Thick-copper high-shielding circuit board structure

Abstract

The utility model provides a thick copper high-shielding circuit board structure, which comprises a thick copper circuit, prepregs, shielding layers and solder mask layers, the prepregs, the shielding layers and the solder mask layers are arranged on the two sides of the thick copper circuit in sequence outwards, the thick copper circuit is bonded between the two shielding layers through the prepregs, and the solder mask layers are arranged on the two sides of the thick copper circuit. The thick copper circuit is embedded in the prepreg to form a structure that the thick copper circuit is embedded in the prepreg, so that the thickness increase of the circuit board is relatively small while high shielding performance is realized, and the problem that the thickness of the circuit board is relatively large due to the fact that a shielding function needs to be designed on a welded electronic component or modules such as a shielding cage need to be independently designed in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, and in particular to a thick copper high shielding circuit board structure. Background Technology

[0002] With the development of high-tech fields such as intelligent connected vehicles and military industry, the requirements for the rigid circuit boards used are becoming increasingly higher, requiring them to have the dual characteristics of high current carrying capacity and high shielding. Therefore, the electrical performance of thick copper lines is used to achieve the "high current carrying capacity".

[0003] However, most of the thick copper circuits with high current carrying capacity are used inside electronic modules, which generally require the design and fabrication of shielding layers. Common methods include designing shielding functions directly onto the soldered electronic components or designing shielding cages and other modules to achieve high shielding performance. However, this increases the thickness and cost of the circuit board, and the performance is difficult to meet the market's demand for more refined and thinner electronic module structures.

[0004] Based on this, and in response to the aforementioned background and problems, there is a need to provide a novel thick copper high-shield circuit board structure. Utility Model Content

[0005] This utility model aims to solve the problem that the current processing of circuit boards with high current carrying capacity and high shielding results in a large overall thickness of the circuit board. It provides a thick copper high shielding circuit board structure, including a thick copper line, a prepreg, a shielding layer and a solder resist layer. The prepreg, the shielding layer and the solder resist layer are arranged outwardly on both sides of the thick copper line.

[0006] Furthermore, the thick copper circuit consists of two circuit patterns.

[0007] Furthermore, the shielding layer is a silver paste layer, a copper paste layer, or a shielding film.

[0008] Furthermore, the thickness of the shielding layer is greater than or equal to 10 micrometers.

[0009] Furthermore, the shielding layer has a mesh structure with a mesh count of 100 to 270 meshes.

[0010] Furthermore, the thickness of the solder resist layer is greater than or equal to 15 micrometers.

[0011] Furthermore, the material of the prepreg is epoxy resin, glass fiber, ceramic powder composite epoxy resin, polyimide, or polytetrafluoroethylene.

[0012] Furthermore, the thickness of the thick copper circuit is greater than or equal to 105 micrometers.

[0013] The thick copper high shielding circuit board structure proposed in this utility model uses a prepreg to bond thick copper lines between two shielding layers, forming a structure in which the thick copper lines are embedded in the prepreg. While achieving high shielding performance, the thickness of the circuit board increases relatively little. This solves the problem in the prior art that requires designing shielding functions on soldered electronic components or designing independent shielding cages and other modules, resulting in a large circuit board thickness. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0015] Figure 1 This is a cross-sectional schematic diagram of the thick copper high shielding circuit board structure of this utility model;

[0016] Figure 2 This is a cross-sectional schematic diagram of one embodiment of the thick copper circuit of this utility model.

[0017] Explanation of icon numbers:

[0018]

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0023] Please see Figure 1 , Figure 1 This is a cross-sectional schematic diagram of the thick copper high-shield circuit board structure of this utility model.

[0024] The thick copper high-shield circuit board structure 10 of this embodiment includes a thick copper line 100, a prepreg 200, a shielding layer 300, and a solder resist layer 400. The prepreg 200, the shielding layer 300, and the solder resist layer 400 are sequentially arranged outward on both sides of the thick copper line 100. Specifically, a single-sided thick copper clad laminate is taken, etched to form the thick copper line 100, and then pressed with the prepreg 200 to form a pressed structure in which the thick copper line 100 is embedded in the prepreg 200. The shielding layer 300 and the solder resist layer 400 are sequentially fabricated on both sides of the pressed structure to finally form the entire circuit board.

[0025] Please see Figure 2 , Figure 2 This is a cross-sectional schematic diagram of one embodiment of the thick copper circuit of this utility model.

[0026] Because thick copper lines are relatively thick, single-sided etching of the copper layer can easily lead to over-etching or incomplete etching. Therefore, in another embodiment, the thick copper line 100 consists of two lines, upper and lower. That is, an upper half line 1010 and a lower half line 1020 are fabricated on the upper and lower copper surfaces of a single-layer thick copper plate. The upper half line 1010 and the lower half line 1020 correspond to form the thick copper line 100. By dividing the thick copper line pattern 100 into two parts, the thickness of the copper layer etched in a single step is reduced, effectively avoiding the problem of over-etching or incomplete etching of the thick copper line 100. Specifically, half of the line is fabricated on the thick copper layer first, and a prepreg is laminated on it. Then, the other half of the line is fabricated, and the other half of the prepreg is laminated on it. The prepreg is laminated from both sides of the thick copper line 100 to ensure that the prepreg fills the etched area of ​​the thick copper plate, effectively avoiding the problem of incomplete filling of the prepreg that may occur when etching and laminating on one side.

[0027] In this embodiment, the thickness of the thick copper line 100 is greater than or equal to 105 micrometers. The thicker the line, the greater the current it can carry, and the more effectively it can dissipate heat and maintain the stable operation of the circuit board. In addition, thick copper can enhance the durability of the circuit board and reduce damage caused by external forces.

[0028] In this embodiment, the shielding layer 300 is a silver paste layer, a copper paste layer, or a shielding film. The silver paste layer or copper paste layer, as a metallic shielding layer, forms a conductive coating on the circuit board. Its conductivity reflects and absorbs electromagnetic waves, effectively preventing electromagnetic and radio frequency interference from external signals and ensuring the stability of the circuit system. The shielding film has the advantages of preventing interference signals, protecting components, and improving circuit performance. Furthermore, the shielding film has a smaller thickness, reducing the overall thickness of the circuit board while still meeting shielding performance requirements.

[0029] In this embodiment, the shielding layer 300 has a mesh structure, which can effectively shield electromagnetic interference. The mesh count of the mesh structure is between 100 and 270 meshes. The mesh count affects the coating effect of the silver paste layer and the copper paste layer, and thus affects the shielding effect. Therefore, the shielding layer 300 in the circuit board adopts a mesh structure of 100 to 270 meshes to form a balance between the most basic shielding effect and the maximum process capability. If the mesh count is less than 100 meshes, the mesh openings are too large, making it difficult to form effective shielding performance. If the mesh count is greater than 270 meshes, the manufacturing requirements are too high, exceeding the process capability under normal circumstances, making it difficult to manufacture. Furthermore, while ensuring the shielding effect, the materials and manufacturing are relatively more economical, and the weight of the entire circuit board can be reduced, which is conducive to the lightweight design of the circuit board and improves the overall performance and reliability of the circuit board.

[0030] In this embodiment, the thickness of the shielding layer 300 is greater than or equal to 10 micrometers. Designing a thinner shielding layer 300 effectively reduces electromagnetic interference while simultaneously reducing the overall thickness of the circuit board, meeting the requirements of high-precision circuit board manufacturing. Furthermore, the copper paste layer and silver paste layer have good thermal conductivity; a thinner copper paste layer or silver paste layer ensures that the heat generated during the operation of thick copper circuitry is dissipated in a timely manner, thus improving the thermal management efficiency of the circuit board.

[0031] In this embodiment, the thickness of the solder mask layer 400 is greater than or equal to 15 micrometers. A thinner solder mask layer 400 not only provides better isolation and protection, reducing corrosion and oxidation and extending the lifespan of the circuit board, but also reduces the circuit board thickness, meeting the requirements of high-precision circuit board processing.

[0032] In this embodiment, the prepreg 200 is made of epoxy resin, glass fiber, ceramic powder composite epoxy resin, polyimide, or polytetrafluoroethylene.

[0033] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model and based on the description and drawings of the present utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A thick copper high shielding circuit board structure, characterized by, The thick copper circuit includes a prepreg, a shielding layer and a solder resist layer, and two surfaces of the thick copper circuit are sequentially provided with the prepreg, the shielding layer and the solder resist layer.

2. A thickened copper, high- shielded circuitized structure according to claim 1 wherein, The thick copper circuit is composed of two circuit layers.

3. A thickened copper, high- shielded circuit board structure as defined in Claim 1 or 2 wherein, The shielding layer is a silver paste layer, a copper paste layer or a shielding film.

4. The thickened copper high- shielding circuitized board structure of claim 1 or 2, wherein, The thickness of the shielding layer is greater than or equal to 10 microns.

5. The thickened copper, high- shielded circuitized structure of claims 1 or 2, wherein, The shielding layer is a mesh structure, and the mesh structure has a mesh number of 100 to 270.

6. The thickened copper, high- shielded circuitized structure of claims 1 or 2, wherein, The thickness of the solder resist layer is greater than or equal to 15 microns.

7. The thickened copper, high- shielded circuitized structure of claims 1 or 2, wherein, The material of the prepreg is epoxy resin, glass fiber, ceramic powder composite epoxy resin, polyimide or polytetrafluoroethylene.

8. The thickened copper, high- shielded circuitized structure of claims 1 or 2, wherein, The thickness of the thick copper circuit is greater than or equal to 105 microns.

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