Novel solder mask developing machine

Abstract

The utility model relates to the field of printed circuit board manufacturing equipment, in particular to a novel solder mask developing machine. Comprising a machine body, a first station, a second station and a third station are sequentially arranged on the machine body, a workpiece conveying assembly is arranged on the machine body and used for conveying workpieces, a spraying assembly is arranged on the machine body along the two opposite sides of the workpiece conveying assembly, and the spraying assembly is connected with a water supply assembly; the spraying assembly comprises a first spraying unit, a second spraying unit and a third spraying unit which are arranged corresponding to the first station, the second station and the third station respectively. According to different stage requirements of the PCB in the solder mask developing process, the spraying mode is accurately adjusted, the problem that in-hole ink cleaning and surface ink line protection cannot be considered at the same time is effectively solved, and the developing quality is remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of printed circuit board manufacturing equipment, in particular to a novel solder mask developing machine. BACKGROUND

[0002] In the manufacturing process of PCB products, the surface is usually coated with a layer of solder mask ink. Solder mask ink plays a crucial role in effectively protecting the copper surface from oxidation and scratches, while also serving as an insulator, which is essential for the normal use and performance stability of the PCB board.

[0003] However, with the continuous development of electronic technology and the increasing diversification of PCB product application scenarios, customers' quality requirements for PCB products are also continuously improving. In particular, in the solder mask process, higher standards are set for the aperture ratio and appearance of PCB products.

[0004] Traditional solder mask developing machines have many problems when faced with these new requirements. The spray design is relatively simple, usually only one spray mode, and lacks targeted design in terms of PCB hole ink punching and protection of ink lines. This results in two undesirable situations in actual operation: either to punch the hole ink clean by increasing the spray intensity, resulting in the surface ink line falling off due to overdevelopment, affecting the integrity of the PCB board line and electrical performance; or to reduce the spray intensity to protect the surface ink, but the hole ink cannot be completely developed and washed clean, and the residual ink may affect the aperture accuracy of the PCB board and subsequent welding processes.

[0005] Therefore, based on the above problems, the prior art needs to be improved. CONTENT OF THE INVENTION

[0006] The purpose of the present application is to provide a novel solder mask developing machine.

[0007] The above technical purpose of the present application is achieved by the following technical solution: a novel solder mask developing machine, comprising a machine body, a first station, a second station and a third station are sequentially arranged on the machine body, a workpiece conveying assembly is arranged on the machine body for conveying workpieces, along the opposite sides of the workpiece conveying assembly, a spray assembly is arranged on the machine body, the spray assembly is connected with a water supply assembly; the spray assembly comprises a first spray unit, a second spray unit and a third spray unit, which are respectively arranged corresponding to the first station, the second station and the third station.

[0008] By adopting the technical scheme, the spraying assembly is divided into three units corresponding to different stations, which can accurately adjust the spraying mode and parameters according to the different stage requirements of the PCB in the solder mask developing process, effectively solve the problem that the traditional developing machine cannot simultaneously consider the ink cleaning in the hole and the protection of the surface ink circuit, significantly improve the developing quality, ensure the aperture accuracy and circuit integrity of the PCB, and improve the electrical performance and reliability of the product. The three stations arranged on the machine body cooperate with the workpiece conveying assembly to realize the orderly circulation of the PCB in the developing process, and improve the production efficiency. The spraying assembly is arranged along the opposite sides of the workpiece conveying assembly and connected with the water supply assembly, which ensures the comprehensiveness and uniformity of the spraying, so that the developing chemical solution can fully act on each part of the PCB.

[0009] Optionally, the first spraying unit comprises a plurality of first spray heads and a first spraying pipe connected with the water supply assembly, the first spray head is a conical spray head, the distance between the first spray head and the conveying surface of the workpiece conveying assembly is 100mm-130mm, and the first spraying unit is used for dissolving the ink on the surface of the workpiece by using the developing chemical solution and enabling the developing chemical solution to enter the small hole of the workpiece to dissolve the ink.

[0010] By adopting the technical scheme, the distance between the spray head and the conveying surface of the workpiece conveying assembly is between 100mm and 130mm, and the conical spray head is adopted, so that the developing chemical solution can be sprayed on the surface of the workpiece at a suitable angle and force. On the one hand, it helps to uniformly dissolve the ink on the surface of the workpiece, so that the ink can be gradually removed under the action of the developing chemical solution, ensuring the stability and effectiveness of the ink removal process; on the other hand, it enables the developing chemical solution to smoothly enter the small hole of the workpiece to dissolve the ink under a smaller impact force, avoiding damage to the structure inside the hole or making the chemical solution unable to effectively penetrate into the hole due to excessive impact force. This not only improves the efficiency and quality of ink dissolution in the hole, but also lays a good foundation for the subsequent spraying stage, helps to improve the processing accuracy and effect of the solder mask developing machine on the PCB, ensures that the product meets higher requirements in terms of aperture ratio and appearance, improves the reliability and stability of the PCB in subsequent use, enhances the competitiveness of the product in the market, at the same time, helps to improve the production yield in the PCB manufacturing process, and reduces the production cost.

[0011] Optionally, the second spraying unit comprises a plurality of second spray heads and a second spraying pipe connected with the water supply assembly, the second spray head is a fan-shaped spray head, the distance between the second spray head and the conveying surface of the workpiece conveying assembly is 40mm-60mm, and the second spraying unit is used for timely flushing the ink in the hole of the workpiece with a larger impact force.

[0012] By adopting the technical scheme, the fan-shaped spray head is used, and the distance between the spray head and the conveying surface of the workpiece conveying assembly is 40mm-60mm. In this distance range, the fan-shaped spray head can concentrate a large impact force for spraying in a relatively small area. At this time, the ink line on the workpiece surface has not yet completely formed, and this large impact force spraying mode can accurately and efficiently flush the ink in the hole in time. On the one hand, the concentrated impact force ensures that the ink in the hole can be completely removed, avoiding the influence of residual ink on the PCB hole diameter accuracy and subsequent processes, and ensuring the high-quality production of products. On the other hand, since it is aimed at the ink in the hole, and the surface ink line has not yet completely formed at this stage, the small action area can minimize the adverse effects on the surface ink, preventing the surface ink from being damaged prematurely due to excessive spraying. This enables the solder mask developing machine to better control the protection of the surface ink while ensuring the cleaning of the ink in the hole, improving the accuracy and reliability of the entire solder mask developing process, and improving the production qualification rate of the PCB.

[0013] Optionally, the third spraying unit comprises a plurality of third spray heads and a third spraying pipe connected with the water supply assembly, the third spray head is a fan-shaped spray head, the distance between the third spray head and the conveying surface of the workpiece conveying assembly is 100mm-130mm, and the third spraying unit is used to prevent the surface ink line from falling off due to excessive spraying impact force after the surface ink line of the workpiece is formed, so that the developer flows into the hole to dissolve the ink to develop cleanly.

[0014] By adopting the technical scheme, the fan-shaped spray head is used, and the distance between the spray head and the conveying surface of the workpiece conveying assembly is kept at 100mm-130mm. The spraying at this distance can effectively prevent the surface ink line from falling off due to excessive spraying impact force when the surface ink line of the workpiece has been formed. On the one hand, the appropriate distance and the design of the fan-shaped spray head enable the developer to fall on the workpiece surface in a relatively soft and uniform manner, which can ensure that the developer flows into the hole to dissolve the remaining small amount of ink to achieve the purpose of clean development, and can also avoid excessive impact on the formed surface ink line, ensuring the integrity of the surface ink line, thereby ensuring the appearance quality and electrical performance of the PCB. On the other hand, this accurate spraying control helps to improve the stability and reliability of the entire solder mask developing process, reduces product defects caused by improper spraying, improves the qualification rate of products, and enables the PCB to meet the hole diameter ratio requirement while having good appearance quality.

[0015] Optionally, the workpiece conveying assembly comprises an upper conveying roller set and a lower conveying roller set, and a reserved gap is formed between the upper conveying roller set and the lower conveying roller set.

[0016] By adopting the above technical solution, a reserved gap is formed between the upper conveying roller set and the lower conveying roller set, effectively avoiding the problem of indentation on the board surface caused by the upper conveying roller directly pressing on the PCB board due to gravity. This allows the PCB board to maintain good flatness and surface integrity during transportation, ensuring that the appearance quality of the PCB board is not damaged, and avoiding potential electrical problems such as short circuit caused by indentation. At the same time, the existence of the reserved gap provides space for the slight deformation of the PCB board during transportation, reducing the risk of damage to the PCB board caused by mechanical stress during transportation, improving the stability and reliability of the PCB board during transportation, and thus ensuring the smooth progress of the entire solder mask development process, which helps to improve the production yield of the product and reduce the scrap rate caused by surface defects of the product.

[0017] Optionally, the lower conveying roller set is made of soft rubber sheet.

[0018] By adopting the above technical solution, the soft rubber sheet is soft in texture and can deform when in contact with the PCB board. This characteristic allows it to effectively fit the board surface when transporting the PCB board, greatly reducing the risk of scratching the ink layer on the surface of the PCB board, thereby protecting the integrity of the ink surface and ensuring that the appearance quality of the PCB board is not damaged. At the same time, the elasticity of the soft rubber sheet can buffer the vibration and impact force generated during transportation, further reducing the possibility of damage to the PCB board and ensuring the stability of the PCB board during transportation.

[0019] Optionally, the water supply assembly includes a water pump for providing power for the development solution conveying, a connecting pipe for connecting the water pump, the cold water pipe, the hot water pipe and the spraying assembly to form a corrosion-resistant development solution conveying channel, and the cold water pipe and the hot water pipe for introducing cold water and hot water respectively and provided with control valves for adjusting the water temperature.

[0020] By adopting the above technical solution, the water pump provides stable power for the development solution conveying, ensuring that the development solution can be continuously and stably supplied to the spraying assembly, ensuring the smooth progress of the spraying process, avoiding uneven spraying or interruption caused by insufficient power, and thus affecting the solder mask development effect. The connecting pipe forms a corrosion-resistant development solution conveying channel, effectively preventing the development solution from corroding the pipe, prolonging the service life of the water supply assembly, reducing the harm caused by pipe corrosion leakage to the equipment and environment, and at the same time ensuring that the purity and quality of the development solution are not affected during conveying. The provision of the cold water pipe and the hot water pipe and the provision of the control valves thereon can accurately adjust the water temperature to adapt to the specific needs of different process stages and PCB boards. Suitable water temperature helps to optimize the chemical activity of the development solution, improve its solubility and washing effect on the ink, and further improve the quality and efficiency of the solder mask development.

[0021] Optionally, the connecting pipe is provided with a filter.

[0022] By adopting the above technical scheme, the filter can effectively intercept impurity particles in the developer, avoid impurities from being sprayed onto the PCB board with the developer, prevent the impurities from scratching or contaminating the surface of the PCB board, and effectively guarantee the appearance quality of the PCB board. Meanwhile, the pure developer can ensure that the developing effect is not interfered by impurities during the spraying process, improve the accuracy and consistency of developing, help to realize more accurate aperture ratio control and clearer line developing, and improve the overall performance of the PCB board. In addition, the filter can also prevent impurities from entering the spraying assembly, reduce the probability of faults such as nozzle blockage, prolong the service life of the spraying assembly, reduce the equipment maintenance cost, improve the stability and reliability of the equipment operation, and enable the solder mask developing machine to work continuously and efficiently.

[0023] In summary, the present application at least has the following beneficial effects:

[0024] 1. The spraying assembly is divided into three units corresponding to different stations, and the nozzles of each unit are designed to have different spraying distances. The first spraying unit (100-130 mm conical nozzle) can make the developer gently dissolve the surface and the ink in the hole, and the third spraying unit (100-130 mm fan-shaped nozzle) can protect the surface ink circuit while ensuring clean developing in the hole, solving the problem that the traditional developing machine cannot balance the ink cleaning in the hole and the surface circuit protection, and improving the aperture precision, circuit integrity and electrical performance of the PCB board.

[0025] 2. The three stations of the machine body cooperate with the workpiece transportation assembly to orderly transfer the PCB board, improving production efficiency; the spraying assembly and the water supply assembly are arranged along the two sides of the transportation assembly to ensure that the spraying is comprehensive and uniform; the soft rubber sheet of the lower conveying roller set is designed to reduce scratches and buffer vibration, and the reserved gap avoids indentation of the upper roller, ensuring stable transportation, reducing the risk of PCB board damage, and improving production yield. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a structural schematic diagram of a new type of solder mask developing machine;

[0027] Figure 2 is a structural schematic diagram of a first spraying unit;

[0028] Figure 3 is a structural schematic diagram of a second spraying unit;

[0029] Figure 4 is a structural schematic diagram of a third spraying unit;

[0030] Figure 5 is a structural schematic diagram of a water supply assembly.

[0031] REFERENCE SIGNS

[0032] 1, body; 2, workpiece conveying assembly; 21, upper conveying roller set; 22, lower conveying roller set; 3, spraying assembly; 31, first spraying unit; 311, first spray head; 312, first spraying pipe; 32, second spraying unit; 321, second spray head; 322, second spraying pipe; 33, third spraying unit; 331, third spray head; 332, third spraying pipe; 4, water supply assembly; 41, water pump; 42, cold water pipe; 43, hot water pipe; 44, connecting pipe; 45, filter. DETAILED DESCRIPTION

[0033] The application will be further described in detail below with reference to the accompanying drawings.

[0034] In the embodiment, with reference to Figure 1 A new anti-welding developing machine comprises a body 1, and a first work station, a second work station and a third work station are sequentially arranged on the body 1. A workpiece conveying assembly 2 is arranged on the body 1 and used for conveying workpieces. Spraying assemblies 3 are arranged on the body 1 along opposite sides of the workpiece conveying assembly 2, and the spraying assemblies 3 are connected with a water supply assembly 4. The spraying assemblies 3 comprise first spraying units 31, second spraying units 32 and third spraying units 33, which are arranged correspondingly to the three work stations.

[0035] Specifically, with reference to Figure 1 The body 1 serves as the main structure of the entire anti-welding developing machine and provides installation and support for various work stations and assemblies. The first work station, the second work station and the third work station are sequentially arranged and correspond to different developing stages. In actual operation, workpieces pass through the three work stations in sequence through the workpiece conveying assembly 2 to complete the anti-welding developing process.

[0036] Specifically, with reference to Figure 2 The first spraying unit 31 comprises a plurality of first spray heads 311 and a first spraying pipe 312 connected with the water supply assembly 4. The first spray head 311 is a conical spray head, and the distance from the first spray head 311 to the conveying surface of the workpiece conveying assembly 2 is 100 mm-130 mm. At this distance, the developing chemical can be sprayed on the surface of the workpiece at a suitable angle and force, uniformly dissolving the ink on the surface of the workpiece, and enabling the developing chemical to enter the small holes of the workpiece to dissolve the ink.

[0037] Specifically, with reference to Figure 3 The second spraying unit 32 comprises a plurality of second spray heads 321 and a second spraying pipe 322 connected with the water supply assembly 4. The second spray head 321 is a fan-shaped spray head, and the distance from the second spray head 321 to the conveying surface of the workpiece conveying assembly 2 is 40 mm-60 mm. At this distance, the fan-shaped spray head can concentrate a large impact force in a relatively small area to flush out the ink in the holes of the workpiece in time.

[0038] Specifically, with reference to Figure 4The third spraying unit 33 comprises a plurality of third spray heads 331 and a third spraying pipe 332 connected with the water supply assembly 4. The third spray head 331 is a fan-shaped spray head, and the distance from the conveying surface of the workpiece conveying assembly 2 is 100mm-130mm. After the ink circuit on the surface of the workpiece is formed, the spraying at this distance can prevent the ink circuit on the surface from falling off due to excessive spraying impact force, so that the developer flows into the hole to dissolve the ink to develop cleanly.

[0039] Specifically, referring to Figure 1 The workpiece conveying assembly 2 comprises an upper conveying roller set 21 and a lower conveying roller set 22. A reserved gap is formed between the upper conveying roller set 21 and the lower conveying roller set 22 to avoid the upper conveying roller directly pressing on the PCB to cause indentation on the surface of the PCB. The lower conveying roller set 22 is made of soft rubber sheet, which is soft in texture and can effectively adhere to the surface of the PCB to reduce the risk of scratching the ink layer and buffer the vibration and impact force in the conveying process.

[0040] Specifically, referring to Figure 5 The water supply assembly 4 comprises a water pump 41 for providing the power for conveying the developer, a connecting pipe 44 for connecting the water pump 41, a cold water pipe 42, a hot water pipe 43 and the spraying assembly 3 to form a corrosion-resistant developer conveying channel, and the cold water pipe 42 and the hot water pipe 43 for introducing cold water and hot water respectively and provided with control valves to adjust the water temperature. The connecting pipe 44 is provided with a filter 45, which can effectively intercept impurity particles in the developer to ensure the purity of the developer.

[0041] The implementation principle of the embodiment is as follows: in actual operation, the water pump 41 draws the developer from the water tank and conveys it to the spraying assembly 3 through the connecting pipe 44. The cold water pipe 42 and the hot water pipe 43 adjust the water temperature according to the process requirements to make the developing developer play the best developing effect at the appropriate temperature. The filter 45 intercepts impurities in the developer to prevent the impurities from damaging the PCB and the spraying assembly 3.

[0042] The conical first spray head 311 in the first spraying unit 31 is 100mm-130mm away from the conveying surface of the workpiece conveying assembly 2. At this distance, the developer is sprayed on the surface of the workpiece at a specific angle and force. Since the spray head is conical, the developer spreads after being sprayed, which can uniformly cover the surface of the workpiece. This spraying method helps the developing developer to slowly and uniformly dissolve the ink on the surface of the workpiece. At the same time, this distance and the angle of the spray head make the developer enter the small hole of the workpiece with relatively small impact force, avoiding damage to the structure in the hole, so as to effectively dissolve the ink in the hole. The first spraying unit 31 mainly lays the foundation for the subsequent developing process to ensure that the ink on the surface and in the hole is preliminarily dissolved to prepare for the subsequent deeper developing.

[0043] The fan-shaped second spray head 321 in the second spray unit 32 is 40-60 mm away from the conveying surface of the workpiece conveying assembly 2. This relatively short distance allows the spray head to concentrate a large impact force in a relatively small area. At this stage, the ink lines on the workpiece surface have not yet fully formed, and the large impact force can accurately and efficiently flush the ink in the hole in time. The fan-shaped spray head design allows the chemical solution to be sprayed in a fan shape, covering a specific area and concentrating the flushing force on the ink in the hole. At the same time, since the surface ink lines have not yet fully formed, a smaller action area can minimize the adverse effects on the surface ink and prevent the surface ink from being damaged prematurely due to excessive spraying. The second spray unit 32 further removes the ink in the hole and lays the foundation for the final development.

[0044] The fan-shaped third spray head 331 in the third spray unit 33 is also 100-130 mm away from the conveying surface of the workpiece conveying assembly 2. At this distance, the spray can effectively prevent the surface ink lines from falling off due to excessive impact force of the spray. Since the spray head is fan-shaped, the chemical solution can be sprayed in a relatively soft and uniform manner. At this stage, the main purpose is to protect the formed surface ink lines while allowing the chemical solution to flow into the hole to dissolve the remaining small amount of ink to achieve clean development. This distance and spray head design allow the chemical solution to perform the final dissolution treatment on the ink in the hole while avoiding excessive impact on the surface ink lines, ensuring the integrity of the surface ink lines and thus the appearance quality and electrical performance of the PCB. The third spray unit 33 completes the final stage of the solder mask development and ensures that the PCB meets the high quality requirements after development.

[0045] The embodiments of the present specific embodiment are the preferred embodiments of the present application, but do not limit the protection scope of the present application. Therefore, any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A novel no-clean developer, characterized by, The utility model provides a kind of printing plate developing device, including fuselage (1), the first station, the second station and the third station are sequentially provided on the fuselage (1), workpiece transport component (2) is provided on the fuselage (1) for transporting workpiece, along the opposite sides of the workpiece transport component (2), the spraying assembly (3) is provided on the fuselage (1), the spraying assembly (3) is connected with water supply component (4);The spraying assembly (3) includes first spraying unit (31), second spraying unit (32) and third spraying unit (33), is set respectively corresponding the first station, the second station and the third station.

2. A novel no-clean developer as claimed in claim 1, wherein, The first spraying unit (31) includes a plurality of first spray heads (311) and a first spraying pipe (312) connected with the water supply component (4), the first spray head (311) is a conical spray head, the distance between the first spray head (311) and the conveying surface of the workpiece transport component (2) is 100mm-130mm, and the first spraying unit (31) is used for dissolving the ink on the surface of the workpiece with developing solution and enabling the developing solution to dissolve the ink in the small holes of the workpiece.

3. A novel no-clean developer as claimed in claim 1, wherein, The second spraying unit (32) includes a plurality of second spray heads (321) and a second spraying pipe (322) connected with the water supply component (4), the second spray head (321) is a fan-shaped spray head, the distance between the second spray head (321) and the conveying surface of the workpiece transport component (2) is 40mm-60mm, and the second spraying unit (32) is used for flushing the ink in the holes of the workpiece out in time with greater impact force.

4. A novel no-clean developer as claimed in claim 1, wherein, The third spraying unit (33) includes a plurality of third spray heads (331) and a third spraying pipe (332) connected with the water supply component (4), the third spray head (331) is a fan-shaped spray head, the distance between the third spray head (331) and the conveying surface of the workpiece transport component (2) is 100mm-130mm, and the third spraying unit (33) is used for preventing the surface ink circuit from falling off due to excessive impact force after the formation of the surface ink circuit, enabling the developing solution to flow into the holes to dissolve the ink and develop cleanly.

5. A novel anti-solder developing machine according to claim 1, characterized in that, The workpiece transport component (2) includes an upper conveying roller set (21) and a lower conveying roller set (22), and a reserved gap is formed between the upper conveying roller set (21) and the lower conveying roller set (22).

6. A novel no-clean developer as claimed in claim 5, wherein, The lower conveying roller set (22) is made of soft rubber.

7. A novel no-clean developer as claimed in claim 1, wherein, The water supply component (4) includes a water pump (41) for providing developing solution conveying power, a connecting pipe (44) for connecting the water pump (41), a cold water pipe (42), a hot water pipe (43) and the spraying assembly (3) to form a corrosion-resistant developing solution conveying channel, the cold water pipe (42) and the hot water pipe (43) for introducing cold water and hot water respectively and provided with control valves to adjust the water temperature.

8. A novel no-clean developer as claimed in claim 7, wherein, The connecting pipe (44) is provided with a filter (45).

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