Jig for chemical etching
By designing a fixture for chemical etching, the problems of etching solution waste and high operational risks were solved, achieving efficient and safe etching results for small-batch etching, suitable for small-batch or sampling etching needs.
Patent Information
- Application Number
- CN202423144669.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2034-12-19
AI Technical Summary
Existing chemical etching technology suffers from serious waste of etching solution, high operational risks, and poor etching results, especially in small-batch or sampling etching.
A chemical etching fixture was designed, including an etching container, an etching jig, and a lifting mechanism. The container is equipped with an exhaust port and a settling tank. The jig is used to fix the silicon wafer. The lifting mechanism can move up and down longitudinally to increase the contact area between the etching solution and the silicon wafer, and collects solid impurities through the settling tank.
It effectively reduces etching solution waste, improves etching effect, reduces operational risks, and ensures that the silicon wafer surface is not damaged, making it suitable for small-batch or sampling etching needs.
Smart Images
Figure CN223859615U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a jig for chemical etching particularly belongs to the technical field of chemical etching. BACKGROUND
[0002] The crystal in nature and theory are different, and some defects inevitably exist, for example, in the single crystal silicon rod grown by using the magnetic control vertical pulling method, due to slight changes of a thermal field, a magnetic field and an atmosphere, some dislocation structures are inevitably introduced. The dislocation is formed by the boundary between the slipped and unslipped areas in the crystal, and the existence of the dislocation has a great influence on the physical properties of the cast single crystal silicon parts, especially the mechanical properties. In addition, high dislocation density can cause serious reverse leakage current, and the efficiency of the silicon solar cell is reduced. Understanding the dislocation type and distribution in the single crystal silicon helps to optimize the epitaxial growth and the silicon device preparation process, reduce the formation of dislocations, and thus improve the overall quality and reliability of the material. There are many methods for making the dislocations in the single crystal silicon appear, for example, X-ray topography technology, physical grinding method and chemical etching method, wherein the chemical etching method is favored by the industry due to simple equipment, intuitive observation and easy operation. However, when sampling or etching Si pieces in small batches, the volume of the industrial etching tank is too large, which can cause serious waste of etching liquid, and a large amount of waste liquid also causes burden for later treatment. The commonly used PMMA (polymethyl methacrylate) small water tank is a flat cylindrical structure. Due to the volatility of the etching liquid and a large amount of toxic gas generated during the etching process, there is a risk of harm to the health of the operator during the etching process. In addition, since the etching liquid contains HNO3 which has lubricity, the silicon piece with HNO3 on the surface is not easy to be lifted by the clamp during the etching process, which can cause bubbles to accumulate and be difficult to release in the first time, and affect the etching effect. CONTENT OF THE UTILITY MODEL
[0003] The main purpose of the utility model is to provide a jig for chemical etching, so as to overcome the defects in the prior art.
[0004] In order to achieve the above-mentioned purpose of the utility model, the technical scheme adopted by the utility model comprises:
[0005] The utility model embodiment provides a jig for chemical etching, which comprises:
[0006] An etching container is internally provided with a working chamber for containing etching liquid and performing etching, and an exhaust port in communication with the working chamber is arranged on the etching container;
[0007] An etching clamp is arranged in the working chamber, and the etching clamp is used for carrying and fixing a silicon piece;
[0008] A lifting mechanism, a part of the lifting mechanism is arranged in the working chamber, the part is fixedly connected with the etching fixture, another part of the lifting mechanism is arranged outside the working chamber, and the lifting mechanism is movably connected with the etching container.
[0009] Compared with the prior art, the advantages of the utility model include:
[0010] The etching groove of the utility model is provided with a network of settling grooves, and large SiO2 generated in the reaction can be settled in the settling grooves, so that the reaction is not adversely affected.
[0011] The utility model discloses a kind of chemical etching fixtures provided by the embodiment of the utility model, and vertical tank body is used, etching liquid can be saved to the greatest extent under the premise of guaranteeing that silicon wafer is enough contact area with etching liquid.
[0012] The utility model discloses a kind of chemical etching fixtures provided by the embodiment of the utility model, and lifting rod is designed, and the contact area of etching liquid and Si piece is increased by the up-down movement of lifting rod during etching process, and etching effect is enhanced.
[0013] The etching groove of the utility model is provided with a network of settling grooves, and large SiO2 generated in the reaction can be settled in the settling grooves, so that the reaction is not adversely affected. BRIEF DESCRIPTION OF DRAWINGS
[0014] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0015] Figure 1 It is a kind of whole structure schematic diagram of chemical etching fixture provided in a typical embodiment case of the utility model;
[0016] Figure 2 It is a kind of whole perspective structure schematic diagram of chemical etching fixture provided in a typical embodiment case of the utility model;
[0017] Figure 3 It is a side view of a kind of chemical etching fixture provided in a typical embodiment case of the utility model;
[0018] Figure 4is Figure 3 is a schematic diagram of a cross-sectional structure formed along A-A in the middle;
[0019] Figure 5 is a schematic diagram of the internal structure of an etching container of a jig for chemical etching in a typical embodiment case of the present application;
[0020] Figure 6 is a schematic diagram of the structure of the etching clamp and the lifting mechanism in cooperation in a typical embodiment case of the present application;
[0021] Figure 7 is a top view of the etching container of the jig for chemical etching in a typical embodiment case of the present application. DETAILED DESCRIPTION
[0022] In view of the deficiencies in the prior art, the present inventors have long studied and practiced to propose the technical solution of the present application. The technical solution, its implementation process and principles will be further explained and described as follows.
[0023] The embodiment of the present application provides a jig for chemical etching, which comprises:
[0024] An etching container, which has a working chamber for containing etching liquid and for etching inside, and is provided with an exhaust port in communication with the working chamber;
[0025] An etching clamp, which is arranged in the working chamber and is used to carry and fix a silicon wafer;
[0026] A lifting mechanism, a part of which is arranged in the working chamber and is fixedly connected with the etching clamp, and another part of which is arranged outside the working chamber, and the lifting mechanism is movably connected with the etching container, and can be repeatedly lifted to drive the etching clamp to move up and down in the etching liquid in the working chamber along the longitudinal direction of the working chamber.
[0027] Further, the bottom surface of the working chamber is further provided with a plurality of settling tanks, which are used to at least accommodate solid impurities generated in the etching process.
[0028] Further, the plurality of settling tanks are sequentially connected to form a grid structure.
[0029] Further, the etching container comprises an etching container body and a cover plate, the etching container body has an etching groove for containing etching liquid, the cover plate is arranged on the etching container body in an openable manner, the cover plate covers the groove opening of the etching groove and forms the working chamber together with the etching groove, the exhaust port is arranged on the cover plate, and the settling groove is arranged at the groove bottom of the etching groove.
[0030] Further, the etching container further comprises a support bracket arranged on the outer portion of the etching container.
[0031] Further, the etching container further comprises four support brackets arranged on the two sides of the etching container respectively.
[0032] Further, the support bracket is a triangular bracket, and the four support brackets are located in two parallel extension planes.
[0033] Further, the support bracket is an isosceles right triangle bracket, and one right angle side of the support bracket is fixedly connected with the etching container.
[0034] Further, the support bracket is fixedly arranged on the etching container body.
[0035] Further, the lifting mechanism comprises two lifting rods and at least one operating rod, the two lifting rods are arranged in parallel, the second ends of the two lifting rods are fixedly connected with the etching clamp, and the two ends of the operating rod are fixedly connected with the middle portions or the first ends of the two lifting rods respectively; the etching container is provided with two spaced lifting holes, the portions of the lifting rods close to the first ends are arranged to protrude from the lifting holes, the lifting rods can move along the lifting holes, and at least one operating rod is arranged outside the working chamber operating rod.
[0036] Further, the lifting holes are arranged on the cover plate.
[0037] Further, the lifting mechanism comprises a plurality of operating rods, and the operating rods are arranged in parallel along the length direction of the lifting rods.
[0038] Further, the operating rod and the lifting rod are detachably connected, and when the lifting rod outside the working chamber is separated from the operating rod, the lifting rod can pass through the lifting hole and be separated from the etching container.
[0039] Further, the operating rod and the lifting rod are connected in a plug-in manner.
[0040] Further, the etching clamp has a plurality of parallel arranged grooves, and the grooves are used for fixing the silicon wafer.
[0041] The technical scheme, implementation process and principles will be further explained in combination with the accompanying drawings and specific implementation cases. Unless specifically stated, each component in the embodiments of the present application can be prepared by market purchase or known processing technology in the art, and is not specifically limited here.
[0042] Please refer to Figures 1-6 In a more typical implementation case, a chemical etching jig includes an etching container 100, an etching clamp 300 and a lifting mechanism 200. The etching container 100 has an internal working chamber for holding etching liquid and allowing etching to be performed. The etching container 100 is provided with an exhaust port 102 in communication with the working chamber. The etching clamp 300 is arranged in the working chamber and is used to carry and fix at least a silicon wafer. A part of the lifting mechanism 200 is arranged in the working chamber and is fixedly connected with the etching clamp 300. Another part of the lifting mechanism 200 is arranged outside the working chamber. The lifting mechanism 200 is movably connected with the etching container 100. The lifting mechanism 200 can be repeatedly lifted and lowered along the longitudinal direction of the working chamber to drive the etching clamp 300 to move in the etching liquid in the working chamber.
[0043] Specifically, the etching container 100, the etching clamp 300 and the lifting mechanism 200 of the chemical etching jig can all be made of PMMA (polymethyl methacrylate), or other materials with similar properties, which are not limited here.
[0044] Specifically, please refer again to Figures 2-6 The etching container 100 includes an etching container body 110 and a cover plate 120. The etching container body 110 has an etching groove 101 for holding etching liquid. The cover plate 120 is arranged on the etching container body 110 in an openable manner and can be sealingly connected with the etching container body 110. The cover plate 120 covers the groove opening of the etching groove 101 and forms a working chamber together with the etching groove 101. The cover plate 120 is provided with the exhaust port 102. The groove bottom of the etching groove 101 is provided with a plurality of settling grooves 140. The settling grooves 140 are sequentially and adjacently arranged to form a grid structure. Solid impurities (bulk SiO2) generated during the etching process fall into the settling grooves 140, thereby avoiding damage to the silicon wafer caused by the falling solid impurities.
[0045] Specifically, the etching container body 110 is a cuboid structure with a length of 18 cm, a width of 8 cm, and a height of 22 cm. The wall thickness of the etching container body 110 is 0.2 cm. An isosceles right triangle bracket 130 parallel to the short side is designed on the outer side wall of the etching container body 110. One leg of the isosceles right triangle bracket 130 is fixedly connected with the etching container body 110, and the length of the right angle side of the isosceles right triangle bracket 130 is 4 cm. In this way, the etching container body 110 filled with etching liquid is stable and cannot be tilted. The depth of the settling tank 140 at the bottom of the etching tank 101 is 2 cm. The large SiO2 generated by the reaction will settle in the grid and will not adversely affect the reaction.
[0046] Specifically, please refer to Figure 2 、 Figure 3 、 Figure 4 and Figure 7 , the lifting mechanism 200 includes two lifting rods 210 and three (of course, one or more) operating rods 220. The two lifting rods 210 are arranged in parallel, and the three operating rods 220 are arranged at intervals between the two lifting rods 210. Each operating rod 220 is fixedly connected at both ends to the middle part (the part between the first end and the second end) or the first end of the two lifting rods 210, and the second end of the two lifting rods 210 is fixedly connected with the etching clamp 300. The cover plate 120 of the etching container 100 is provided with two spaced-apart lifting holes. The part of the lifting rod 210 close to the first end extends from the lifting hole, and the lifting rod 210 can move along the lifting hole. The part of the lifting rod 210 close to the second end is arranged in the working chamber, and at least one operating rod 220 is arranged outside the working chamber. By operating the operating rod 220 outside the working chamber, the lifting mechanism 200 can drive the etching clamp 300 to move up and down.
[0047] Specifically, the lifting holes on the cover plate 120 have a limiting and guiding effect on the movement of the lifting mechanism 200. In order to improve the stability of the movement of the lifting mechanism 200 and avoid splashing of the etching liquid inside the etching container 100, the shape of the radial cross section of the lifting hole is the same as that of the lifting rod 210, the hole diameter of the lifting hole is slightly larger than the outer diameter of the lifting rod 210, and the surface of the contact area between the lifting hole and the lifting rod 210 is smooth. On the one hand, the plurality of operating rods 220 can realize the lifting distance of the lifting mechanism 200. For example, the adjacent two operating rods 220 are located on the upper and lower sides of the cover plate 120, and the spacing between the adjacent two operating rods 220 is the maximum lifting distance of the lifting mechanism 200, which also corresponds to the maximum movement amplitude of the silicon wafer on the etching clamp 300. On the other hand, the plurality of operating rods 220 can also adjust the maximum immersion depth of the etching clamp 300 to adapt to the etching tank 101 with different depth dimensions of the etching container body 110.
[0048] Specifically, the operating rod 220 is detachably connected with the pulling rod 210. When the pulling rod 210 outside the working chamber is separated from the operating rod 220, the pulling rod 210 can pass through the pulling hole and be separated from the etching container 100. For example, the operating rod 220 is connected with the pulling rod 210 by plugging.
[0049] For example, two pulling rods 210 are connected on both sides of the etching clamp 300. The diameter of the pulling rod 210 is 0.4 cm, and the length is 26 cm. Three operating rods 220 are respectively arranged at the height of 26 cm, 13 cm and 6.5 cm of the pulling rod 210.
[0050] Specifically, the etching clamp 300 has a plurality of parallel grooves 310 for fixing the silicon wafer. For example, the etching clamp 300 has a total length of 12 cm, a width of 6 cm and a height of 2 cm. The side connected with the pulling rod 210 is designed with four grooves 310 with a depth of 1 cm and a width of 0.4 cm. The side walls of the grooves 310 are all 0.4 cm. As shown in the figure, the four grooves 310 and six side walls are a total of 4 cm. The distance between the two innermost side walls is 2 cm.
[0051] For example, the cover plate 120 has a length of 18.4 cm, a width of 8.4 cm and a height of 5 cm. An exhaust port 102 is opened on the side wall of the short side. The exhaust port 102 has a length of 2.5 cm, a width of 8.4 cm and a height of 2.5 cm. In addition, the distance between the two pulling holes on the cover plate 120 is 12 cm, and the diameter is 0.41 cm. The pulling rod 210 can pass through the cover plate 120 after the operating rod 220 is removed.
[0052] Specifically, before chemical etching with the chemical etching tool, the silicon wafer is clamped in the groove 310 of the etching clamp 300, the etching tank 101 of the etching container 100 is filled with etching liquid, the pulling rod 210, the etching clamp 300 and the cover plate 120 are combined together, and the whole structure with the silicon wafer is slowly put into the etching tank 101, and the cover plate 120 is tightly covered.
[0053] During the etching process, the chemical etching tool is placed in a fume hood. The exhaust port 102 of the etching container 100 is opposite to the exhaust port of the fume hood, so that the generated gas can be discharged in time to protect the safety of the operator.
[0054] The operator slowly reciprocatingly pulls the operation rod 220 to make the bubbles adhered on the silicon wafer fall off, increase the contact area of the etching liquid and the Si wafer, and enhance the etching effect; the gas generated in the reaction is directed discharged through the exhaust port 102 designed on the cover plate 120, the personal safety of the operator is protected, and the large SiO2 generated in the reaction is settled in the settling tank 140 at the bottom of the etching tank 101, and the silicon wafer is not scratched.
[0055] The volume of the industrial chemical etching tank 101 is 40-70 L, the number of sample test samples is small, and chemical etching is performed on a small amount of samples, so that the waste of etching liquid is caused, and the discharge of too much waste liquid needs to spend considerable treatment cost. The volume of the chemical etching jig provided in the embodiment of the utility model is 1.5-3 L, the contact area of the sample and the etching liquid is not affected, the waste of etching liquid can be reduced to the maximum, and the etching of a small amount of samples is more suitable.
[0056] The etching liquid component is HF and HNO3, the etching sample is a Si wafer, and the following reactions occur in the etching process:
[0057] a. Si + 4HNO3 = SiO2 + 4NO2↑+ 2H2O;
[0058] b. Si + 4HF = SiF4↑+ 4H2↑;
[0059] c. Si + 4HNO3 + 6HF = H2SiF6 + 4NO2↑ + 4H2O.
[0060] When the etching liquid just participates in the reaction, the concentration is high, the reaction is violent, and a large amount of gas and bubbles are generated; when the reaction is performed for a period of time, the reaction tends to be gentle, the bubbles are reduced, and considering the volatility of the two acids, a small amount of gas is also generated at this time; the chemical etching jig provided in the embodiment of the utility model is designed with a cover plate 120, the cover plate 120 is designed with an exhaust port 102, the exhaust port 102 is opposite to the exhaust port of the fume hood, and the generated gas can be first extracted.
[0061] In addition to being designed with the exhaust port on the cover plate of the chemical etching jig provided in the embodiment of the utility model, the lifting hole for the lifting rod to move up and down is also designed; in the etching process, the operator slowly lifts and lowers the etching clamp to make the bubbles adhered on the silicon wafer fall off, increase the contact area of the etching liquid and the Si wafer, and enhance the etching effect.
[0062] It should be understood that the above embodiments are only to illustrate the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made in accordance with the spirit and essence of the present application shall be covered within the protection scope of the present application.
Claims
1. A jig for chemical etching, characterized by comprising: The application relates to an etching container, which comprises: an etching container body, which is internally provided with an etching tank for containing etching liquid and a working chamber for etching, and externally provided with an exhaust port in communication with the working chamber; an etching clamp, which is arranged in the working chamber and used for carrying and fixing a silicon wafer; a lifting mechanism, which is partially arranged in the working chamber and fixedly connected with the etching clamp, and partially arranged outside the working chamber and movably connected with the etching container, so that the lifting mechanism can be repeatedly lifted and moved up and down along the longitudinal direction of the working chamber to drive the etching clamp to move in the etching liquid in the working chamber.
2. The chemical etching jig according to claim 1, wherein: The bottom surface of the working chamber is further provided with a plurality of settling tanks, which are used for collecting solid impurities generated in the etching process.
3. The chemical etching jig according to claim 2, wherein: The plurality of settling tanks are sequentially and adjacently arranged in a grid structure.
4. The jig for chemical etching according to claim 2 or 3, wherein: The etching container comprises an etching container body and a cover plate, the etching container body is provided with an etching tank for containing etching liquid, the cover plate is arranged on the etching container body in an openable manner, the cover plate covers the tank opening of the etching tank and forms the working chamber together with the etching tank, the exhaust port is arranged on the cover plate, and the settling tanks are arranged on the tank bottom of the etching tank.
5. The jig for chemical etching according to claim 4, wherein: The etching container is further fixedly provided with supporting brackets outside.
6. The jig for chemical etching according to claim 5, wherein: The etching container is further provided with four supporting brackets, which are arranged on the two sides of the etching container respectively.
7. The jig for chemical etching according to claim 5 or 6, wherein: The supporting brackets are triangular brackets, and the four supporting brackets are located in two parallel extension planes.
8. The jig for chemical etching according to claim 7, wherein: The supporting brackets are isosceles right-angled triangular brackets, one right-angled side of the supporting bracket is fixedly connected with the etching container.
9. The jig for chemical etching according to claim 5 or 6, wherein: The supporting brackets are fixedly arranged on the etching container body.
10. The jig for chemical etching according to claim 4, wherein: The lifting mechanism comprises two lifting rods and at least one operating rod, the two lifting rods are arranged in parallel, the second ends of the two lifting rods are fixedly connected with the etching clamp, and the two ends of the operating rod are fixedly connected with the middle parts or the first ends of the two lifting rods respectively; the etching container is provided with two spaced lifting holes, the parts of the lifting rods close to the first ends are arranged to extend from the lifting holes, the lifting rods can move along the lifting holes, and at least one operating rod is arranged outside the working chamber operating rod.
11. The jig for chemical etching according to claim 10, wherein: The lifting holes are arranged on the cover plate.
12. The jig for chemical etching according to claim 10, wherein: The lifting mechanism comprises a plurality of operating rods, which are arranged in parallel along the length direction of the lifting rods.
13. The jig for chemical etching according to claim 12, wherein: The operating rod and the lifting rod are detachably connected, when the lifting rod outside the working chamber is separated from the operating rod, the lifting rod can pass through the lifting hole and be separated from the etching container.
14. The jig for chemical etching according to claim 13, wherein: The operating rod and the lifting rod are connected through plugging.
15. The jig for chemical etching according to Claim 1, wherein: The etching clamp is provided with a plurality of parallel arranged channels, which are used for fixing the silicon wafer.