toward the back plate 118. By limiting the position of the grounding portion 116 as described above, the distance between the grounding portion 116 and the avoiding groove 1181 is shortened. It can be understood that the distance between the grounding portion 116 and the grounding wire harness is also shortened, so that the grounding wire harness is directly connected to the grounding portion 116 through the avoiding groove 1181 provided on the back plate 118 near the end of the extending portion 114, and the complexity of the connection of the wire harness inside the microwave heating device 100 is further reduced.

[0056] In an embodiment, the microwave heating device 100 comprises a microwave oven or a microwave and steam oven.

[0057] In the technical solution of this embodiment, when the microwave heating device 100 is a microwave and steam oven, the microwave heating device 100 further comprises a steam generating device and a baking device. The steam generating device is used to output steam into the heating cavity 140 of the microwave heating device 100, so as to use the output steam to cook the food in the heating cavity 140. The baking device can be a heating pipe or a hot air heating device. The heating pipe can be located at the top of the heating cavity 140, and the hot air heating device can be located at the back of the heating cavity 140. The specific arrangement can be made according to actual needs.

[0058] The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A microwave heating device, characterized by, The microwave heating device comprises: a cavity structure, one of a top plate and a bottom plate of the cavity structure comprising a plate body and an extension extending away from the plate body, the extension having a mounting portion and a grounding portion, the mounting portion having a mounting surface facing the other one of the top plate and the bottom plate, the cavity structure further comprising a cover portion provided on the mounting surface; a magnetron grounding plate provided on a side of the cover portion away from the mounting portion, the magnetron grounding plate having a grounding surface facing the other one of the top plate and the bottom plate.

2. The microwave heating apparatus according to claim 1, wherein The mounting portion comprises a main portion and an engaging portion provided on an outer edge of the main portion, the mounting surface being located on the engaging portion, the grounding portion extending from the engaging portion towards a side away from the main portion.

3. The microwave heating device of claim 1, wherein In a direction from the top plate to the bottom plate, the grounding portion is staggered with the magnetron grounding plate.

4. The microwave heating device of claim 1, wherein The microwave heating device further comprises a magnetron provided on the grounding surface.

5. The microwave heating apparatus according to claim 4, wherein An emission end of the magnetron faces the one of the top plate and the bottom plate.

6. The microwave heating device of claim 1, wherein The plate body corresponds to a heating cavity of the microwave heating device.

7. The microwave heating device of claim 1, wherein The microwave heating device further comprises a waveguide tube, the cover portion and the mounting portion forming a waveguide cavity, the waveguide tube being provided in the waveguide cavity.

8. The microwave heating device of claim 7, wherein, The cover portion has a first through hole, the magnetron grounding plate has a second through hole, the first through hole and the second through hole being through, the magnetron being coupled to the waveguide tube through the first through hole and the second through hole.

9. The microwave heating device of claim 1, wherein The magnetron grounding plate comprises a limiting portion extending from the magnetron grounding plate towards the other one of the top plate and the bottom plate.

10. The microwave heating apparatus according to any one of claims 1 to 9, characterized by The microwave heating device comprises a microwave oven or a micro-steaming-baking all-in-one machine.

Images