High-temperature pressing device for flexible circuit board

By introducing protective components into the high-temperature pressing device for flexible circuit boards, air compression and elastic potential energy are used to buffer and prevent damage to the circuit boards, thus solving the damage problem caused by high-temperature pressing, improving processing stability and reducing the impact of residual heat.

CN223859346UActive Publication Date: 2026-01-30EAST ELECTRONIC TECH (DONGTAI) CO LTD
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Patent Information

Application Number
CN202520028661.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-07
Publication Date
2026-01-30
Estimated Expiration
2035-01-07

AI Technical Summary

Technical Problem

Existing high-temperature lamination devices for flexible circuit boards are prone to damage to the circuit boards due to high pressure during the lamination process, lacking effective buffer protection.

Method used

A protective component was designed, including a placement platform, a limiting block, a plug rod, a piston, a sleeve, and a spring. It achieves buffer protection through air compression and elastic potential energy, and is combined with fan cooling to improve stability.

Benefits of technology

It effectively prevents the flexible circuit board from being damaged by high pressure during the high-temperature lamination process, improves the processing stability, and reduces the impact of residual heat through heat dissipation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of high-temperature pressing devices, and discloses a flexible circuit board high-temperature pressing device which comprises a base, a control panel is fixedly connected to the outer side of one end of the base, a first support is fixedly connected to the upper side of the middle end of the base, and an electric telescopic rod is fixedly connected to the upper end of the first support. The outer side of the end, close to the control panel, of the base is fixedly connected with a fixing frame, the outer side of one end of the fixing frame is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a winding drum in a penetrating mode, and the end, away from the motor, of the winding drum is rotationally connected to the fixing frame. A thin film is wound on the outer side of the winding drum, the middle end of the base is fixedly connected with a protection assembly, the protection assembly comprises a placement table inserted into the inner side of the middle end of the base, and the protection assembly can be used for carrying out buffering protection on the machined flexible circuit board when the machined flexible circuit board is extruded, so that damage to the flexible circuit board due to high-pressure pressing is avoided; and the machining stability is improved.
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Description

Technical Field

[0001] This utility model relates to the technical field of high-temperature pressing devices, specifically to a high-temperature pressing device for flexible circuit boards. Background Technology

[0002] A high-temperature lamination device for flexible circuit boards is a device used to heat and press flexible circuit boards and films together. The high-temperature lamination device generally consists of a base, a support, an electric telescopic rod, a high-temperature lamination plate, and a winding drum. In use, the flexible circuit board to be processed is placed on the base, and then the winding drum drives the film to rotate so that it is fitted onto the flexible circuit board. Subsequently, with the assistance of the support, the electric telescopic rod is activated to drive the high-temperature lamination plate to press the film and the flexible circuit board together.

[0003] A search revealed a Chinese patent application (CN202121643967.3) proposing a high-temperature pressing device for a smart heating plate. The bottom wall of the first inner cavity is slidably connected to a third rod via a slide rail. One end of the third rod is fixedly connected to an arc-shaped block. A movable rod is located inside the first inner cavity, and a conical plug is fixedly connected to the top of the movable rod. In this prior art, a placement groove is opened above the worktable, and the material to be processed is placed in the placement groove for positioning, thus facilitating the restriction of the processed material and preventing displacement during subsequent pressing.

[0004] In the aforementioned existing methods, the material to be processed is mainly processed by opening slots in the high-temperature pressing device. However, compared with the traditional high-temperature pressing device for flexible circuit boards, the high-temperature pressing device is prone to damage to the flexible circuit board due to excessive pressure caused by the extrusion of the high-temperature pressing plate, thus affecting the performance of the flexible circuit board. Utility Model Content

[0005] The purpose of this invention is to provide a high-temperature pressing device for flexible circuit boards, which solves the problem that existing high-temperature pressing devices for flexible circuit boards do not provide buffer protection when pressing them, thus making them easily damaged by high pressure.

[0006] This utility model provides the following technical solution: a high-temperature pressing device for flexible circuit boards, comprising a base, a control panel fixedly connected to the outer side of one end of the base, and a first bracket fixedly connected to the upper side of the middle end of the base. An electric telescopic rod is fixedly connected to the upper end of the first bracket, and a high-temperature pressing plate is fixedly connected to the lower end of the electric telescopic rod through the first bracket. A fixing frame is fixedly connected to the outer side of the end of the base near the control panel, and a motor is fixedly connected to the outer side of one end of the fixing frame. A take-up drum is fixedly connected through the output shaft of the motor, and the end of the take-up drum away from the motor is rotatably connected to the fixing frame. A film is wound around the outer side of the take-up drum, and a protective component is fixedly connected to the middle end of the base. The protective component includes a placement platform inserted into the inner side of the middle end of the base, and limit blocks are fixedly connected to both ends of the placement platform. The end of the limit block away from the placement platform is inserted into the base.

[0007] The above technical solution utilizes a placement stage to place the flexible circuit board to be processed, and a limiting block assists in the movement of the placement stage.

[0008] As a preferred embodiment of the above technical solution, a placement groove is provided inside the upper end of the placement platform, and material retrieval grooves are provided at both ends of the placement groove.

[0009] The above technical solution allows for the placement of flexible circuit boards placed on the placement table using a placement slot, while the material retrieval slot facilitates the subsequent removal of the flexible circuit boards from the placement slot.

[0010] As a preferred embodiment of the above technical solution, a rod is fixedly connected to the middle of the lower side of the placement platform, and a piston is fixedly connected to the lower end of the rod, with a sleeve sleeved on the outside of the piston.

[0011] The above technical solution allows the piston to move inside the sleeve by using a plunger, thereby compressing the air inside the lower end of the piston and using the air compression for buffering.

[0012] As a preferred embodiment of the above technical solution, a spring is sleeved on the outside of the piston and the sleeve, and the upper end of the spring is fixedly connected to the placement platform, the lower end of the spring is fixedly connected to a filter plate, and the outer end of the filter plate is fixedly connected to the base, and the lower end of the sleeve is fixedly connected to the filter plate.

[0013] The above technical solution utilizes the elastic potential energy of the spring to provide secondary cushioning for the movement of the placement platform.

[0014] As a preferred embodiment of the above technical solution, a second bracket is fixedly connected to both ends of the lower side of the filter plate, and a filter screen cover is fixedly connected to the inner side of the lower end of the second bracket. A motor is fixedly connected to the inner side of the upper end of the filter screen cover, and a fan is fixedly connected to the output shaft of the motor.

[0015] The above technical solution allows the motor to drive the fan to rotate, thereby accelerating the flow of surrounding air.

[0016] As a preferred embodiment of the above technical solution, a blade holder is provided on the outer side of the upper end of the placement platform, and the lower end of the blade holder is fixedly connected to the base, and a cutting blade is fixedly connected to the upper end of the blade holder.

[0017] The above technical solution allows for the cutting of excess film using a cutter in conjunction with a high-temperature pressing plate.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] This high-temperature pressing device for flexible circuit boards can buffer and protect the processed flexible circuit boards when they are squeezed by protective components, thereby avoiding damage to the flexible circuit boards caused by high-pressure pressing and improving the stability during processing. Attached Figure Description

[0020] Figure 1 A three-dimensional structural diagram of a high-temperature lamination device for flexible circuit boards;

[0021] Figure 2 This is a first-view cross-sectional structural diagram of a high-temperature lamination device for flexible circuit boards.

[0022] Figure 3 This is a schematic diagram of a cross-sectional structure from a second perspective of a high-temperature lamination device for flexible circuit boards.

[0023] Figure 4 for Figure 2 Enlarged schematic diagram of the structure at point A in the middle.

[0024] In the diagram: 1. Base; 11. Control panel; 12. First support; 13. Electric telescopic rod; 14. High-temperature pressing plate; 15. Fixing frame; 16. Motor; 17. Rewind drum; 18. Film; 2. Protective components; 21. Placement platform; 22. Limiting block; 23. Placement slot; 24. Material chute; 25. Insert rod; 26. Piston; 27. Sleeve; 28. Spring; 29. ​​Filter screen plate; 210. Second support; 211. Filter screen cover; 212. Motor; 213. Fan; 214. Knife holder; 215. Cutter. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0026] like Figure 1 - Figure 4As shown, this utility model provides a technical solution: a high-temperature pressing device for flexible circuit boards, including a base 1, a control panel 11 fixedly connected to the outer side of one end of the base 1, and a first bracket 12 fixedly connected to the upper side of the middle end of the base 1. An electric telescopic rod 13 is fixedly connected to the upper end of the first bracket 12, and a high-temperature pressing plate 14 is fixedly connected to the lower end of the electric telescopic rod 13 through the first bracket 12. A fixing frame 15 is fixedly connected to the outer side of the end of the base 1 near the control panel 11, and a motor 16 is fixedly connected to the outer side of one end of the fixing frame 15. The output shaft of the motor 16 is fixedly connected to a receiving device. The winding drum 17 has one end rotatably connected to the fixed frame 15 away from the motor 16. A film 18 is wrapped around the outside of the winding drum 17, and a protective component 2 is fixedly connected to the middle of the base 1. The protective component 2 includes a placement platform 21 inserted into the inner side of the middle of the base 1, and limit blocks 22 are fixedly connected to both ends of the placement platform 21. The end of the limit block 22 away from the placement platform 21 is inserted into the base 1. The protective component 2 can buffer and protect the flexible circuit board being squeezed during processing, thereby avoiding damage to the flexible circuit board caused by high pressure and improving the stability during processing.

[0027] like Figure 4 As shown, a placement slot 23 is provided inside the upper end of the placement platform 21, and a material retrieval slot 24 is provided at both ends of the placement slot 23. The flexible circuit board placed on the placement platform 21 can be placed through the placement slot 23, and the flexible circuit board can be easily removed by using the material retrieval slot 24.

[0028] like Figure 3 As shown, a rod 25 is fixedly connected to the middle of the lower side of the placement platform 21, and a piston 26 is fixedly connected to the lower end of the rod 25. A sleeve 27 is sleeved on the outside of the piston 26. When the placement platform 21 moves, it drives the rod 25 and the piston 26 to move inside the sleeve 27, and the piston 26 compresses the air inside the lower end of the sleeve 27.

[0029] like Figure 3 As shown, a spring 28 is sleeved on the outside of the piston 26 and the sleeve 27. The upper end of the spring 28 is fixedly connected to the placement platform 21, and the lower end of the spring 28 is fixedly connected to the filter screen plate 29. The outer end of the filter screen plate 29 is fixedly connected to the base 1, and the lower end of the sleeve 27 is fixedly connected to the filter screen plate 29. The spring 28 is compressed by the movement of the placement platform 21 under the support of the filter screen plate 29. The elastic potential energy of the spring 28 provides secondary buffering for the downward movement of the placement platform 21.

[0030] like Figure 2As shown, the lower ends of the filter plate 29 are fixedly connected to the second bracket 210, and the lower inner side of the second bracket 210 is fixedly connected to the filter screen cover 211. The upper inner side of the filter screen cover 211 is fixedly connected to the motor 212, and the output shaft of the motor 212 is fixedly connected to the fan 213. The second bracket 210 and the filter screen cover 211 support and protect the motor 212 and the fan 213. At the same time, after the motor 212 is started, the output shaft drives the fan 213 to rotate, and the rotation of the fan 213 accelerates the flow of air around it.

[0031] like Figure 4 As shown, a cutting table 214 is provided on the outer side of the upper end of the placement platform 21, and the lower end of the cutting table 214 is fixedly connected to the base 1. A cutting blade 215 is fixedly connected to the upper end of the cutting table 214. With the support of the cutting table 214, the film 18 covering the outside of the flexible circuit board is cut by the cutting blade 215 in conjunction with the downward movement of the high temperature pressing plate 14.

[0032] Working principle: When processing flexible circuit boards, the flexible circuit board to be processed is first placed in the placement slot 23. Then, the motor 16 is controlled to operate through the control panel 11. After the motor 16 operates under the support of the fixing frame 15, the output shaft drives the winding drum 17 to rotate. The rotation of the winding drum 17 is used to wind up the film 18. As the film 18 is wound up, it moves. When the uncut part of the film 18 covers the flexible circuit board, the motor 16 is then turned off. Then, the electric telescopic rod 13 and the high-temperature pressing plate 14 are controlled to operate through the control panel 11. The electric telescopic rod 13 operates under the support of the control panel 11. The extended platen 14 moves, and after it rotates, it is heated. As the platen 14 moves downward, it adheres to the film 18 and the flexible circuit board, and is then compressed. The placement platform 21 is compressed and moves downward under the limit of the limiting block 22. After the placement platform 21 moves downward, it is buffered by the insertion rod 25 and the piston 26 with the assistance of the sleeve 27. At the same time, the downward movement of the placement platform 21 compresses the spring 28 under the support of the filter plate 29. At this time, the compression of the air at the lower end of the sleeve 27 by the piston 26 and the elastic potential energy of the spring 28 are used to compress the flexible circuit. The pressure on the board is buffered. When the upper end of the placement platform 21 moves down to the same height as the cutter 215, the film 18 on the outer end of the flexible circuit board is cut as the high-temperature pressing plate 14 continues to press down. After cutting, the film 18 and the flexible circuit board are pressed together by the high temperature of the high-temperature pressing plate 14. After pressing, the control panel 11 is activated again to control the electric telescopic rod 13 to move the high-temperature pressing plate 14 upward. As the high-temperature pressing plate 14 moves upward, the elastic potential energy of the spring 28 pushes the placement platform 21 to move upward and back to its original position with the assistance of the limit block 22. After the placement platform 21 moves upward and resets, it can then... The flexible circuit board placed in the placement slot 23 is taken out through the material picking slot 24. Then, the motor 212 can be controlled to run through the control panel 11. Under the support of the second bracket 210 and the filter screen cover 211, the output shaft of the motor 212 drives the fan 213 to rotate. The rotation of the fan 213 causes the air inside the upper part of the base 1 to flow rapidly. After the air flows rapidly, it forms an airflow. The rapid flow of air causes the air to enter the middle part of the base 1 from the upper part and then be discharged through the lower part of the base 1. The airflow is used to dissipate the heat at the placement platform 21, so as to avoid the residual heat affecting the subsequent pressing.

[0033] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A flexible circuit board high temperature press bonding apparatus comprising a base (1), characterized in that: The one end outer side of the base (1) is fixedly connected with a control panel (11), and the upper side of the middle end of the base (1) is fixedly connected with a first support (12), the upper end of the first support (12) is fixedly connected with an electric telescopic rod (13), and the lower end of the electric telescopic rod (13) is fixedly connected with a high-temperature pressing plate (14) penetrating through the first support (12), the one end outer side of the base (1) close to the control panel (11) is fixedly connected with a fixed frame (15), and the one end outer side of the fixed frame (15) is fixedly connected with a motor (16), the output shaft of the motor (16) is fixedly connected with a winding drum (17), and the end of the winding drum (17) away from the motor (16) is rotatably connected to the fixed frame (15), the outer side of the winding drum (17) is wound with a film (18), and the middle end of the base (1) is fixedly connected with a protection assembly (2), the protection assembly (2) comprises a placing table (21) inserted into the inner side of the middle end of the base (1), and the both ends of the placing table (21) are fixedly connected with limiting blocks (22), and the one end of the limiting block (22) away from the placing table (21) is inserted into the base (1).

2. The flexible circuit board high temperature lamination apparatus of claim 1, wherein: The upper end of the placing table (21) is internally provided with a placing groove (23), and the both ends of the placing groove (23) are provided with material taking grooves (24).

3. The flexible circuit board high temperature lamination apparatus of claim 2, wherein: The lower middle end of the placing table (21) is fixedly connected with a plug rod (25), and the lower end of the plug rod (25) is fixedly connected with a piston (26), and the outer side of the piston (26) is sleeved with a sleeve (27).

4. The flexible circuit board high temperature lamination apparatus of claim 3, wherein: The outer side of the piston (26) and the sleeve (27) is sleeved with a spring (28), and the upper end of the spring (28) is fixedly connected to the placing table (21), and the lower end of the spring (28) is fixedly connected with a filter screen plate (29), and the outer end of the filter screen plate (29) is fixedly connected to the base (1), and the lower end of the sleeve (27) is fixedly connected to the filter screen plate (29).

5. The flexible circuit board high temperature lamination apparatus of claim 4, wherein: The both ends of the lower side of the filter screen plate (29) are fixedly connected with a second support (210), and the inner side of the lower end of the second support (210) is fixedly connected with a filter screen guard (211), the inner side of the upper end of the filter screen guard (211) is fixedly connected with a motor (212), and the output shaft of the motor (212) is fixedly connected with a fan (213).

6. The flexible circuit board high temperature lamination apparatus of claim 2, wherein: The upper end of the placing table (21) is provided with a knife table (214), and the lower end of the knife table (214) is fixedly connected to the base (1), and the upper end of the knife table (214) is fixedly connected with a cutter (215).

Citation Information

Patent Citations

  • High-temperature pressing device of intelligent heating plate

    CN216139616U