Multi-chip heat dissipation frame

Abstract

The utility model belongs to the field of semiconductor chips, and particularly relates to a multi-chip heat dissipation frame which comprises a frame body, a packaging area used for packaging is arranged at the center of the frame body, a large base island and a small base island used for installing chips are arranged in the middle of the packaging area, the large base island is arranged in a packaging mode, the small base island is arranged in an exposed mode, and the small base island is arranged in an exposed mode. And the large base islands and the small base islands are filled with conductive adhesive. According to the utility model, through mutual cooperation of the frame main body, the large base island, the small base island, the first pin assembly, the second pin assembly and other structures, a traditional single base island is changed into double base islands, and the small base island is exposed outside the packaging area, so that heat can be directly transmitted to the outside, the heat dissipation effect is improved, and the service life is prolonged. And meanwhile, the large base island can also utilize the seventh pin and the eighth pin to realize double-pin heat dissipation, so that the heat dissipation effect is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor chip technical field, concretely is a kind of multi-chip heat dissipation frame. BACKGROUND

[0002] In integrated circuit package eSOW16L (Small Out line Package (Wide-Type) with exposed thermal pad product, traditional SOW16L product, most lead frame designs are single base island structure, and lead frame base island recess is shallow, and heat sink cannot be exposed, and the function of sealing package chip is needed to expose lead frame base island.This packaging product is mainly used for mobile phone fast charging, usually when mobile phone is charged using fast charging mode, mobile phone battery capacity is higher, so when charging, mobile phone fast charging needs to meet the requirements of high power and high heat dissipation, and in integrated circuit packaging process, large power MOS chip needs to be selected, and the size of this kind of chip is larger, so higher requirements are put forward for the high heat dissipation and high reliability of integrated circuit packaging product.

[0003] SOT23 packaging type is a kind of common packaging form, and the market range is wide, but this packaging structure is poor in heat dissipation because frame base island is contained in plastic package, and heat generated during product working process cannot be effectively transferred to outside, which affects the use performance of product. UTILITY MODEL CONTENT

[0004] The utility model aims at solving one of the technical problems existing in prior art or related art.

[0005] Therefore, the technical scheme adopted by the utility model is as follows:

[0006] A multi-chip heat dissipation frame, comprising a frame body, a packaging area for packaging is arranged at the center position of the frame body, a large base island and a small base island for installing chip are arranged at the middle part of the packaging area, wherein the large base island is packaged and arranged, the small base island is exposed and arranged, and the large base island and the small base island are filled with conductive adhesive;

[0007] The top and the bottom of the packaging area are respectively connected with first pin assembly and second pin assembly, and the first pin assembly and the second pin assembly are symmetrically arranged.

[0008] One side of the large base island is connected with first connecting rib, and one side of the small base island is connected with second connecting rib, and the first connecting rib and the second connecting rib are mirror image arranged along the center line of the width direction of the packaging area.

[0009] Based on the above technical scheme, the use principle and the generated technical effects are as follows:

[0010] In actual use, the filling of the conductive glue in the large base island and the small base island can greatly improve the heat dissipation capacity of the chip, and since the small base island is exposed outside the packaging area, heat can be directly transmitted to the outside, further improving the heat dissipation effect, and the large base island is packaged inside the plastic part, and the first connecting rib, the seventh pin and the eighth pin can effectively fix the chip on the large base island, ensuring the flatness of the chip during installation, and the small base island and the second pin, the second connecting rib and the third connecting rib can effectively fix the chip on the small base island, ensuring the flatness of the chip during installation, and effectively avoiding the problem of uneven heat dissipation of the two chips caused by the mismatch of the heat dissipation efficiency of the large base island and the heat dissipation efficiency of the small base island.

[0011] In a preferred example, the frame body, the large base island, the small base island, the first pin assembly and the second pin assembly, the first connecting rib and the second connecting rib are integrally punched and cut from a copper strip.

[0012] In a preferred example, the first pin assembly includes four pins, and the first pin, the second pin, the third pin and the fourth pin are arranged from left to right along the length direction of the packaging area.

[0013] The second pin assembly includes four pins, and the fifth pin, the sixth pin, the seventh pin and the eighth pin are arranged from left to right along the length direction of the packaging area.

[0014] In a preferred example, the second pin is connected with the small base island.

[0015] In a preferred example, the seventh pin and the eighth pin are connected with the large base island.

[0016] In a preferred example, the bottom of the small base island is connected with a third connecting rib, and the third connecting rib is located between the fifth pin and the sixth pin.

[0017] In a preferred example, a lock hole is formed in the connection position of the seventh pin and the large base island.

[0018] In a preferred example, a glue clamping hole is formed in each of the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin and the seventh pin.

[0019] The nouns, conjunctions or adjectives involved in the above technical solutions are explained as follows:

[0020] Fixed connection refers to the connection of parts or components after being fixed without any relative movement. It can be divided into detachable connection and non-detachable connection.

[0021] (1) Detachable connections use screws, splines, wedges, etc. to fix parts together. This type of connection can be disassembled during maintenance without damaging the parts. However, the specifications of the connecting parts used must be correct (such as the length of bolts, keys, wedges) and properly tightened.

[0022] (2) Non-removable connections mainly refer to welding, riveting, and tenon joints. Since disassembly requires forging, sawing, or oxy-acetylene cutting for repair or replacement, these parts generally cannot be reused. Furthermore, attention should be paid to process quality, technical inspection, and remedial measures (such as correction and polishing) during connection.

[0023] A movable connection refers to a connection in which parts or components are fixed but have relative motion.

[0024] The above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0025] In this invention, the traditional single base island is transformed into a dual base island by the cooperation of the frame body, large base island, small base island, first pin assembly, and second pin assembly. The small base island is exposed outside the package area, so heat can be directly transferred to the outside, improving the heat dissipation effect. At the same time, the large base island can also use the seventh and eighth pins to achieve dual-pin heat dissipation, further improving the heat dissipation effect. Attached Figure Description

[0026] Fig. 1 This is a top sectional view of the overall structure of this utility model;

[0027] Fig. 2 This is a top view of the overall structure of this utility model after encapsulation.

[0028] Figure label:

[0029] 1. Frame body; 2. Encapsulation area; 3. Large base island; 4. Small base island; 5. First pin assembly; 51. First pin; 52. Second pin; 53. Third pin; 54. Fourth pin; 6. Second pin assembly; 61. Fifth pin; 62. Sixth pin; 63. Seventh pin; 64. Eighth pin; 7. First connecting rib; 8. Second connecting rib; 9. Third connecting rib; 10. Locking core hole; 11. Adhesive hole. Detailed Implementation

[0030] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present disclosure. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0031] According to the concept of the present application, an embodiment of a multi-chip heat dissipation frame for packaging and heat dissipation of chips is described herein. Figs. 1-2 Specifically, the multi-chip heat dissipation frame is configured as an integrated structure, which has three components of a frame body 1, a large base island 3 and a small base island 4. By the cooperation of the structures of the frame body, the large base island 3, the small base island 4, the first pin assembly 5 and the second pin assembly 6, the traditional single base island is set as a double base island, and the small base island 4 is exposed outside the packaging area 2, so that heat can be directly transmitted to the outside, improving the heat dissipation effect, and the large base island 3 can also realize double-pin heat dissipation by the seventh pin 63 and the eighth pin 64, further improving the heat dissipation effect.

[0032] In combination with Fig. 1 and Fig. 2 , the present disclosure provides a multi-chip heat dissipation frame, which comprises a frame body 1, a packaging area 2 is arranged at the center of the frame body 1 for packaging, a large base island 3 and a small base island 4 are arranged at the middle of the packaging area 2 for mounting chips, wherein the large base island 3 is arranged in a packaging manner, and the small base island 4 is arranged in an exposed manner, and the large base island 3 and the small base island 4 are filled with conductive glue. In existing products, insulating glue is usually filled, but the heat dissipation performance of the insulating glue is poor, so filling the large base island 3 and the small base island 4 with conductive glue can greatly improve the heat dissipation capacity of the chips, and since the small base island 4 is exposed outside the packaging area 2, heat can be directly transmitted to the outside, further improving the heat dissipation effect.

[0033] The top and the bottom of the packaging area 2 are respectively connected with a first pin assembly 5 and a second pin assembly 6, and the first pin assembly 5 and the second pin assembly 6 are symmetrically arranged.

[0034] One side of the large base island 3 is connected with a first connecting rib 7, and one side of the small base island 4 is connected with a second connecting rib 8, and the first connecting rib 7 and the second connecting rib 8 are mirror image arranged along the center line of the width direction of the packaging area 2.

[0035] For the technical solutions of the present embodiment, the frame body 1, the large base island 3, the small base island 4, the first pin assembly 5 and the second pin assembly 6, the first connecting rib 7 and the second connecting rib 8 are all integrally punched and cut from a copper strip.

[0036] It should be noted that the small base island 4 is provided with a rounded corner at the edge to avoid current breakdown between the base island and the pin.

[0037] According to the technical scheme of the embodiment, the first pin assembly 5 includes four pins, which are the first pin 51, the second pin 52, the third pin 53, and the fourth pin 54 from left to right along the length direction of the packaging area 2.

[0038] The second pin assembly 6 includes four pins, which are the fifth pin 61, the sixth pin 62, the seventh pin 63, and the eighth pin 64 from left to right along the length direction of the packaging area 2. In actual use, the chip is first placed on the small base island 4 and the large base island 3, and then the chip and the plurality of pins are connected through wiring. In this way, the chip can be electrically connected with the pins. Then, the frame body 1 is plastic encapsulated and packaged, and the pins are exposed outside for plug-in cooperation with other interfaces.

[0039] According to the technical scheme of the embodiment, the second pin 52 is connected with the small base island 4, and the bottom of the small base island 4 is connected with the third connecting rib 9 located between the fifth pin 61 and the sixth pin 62. By using the second pin 52, the second connecting rib 8, and the third connecting rib 9, the chip on the small base island 4 can be effectively fixed, and the flatness during installation of the chip is ensured.

[0040] According to the technical scheme of the embodiment, the seventh pin 63 and the eighth pin 64 are connected with the large base island 3. By using the first connecting rib 7, the seventh pin 63, and the eighth pin 64, the chip on the large base island 3 can be effectively fixed, and the flatness during installation of the chip is ensured.

[0041] According to the technical scheme of the embodiment, the large base island 3 can also use the seventh pin 63 and the eighth pin 64 to realize double-pin heat dissipation. The lock core hole 10 is arranged at the connection position of the seventh pin 63 and the large base island 3. By using the lock core hole 10, the hole is facilitated during resin filling, and the bonding force is ensured.

[0042] According to the technical scheme of the embodiment, the first pin 51, the second pin 52, the third pin 53, the fourth pin 54, the fifth pin 61, the sixth pin 62, and the seventh pin 63 are all provided with the glue clamping hole 11. By using the glue clamping hole 11, the plastic part can be clamped into the glue clamping hole 11 during injection molding, which can effectively prevent the plastic part from being horizontally displaced from the large base island 3 or the small base island 4 due to external force, causing the plastic part to fall off or delaminate.

[0043] Specifically, in actual use, the filling of conductive glue in the large base island 3 and the small base island 4 can greatly improve the heat dissipation capacity of the chip, and since the small base island 4 is exposed outside the packaging area 2, heat can be directly transmitted to the outside, further improving the heat dissipation effect. The large base island 3 is packaged inside the plastic part, and the first connecting rib 7, the seventh pin 63 and the eighth pin 64 can realize effective fixation of the chip on the large base island 3, ensuring the flatness during chip installation. The small base island 4 and the second pin 52, the second connecting rib 8 and the third connecting rib 9 can realize effective fixation of the chip on the small base island 4, ensuring the flatness during chip installation, and can effectively avoid the problem of uneven heat dissipation of the two chips caused by the mismatch of the heat dissipation efficiency of the large base island 3 and the small base island 4.

[0044] The multi-chip heat dissipation frame provided by the utility model will be further described below in combination with the drawings and embodiments.

[0045] A multi-chip heat dissipation frame, comprising a frame body 1, a packaging area 2 is arranged at the center position of the frame body 1 for packaging, a large base island 3 and a small base island 4 are arranged at the middle part of the packaging area 2 for mounting chips, wherein the large base island 3 is packaged and arranged, and the small base island 4 is exposed and arranged, and the large base island 3 and the small base island 4 are filled with conductive glue;

[0046] The top and the bottom of the packaging area 2 are respectively connected with a first pin assembly 5 and a second pin assembly 6, and the first pin assembly 5 and the second pin assembly 6 are symmetrically arranged.

[0047] One side of the large base island 3 is connected with a first connecting rib 7, and one side of the small base island 4 is connected with a second connecting rib 8, and the first connecting rib 7 and the second connecting rib 8 are mirror image arranged along the center line of the width direction of the packaging area 2.

[0048] The working principle and use process of the utility model are as follows: in actual use, the filling of conductive glue in the large base island 3 and the small base island 4 can greatly improve the heat dissipation capacity of the chip, and since the small base island 4 is exposed outside the packaging area 2, heat can be directly transmitted to the outside, further improving the heat dissipation effect. The large base island 3 is packaged inside the plastic part, and the first connecting rib 7, the seventh pin 63 and the eighth pin 64 can realize effective fixation of the chip on the large base island 3, ensuring the flatness during chip installation. The small base island 4 and the second pin 52, the second connecting rib 8 and the third connecting rib 9 can realize effective fixation of the chip on the small base island 4, ensuring the flatness during chip installation, and can effectively avoid the problem of uneven heat dissipation of the two chips caused by the mismatch of the heat dissipation efficiency of the large base island 3 and the small base island 4.

[0049] In the present application, the term "a plurality of" means two or more, unless otherwise expressly specified. The term "and / or" as used herein encompasses all possibilities of combinations of one or more relevant items. The terms "mounting", "connected", "connecting", "fixed", and the like, should be interpreted broadly, for example, "connected" can be fixed connection, or detachable connection, or integrally connected; "connected" can be directly connected, or indirectly connected through intermediate media. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] It should be noted that when an element is referred to as being "mounted", "attached", "fixed" or "disposed" on another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions used herein are for illustrative purposes only and are not intended to be limiting.

[0051] In the description of the present application, the terms "one embodiment", "some embodiments", "certain embodiments" and the like are described, which means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] Although embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations of the embodiments can be made without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A multi-chip heat spreader frame, comprising: The application relates to a frame body (1) provided with a packaging area (2) for packaging at a central position, wherein a large base island (3) for mounting a chip is arranged in the middle of the packaging area (2) and a small base island (4) is arranged in a bare state, and the large base island (3) and the small base island (4) are filled with conductive glue. A first pin assembly (5) and a second pin assembly (6) are respectively connected to the top and the bottom of the packaging area (2), and the first pin assembly (5) and the second pin assembly (6) are symmetrically arranged. A first connecting rib (7) is connected to one side of the large base island (3), a second connecting rib (8) is connected to one side of the small base island (4), and the first connecting rib (7) and the second connecting rib (8) are mirror-symmetrically arranged along the center line in the width direction of the packaging area (2).

2. The multi-chip heat spreader frame of claim 1, wherein, The frame body (1), the large base island (3), the small base island (4), the first pin (51) assembly (5) and the second pin (52) assembly, the first connecting rib (7) and the second connecting rib (8) are all integrally punched and cut from a copper strip.

3. The multi-chip heat spreader frame of claim 1, wherein, The first pin (51) assembly (5) comprises four pins, and the first pin (51), the second pin (52), the third pin (53) and the fourth pin (54) are arranged from left to right along the length direction of the packaging area (2). The second pin assembly (6) comprises four pins, and the fifth pin (61), the sixth pin (62), the seventh pin (63) and the eighth pin (64) are arranged from left to right along the length direction of the packaging area (2).

4. The multi-chip heat spreader frame of claim 3, wherein, The second pin (52) is connected to the small base island (4).

5. The multi-chip heat spreader frame of claim 4, wherein, The seventh pin (63) and the eighth pin (64) are connected to the large base island (3).

6. A multi-chip heat spreader frame according to claim 5, wherein, The third connecting rib (9) is connected to the bottom of the small base island (4) and is located between the fifth pin (61) and the sixth pin (62).

7. A multi-chip heat spreader frame according to claim 6, wherein, A lock core hole (10) is arranged at the position where the seventh pin (63) is connected to the large base island (3).

8. The multi-chip heat spreader frame of claim 6, wherein, A glue clamping hole (11) is arranged on each of the first pin (51), the second pin (52), the third pin (53), the fourth pin (54), the fifth pin (61), the sixth pin (62) and the seventh pin (63).

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