Semiconductor silicon epitaxial wafer vacuum clamping device

Abstract

The utility model discloses a semiconductor silicon epitaxial wafer vacuum clamping device, which comprises a mounting plate, a clamping processing assembly is mounted on the outer surface of the mounting plate, the clamping processing assembly comprises a sliding cylinder, the sliding cylinder is fixedly connected to the outer surface of the mounting plate, the outer surface of the sliding cylinder is slidably connected with a sliding rod, and the sliding rod is fixedly connected with the mounting plate. The left end of the sliding rod is fixedly connected with a sliding plate, and a clamping groove is formed in the outer surface of the sliding plate. According to the semiconductor silicon epitaxial wafer vacuum clamping device, through cooperation of the mounting plate and the clamping processing assembly, the clamping processing assembly not only can clamp the semiconductor silicon epitaxial wafer, but also can rotate the clamped semiconductor silicon epitaxial wafer, so that subsequent processing work on the semiconductor silicon epitaxial wafer is facilitated; and meanwhile, the semiconductor silicon epitaxial wafer is fixed in a brand-new mechanical automation manner, so that the problem of pollution deformation or uneven stress on the surface of the semiconductor silicon epitaxial wafer is solved, and the quality of subsequent products can be ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing, concretely to a semiconductor silicon epitaxial wafer vacuum clamping device. BACKGROUND

[0002] The semiconductor silicon epitaxial wafer is a kind of semiconductor material formed by growing a high-quality, single-crystal silicon thin layer (epitaxial layer) on the surface of silicon substrate (usually single-crystal silicon wafer). Epitaxial wafer is usually used in the manufacture of semiconductor devices such as integrated circuits (IC), power devices, optoelectronic devices, etc.

[0003] In the process of semiconductor device manufacturing, silicon epitaxial wafer as an important basic material, its surface quality directly affects the performance and reliability of the device. Silicon epitaxial wafer needs to be clamped accurately and stably during processing, transportation and testing process. The traditional clamping method mostly depends on mechanical clamping jaw or manual fixing, but this way is easy to cause epitaxial wafer surface pollution, deformation or uneven stress, which seriously affects product quality. Therefore, we provide a semiconductor silicon epitaxial wafer vacuum clamping device. UTILITY MODEL CONTENT

[0004] (I) Technical problem solved

[0005] In view of the deficiencies of the prior art, the utility model provides a semiconductor silicon epitaxial wafer vacuum clamping device, which solves the technical problems raised in the above background technology.

[0006] (II) Technical scheme

[0007] To achieve the above purpose, the utility model provides the following technical scheme: a semiconductor silicon epitaxial wafer vacuum clamping device, comprising a mounting plate, the outer surface of the mounting plate is provided with a clamping processing assembly, the clamping processing assembly comprises a sliding cylinder, the sliding cylinder is fixedly connected to the outer surface of the mounting plate, the outer surface of the sliding cylinder is slidably connected with a sliding rod, the left end of the sliding rod is fixedly connected with a sliding plate, the outer surface of the sliding plate is provided with a clamping groove, the inner wall of the clamping groove is provided with a rubber ring, the outer surface of the rubber ring is slidably connected with the inner side wall of the sliding cylinder, and the outer surface of the sliding cylinder is rotatably connected with an adsorption disc through a short cylinder.

[0008] Preferably, the clamping processing assembly further comprises a motor, the motor is installed on the outer surface of the mounting plate, and the outer surface of the adsorption disc is fixedly connected with a first gear.

[0009] Preferably, the output end of the motor is fixedly connected with a second gear, and the second gear is engaged with the first gear.

[0010] Preferably, the clamping processing assembly further comprises an electric push rod, the output end of the electric push rod is fixedly connected with a push plate, the outer surface of the push plate is fixedly connected with the right end of the sliding rod, and the outer surface of the push plate is slidably connected with a guide rod.

[0011] Preferably, the right end of the guide rod is fixedly connected with a circular plate, and the other end of the circular plate is fixedly connected with the outer surface of the mounting plate.

[0012] (Three) beneficial effects

[0013] The utility model provides a kind of semiconductor silicon epitaxial wafer vacuum clamping device. With following beneficial effects:

[0014] The semiconductor silicon epitaxial wafer vacuum clamping device, by the cooperation of mounting plate and clamping processing assembly, clamping processing assembly can not only realize the clamping of semiconductor silicon epitaxial wafer, but also can rotate the clamped semiconductor silicon epitaxial wafer, to facilitate subsequent processing work of semiconductor silicon epitaxial wafer, while the fixing mode of semiconductor silicon epitaxial wafer is completely new mechanical automation, without the problem of pollution deformation or uneven stress on the surface of semiconductor silicon epitaxial wafer, to ensure subsequent product quality. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is the perspective structural schematic diagram of the utility model front view;

[0016] Fig. 2 It is the internal structure schematic diagram of the utility model sliding cylinder;

[0017] Fig. 3 It is the sectional view of the utility model front view.

[0018] In the drawing: 1, mounting plate;2, clamping processing assembly;201, sliding cylinder;202, sliding rod;203, sliding plate;204, clamping groove;205, rubber ring;206, adsorption disc;207, motor;208, first gear;209, second gear;210, electric push rod;211, push plate;212, guide rod;213, circular plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0020] As Figs. 1-3The utility model provides a technical scheme: a semiconductor silicon epitaxial wafer vacuum clamping device, including mounting plate 1, the outer surface of mounting plate 1 is installed and clamps processing subassembly 2, clamps processing subassembly 2 includes slide cylinder 201, slide cylinder 201 fixedly connected to the outer surface of mounting plate 1, the outer surface sliding connection of slide cylinder 201 has slide rod 202, the left end fixedly connected of slide rod 202 has slide plate 203, the outer surface of slide plate 203 is equipped with the clamping groove 204 of 204, the inner wall of clamping groove 204 is installed rubber ring 205, the outer surface of rubber ring 205 is slidably connected with the inner side wall of slide cylinder 201, through the sliding connection between slide cylinder 201 and slide rod 202, the movement of slide plate 203 can be realized, and then the sliding connection between rubber ring 205 and the inner wall of slide cylinder 201 is used, and the exclusion of the air in slide cylinder 201 can be realized by pulling slide rod 202 outward, to facilitate subsequent clamping work.

[0021] The outer surface of slide cylinder 201 is rotatably connected with adsorption disc 206 by short cylinder, and the rotation of the element can be facilitated by the rotatably connected adsorption disc 206, thereby providing certain convenience for subsequent processing.

[0022] The clamping processing subassembly 2 further includes motor 207, the outer surface of mounting plate 1 is installed motor 207, the outer surface of adsorption disc 206 is fixedly connected with first gear 208, the clamping processing subassembly 2 further includes motor 207, the outer surface of mounting plate 1 is installed motor 207, the outer surface of adsorption disc 206 is fixedly connected with first gear 208, the output end of motor 207 is fixedly connected with second gear 209, and the second gear 209 is engaged with the first gear 208, the rotation of second gear 209 can be driven by the work of motor 207, the rotation of adsorption disc 206 can be realized by the engagement between second gear 209 and first gear 208, thereby facilitating subsequent processing work of the element.

[0023] The clamping processing subassembly 2 further includes electric push rod 210, the output end of electric push rod 210 is fixedly connected with push plate 211, the right end of the outer surface of slide rod 202 is fixedly connected with push plate 211, the outer surface of push plate 211 is slidably connected with guide rod 212, the movement of push plate 211 can be realized by the work of electric push rod 210, thereby the movement of slide rod 202 can be realized, so that the air in slide cylinder 201 can be discharged, thereby the adsorption work can be realized, and subsequent processing is facilitated.

[0024] The right end of guide rod 212 is fixedly connected with round plate 213, and the other end of round plate 213 is fixedly connected with the outer surface of mounting plate 1, the movement of push plate 211 can be guided to some extent, thereby the stability of subsequent device when in use can be ensured.

[0025] In use, when clamping the semiconductor silicon wafer, first place the semiconductor silicon wafer to be processed on the surface of the adsorption disc 206, then start the electric push rod 210, the output end of the electric push rod 210 drives the push plate 211 to move, and in turn can drive the sliding rod 202 to move, in the process of moving, the sliding connection between the rubber ring 205 and the sliding cylinder 201 is utilized, the air in the sliding cylinder 201 can be exhausted, so as to generate negative pressure, and in turn the semiconductor silicon wafer can be adsorbed, after adsorption is completed, start the motor 207, the power end of the motor 207 drives the second gear 209 to rotate, the meshing between the second gear 209 and the first gear 208 is utilized, the rotation of the adsorption disc 206 can be realized, and in turn the subsequent processing work of the semiconductor silicon wafer is facilitated, in this way, the fixing mode of the semiconductor silicon wafer adopts a brand-new mechanical automation, and the problems of surface pollution, deformation or uneven stress of the semiconductor silicon wafer are not caused, and the subsequent product quality can be guaranteed.

[0026] Meanwhile, the contents not described in detail in the specification all belong to the prior art known by the person skilled in the art.

[0027] It should be noted that, in this document, the relationship terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or equipment including the element.

[0028] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A vacuum chucking device for semiconductor silicon epitaxial wafers, comprising a mounting plate (1), characterized in that: The outer surface of the mounting plate (1) is provided with a clamping machining assembly (2), the clamping machining assembly (2) comprises a sliding cylinder (201), the sliding cylinder (201) is fixedly connected to the outer surface of the mounting plate (1), the outer surface of the sliding cylinder (201) is slidably connected with a sliding rod (202), the left end of the sliding rod (202) is fixedly connected with a sliding plate (203), the outer surface of the sliding plate (203) is provided with a clamping groove (204), the inner wall of the clamping groove (204) is provided with a rubber ring (205), the outer surface of the rubber ring (205) is slidably connected with the inner side wall of the sliding cylinder (201), and the outer surface of the sliding cylinder (201) is rotatably connected with a suction disc (206) through a short cylinder.

2. The vacuum chucking device for semiconductor silicon epitaxial wafer according to claim 1, characterized in that: The clamping machining assembly (2) further comprises a motor (207), the motor (207) is mounted on the outer surface of the mounting plate (1), and the outer surface of the suction disc (206) is fixedly connected with a first gear (208).

3. The vacuum chucking device for semiconductor silicon epitaxial wafer according to claim 2, characterized in that: The output end of the motor (207) is fixedly connected with a second gear (209), and the second gear (209) is engaged with the first gear (208).

4. The vacuum chucking device for semiconductor silicon epitaxial wafer according to claim 2, characterized in that: The clamping machining assembly (2) further comprises an electric push rod (210), the output end of the electric push rod (210) is fixedly connected with a push plate (211), the outer surface of the push plate (211) is fixedly connected with the right end of the sliding rod (202), and the outer surface of the push plate (211) is slidably connected with a guide rod (212).

5. The vacuum chucking device for semiconductor silicon epitaxial wafer according to claim 4, characterized in that: The right end of the guide rod (212) is fixedly connected with a circular plate (213), and the other end of the circular plate (213) is fixedly connected with the outer surface of the mounting plate (1).

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