Waterproof high-temperature-resistant diode

Abstract

The utility model discloses a waterproof high-temperature-resistant diode which comprises a second lead and a second sealing ring, a heat dissipation structure is arranged at the top end of the second sealing ring, a first clamping strip is fixedly connected to the side surface of the heat dissipation structure, a second clamping strip is arranged on one side of the first clamping strip, a clamping ring is fixedly connected to the side surface of the second clamping strip, and the second clamping strip is clamped with the first clamping strip. The side surface of the clamping ring is fixedly connected with a connecting ring, the side surface of the connecting ring is fixedly connected with a connecting plate, the end, away from the heat dissipation structure, of the second lead is fixedly connected with a connecting block, the connecting plate is slidably connected with a first lead, and the end, close to the heat dissipation structure, of the first lead is fixedly connected with a connecting groove. One side surface of the fixing ring is fixedly connected with a spring, and one end, far away from the fixing ring I, of the spring is fixedly connected to the side surface of the connecting plate, through the above structure, the installation direction of the diode can be conveniently adjusted under the condition that a tool is not needed to be used when the diode is installed wrongly, and damage and influence on use of the diode are avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to waterproof high temperature's diode technical field, especially in kind waterproof high temperature's diode. BACKGROUND

[0002] The waterproof high temperature's diode of prior art, through the design of structure, thereby facilitate using, but its in use, due to the characteristic of diode itself, has positive and negative direction, when the installation direction is wrong, it is inconvenient to adjust, need through the tool can carry out, when using, it is more cumbersome, and the efficiency is lower, like the patent of China disclosed "a variable capacitance diode with waterproof and high temperature resistance", its application number is "CN202122631186.9", it includes lead, N shape germanium sheet and sealing block, the outer wall of lead is provided with protection structure, one side of lead is provided with metal contact filament, one side of metal contact filament is provided with N shape germanium sheet, one side of N shape germanium sheet is provided with sealing block, the top of sealing block is provided with heat dissipation structure, one side of sealing block is provided with medium, the outer wall of medium is provided with anti-expansion structure, the anti-expansion structure includes restraint frame, restraint net and fixed block, restraint frame is arranged on the outer wall of medium, the inside of restraint frame is provided with restraint net, and both sides of restraint frame are provided with fixed block, it is convenient for using through the above structure, but its in use, due to the characteristic of diode itself, has positive and negative direction, when the installation direction is wrong, it is inconvenient to adjust, need through the tool can carry out, when using, it is more cumbersome, and the efficiency is lower, and there is limitation when using. CONTENT OF UTILITY MODEL

[0003] The utility model discloses waterproof high temperature's diode, through setting up lead two with sealing ring two, heat dissipation structure, card strip one, card strip, clasp ring, connecting ring, connecting plate, connecting block, lead one, connecting groove, fixed ring one, spring, it is convenient for adjusting the installation direction of diode when installing error without using the tool, avoids damaging, to avoid affecting use.

[0004] The utility model discloses still provide with above-mentioned waterproof high temperature resistant diode, include: lead two with sealing ring two, sealing ring two top end is provided with heat dissipation structure, the heat dissipation structure side surface fixedly connected with the clamping strip no.

[0005] According to the waterproof high temperature resistant diode, the heat dissipation structure includes heat dissipation glue, a sealing layer and a heat dissipation layer, the sealing layer is arranged on the inner side of the heat dissipation layer, and the heat dissipation glue is arranged on the inner side of the sealing layer, so that heat dissipation is facilitated.

[0006] According to the waterproof high temperature resistant diode, the heat dissipation glue is provided with a medium on the inner side, and the lead two is connected with the medium, so that connection and use are facilitated.

[0007] According to the waterproof high temperature resistant diode, metal contact wires are arranged between the leads two, so that use is facilitated.

[0008] According to the waterproof high temperature resistant diode, a limiting ring is fixedly connected to the side surface of the lead one, and the limiting ring is located at one end close to the heat dissipation structure, so that the connecting plate can be limited.

[0009] According to the waterproof high temperature resistant diode, a sealing ring one is arranged on the connecting plate, and the lead one is located on the inner side of the sealing ring one, so that the position of the lead one is determined, and sealing is facilitated.

[0010] According to the waterproof high temperature resistant diode, a fixing ring two is fixedly connected to the inner side surface of the clamping ring, and a sealing ring three is fixedly connected to the side surface of the fixing ring two, so that sealing is facilitated.

[0011] According to the waterproof high temperature resistant diode, the two end structures of the heat dissipation structure are symmetrical structures, so that use is facilitated. Advantages

[0012] Compared with the prior art, the waterproof and high-temperature-resistant diode is convenient to adjust the installation direction without using tools when the installation of the diode is wrong, avoids damage and affects use. BRIEF DESCRIPTION OF DRAWINGS

[0013] The utility model will be further explained in connection with the drawings and examples;

[0014] Figure 1 It is the overall structural drawing of waterproof and high-temperature-resistant diode of the utility model;

[0015] Figure 2 It is the rear view structure diagram of waterproof and high-temperature-resistant diode of the utility model;

[0016] Figure 3 It is the transverse section structure diagram of waterproof and high-temperature-resistant diode of the utility model;

[0017] Figure 4 It is the longitudinal section structure diagram of waterproof and high-temperature-resistant diode of the utility model.

[0018] LEGEND:

[0019] 1, connecting ring; 2, clasp; 3, lead one; 4, heat dissipation structure; 401, heat dissipation glue; 402, sealing layer; 403, heat dissipation layer; 5, fixed ring one; 6, spring; 7, connecting plate; 8, sealing ring one; 9, connecting groove; 10, connecting block; 11, sealing ring two; 12, limit ring; 13, fixed ring two; 14, sealing ring three; 15, card strip one; 16, card strip two; 17, lead two; 18, medium. DETAILED DESCRIPTION

[0020] This part will describe the specific embodiment of the utility model in detail, and the preferred embodiment of the utility model is shown in the drawings, and the role of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.

[0021] REFERENCE Figures 1-4The utility model discloses a waterproof high temperature resistant diode, it includes: lead two 17 with sealing ring two 11, sealing ring two 11 top end is provided with heat dissipation structure 4, heat dissipation structure 4 includes heat dissipation glue 401, sealing layer 402, heat dissipation layer 403, sealing layer 402 sets up in heat dissipation layer 403 inboard, heat dissipation glue 401 sets up in sealing layer 402 inboard, heat dissipation glue 401 inboard is provided with medium 18, lead two 17 is connected with medium 18, heat dissipation structure 4 both ends structure are all symmetrical structure, heat dissipation structure 4 side surface fixedly connected with clamping strip one 15, clamping strip one 15 side is provided with clamping strip two 16, clamping strip two 16 side surface fixedly connected with snap ring 2, and clamping strip two 16 is engaged with clamping strip one 15, snap ring 2 inboard surface fixedly connected with fixed ring two 13, fixed ring two 13 side surface fixedly connected with sealing ring three 14, snap ring 2 side surface fixedly connected with connecting ring 1, connecting ring 1 side surface fixedly connected with connecting plate 7, and be provided with sealing ring one 8 on connecting plate 7, lead one 3 is located in sealing ring one 8 inboard, and be provided with metal contact wire between lead two 17, and lead two 17 is fixedly connected with connecting block 10 at the end away from heat dissipation structure 4, and lead one 3 is slidably connected on connecting plate 7, and lead one 3 side surface fixedly connected with limit ring 12, limit ring 12 is located at the end close to heat dissipation structure 4, and lead one 3 close to heat dissipation structure 4 one end fixedly connected with connecting groove 9, and connecting block 10 is located in connecting groove 9, and all are electrically conductive material, and lead one 3 side surface fixedly connected with fixed ring one 5, and fixed ring one 5 side surface fixedly connected with spring 6, and spring 6 is fixedly connected in connecting plate 7 side surface at the end away from fixed ring one 5.

[0022] Specifically, since clamping strip one 15 and clamping strip two 16 are both semi-flexible materials, clamping strip two 16 is clamped under the action of clamping strip one 15, so that snap ring 2 can be sleeved outside heat dissipation structure 4 to prevent it from falling off, meanwhile, sealing ring one 8, sealing ring two 11 and sealing ring three 14 can be waterproof and dissipate heat under the action of heat dissipation structure 4, when the installation direction is wrong, clamping strip two 16 on snap ring 2 is removed from clamping strip one 15 outside heat dissipation structure 4, so that connecting plate 7 retreats and compresses spring 6, and under the condition that the overall use of lead one 3 is not changed, it is fine-tuned, connecting block 10 is taken out of connecting groove 9 to adjust, after adjustment, the components are restored to the original position by the same principle, and connecting plate 7 is limited under the action of limit ring 12, so that it can be used.

[0023] Working principle: in use, the card strip two 16 on the snap ring 2 is sleeved on the card strip one 15 outside the heat dissipation structure 4, since the card strip one 15 and the card strip two 16 are both semi-flexible materials, the card strip one 15 can be clamped to the card strip two 16, the position of the snap ring 2 is fixed, when the installation direction is wrong, the card strip two 16 on the snap ring 2 is removed from the card strip one 15 outside the heat dissipation structure 4, the spring 6 is compressed, and the lead one 3 is fine-tuned without changing the overall use, the connecting block 10 is taken out from the connecting groove 9, and the adjustment is completed, then the same principle is used to restore to the position before the adjustment.

[0024] The embodiments of the utility model are explained in detail above in combination with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range possessed by the ordinary skilled in the art without departing from the purpose of the utility model.

Claims

1. A water-resistant, high-temperature diode, characterized by, Include: The lead two (17) and the sealing ring two (11), the sealing ring two (11) top end is provided with heat dissipation structure (4), the side surface of heat dissipation structure (4) is fixedly connected with the card strip one (15), the card strip one (15) side is provided with the card strip two (16), the side surface of card strip two (16) is fixedly connected with the snap ring (2), and the card strip two (16) is engaged with the card strip one (15), the side surface of snap ring (2) is fixedly connected with the connecting ring (1), the side surface of connecting ring (1) is fixedly connected with the connecting plate (7), the lead two (17) is fixedly connected with the connecting block (10) away from heat dissipation structure (4) one end, the connecting plate (7) is slidably connected with the lead one (3), the lead one (3) is fixedly connected with the connecting groove (9) close to heat dissipation structure (4) one end, the connecting block (10) is located in the connecting groove (9), and they are all conductive material, the side surface of lead one (3) is fixedly connected with the fixed ring one (5), the side surface of fixed ring one (5) is fixedly connected with the spring (6), the spring (6) is fixedly connected on the side surface of connecting plate (7) away from fixed ring one (5) one end.

2. The water-resistant, high-temperature diode of claim 1, wherein, The heat dissipation structure (4) includes heat dissipation glue (401), sealing layer (402), heat dissipation layer (403), the sealing layer (402) is arranged on the inner side of heat dissipation layer (403), and the heat dissipation glue (401) is arranged on the inner side of sealing layer (402).

3. The water-resistant, high-temperature diode of claim 2, wherein, The inner side of heat dissipation glue (401) is provided with medium (18), and the lead two (17) is connected with medium (18).

4. The water-resistant, high-temperature diode of claim 1, wherein, The metal contact wire is arranged between the lead two (17).

5. The water-resistant, high-temperature diode of claim 1, wherein, The side surface of lead one (3) is fixedly connected with the limiting ring (12), and the limiting ring (12) is located at one end close to heat dissipation structure (4).

6. The water-resistant, high-temperature diode of claim 1, wherein, The connecting plate (7) is provided with sealing ring one (8), and the lead one (3) is located on the inner side of sealing ring one (8).

7. The water-resistant, high-temperature diode of claim 1, wherein, The inner side surface of snap ring (2) is fixedly connected with the fixed ring two (13), and the side surface of fixed ring two (13) is fixedly connected with the sealing ring three (14).

8. The water-resistant, high-temperature diode of claim 1, wherein, The two ends of heat dissipation structure (4) are symmetrically structured.

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