Material frame for semiconductor trimming machine

Abstract

The utility model provides a material frame for a semiconductor bar cutter, which relates to the technical field of bar cutter material frames, is positioned in a bar cutter, is used for stacking a plurality of lead frames, and comprises four square column structures and a bottom block, and the four square column structures are respectively positioned at four corners of the material frame; the bottom block is provided with four limiting assemblies in one-to-one correspondence with the square column structures. The four square column structures are connected with the bottom block in an inserted mode through the corresponding limiting assemblies. Each limiting assembly comprises a plurality of inserting structures, each inserting structure is distributed in an L shape, and every two adjacent inserting structures located in the same limiting assembly are equally spaced; each square column structure is in an L shape, the L-shaped protruding ends of the square column structures face outwards, and the problems that due to the fact that a material frame in an existing rib cutting machine is integrally formed, the material frame cannot stably support lead frames of different models, and the lead frames of different models need to be replaced for supporting the lead frames of different models are solved. And low-cost production of the semiconductor is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of the material frame of the wire cutting machine, and particularly relates to a material frame for a semiconductor wire cutting machine. BACKGROUND

[0002] When the semiconductor is processed, the lead frame used for semiconductor production needs to be subjected to wire cutting treatment by using the wire cutting machine.

[0003] When the wire cutting machine cuts the lead frame, the clamping mechanism in the wire cutting machine clamps the lead frame in the material frame into the cutting groove one by one for wire cutting operation. However, the material frame in the existing wire cutting machine is integrally formed, so that the material frame cannot stably support lead frames of different models. For lead frames of different models, different models of material frames need to be replaced for support, which causes the problem of increased cost of semiconductor processing. UTILITY MODEL CONTENTS

[0004] (I) Technical problem solved

[0005] In view of the deficiencies of the prior art, the utility model provides a material frame for a semiconductor wire cutting machine, which solves the problem that the material frame in the existing wire cutting machine is integrally formed, so that the material frame cannot stably support lead frames of different models.

[0006] (II) Technical scheme

[0007] To achieve the above purpose, the utility model is implemented by the following technical scheme:

[0008] In the utility model, the material frame for the semiconductor wire cutting machine is located in the wire cutting machine and is used for stacking multiple lead frames. The material frame comprises four square column structures and a bottom block. The four square column structures are respectively located at the four corners of the material frame.

[0009] The bottom block is provided with four limiting assemblies corresponding to the square column structures.

[0010] The four square column structures are respectively inserted into the bottom block through the corresponding limiting assemblies.

[0011] Each limiting assembly comprises multiple insertion structures. Each insertion structure is in L-shaped distribution, and the adjacent two insertion structures in the same limiting assembly are equidistant.

[0012] Each square column structure is in L-shaped distribution, and the L-shaped protruding end of the square column structure faces outward. The L-shaped recess of the square column structure is respectively provided with a supporting block.

[0013] Each supporting block divides the L-shaped recess of the corresponding square column structure into a limiting groove and an avoiding groove.

[0014] A plurality of lead frames are stacked in the square supporting frame formed by the plurality of limiting grooves and are in contact with the inner wall of the square supporting frame.

[0015] Further, the depth of each of the avoiding grooves is greater than the height of the corresponding inserting structure of the limiting component.

[0016] Further, a through groove is formed in the middle of the upper and lower ends of each of the lead frames.

[0017] After two adjacent lead frames are stacked, two adjacent through grooves form an inserting groove.

[0018] Further, at least one pulling rod is installed on the bottom block.

[0019] Each of the pulling rods is L-shaped and is located at the end of the bottom block close to the warehouse door of the material frame for feeding.

[0020] A plurality of sliding grooves are formed in the end of the bottom block away from the square column structure and the bottom block is slidingly connected to the cutting machine through the plurality of sliding grooves.

[0021] Further, each of the inserting structures comprises an inserting block one and an inserting block two.

[0022] Each of the inserting block one and the inserting block two is T-shaped.

[0023] An inserting groove one and an inserting groove two corresponding to the inserting block one and the inserting block two respectively are formed in the end of each of the square column structures close to the inserting structure.

[0024] The inserting groove one and the inserting groove two located on the same square column structure are located on two straight edges of the L-shaped square column structure, and the T-shaped head ends of the inserting groove one and the inserting groove two located on the same square column structure are located on the same straight edge of the L-shaped square column structure.

[0025] The adjacent two limiting components are mirror image arranged.

[0026] The four square column structures are square column one, square column two, square column three and square column four, and the adjacent two square column structures are mirror image arranged.

[0027] (Three) beneficial effects

[0028] The utility model provides a material frame for semiconductor cutting machine, compared with prior art, has the following beneficial effects:

[0029] By setting four square column structures and four limiting assemblies, the material frame can be disassembled, meanwhile, the limiting assembly is set as a form of multiple plug-in structures, and the adjacent two plug-in structures in the same limiting assembly are equidistant, by placing the square column structure on the different plug-in structures of the corresponding limiting assembly, the position of the square column structure is adjusted, so that the size of the square supporting frame formed by the four square column structures is adjusted, so as to be suitable for placing different models of lead frames, the problem that the material frame cannot meet the stable support of different models of lead frames due to the integral molding of the material frame in the existing rib cutting machine is solved, the problem that different models of lead frames need to be replaced by different models of material frames for support is solved, and low-cost production of semiconductors is realized. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0031] Figure 1 It is an exploded view of a material frame for a semiconductor rib cutting machine.

[0032] Figure 2 It is Figure 1 It is a structural schematic view of multiple limiting assemblies mounted on the bottom block.

[0033] Figure 3 It is Figure 1 It is a perspective view of the square column one.

[0034] Figure 4 It is Figure 1 It is a perspective view of part of the structure after turning over.

[0035] Reference signs:

[0036] 1, square column one; 10, supporting block; 11, limiting groove; 12, avoiding groove; 13, slot one; 14, slot two; 2, square column two; 3, square column three; 4, square column four; 5, lead frame; 51, plug-in slot; 6, bottom block; 60, sliding groove; 61, pulling rod; 62, limiting assembly; 63, plug-in structure; 631, plug block one; 632, plug block two. DETAILED DESCRIPTION

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0038] This application provides a material frame for a semiconductor lead cutting machine, which solves the problem that the material frame in the existing lead cutting machine is integrally formed, making it unable to stably support different types of lead frames, thus achieving low-cost semiconductor production.

[0039] The technical solution in this application is to solve the above-mentioned technical problems, and the general idea is as follows:

[0040] The existing lead frame in the lead cutting machine is integrally molded, which makes it unable to stably support different models of lead frames. Different models of lead frames need to be replaced with different models of lead frames, which increases the cost of semiconductor processing.

[0041] Research has found that, for example Figures 1-4 As shown, by setting four square column structures and four limiting components, the material frame can be detached. At the same time, the limiting components are set in the form of multiple plug-in structures, and the two adjacent plug-in structures within the same limiting component are equidistant. By placing the square column structures on different plug-in structures on the corresponding limiting components, the position of the square column structures can be adjusted, thereby adjusting the size of the square support frame formed by the four square column structures to accommodate the placement of different types of lead frames. This solves the problem in existing lead cutting machines where the material frame is integrally formed, which makes it unable to stably support different types of lead frames, requiring the replacement of different types of material frames for different types of lead frames. This achieves low-cost semiconductor production.

[0042] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0043] Example:

[0044] like Figures 1-3 As shown, a material frame for a semiconductor lead cutting machine is located inside the lead cutting machine and is used to stack multiple lead frames 5. It includes four square column structures and a base block 6. The four square column structures are respectively located at the four corners of the material frame.

[0045] Four limiting components 62, each corresponding to a square column structure, are installed on the bottom block 6.

[0046] Each of the four square column structures is connected with the bottom block 6 through a corresponding limiting assembly 62.

[0047] Each of the limiting assemblies 62 comprises a plurality of connecting structures 63, each of which is in the shape of L, and adjacent two connecting structures 63 in the same limiting assembly 62 are equidistant.

[0048] Each of the square column structures is in the shape of L, and the L-shaped protruding end of the square column structure faces outward, and each of the L-shaped recesses of the square column structure is provided with a supporting block 10.

[0049] Each of the supporting blocks 10 divides the L-shaped recess of the corresponding square column structure into a limiting groove 11 and an avoiding groove 12.

[0050] A plurality of lead frames 5 are stacked in the square supporting frame formed by the limiting grooves 11, and are in contact with the inner wall of the square supporting frame.

[0051] By arranging four square column structures and four limiting assemblies 62, the material frame can be disassembled, and the limiting assembly 62 is arranged in the form of a plurality of connecting structures 63, and adjacent two connecting structures 63 in the same limiting assembly 62 are equidistant, by placing the square column structure on different connecting structures 63 of the corresponding limiting assembly 62, the position of the square column structure is adjusted, so as to adjust the size of the square supporting frame formed by the four square column structures, so as to be suitable for placing lead frames 5 of different models, solve the problem that the material frame cannot meet the stable support of lead frames 5 of different models due to the integral molding of the material frame in the existing cutting machine, and realize the low-cost production of semiconductors.

[0052] As shown in Figure 1 Each of the lead frames 5 is provided with a through groove in the middle of the upper and lower ends.

[0053] After the adjacent two lead frames 5 are stacked, the two adjacent through grooves form a connecting groove 51.

[0054] By arranging the material frame in the form of four square column structures connected to the bottom block 6, there is no contact between adjacent two square column structures, which can facilitate the complete synchronous exposure of a plurality of connecting grooves 51, so as to facilitate the clamping of the lead frames 5 by the clamping mechanism in the cutting machine through the corresponding connecting grooves 51, solve the problem that the existing material frame around the frame will block part of the connecting grooves 51, and cannot completely expose all the connecting grooves 51 in the material frame, and a pushing structure needs to be installed in the material frame to realize the clamping of the lead frames 5 in the blocked position.

[0055] As shown in Figure 1 The bottom block 6 is provided with at least one pulling rod 61.

[0056] Each of the pull rods 61 is L-shaped, and is located at the end of the bottom block 6 close to the warehouse door end of the cutting machine for material frame replenishment;

[0057] The bottom block 6 is provided with a plurality of sliding grooves 60 at the end away from the square column structure, and is slidably connected with the cutting machine through the plurality of sliding grooves 60;

[0058] By setting the pull rod 61 and the sliding groove 60, the entire material frame can be pulled to the warehouse door end of the cutting machine for material frame replenishment, and the sliding groove 60 is inserted and fixed with the machine body when the material frame is used, so that the clamping mechanism can clamp the lead frame 5 from the material frame.

[0059] As shown in Figure 3 The depth of each of the avoidance grooves 12 is greater than the height of the corresponding insertion structure 63 on the limiting component 62.

[0060] By limiting the height of the avoidance groove 12, the depth of the avoidance groove 12 is set to be higher than the height of the insertion structure 63 on the limiting component 62, so that when the spacing between the adjacent two insertion structures 63 is set, the problem of interference caused by the size of the supporting block 10 to the unused insertion structure 63 on the limiting component 62 does not need to be considered, the problem of limited spacing between the adjacent two insertion structures 63 is solved, more sizes of square supporting frames are formed, and thus the material frame can be applied to more models of lead frames 5 as much as possible.

[0061] As shown in Figures 1-4 Each of the insertion structures 63 comprises an insertion block one 631 and an insertion block two 632;

[0062] Each of the insertion block one 631 and the insertion block two 632 is T-shaped;

[0063] Each of the square column structures is provided with an insertion slot one 13 and an insertion slot two 14 corresponding to the insertion block one 631 and the insertion block two 632 respectively at one end close to the insertion structure 63;

[0064] The insertion slot one 13 and the insertion slot two 14 located on the same square column structure are located on two straight edges of the L-shaped square column structure, and the T-shaped head ends of the insertion slot one 13 and the insertion slot two 14 located on the same square column structure are located on the same straight edge of the L-shaped square column structure, as shown in Figure 3 ;

[0065] The adjacent two limiting components 62 are mirror image arranged;

[0066] The four square column structures are square column one 1, square column two 2, square column three 3 and square column four 4, and the adjacent two square column structures are mirror image arranged.

[0067] By setting the plug-in structure 63 as a combination of plug-in block one 631 and plug-in block two 632, setting both the plug-in block one 631 and the plug-in block two 632 as T-shaped, and locating the T-shaped head ends of the slot one 13 and the slot two 14 on the same straight side of the L-shaped square column structure, the setting of the two T-shaped plug-in block one 631 and plug-in block two 632 and the slot one 13 and the slot two 14 can improve the stability of the installation of the square column structure.

[0068] It should be noted that the spacing between the adjacent two plug-in structures 63 on the same limiting component 62 is designed according to the conventional signal of the lead frame 5.

[0069] During operation, the material frame is adjusted according to the size of the lead frame 5 that needs to be cut;

[0070] When adjusting the material frame, the square column structure is plugged into the corresponding limiting component 62, and the assembly of the material frame is realized by the plug-in of the square column structure and the limiting component 62, and the size of the square support frame formed by the four square column structures is adjusted by the multiple plug-in structures 63 on the limiting component 62, thereby realizing that the material frame can support multiple lead frames 5 of different sizes while improving the stability of the support of the material frame to the lead frame 5;

[0071] After the material frame is adjusted, multiple lead frames 5 of the same size are stacked in the material frame, the worker slides the material frame with multiple lead frames 5 to the clamping position of the clamping mechanism along the slide of the lead cutting machine, and plugs the slide groove 60 at the bottom of the bottom block 6 into the lead cutting machine to realize the stability between the material frame and the lead cutting machine during use;

[0072] After the multiple lead frames 5 in the material frame are clamped by the clamping mechanism, the worker pulls the bottom block 6 by pulling the rod 61, disengages the plug-in of the bottom block 6 and the lead cutting machine, and moves the entire material frame, thereby facilitating the replenishment operation of the material frame in the lead cutting machine.

[0073] Compared with the prior art, the present application has the following advantages:

[0074] 1. By setting four square column structures and four limiting components 62, the material frame can be disassembled, and by setting the limiting component 62 as multiple plug-in structures 63, and the adjacent two plug-in structures 63 in the same limiting component 62 are equidistant, by placing the square column structure on different plug-in structures 63 of the corresponding limiting component 62, the position of the square column structure is adjusted, thereby adjusting the size of the square support frame formed by the four square column structures, to adapt to the placement of lead frames 5 of different models, solving the problem that the material frame in the existing lead cutting machine is integrally formed, which cannot stably support lead frames 5 of different models, and realizing low-cost production of semiconductors.

[0075] 2. By limiting the height of the clearance groove 12, the depth of the clearance groove 12 is set to be higher than the height of the plug-in structure 63 on the corresponding limiting component 62. Therefore, when setting the spacing between two adjacent plug-in structures 63, it is not necessary to consider the interference of the size of the support block 10 on the unused plug-in structure 63 on the limiting component 62. This solves the problem of limited spacing between two adjacent plug-in structures 63, enabling the formation of more square support frame sizes, so that the material frame can be applied to more types of lead frame 5 as much as possible.

[0076] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0077] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A frame for a semiconductor slitter, characterized by, The application is located in a cutting machine and is used for stacking multiple lead frame (5) including four square column structures and a bottom block (6), four square column structures are respectively located at four corners of the material frame; Four limiting assemblies (62) corresponding to the square column structures are installed on the bottom block (6); Four square column structures are respectively inserted into the bottom block (6) through the corresponding limiting assemblies (62); Each limiting assembly (62) includes multiple insertion structures (63), each insertion structure (63) is L-shaped and adjacent two insertion structures (63) in the same limiting assembly (62) are equidistant; Each square column structure is L-shaped, and the L-shaped convex end of the square column structure faces outward, and a supporting block (10) is respectively installed in the L-shaped recess of the square column structure; Each supporting block (10) divides the L-shaped recess of the corresponding square column structure into a limiting groove (11) and an avoiding groove (12); Multiple lead frames (5) are stacked in the square supporting frame formed by multiple limiting grooves (11) and are in contact with the inner wall of the square supporting frame.

2. A frame for a semiconductor slitter as claimed in claim 1, characterized in that The depth of each avoiding groove (12) is greater than the height of the insertion structure (63) on the corresponding limiting assembly (62).

3. The frame for a semiconductor slitter as set forth in claim 1, wherein Through grooves are respectively formed in the middle of the upper and lower ends of each lead frame (5); After adjacent two lead frames (5) are stacked, two adjacent through grooves form an insertion groove (51).

4. The frame for a semiconductor slitter as set forth in claim 1, wherein At least one pulling rod (61) is installed on the bottom block (6); Each pulling rod (61) is L-shaped and is located at the warehouse door end of the bottom block (6) close to the cutting machine for material frame replenishment. Multiple sliding grooves (60) are formed in the end of the bottom block (6) away from the square column structure, and the bottom block (6) is connected with the cutting machine through the multiple sliding grooves (60).

5. The frame for a semiconductor slitter as set forth in claim 2, wherein Each insertion structure (63) includes an insertion block one (631) and an insertion block two (632); Each insertion block one (631) and insertion block two (632) are T-shaped; An insertion groove one (13) and an insertion groove two (14) corresponding to the insertion block one (631) and the insertion block two (632) are respectively formed in one end of each square column structure close to the insertion structure (63); The insertion groove one (13) and the insertion groove two (14) on the same square column structure are respectively located on two straight edges of the L-shaped square column structure, and the T-shaped head end of the insertion groove one (13) and the insertion groove two (14) on the same square column structure is located on the same straight edge of the L-shaped square column structure; Adjacent two limiting assemblies (62) are mirror image arranged; Four square column structures are square column one (1), square column two (2), square column three (3) and square column four (4), and adjacent two square column structures are mirror image arranged.

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