Chip liquid cooling heat dissipation assembly
By using an isolation plate in the liquid cooling system to form curved flow channels and arc-shaped flow transfer channels, the problems of crossflow and backflow of coolant in the cooling cavity are solved, achieving a highly efficient chip heat dissipation effect.
Patent Information
- Application Number
- CN202520333452.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-02-28
AI Technical Summary
In existing liquid cooling systems, the coolant has an excessively long flow path and is prone to crossflow and backflow within the cooling chamber, which prevents the chip junction temperature from being effectively reduced.
The chip is packaged with thermally conductive components, and multiple isolation plates are set in the cooling cavity to form a curved flow channel. The heat dissipation fins are divided into multiple groups, combined with arc-shaped flow channels, to avoid cross-flow and backflow of coolant in the cooling cavity and improve heat exchange efficiency.
It effectively improves the thermal conductivity of liquid cooling components, rapidly reduces chip junction temperature, and enhances the flowability and heat exchange efficiency of the coolant.
Smart Images
Figure CN223859655U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a radiator technical field, concretely is a chip liquid cooling heat radiation assembly. BACKGROUND
[0002] With the rapid development of science and technology, the chip presents the development trend of high integration, complication and high frequency, but the heat quantity of the chip is higher and higher, becomes the key factor of hindering the performance and reliability promotion of chip, needs to use the integrated heat dissipation piece to carry out heat dissipation to chip to guarantee that the chip plays the biggest performance and stability, and most integrated heat dissipation pieces cannot be directly fixed on BGA circuit board body, therefore, the mode that sets up a heat radiation assembly above the chip and installs the integrated heat dissipation piece on the heat radiation assembly to carry out heat dissipation has been used by most manufacturers.
[0003] Now with the rise of mobile technology, 5G mobile communication, cloud computing, data center, block chain system, artificial intelligence and other technologies, the amount of data generated in various industries is increasing day by day, especially the application of various technology nodes promotes the rise of high-density servers, and the core chips and graphics cards in the server need efficient heat dissipation. How to balance efficient computing and efficient heat dissipation is a key problem to consider in server construction; traditional heat dissipation components usually include air cooling and liquid cooling, and with the increase of chip power, the heat generation has also increased a lot, and the air cooling component is difficult to meet the heat dissipation needs of high-power chips.
[0004] However, in the existing liquid cooling system, the stroke between the input port and the output port of the cooling liquid is large; when the cooling liquid is injected from the input port and flows through the cooling cavity and then flows out from the output port, the cooling liquid has absorbed heat from the local part of the chip during the initial flow section, that is, the temperature of the cooling liquid has gradually risen, and when the cooling liquid flows into the later section, it cannot effectively conduct heat with the chip. On the other hand, in the traditional liquid cooling system, the area of the cooling cavity is relatively large, and when the cooling liquid flows in the cooling cavity, the phenomenon of "streaming" and "backflow" easily occurs, so that part of the cooling liquid absorbs heat and stays in the cooling cavity for a long time, resulting in low heat exchange efficiency between the cooling liquid and the chip. Based on the above two reasons, the liquid cooling system in the prior art cannot effectively reduce the junction temperature of the chip.
[0005] Therefore, there is an urgent need for a chip liquid cooling heat dissipation assembly to solve the above problems. Utility model content
[0006] Based on the above, the purpose of the utility model is to provide a chip liquid cooling heat dissipation assembly to solve the problem that the liquid cooling system in the prior art cannot effectively reduce the junction temperature of the chip due to the long flow process of the cooling liquid and the phenomenon of "streaming" and "backflow" of the cooling liquid in the cooling cavity.
[0007] To solve the above technical problems, the utility model discloses the following technical scheme:
[0008] The utility model provides a kind of chip liquid cooling heat dissipation component, including the heat conduction component for encapsulating chip, the heat conduction component is encapsulated with upper cover, and the bottom of the upper cover forms cooling cavity;The upper end surface of the heat conduction component is equipped with radiating fin;Multiple isolation plates are equipped with in the cooling cavity parallelly and interval, one end of the isolation plate is connected to the inner side wall of the cooling cavity, and the other end forms diversion passage with the inner side wall of the cooling cavity;The top of the upper cover is equipped with water inlet and water outlet connected to cooling cavity, and the water inlet and water outlet form curved flow channel by multiple isolation plates between them;
[0009] Wherein, the radiating fin is placed in the cooling cavity, and multiple the isolation plate separates the radiating fin into multiple groups.
[0010] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the inner angle of cooling cavity is arranged in arc shape, and the end of the isolation plate close to the diversion passage is arranged in arc shape or inclined shape.
[0011] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the heat conduction component is heat conduction cover plate, the bottom of the heat conduction cover plate is equipped with empty cavity for encapsulating chip, and the empty cavity is equipped with heat conduction layer.
[0012] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the heat conduction component is heat conduction cover plate, the bottom of the heat conduction cover plate is equipped with empty cavity for encapsulating chip, and the empty cavity is equipped with heat conduction layer.
[0013] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the evaporation cavity of the heat conduction cover plate is equipped with several heat conduction columns in array, and the heat conduction column is equipped with heat conduction ring.
[0014] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the heat conduction ring is equipped with several evaporation capillary holes.
[0015] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the upper and lower inner walls of the evaporation cavity are respectively equipped with copper mesh layer or copper powder structure layer.
[0016] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the heat conduction column and heat conduction ring are cylindrical body, or ellipsoid, or cuboid structure.
[0017] As an optional technical scheme of a kind of chip liquid cooling heat dissipation component, the heat conduction layer is indium sheet layer or heat conduction silica gel layer.
[0018] The utility model has the advantages that:
[0019] The utility model provides a kind of chip liquid cooling heat dissipation assembly, the chip liquid cooling heat dissipation assembly includes the heat conduction component for encapsulating chip, heat conduction component is encapsulated with upper cover, and the bottom of upper cover forms cooling cavity;The upper end surface of heat conduction component is equipped with radiating fin;Multiple isolation plates are equipped with in cooling cavity parallel interval, one end of isolation plate is connected to the inner side wall of cooling cavity, and the other end forms diversion passage with the inner side wall of cooling cavity;The top of upper cover is equipped with water inlet and water outlet connected to cooling cavity, and the curved flow channel is formed between water inlet and water outlet by multiple isolation plates.
[0020] Under the above structure, isolation plate separates radiating fin into multiple groups, and the curved flow channel is formed between water inlet and water outlet by the setting of diversion passage;When cooling liquid is input from water inlet, it will flow through each group of radiating fin in turn and then flow out from water outlet, to form liquid cooling circulation system;Due to the curved passage and the structure of radiating fin into multiple small groups, the problems of "string flow" and "backflow" of cooling liquid in cooling cavity during flowing are avoided, the heat conduction efficiency of the liquid cooling heat dissipation assembly is improved, so as to effectively reduce the junction temperature of chip. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 It is the explosion structure schematic view of liquid cooling heat dissipation assembly in the utility model embodiment one.
[0022] Figure 2 It is the bottom view of heat conduction cover plate in the utility model embodiment one.
[0023] Figure 3 It is the bottom view of upper cover in the utility model embodiment one.
[0024] Figure 4 It is the explosion schematic view of heat conduction plate in the utility model embodiment two.
[0025] Figure 5 It is the section view schematic view of heat conduction ring in the utility model embodiment two.
[0026] In the drawing:
[0027] 1, upper cover; 10, cooling cavity; 11, isolation plate; 12, diversion passage; 13, water inlet; 14, water outlet;
[0028] 2, heat conduction component; 20, heat conduction cover plate; 21, heat conduction plate; 210, heat conduction column; 211, heat conduction ring; 212, evaporation capillary hole; 213, copper mesh layer; 22, empty cavity; 23, heat conduction layer; 24, top cover; 25, base;
[0029] 3, radiating fin. DETAILED DESCRIPTION
[0030] The utility model will be described in further detail below in connection with the drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the utility model, but not to limit the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for the convenience of description, not all the structures.
[0031] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0032] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0033] In the description of the embodiment, the terms "up", "down", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model.
[0034] In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.
[0035] Embodiment one
[0036] As Figures 1-3As shown, the utility model provides a kind of chip liquid cooling heat dissipation component, the chip liquid cooling heat dissipation component includes the heat conduction component 2 for encapsulating chip, and heat conduction component 2 is encapsulated with upper cover 1, and the bottom of upper cover 1 forms cooling cavity 10;The upper end surface of heat conduction component 2 is equipped with radiating fin 3;Multiple isolation plates 11 are spaced apart and arranged in parallel in cooling cavity 10, one end of isolation plate 11 is connected to the inner side wall of cooling cavity 10, and the other end forms flow channel 12 between the inner side wall of cooling cavity 10;The top of upper cover 1 is equipped with water inlet 13 and water outlet 14 connected to cooling cavity 10, and the curved flow passage is formed between water inlet 13 and water outlet 14 by multiple isolation plates 11;Wherein, radiating fin 3 is placed in the cooling cavity 10, and multiple isolation plates 11 separate the radiating fin 3 into multiple groups.
[0037] The chip liquid cooling heat dissipation component provided by the utility model separates radiating fin 3 into multiple groups by isolation plate 11, and forms the curved flow passage between water inlet 13 and water outlet 14 by the arrangement of flow channel 12;When cooling liquid is input from water inlet 13, it will flow through each group of radiating fin 3 in turn and then flow out from water outlet 14, to form a liquid cooling circulation system;Due to the curved channel and the structure of radiating fin 3 into multiple groups, the problem of "string flow" and "backflow" of cooling liquid in cooling cavity 10 during flow is avoided, the heat conduction efficiency of the liquid cooling heat dissipation component is improved, and the junction temperature of the chip is effectively reduced.The inner angle of cooling cavity 10 and the end of isolation plate 11 close to flow channel 12 are arc-shaped, which improves the flow direction of the cooling liquid, so that the junction temperature of the chip is reduced more quickly.
[0038] Specifically, as shown, Figure 2 In the embodiment, heat conduction component 2 is a heat conduction cover plate 20 encapsulated on the chip, multiple groups of radiating fin 3 are arranged equidistantly and in parallel on the upper end surface of heat conduction cover plate 20, and radiating fin 3 and heat conduction cover plate 20 are integrally formed;Heat conduction cover plate 20 and upper cover 1 are sealed and fixed by laser welding, to prevent the cooling liquid in cooling cavity 10 from overflowing outward and improve the sealing and stability of cooling cavity 10;When upper cover 1 is encapsulated on heat conduction cover plate 20, isolation plate 11 abuts against heat conduction cover plate 20 between each group of radiating fin 3, in this structure, cooling liquid will be input from water inlet 13, pass through the curved channel formed by isolation plate 11, conduct heat to radiating fin 3 and heat conduction cover plate 20 in turn, and be output from water outlet 14, to form a high-efficiency liquid cooling circulation system;Due to the curved channel, compared with the large-area cooling cavity 10 in the prior art, the structure effectively avoids the backflow problem of cooling liquid in cooling cavity 10, and improves the heat exchange efficiency between cooling liquid and radiating fin 3 and heat conduction cover plate 20.
[0039] Further, the bottom of the heat-conducting cover plate 20 is provided with an avoiding cavity 22, and the avoiding cavity 22 is provided with a heat-conducting layer 23, which can be an indium sheet layer or a heat-conducting silica gel layer. The chip liquid cooling heat dissipation assembly is packaged on the chip or the circuit board through the heat-conducting cover plate 20, the avoiding cavity 22 provides a avoiding space for the chip, so that the heat-conducting cover plate 20 is effectively sealed and packaged with the chip; and the chip is in abutment with the heat-conducting layer 23 for heat conduction, and the indium sheet layer or the heat-conducting silica gel layer can efficiently conduct the heat of the chip to the heat-conducting cover plate 20 for heat exchange effect.
[0040] In the embodiment, as shown in Figure 3 In order to further reduce the backflow phenomenon of the cooling liquid in the cooling cavity 10, the inner corners of the cooling cavity 10 and the inner corners between the partition plate 11 and the cooling cavity 10 are all provided in a circular arc shape, and the end of the partition plate 11 close to the circulating channel 12 is provided in a circular arc shape or an inclined shape. Therefore, when the cooling liquid circulates in the cooling cavity 10, the flow directionality of the cooling liquid can be improved, the cooling liquid is prevented from staying in the cooling cavity 10 for a long time, and the heat exchange efficiency of the chip liquid cooling heat dissipation assembly is improved.
[0041] Embodiment two
[0042] As shown in Figure 3 and Figure 4 The difference between the embodiment and the embodiment one is that the heat-conducting assembly 2 in the embodiment is a heat spreading plate 21, and the heat dissipation fins 3 are arranged on the top end surface of the heat spreading plate 21; the bottom of the heat spreading plate 21 is provided with an avoiding cavity 22, and the avoiding cavity 22 is provided with an indium sheet layer or a heat-conducting silica gel layer; and the chip is packaged on the bottom of the heat spreading plate 21 for heat conduction.
[0043] Specifically, the heat spreading plate 21 includes a base 25 and a top cover 24 packaged on the base 25, and a evaporation cavity is formed between the base 25 and the top cover 24, and a plurality of heat-conducting columns 210 are arranged in an array in the evaporation cavity, and a heat-conducting ring 211 is sleeved on the heat-conducting column 210. The heat-conducting column 210 and the heat-conducting ring 211 can be in a plurality of different shapes, such as a cylinder, an ellipsoid or a cuboid, to increase the heat-conducting efficiency. Further, a plurality of evaporation capillary holes 212 are arranged on the heat-conducting column, and the arrangement of the evaporation capillary holes 212 can increase the heat exchange efficiency of the working medium in the evaporation cavity, so as to improve the heat conduction efficiency between the heat spreading plate 21 and the chip.
[0044] Further, the bottom of the top cover 24 and the upper end surface of the base 25 are respectively provided with a copper mesh layer 213 or a copper powder structure, which further enables the working medium in the evaporation cavity to circulate and exchange heat quickly, that is, the heat exchange efficiency between the heat spreading plate 21 and the chip is further improved.
[0045] It needs to be explained that the upper end surface of the upper cover 1 can be provided with multiple groups of water inlets 13 and water outlets 14, and the isolation plates 11 at the bottom of the upper cover 1 can also be provided with multiple groups, each group of isolation plates 11 is provided with a partition, and the water inlet 13 and the water outlet 14 of each group are respectively connected to the flow channel between each group of isolation plates 11, so that when the area of the chip liquid cooling heat dissipation assembly is limited, the cooling cavity 10 and the heat dissipation fins 3 are provided with multiple regions, multiple cooling circulation paths are formed, the heat exchange efficiency between the liquid cooling heat dissipation assembly and the chip is further improved, and the backflow phenomenon of the cooling liquid in the cooling cavity 10 is reduced.
[0046] The above is only the preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as above, it is not intended to limit the utility model. Any skilled person in the art can make some changes or modifications to the disclosed technical content without departing from the scope of the utility model technical solution, and any simple modification, equivalent change and modification of the above embodiment belong to the scope of the utility model technical solution.
Claims
1. A chip liquid cooling heat dissipation assembly, comprising a heat conduction assembly for packaging a chip, an upper cover being packaged on the heat conduction assembly, and a bottom of the upper cover forming a cooling cavity; characterized in that, The upper end surface of the heat-conducting component is provided with heat dissipation fins; a plurality of partition plates are provided in parallel and at intervals in the cooling cavity, one end of the partition plate is connected to the inner side wall of the cooling cavity, and the other end forms a flow channel with the inner side wall of the cooling cavity; the top of the upper cover is provided with a water inlet and a water outlet connected to the cooling cavity, and the water inlet and the water outlet form a curved flow channel through a plurality of partition plates. Among them, the heat dissipation fins are placed in the cooling cavity, and a plurality of the partition plates separate the heat dissipation fins into multiple groups.
2. The liquid cooling heat dissipation assembly of claim 1, wherein, The inner corner of the cooling cavity is arranged in a circular arc shape, and the end of the partition plate close to the flow channel is arranged in a circular arc shape or an inclined shape.
3. The liquid cooling heat dissipation assembly of claim 1, wherein, The heat-conducting component is a heat-conducting cover plate, the bottom of the heat-conducting cover plate is provided with a hollow cavity for packaging a chip, and the hollow cavity is provided with a heat-conducting layer.
4. The liquid cooling heat dissipation assembly of claim 1, wherein, The heat-conducting component is a heat spreading plate, the bottom of the heat spreading plate is provided with a hollow cavity for packaging a chip, and the hollow cavity is provided with a heat-conducting layer.
5. The liquid cooling heat dissipation assembly of claim 4, wherein, A plurality of heat-conducting columns are arranged in an array in the evaporation cavity of the heat spreading plate, and a heat-conducting ring is sleeved on the heat-conducting column.
6. The liquid cooling heat dissipation assembly of claim 5, wherein, A plurality of evaporation capillary holes are provided on the heat-conducting ring.
7. The liquid cooling heat dissipation assembly of claim 6, wherein, Copper mesh layers or copper powder structure layers are respectively arranged on the upper and lower inner walls of the evaporation cavity.
8. The liquid cooling heat dissipation assembly of claim 7, wherein, The heat-conducting column and the heat-conducting ring are in a cylindrical, elliptical or cuboid structure.
9. The liquid cooling heat dissipation assembly of claim 3 or 4, wherein, The heat-conducting layer is an indium sheet layer or a heat-conducting silica gel layer.