Semiconductor preparation transfer device based on visual inspection

Abstract

The utility model discloses a semiconductor preparation transfer device based on visual inspection. The semiconductor preparation transfer device comprises a base, a mechanical arm and an adapter plate, wherein the mechanical arm is installed at the top of the base and used for achieving multi-angle posture changes, and the adapter plate is installed at one end of the mechanical arm. The side face, close to one end, of the mechanical arm is provided with a CCD visual camera used for detecting the orientation and the placing distance of a semiconductor to be transferred, and one side of the base is provided with a controller used for adjusting the transferring posture through a control algorithm. Through cooperation of the mechanical arm, the adapter plate, the CCD visual camera, the controller, the negative pressure suction cups and the distance changing mechanism, the operation posture and the azimuth angle of the mechanical arm can be corrected in real time, and the distance between the negative pressure suction cups is changed to be consistent with the placement distance between semiconductors to be transferred; therefore, accurate grabbing, stable transferring and accurate positioning of the semiconductor element are achieved, and the high-standard requirement of a modern semiconductor production line for efficient, accurate and low-pollution transferring is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a semiconductor preparation transfer device based on visual inspection. BACKGROUND

[0002] In the semiconductor manufacturing industry, efficient and accurate material transfer is one of the key factors to ensure smooth production process and improve production efficiency and product quality. With the continuous progress of semiconductor technology, semiconductor components such as wafers and chips are becoming smaller and smaller, and the accuracy requirements in the transfer process are becoming higher and higher.

[0003] The traditional transfer method mainly relies on manual operation, that is, the operator manually loads, unloads and transfers the semiconductor components between different stations. From the efficiency point of view, the manual transfer process takes a long time, and the physical strength and attention of the operator limit the transfer speed, making it difficult to improve the overall production efficiency. From the accuracy point of view, manual transfer cannot guarantee the accurate positioning and stable grabbing of semiconductor components. At the same time, it is also easy to contaminate the semiconductor components, thereby affecting the product quality and yield. SUMMARY

[0004] The utility model overcomes the insufficient prior art and provides a semiconductor preparation transfer device based on visual inspection.

[0005] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of a semiconductor preparation transfer device based on visual inspection, which comprises a base, a mechanical arm installed on the top of the base for realizing multi-angle attitude change, and an adapter plate installed on one end of the mechanical arm.

[0006] The mechanical arm is installed with a CCD vision camera on the side near one end for detecting the orientation and placement distance of the semiconductor to be transferred. One side of the base is provided with a controller for adjusting the transfer attitude through a control algorithm. One side of the adapter plate is installed with a plurality of negative pressure suction cups. One side of the adapter plate is provided with a variable distance mechanism.

[0007] The variable distance mechanism comprises a plurality of moving blocks fixed on the side of the negative pressure suction cups facing one end of the adapter plate, and a dual-axis translation assembly installed on one side of the adapter plate for realizing dual-axis translation of the moving blocks. One side of the moving blocks in the same plane is provided with a distance maintaining frame for maintaining the distance between adjacent moving blocks. One side of the adapter plate is provided with a power source for driving the diagonal moving blocks to move synchronously.

[0008] In a preferred embodiment of this utility model, the controller is electrically connected to the CCD vision camera and the power source respectively; the distribution of the spacing retainers in different planes is as follows: in the X-axis direction, the spacing retainers in multiple planes are evenly distributed in a linear array; in the Y-axis direction, the spacing retainers in the top plane and the spacing retainers in the bottom plane are symmetrically arranged.

[0009] In a preferred embodiment of the present invention, the dual-axis translation assembly includes: a Y-axis slide rail fixed to one side of the adapter plate, and an X-axis slide rail slidably connected to one side of the Y-axis slide rail; one side of the moving block is slidably connected to one side of the X-axis slide rail.

[0010] In a preferred embodiment of this utility model, the X-axis slide rail is arranged perpendicularly to the Y-axis slide rail.

[0011] In a preferred embodiment of the present invention, the spacing retainer includes: a plurality of first connecting strips hinged to one side of the outer movable block, and a plurality of second connecting strips hinged to one side of the middle movable block; one end of the plurality of first connecting strips is hinged to one end of the plurality of second connecting strips.

[0012] In a preferred embodiment of the present invention, the hinge point between the first connecting strip and the moving block is located at one end of the first connecting strip, and a plurality of the first connecting strips are stacked on top of each other in a V-shape; the hinge point between the second connecting strip and the moving block is located in the middle of the second connecting strip, and a plurality of the second connecting strips are stacked on top of each other in a cross shape.

[0013] In a preferred embodiment of this utility model, the power source includes: two cylinders with their tails opposite each other mounted on one side of the adapter plate, and two L-shaped push rods fixed to the output ends of the two cylinders; one end of each L-shaped push rod is fixed to the hinge joint of a plurality of first connecting strips and the moving block.

[0014] In a preferred embodiment of this utility model, the two cylinders are arranged vertically, and the moving blocks at one end of the two L-shaped push rods are connected diagonally.

[0015] In a preferred embodiment of the present invention, the bottom of the base is provided with a plurality of mounting holes for mounting the base in the working position by means of a connector.

[0016] In a preferred embodiment of this utility model, the mounting hole is either an internal threaded hole or a smooth hole.

[0017] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0018] (1) The utility model provides a kind of semiconductor preparation transfer device based on visual inspection, when carrying out the transfer operation of semiconductor, through the cooperation of mechanical arm, adapter plate, CCD vision camera, controller, negative pressure chuck and variable distance mechanism, the running posture and azimuth angle of mechanical arm can be corrected in real time, and the spacing between negative pressure chuck is changed to consistent with the placement spacing between the semiconductor to be transferred, so that accurate grabbing, stable transfer and accurate positioning of semiconductor component are realized, meet the high standard requirement of modern semiconductor production line to efficient, accurate, low pollution transfer.

[0019] (2)In the utility model, the spacing maintaining frame is arranged on one side of the moving block, the spacing maintaining frame is composed of the first connecting strip hinged on one side of the external moving block and the second connecting strip hinged on one side of the middle moving block, the first connecting strip and the second connecting strip are hinged and stacked, so that the shape can be adaptively adjusted with the movement of the moving block, thereby maintaining the stable spacing between the adjacent moving blocks, and automatic adjustment and maintenance of the spacing are realized.

[0020] (3)In the utility model, the power source is arranged on one side of the adapter plate, when the cylinder works, the linear motion of the cylinder pushes or pulls the hinge, thereby driving the movement of the moving block and the spacing maintaining frame, which is converted into the translation motion of the moving block, since the two cylinders are vertically arranged, the movement in the X-axis and Y-axis directions can be controlled respectively, and the moving blocks at one end of the two L-shaped push rods are diagonally connected, so that the moving blocks at the included angle of the two cylinders can be synchronously expanded or retracted in the X-axis and Y-axis directions, the spacing of the negative pressure chucks is adjusted, and the uniformity and stability of the spacing adjustment are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0021] The utility model will be further described in connection with the drawings and examples;

[0022] Figure 1 It is the perspective structural drawing of preferred embodiment of the utility model;

[0023] Figure 2 It is the spacing maintaining frame distribution structural drawing of preferred embodiment of the utility model;

[0024] Figure 3 It is the Figure 2 Enlarged structural drawing of A in the middle;

[0025] In the drawing: 1, base; 2, mechanical arm; 3, adapter plate; 4, CCD vision camera; 5, controller; 6, negative pressure chuck; 7, moving block; 71, Y-axis sliding rail; 72, X-axis sliding rail; 73, first connecting strip; 74, second connecting strip; 75, cylinder; 76, L-shaped push rod; 8, mounting hole. DETAILED DESCRIPTION

[0026] The utility model will be further explained in detail in combination with the drawings and embodiments, these drawings are all simplified schematic diagram, only with the schematic way explains the basic structure of the utility model, therefore it only shows the related structure of the utility model.

[0027] As Figure 1 And Figure 2 As shown in a kind of visual detection-based semiconductor preparation transfer device, including: base 1, installation in base 1 top for realizing the mechanical arm 2 of multi-angle attitude change, and the adapter plate 3 of installation in the end of mechanical arm 2;Mechanical arm 2 is close to the side of one end and is equipped with the CCD vision camera 4 for detecting the orientation and the placing interval of the semiconductor to be transferred, the side of base 1 is provided with the controller 5 for adjusting the transfer attitude by control algorithm, the side of adapter plate 3 is equipped with several negative pressure sucking disc 6, the side of adapter plate 3 is provided with variable distance mechanism;Variable distance mechanism includes: fixed in the direction of several mobile blocks 7 of several negative pressure sucking disc 6 towards the end of adapter plate 3, and installation in the side of adapter plate 3 for realizing the double-shaft translation of mobile block 7 Double-shaft translation assembly;The side of several mobile blocks 7 in the same plane is provided with the interval maintaining frame for maintaining the interval between adjacent mobile blocks 7, the side of adapter plate 3 is provided with the power source for driving the synchronous movement of several mobile blocks 7 of opposite angle.

[0028] It should be noted that the controller 5 is electrically connected with the CCD vision camera 4 and the power source respectively; the distribution mode of the in-plane spacing holders is that: in the X-axis direction, the plurality of in-plane spacing holders are uniformly distributed in a linear array mode, and in the Y-axis direction, the in-plane spacing holders at the top are symmetrically arranged with the in-plane spacing holders at the bottom; the CCD vision camera 4 is a high-performance image acquisition device specially designed for industrial applications, which has high sensitivity, low noise and good image quality based on CCD sensing technology, and is a component known to those skilled in the art, the structure and principle of which can be known by technical personnel through technical manuals, which will not be described in detail here; when the semiconductor transfer operation is performed, the position and the spacing of the semiconductor to be transferred are detected by the CCD vision camera 4, the image data thereof is received by the controller 5, and through advanced control algorithm, the running posture and the azimuth angle of the mechanical arm 2 are continuously corrected through interaction with the mechanical arm 2, and when the running posture and the azimuth angle of the mechanical arm 2 are corrected, through the control of the power source, the synchronous movement of the diagonal moving blocks 7 is driven, and under the cooperation of the spacing holder and the double-shaft translation assembly, the double-shaft translation can be performed when the moving blocks 7 move, and the spacing between the adjacent moving blocks 7 is maintained, so that the spacing between the negative pressure suction cups 6 is changed to be consistent with the spacing of the semiconductor to be transferred, and at the same time, the air pressure is increased by connecting the peripheral negative pressure equipment with the plurality of negative pressure suction cups 6 through the pipeline, so that the negative pressure acts on the negative pressure suction cups 6, so that the negative pressure suction cups 6 generate vacuum adsorption force, and the semiconductor to be transferred can be adsorbed, so as to realize the accurate grabbing, stable transfer and precise positioning of the semiconductor element, and meet the high-standard requirements of modern semiconductor production line for efficient, accurate and low-pollution transfer.

[0029] It can be understood that the control circuit of the controller 5 can be realized through simple programming by those skilled in the art, which belongs to the common knowledge in the art, and the present application file mainly protects the mechanical device, so the control mode and the circuit connection will not be explained in detail here.

[0030] As shown in Figure 3 some embodiments, the double-shaft translation assembly includes: a Y-axis sliding rail 71 fixed on one side of the adapter plate 3, and an X-axis sliding rail 72 slidingly connected on one side of the Y-axis sliding rail 71; one side of the moving block 7 is slidingly connected with one side of the X-axis sliding rail 72.

[0031] It should be noted that the X-axis sliding rail 72 is perpendicular to the Y-axis sliding rail 71; when the moving block 7 drives the negative pressure suction cup 6 to translate, since the X-axis sliding rail 72 is slidingly connected on the Y-axis sliding rail 71, and the moving block 7 is slidingly connected on the X-axis sliding rail 72, the moving block 7 can freely move in the X-axis and Y-axis directions, so as to realize the accurate adjustment of the position of the negative pressure suction cup 6, and provide flexible positioning capability for the semiconductor transfer.

[0032] As Figure 2 shown, in some embodiments, the spacing holder comprises: a plurality of first connecting strips 73 hinged on one side of the outer moving block 7, and a plurality of second connecting strips 74 hinged on one side of the middle moving block 7; one end of the plurality of first connecting strips 73 is hinged with one end of the plurality of second connecting strips 74.

[0033] It should be noted that the hinge point of the first connecting strip 73 with the moving block 7 is located at one end of the first connecting strip 73, and the plurality of first connecting strips 73 are stacked in V shape; the hinge point of the second connecting strip 74 with the moving block 7 is located at the middle of the second connecting strip 74, and the plurality of second connecting strips 74 are stacked in cross shape; by composing the spacing holder with the first connecting strips 73 hinged on one side of the outer moving block 7 and the second connecting strips 74 hinged on one side of the middle moving block 7, and by the hinge and stacking mode of the first connecting strips 73 and the second connecting strips 74, it can adaptively adjust the shape with the movement of the moving block 7, thereby maintaining the stable spacing between adjacent moving blocks 7, and realizing the automatic adjustment and maintenance of the spacing.

[0034] In some embodiments, the power source comprises: two air cylinders 75 oppositely mounted on one side of the adapter plate 3, and two L-shaped push rods 76 fixed at the output ends of the two air cylinders 75; one end of the L-shaped push rod 76 is fixed with the hinge of the plurality of first connecting strips 73 and the moving block 7.

[0035] It should be noted that the two air cylinders 75 are vertically arranged, and the moving blocks 7 at one end of the two L-shaped push rods 76 are diagonally connected; when the air cylinder 75 works, through the linear motion of the air cylinder 75, the L-shaped push rod 76 will push or pull the hinge, thereby driving the movement of the moving block 7 and the spacing holder, which is converted into the translation motion of the moving block 7; since the two air cylinders 75 are vertically arranged, the movement in X-axis and Y-axis directions can be controlled respectively, and since the moving blocks 7 at one end of the two L-shaped push rods 76 are diagonally connected, the plurality of moving blocks 7 can be synchronously expanded or retracted in X-axis and Y-axis directions from the moving blocks 7 at the included angle of the two air cylinders 75, thereby realizing the adjustment of the spacing of the negative pressure suction disc 6, and ensuring the uniformity and stability of the spacing adjustment.

[0036] As Figure 1 shown, in some embodiments, the bottom of the base 1 is provided with a plurality of mounting holes 8 for mounting the base 1 at the working position through the connecting member.

[0037] It should be noted that the mounting hole 8 is one of an internal threaded hole or a light hole; through the arrangement of the plurality of mounting holes 8, the base 1 can be quickly and stably connected with the working position through the connecting member such as a bolt or a pin.

[0038] The utility model discloses a high -efficient, accurate, low -pollution transport of modern semiconductor production line to high -standard requirement is satisfied when the utility model uses, through the stable installation of base 1 at the working position, the high -performance CCD vision camera 4 detects the orientation and the interval of the semiconductor of waiting for transfer, and will image data transmission give controller 5. After controller 5 receives data, using advanced control algorithm and mechanical arm 2 carry out real -time interaction, correct the operating posture and azimuth angle of mechanical arm 2. Meanwhile, controller 5 controls power source drive diagonal arrangement's moving block 7 through double -shaft translation component synchronous movement in X -axis and Y -axis direction, and the interval holding frame is self -adaptation adjustment shape to keep the stable interval between adjacent moving block 7 in the moving process. The movement of moving block 7 drives the adjustment of the interval of negative pressure sucking disc 6, makes it with the interval of the semiconductor of waiting for transfer consistent. Subsequently, peripheral negative pressure equipment is connected through pipeline and negative pressure sucking disc 6, produces negative pressure effect, makes negative pressure sucking disc 6 produce vacuum adsorption force, accurate grabbing semiconductor element. Finally, mechanical arm 2 realizes the stable transfer and accurate positioning of semiconductor element under the accurate control of controller 5, satisfies the high -standard requirement of modern semiconductor production line to high -efficient, accurate, low -pollution transfer.

[0039] The above is according to the ideal embodiment of the utility model for the enlightenment, through the above-mentioned explanation content, for the person skilled in the art, obviously, the utility model is not limited to the details of the above-mentioned exemplary embodiments, and can realize the utility model in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, no matter from which point, should regard the embodiment as exemplary, and non - limiting, the scope of the utility model is defined by the appended claims instead of the above -mentioned description, therefore, all the changes falling in the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0040] In addition, it should be understood that, although the present specification is described according to the embodiment, not every embodiment contains only one independent technical scheme, the description mode of the specification is only for the sake of clarity, the person skilled in the art should regard the specification as a whole, and the technical scheme in each embodiment can also be combined appropriately to form other embodiments that the person skilled in the art can understand.

Claims

1. A semiconductor fabrication transfer device based on vision inspection, characterized in that, Include: Base (1), mechanical arm (2) installed on the top of the base (1) for realizing multi-angle posture change, and adapter plate (3) installed on one end of the mechanical arm (2); The side of the mechanical arm (2) close to one end is provided with a CCD vision camera (4) for detecting the orientation and placement interval of the semiconductor to be transported, one side of the base (1) is provided with a controller (5) for adjusting the transportation posture through the control algorithm, and one side of the adapter plate (3) is provided with a plurality of negative pressure suction cups (6). The side of the adapter plate (3) is provided with a variable distance mechanism; The variable distance mechanism comprises: a plurality of moving blocks (7) fixed on the side of the adapter plate (3) towards one end of the adapter plate (3), and a double-axis translation assembly installed on one side of the adapter plate (3) for realizing double-axis translation of the moving blocks (7); The side of a plurality of the moving blocks (7) in the same plane is provided with a distance maintaining frame for maintaining the distance between adjacent moving blocks (7), and the side of the adapter plate (3) is provided with a power source for driving the synchronous movement of the moving blocks (7) at the opposite corners.

2. The visual inspection based semiconductor preparation transfer device according to claim 1, wherein: The controller (5) is electrically connected with the CCD vision camera (4) and the power source respectively; The distribution mode of the distance maintaining frame in different planes is: in the X-axis direction, the distance maintaining frames in multiple planes are uniformly distributed in a linear array mode, and in the Y-axis direction, the distance maintaining frames in the top plane are symmetrically arranged with the distance maintaining frames in the bottom plane. 3.The visual detection based semiconductor preparation transfer device according to claim 1, wherein: The double-axis translation assembly comprises: a Y-axis slide rail (71) fixed on one side of the adapter plate (3), and an X-axis slide rail (72) slidably connected on one side of the Y-axis slide rail (71); One side of the moving block (7) is slidably connected with one side of the X-axis slide rail (72).

4. The apparatus according to claim 3, wherein the apparatus further comprises a visual inspection device. The X-axis slide rail (72) is perpendicular to the Y-axis slide rail (71).

5. The apparatus according to claim 1, wherein the apparatus further comprises a visual inspection device. The distance maintaining frame comprises: a plurality of first connecting strips (73) hinged on one side of the outer moving block (7), and a plurality of second connecting strips (74) hinged on one side of the middle moving block (7); One end of the first connecting strip (73) is hinged with one end of the second connecting strip (74).

6. The apparatus according to claim 5, wherein the apparatus further comprises a visual inspection device. The hinge point of the first connecting strip (73) and the moving block (7) is located at one end of the first connecting strip (73), and a plurality of the first connecting strips (73) are overlapped in V shape; The hinge point of the second connecting strip (74) and the moving block (7) is located in the middle of the second connecting strip (74), and a plurality of the second connecting strips (74) are overlapped in cross shape.

7. The apparatus according to claim 5, wherein the apparatus further comprises a visual inspection device. The power source comprises: two air cylinders (75) oppositely installed on one side of the adapter plate (3), and two L-shaped push rods (76) fixed on the output ends of the two air cylinders (75); One end of the L-shaped push rod (76) is fixed with the hinge of a plurality of the first connecting strips (73) and the moving block (7).

8. The apparatus according to claim 7, wherein the apparatus further comprises a visual inspection device. Two air cylinders (75) are vertically arranged, and the moving blocks (7) at one end of the two L-shaped push rods (76) are connected at opposite corners.

9. The apparatus according to claim 1, wherein the apparatus is a visual inspection based semiconductor manufacturing transfer apparatus. The bottom of the base (1) is provided with a plurality of mounting holes (8) for mounting the base (1) in a working position by connecting members.

10. The apparatus according to claim 9, wherein the apparatus further comprises a visual inspection device. The mounting holes (8) are one of internally threaded holes or plain holes.

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