Flexible circuit board DES production device

Abstract

The utility model provides a flexible circuit board DES production device, and the device comprises a first washing tank which is used for carrying out the first washing of a flexible circuit board; the developing tank is connected with the first washing tank and is used for showing a circuit pattern on the flexible circuit board washed for the first time; the second washing tank is connected with the developing tank so as to wash the developed flexible circuit board for the second time; the etching tank is connected with the second washing tank and used for etching the flexible circuit board washed for the second time, so that a circuit is formed on the flexible circuit board; the third washing tank is connected with the etching tank and used for washing the etched flexible circuit board for the third time so as to prevent the etching liquid in the etching tank from polluting the flexible circuit board; and the film removing tank is connected with the third washing tank and is used for removing the dry film on the flexible circuit board which is washed for the third time. According to the invention, the first washing tank is additionally arranged to wash the fed flexible circuit board, so that film residue foreign matters left on the flexible circuit board in the exposure process can be effectively removed, and the generation of defective products is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board production devices, and particularly relates to a flexible circuit board DES production device. BACKGROUND

[0002] At present, before the DES production of a flexible circuit board, the flexible circuit board needs to be cut off and then placed on a DES line for automatic production. Since the dry film on the flexible circuit board will become brittle due to polymerization during exposure, small film residue foreign matters are prone to occur when the flexible circuit board is cut. The existing DES production device directly places the cut flexible circuit board after exposure on a DES production line for production, at this time, the film residue foreign matters will be adhered to the surface of the flexible circuit board and cannot be removed, resulting in the generation of final defective products. CONTENT OF THE INVENTION

[0003] In order to solve the above technical problems, the present application provides a flexible circuit board DES production device, comprising:

[0004] A first washing tank for washing the flexible circuit board for the first time to remove the film residue foreign matters;

[0005] A developing tank connected with the first washing tank, for making the circuit pattern on the flexible circuit board after the first washing appear;

[0006] A second washing tank connected with the developing tank to wash the developed flexible circuit board for the second time, for preventing the developing solution in the developing tank from polluting the flexible circuit board;

[0007] An etching tank connected with the second washing tank, for etching the flexible circuit board after the second washing, so as to form a circuit on the flexible circuit board;

[0008] A third washing tank connected with the etching tank, for washing the etched flexible circuit board for the third time, so as to prevent the etching solution in the etching tank from polluting the flexible circuit board;

[0009] A film removing tank connected with the third washing tank, for stripping the dry film on the flexible circuit board after the third washing.

[0010] In some embodiments, the first washing tank is a high-pressure water washing tank.

[0011] In some embodiments, the second washing tank is a second water washing tank.

[0012] In some embodiments, the third washing tank comprises a first acid washing tank and a third water washing tank connected in sequence, the first acid washing tank is used for neutralizing the etching solution on the flexible circuit board, and the third water washing tank is used for washing the residual etching solution and acid solution on the flexible circuit board.

[0013] In some embodiments, a fourth washing tank is further included, which is connected with the film removing tank and used for fourth washing of the flexible circuit board after film removing, so as to prevent the film removing solution in the film removing tank from remaining on the flexible circuit board.

[0014] In some embodiments, the fourth washing tank comprises a fourth water washing tank, a second acid washing tank and a fifth water washing tank connected in sequence, the fourth water washing tank is used for fourth water washing of the flexible circuit board to remove the film removing solution remaining on the flexible circuit board, the second acid washing tank is used for neutralizing the film removing solution remaining on the flexible circuit board, and the fifth water washing tank is used for fifth water washing of the flexible circuit board to remove the residual acid and neutralizing solution on the flexible circuit board.

[0015] In some embodiments, an anti-oxidation tank and a sixth water washing tank connected in sequence are further included, the anti-oxidation tank is connected with the fifth water washing tank and used for anti-oxidation treatment of the copper surface on the flexible circuit board, and the sixth water washing tank is used for removing the anti-oxidation solution remaining on the flexible circuit board.

[0016] In some embodiments, a drying tank is further included, which is connected with the sixth water washing tank and used for drying of the flexible circuit board after anti-oxidation treatment.

[0017] In some embodiments, the drying tank comprises a cold air drying tank and / or a hot air drying tank.

[0018] Compared with the prior art, the flexible circuit board DES production device provided by the present application can effectively remove the film residue and foreign matters remaining on the flexible circuit board in the exposure process by adding a first washing tank, so as to reduce the generation of DES production defective products, and has a wide application prospect. BRIEF DESCRIPTION OF DRAWINGS

[0019] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the embodiments. The accompanying drawings are included to provide a description of some embodiments and are not intended to limit the scope of the present application. Moreover, the same reference numerals in all the drawings represent the same or similar elements. In the drawings:

[0020] Figure 1 The structural block diagram of the flexible circuit board DES production device in the present application is shown.

[0021] The reference numerals in the detailed description are as follows:

[0022] 100. The first washing tank

[0023] 200. The developing tank

[0024] 300. The second washing tank

[0025] 400. Etching tank

[0026] 500. Third rinsing tank

[0027] 501. First pickling tank

[0028] 502. Third water rinsing tank

[0029] 600. Desmearing tank

[0030] 700. Fourth rinsing tank

[0031] 701. Fourth water rinsing tank

[0032] 702. Second pickling tank

[0033] 703. Fifth water rinsing tank

[0034] 801. Antioxidation tank

[0035] 802. Sixth water rinsing tank

[0036] 900. Drying tank DETAILED DESCRIPTION

[0037] In the description of the present application, it needs to be understood that, if the description of orientation or positional relationship such as terms of“center”,“longitudinal”,“transverse”,“length”,“width”,“thickness”,“upper”,“lower”,“front”,“back”,“left”,“right”,“vertical”,“horizontal”,“top”,“bottom”,“inner”,“outer”,“clockwise”,“counterclockwise”,“axial”,“radial”,“circumferential” and the like appear, it is understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0038] In the present application, unless specifically defined and limited, the terms such as“mounting”,“connecting”,“connecting”,“fixing” and the like should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] In the description of the present specification, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like appear, it means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0040] To solve the technical problems existing in the related art, the embodiments of the present application provide a flexible circuit board DES production device. Referring to Figure 1 The flexible circuit board DES production device of some embodiments of the present application comprises:

[0041] The first washing tank 100 is used for first washing the flexible circuit board to remove film slag impurities;

[0042] The developing tank 200 is connected with the first washing tank 100, and is used for developing the circuit pattern on the first washed flexible circuit board;

[0043] The second washing tank 300 is connected with the developing tank 200 to wash the developed flexible circuit board for the second time, and is used for preventing the developing solution in the developing tank from polluting the flexible circuit board;

[0044] The etching tank 400 is connected with the second washing tank 300, and is used for etching the second washed flexible circuit board to form a circuit on the flexible circuit board;

[0045] The third washing tank 500 is connected with the etching tank 400, and is used for third washing the etched flexible circuit board to prevent the etching solution in the etching tank from polluting the flexible circuit board;

[0046] The film removing tank 600 is connected with the third washing tank 500, and is used for stripping the dry film on the third washed flexible circuit board.

[0047] In the embodiments of the present application, the first washing tank 100 is a high-pressure water washing tank, and the second washing tank 300 is a second water washing tank. By adding a first washing tank 100 at the front end of the developing tank 200, the first washing tank 100 is used to wash the incoming flexible circuit board for the first time, which can effectively remove the film slag impurities remaining on the incoming flexible circuit board in the exposure process. Therefore, the production device provided by the present application can reduce the defective rate in the DES production process, and has a wide application prospect.

[0048] In some embodiments, the third washing tank 500 comprises a first acid washing tank 501 and a third water washing tank 502 connected in sequence, the first acid washing tank 501 is used for neutralizing the etching liquid on the flexible circuit board, and the third water washing tank 502 is used for flushing the etching liquid and the acid liquid remaining on the flexible circuit board.

[0049] In the above embodiment, the first acid washing tank 501 can effectively neutralize the etching liquid remaining on the flexible circuit board in the etching process, and based on the third water washing tank 502, the etching liquid and the acid liquid remaining on the flexible circuit board can be flushed to ensure that the flexible circuit board is clean when entering the next process.

[0050] In some embodiments, a fourth washing tank 700 is further included, which is connected with the film removing tank 600 and is used for fourthly flushing the flexible circuit board after film removing, so as to prevent the film removing liquid in the film removing tank 600 from remaining on the flexible circuit board; specifically, the fourth washing tank 700 comprises a fourth water washing tank 701, a second acid washing tank 702 and a fifth water washing tank 703 connected in sequence, the fourth water washing tank 701 is used for fourthly washing the flexible circuit board to remove the film removing liquid remaining on the flexible circuit board, the second acid washing tank 702 is used for neutralizing the film removing liquid on the flexible circuit board, and the fifth water washing tank 703 is used for fifthly washing the flexible circuit board to remove the residual acid and the neutralizing liquid remaining on the flexible circuit board.

[0051] In the above embodiment, the fourth water washing tank 701 is arranged to fourthly wash the flexible circuit board to preliminarily remove the film removing liquid remaining on the flexible circuit board, the second acid washing tank 702 can neutralize the film removing liquid remaining on the flexible circuit board, and the fifth water washing tank 703 further washes the flexible circuit board, so as to effectively remove the film removing liquid, the acid liquid and the neutralized neutralizing liquid remaining on the flexible circuit board.

[0052] In some embodiments, an antioxidation tank 801 and a sixth water washing tank 802 connected in sequence are further included, the antioxidation tank 801 is connected with the fifth water washing tank 703 and is used for antioxidation treatment of the copper surface on the flexible circuit board, and the sixth water washing tank 802 is used for removing the antioxidation liquid remaining on the flexible circuit board.

[0053] In the above embodiment, the antioxidation tank 801 can be used for antioxidation treatment of the copper surface on the flexible circuit board, so as to ensure that the copper surface on the flexible circuit board is not easily oxidized in a normal environment, and the sixth water washing tank 802 can effectively remove the antioxidation liquid remaining on the flexible circuit board.

[0054] In some embodiments, a drying tank 900 is further included, which is connected with the sixth water washing tank 802 and is used for drying the flexible circuit board after the antioxidation treatment.

[0055] In the above embodiment, the drying groove 900 comprises a cold air drying groove and / or a hot air drying groove. By arranging a drying groove 900 at the rear end of the sixth washing groove 802, the flexible circuit board after the antioxidation treatment and the sixth water washing can be dried by the drying groove 900, so that the product output by the production device is clean and free of water stains, and the adhesion of external dust and impurities to the surface of the flexible circuit board due to the water stains remaining on the flexible circuit board is avoided.

[0056] The above describes in detail the flexible circuit board DES production device provided by the present application. The principles and embodiments of the present application are described by applying specific examples, and the above embodiment is only used to help understand the core idea of the present application. It should be pointed out that for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A flexible circuit board DES production apparatus characterized by comprising: The utility model relates to a flexible circuit board processing device, comprising: a first washing tank (100) for first washing of the flexible circuit board to remove film slag; a developing tank (200) connected with the first washing tank (100) for developing the circuit pattern on the first washed flexible circuit board; a second washing tank (300) connected with the developing tank (200) for second washing of the developed flexible circuit board to prevent the developing solution in the developing tank (200) from polluting the flexible circuit board; an etching tank (400) connected with the second washing tank (300) for etching the second washed flexible circuit board to form a circuit on the flexible circuit board; a third washing tank (500) connected with the etching tank (400) for third washing of the etched flexible circuit board to prevent the etching solution in the etching tank from polluting the flexible circuit board; a film stripping tank (600) connected with the third washing tank (500) for stripping the dry film on the third washed flexible circuit board.

2. The flexible circuit board DES production apparatus according to claim 1, wherein The first washing tank (100) is a high-pressure water washing tank.

3. The flexible circuit board DES production apparatus according to claim 1, wherein The second washing tank (300) is a second water washing tank.

4. The flexible circuit board DES production apparatus according to claim 1, wherein The third washing tank (500) comprises a first acid washing tank (501) and a third water washing tank (502) connected in sequence, the first acid washing tank (501) is used for neutralizing the etching solution on the flexible circuit board, and the third water washing tank (502) is used for washing the residual etching solution and acid solution on the flexible circuit board.

5. The flexible circuit board DES production apparatus according to claim 1, wherein The utility model further comprises a fourth washing tank (700) connected with the film stripping tank (600) for fourth washing of the film-stripped flexible circuit board to prevent the film-stripping solution in the film stripping tank (600) from remaining on the flexible circuit board.

6. The flexible circuit board DES production apparatus according to claim 5, wherein The fourth washing tank (700) comprises a fourth water washing tank (701), a second acid washing tank (702) and a fifth water washing tank (703) connected in sequence, the fourth water washing tank (701) is used for fourth water washing of the flexible circuit board to remove the residual film-stripping solution on the flexible circuit board, the second acid washing tank (702) is used for neutralizing the residual film-stripping solution on the flexible circuit board, and the fifth water washing tank (703) is used for fifth water washing of the flexible circuit board to remove the residual acid and neutralizing solution on the flexible circuit board.

7. The flexible circuit board DES production apparatus according to claim 6, wherein The utility model further comprises an antioxidation tank (801) and a sixth water washing tank (802) connected in sequence, the antioxidation tank (801) is connected with the fifth water washing tank (703) and used for antioxidation treatment of the copper surface on the flexible circuit board, and the sixth water washing tank (802) is used for removing the residual antioxidation solution on the flexible circuit board.

8. The flexible circuit board DES production apparatus according to claim 7, wherein The utility model further comprises a drying tank (900) connected with the sixth water washing tank (802) and used for drying the antioxidation-treated flexible circuit board.

9. The flexible circuit board DES production apparatus according to claim 8, wherein The drying tank (900) comprises a cold air drying tank and / or a hot air drying tank.

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