Test classifier
By designing a test sorting machine that includes a feeding area and a robotic arm, fully automated testing and retesting of semiconductor devices has been achieved, solving the problems of low efficiency and manual intervention in existing technologies, and improving testing efficiency and processing capacity.
Patent Information
- Application Number
- CN202520187829.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-02-06
AI Technical Summary
Existing test classification machines require manual operation, are inefficient and prone to errors, and cannot achieve fully automated retesting, especially when dealing with large-scale test tasks, their processing capacity is insufficient.
Design a test and sorting machine, including a feeding area, a first robotic arm, a sorting area, a second robotic arm, a discharging area, and a third robotic arm. Through the collaborative work of the robotic arms, automated testing and retesting of semiconductor devices can be achieved, avoiding manual intervention.
It enables fully automated retesting of semiconductor devices, improves testing efficiency, reduces errors caused by human intervention, and enhances the ability to handle large-scale testing tasks.
Smart Images
Figure CN223862328U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor device measurement, and in particular to a test classification machine. Background Technology
[0002] In the field of automated test equipment, sorting machines are common, primarily used for classifying and testing various electronic components. However, existing test sorting machines typically require manual operation, resulting in low efficiency and a high risk of errors. To address this issue, automated retesting equipment has emerged, which can automatically retest semiconductor devices when anomalies are detected, improving testing accuracy and efficiency. However, existing automated retesting equipment usually requires manual handling of the semiconductor devices to be retested at the sorting machine's entrance, failing to achieve full automation. In other words, existing test sorting machines primarily rely on manual operation to automate the retesting of electronic components. While this method achieves basic functionality, it is inefficient and prone to errors. First, existing automated retesting equipment requires manual intervention, increasing labor costs and reducing testing efficiency. Second, existing automated retesting equipment has structural limitations, preventing full automation. Furthermore, existing automated retesting equipment may suffer from insufficient processing capacity when handling large-scale testing tasks.
[0003] Therefore, how to design a test classification machine that can achieve fully automatic retesting has become one of the problems that urgently needs to be solved by those skilled in the art.
[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content
[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a test classification machine to solve the problem that the prior art cannot perform fully automatic retesting of semiconductor devices.
[0006] To achieve the above and other related objectives, this utility model provides a test sorting machine, which includes at least: a feeding area, a first robotic arm, a sorting area, a second robotic arm, a discharging area, and a third robotic arm; the first robotic arm is located above the feeding area and the sorting area, and transports the semiconductor devices to be tested from the feeding area to the sorting area; the sorting area tests the semiconductor devices to be tested and marks the qualified and unqualified semiconductor devices; the second robotic arm is located above the sorting area and the discharging area, and transports the qualified and unqualified semiconductor devices from the sorting area to the discharging area for separate placement; the third robotic arm is located above the feeding area and the discharging area, and transports the unqualified semiconductor devices from the discharging area to the feeding area.
[0007] Optionally, the sorting area includes a first shuttle, a testing robotic arm module, a testing classifier, and a second shuttle; the testing classifier tests and marks the semiconductor devices under test; the testing robotic arm module is located above the testing classifier, and the testing robotic arm module transports the semiconductor devices under test from the first shuttle to the testing classifier, and transports the tested semiconductor devices to the second shuttle; the second robotic arm transports the qualified and unqualified semiconductor devices from the second shuttle to the discharge area for separate placement.
[0008] Alternatively, the classification area may further include a first test completion area; the first test completion area is located on the output side of the second shuttle; the second robotic arm transports the tested and qualified semiconductor devices on the second shuttle to the first test completion area.
[0009] Optionally, the first robotic arm and the second robotic arm are arranged opposite to each other, and the movement trajectory of the first robotic arm is parallel to the movement trajectory of the second robotic arm.
[0010] Optionally, the test sorting machine further includes an empty tray area; the empty tray area is located between the feeding area and the discharging area.
[0011] Optionally, the feeding area and the discharging area are located within the first working area, and the sorting area is located within the second working area; the first working area and the second working area are arranged in parallel.
[0012] Alternatively, the feeding area is located near the input side of the sorting area, and the discharging area is located near the output side of the sorting area.
[0013] Alternatively, the test sorting machine may further include a preparation area, which is connected to the feeding area via a first conveyor belt.
[0014] Alternatively, the test sorting machine may further include a second test completion area, which is connected to the discharge area via a second conveyor belt.
[0015] Alternatively, the preparation area and the second test completion area are located within the third working area, with the preparation area close to the feeding area and the second test completion area close to the discharge area; the third working area, the first working area, and the second working area are parallel to each other, with the third working area adjacent to the first working area and the first working area adjacent to the second working area.
[0016] As described above, the test classification machine of this utility model has the following beneficial effects:
[0017] 1. This utility model uses a third robotic arm to transport the semiconductor device to be retested from the discharge area to the feed area. After the semiconductor device returns to the feed area, the test sorting machine can retest the semiconductor device, eliminating the need for manual intervention during the retesting of semiconductor devices.
[0018] 2. This utility model also includes a preparatory area to improve the working efficiency of the test sorting machine, and a bidirectional first conveyor belt is provided so that the preparatory area can participate in both the test sorting and the reset of semiconductor devices; this utility model also includes a second test completion area to improve the working efficiency of the test sorting machine, and a bidirectional second conveyor belt is provided so that the second test completion area can participate in both the test sorting and the reset of semiconductor devices.
[0019] 3. This utility model has the advantages of simple structure and easy implementation. Attached Figure Description
[0020] Figure 1 The diagram shown is a schematic diagram of the first structure of the test classification machine of this utility model.
[0021] Figure 2 The diagram shown is a second structural schematic of the test classification machine of this utility model.
[0022] Figure 3 The diagram shown is a third structural schematic of the test classification machine of this utility model.
[0023] Component designation explanation
[0024] 1 Feeding area
[0025] 2 First robotic arm
[0026] 3. Classification Area
[0027] 3a First shuttle
[0028] 3b Test robotic arm module
[0029] 3C Test Classifier
[0030] 3D Second Shuttle
[0031] 3e First Test Completed Area
[0032] 4. Second robotic arm
[0033] 5 Discharge Area
[0034] 6. Third robotic arm
[0035] 7 Empty disk area
[0036] 8. Preparation Area
[0037] 9 Second Test Completion Area
[0038] 10 First Working Area
[0039] 11 Second Working Area
[0040] 12 Third Working Area Detailed Implementation
[0041] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.
[0042] Please see Figures 1-3 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0043] Example 1
[0044] like Figure 1 As shown, this embodiment provides a test sorting machine, which includes: a feeding area 1, a first robotic arm 2, a sorting area 3, a second robotic arm 4, a discharging area 5, and a third robotic arm 6.
[0045] like Figure 1 As shown, the first robotic arm 2 is located above the feeding area 1 and the sorting area 3. The first robotic arm 2 transports the semiconductor devices to be tested from the feeding area 1 to the sorting area 3.
[0046] Specifically, in this embodiment, the semiconductor device under test (DUT) is placed on the feeding area 1 via a support tray. The purpose of the first robotic arm 2 above the feeding area 1 and the sorting area 3 is to facilitate the operation of the DUT on the feeding area 1 and the sorting area 3. Furthermore, the first robotic arm 2 only operates when testing the semiconductor device and does not participate in the reset of the semiconductor device. Specifically, the first robotic arm 2 picks up the DUT from the support tray in the feeding area 1 and places it in the sorting area 3 for testing and sorting.
[0047] like Figure 1 As shown, classification area 3 tests the semiconductor devices under test and marks the semiconductor devices that pass the test and those that fail the test.
[0048] Specifically, in this embodiment, the classification area 3 only operates when testing semiconductor devices and does not participate in the reset of semiconductor devices. Further, the classification area 3 includes a first shuttle 3a, a testing robotic arm module 3b, a testing classifier 3c, and a second shuttle 3d; wherein, the testing classifier 3c tests and marks the semiconductor devices under test; the testing robotic arm module 3b is located above the testing classifier 3c, and transports the semiconductor devices under test from the first shuttle 3a to the testing classifier 3c, and transports the tested semiconductor devices to the second shuttle 3d; the second robotic arm 4 transports the qualified and unqualified semiconductor devices from the second shuttle 3d to the discharge area 5 for separate placement. Further, the number of transport slots in the first shuttle 3a, the number of robotic arms in the testing robotic arm module 3b, and the number of transport slots in the second shuttle 3d are correspondingly set, that is, the first shuttle 3a includes n transport slots, the testing robotic arm module 3b includes n robotic arms, and the second shuttle 3d includes n transport slots, where n is a natural number greater than or equal to 1. Furthermore, the classification area 3 also includes a first test completion area 3e; the first test completion area 3e is located on the output side of the second shuttle 3d, and the second robotic arm 4 transports the qualified semiconductor devices on the second shuttle 3d to the first test completion area 3e to reduce the load on the discharge area 5.
[0049] like Figure 1 As shown, the second robotic arm 4 is located above the sorting area 3 and the unloading area 5. The second robotic arm 4 transports the qualified and unqualified semiconductor devices in the sorting area 3 to the unloading area 5 for separate placement.
[0050] Specifically, in this embodiment, the second robotic arm 4 only operates when testing semiconductor devices and does not participate in resetting the semiconductor devices. The purpose of positioning the second robotic arm 4 above the discharge area 5 and the sorting area 3 is to facilitate the manipulation of the semiconductor devices in these areas. The second robotic arm 4 distinguishes between qualified and unqualified semiconductor devices, placing them at different locations in the discharge area 5. Furthermore, the first robotic arm 2 and the second robotic arm 4 are positioned opposite each other, and the movement trajectory of the first robotic arm 2 is parallel to that of the second robotic arm 4. This is to facilitate the transport of semiconductor devices between the feeding area 1, the sorting area 3, and the discharge area 5 by the first robotic arm 2 and the second robotic arm 4.
[0051] like Figure 1 As shown, the third robotic arm 6 is located above the feeding area 1 and the discharging area 5. The third robotic arm 6 transports the defective semiconductor devices on the discharging area 5 to the feeding area 1.
[0052] Specifically, in this embodiment, the third robotic arm 6 only operates during the semiconductor device reset process and does not participate in the testing and classification of semiconductor devices. The third robotic arm 6 is positioned above the feeding area 1 and the discharging area 5 to complete the reset of the semiconductor devices to be retested from the discharging area 5 to the feeding area 1. Further, the tested semiconductor devices are sorted and placed in the discharging area 5. The qualified semiconductor devices are removed from the discharging area 5, and the unqualified semiconductor devices need to be retested. At this time, the reset of the semiconductor devices to be retested is activated, and the third robotic arm 6 transports the tray containing the unqualified semiconductor devices from the discharging area 5 to the feeding area 1, where a new round of testing begins.
[0053] Specifically, in this embodiment, such as Figure 1 As shown, the feeding area 1 and the discharging area 5 are located within the first working area 10, and the sorting area 3 is located within the second working area 10. The first working area 10 and the second working area 11 are arranged in parallel. Dividing the feeding area 1, the discharging area 5, and the sorting area 3 into different working areas facilitates collaborative work between the testing and sorting machines, thereby improving the efficiency of the testing and sorting machine. Furthermore, the feeding area 1 is located on the first working area 10 near the input side of the sorting area 3, and the discharging area 5 is located on the first working area 10 near the output side of the sorting area 3. This is to facilitate the transport of the semiconductor devices under test by the testing and sorting machine during the testing and sorting process.
[0054] Example 2
[0055] like Figure 2 As shown, this embodiment provides a test sorting machine. The difference between this embodiment and the first embodiment is that the test sorting machine also includes an empty tray area 7; the empty tray area 7 is located between the feeding area 1 and the discharging area 5.
[0056] Specifically, in this embodiment, since the first robotic arm 2 directly picks up semiconductor devices from the feeding area 1 and enters the sorting area 3, and the second robotic arm 4 directly picks up semiconductor devices from the sorting area 3 and enters the discharging area 5, the feeding area 1 will generate empty carrying trays, while the discharging area 5 needs empty carrying trays. Therefore, the empty tray area 7 is set between the feeding area 1 and the discharging area 5, so that the empty carrying trays can circulate between the feeding area 1 and the discharging area 5, thereby improving the working efficiency of the test sorting machine.
[0057] Example 3
[0058] like Figure 3 As shown, this embodiment provides a test sorting machine. The difference between this embodiment and the first embodiment is that the test sorting machine also includes a preparatory area 8, which is connected to the feeding area 1 via a first conveyor belt.
[0059] Specifically, in this embodiment, the purpose of setting up the preparatory area 8 is to perform preparatory work before test classification, and the first conveyor belt ( Figure 3 (Not shown in the diagram) The system operates both during semiconductor device testing and during semiconductor device reset: When testing a semiconductor device, the device under test is placed in the preparation area 8, and the first conveyor belt transports the device from the preparation area 8 into the feeding area 1. Afterwards, the first robotic arm 2 and the second robotic arm 4 operate normally. When resetting a semiconductor device, the third robotic arm 6 first transports the tray containing the semiconductor device to be retested from the discharge area 5 to the feeding area 1. The first conveyor belt then transports the device from the feeding area 1 into the preparation area 8, after which the testing and sorting machine begins a new testing process. It should be noted that during reset, the semiconductor device to be retested can either return to the preparation area 8 via the first conveyor belt to begin a new round of testing, or it can remain in the feeding area 1 to begin a new round of testing; this is not limited to this embodiment.
[0060] Specifically, in this embodiment, such as Figure 3 As shown, the preparation area 8 is located within the third working area 12, and is close to the feed area 1 on the third working area 12. The third working area 12, the first working area 10, and the second working area 11 are parallel to each other, with the third working area 12 adjacent to the first working area 10, and the first working area 10 adjacent to the second working area 11. The purpose of setting the preparation area 8 in the above manner is to facilitate the testing, classification, and reset of the semiconductor device under test between the various areas.
[0061] Specifically, in this embodiment, such as Figure 3 As shown, the test sorting machine also includes a second test completion area 9, which is connected to the discharge area 5 via a second conveyor belt.
[0062] Specifically, in this embodiment, the purpose of setting up the second test completion area 9 is to reduce the workload of the discharge area 5, and the second conveyor belt ( Figure 3 (Not shown in the diagram) The semiconductor sorting machine can be activated both during semiconductor device testing and during semiconductor device reset. Further, when testing semiconductor devices, the tested devices are placed in the discharge area 5, and the second conveyor belt transports them from the discharge area 5 to the second test completion area 9, at which point the semiconductor device testing and sorting is complete. When resetting semiconductor devices, the tested and qualified semiconductor devices are first removed from the second test completion area 9, and the second conveyor belt then transports the semiconductor devices to be retested from the second test completion area 9 to the discharge area 5. Afterwards, the test sorting machine initiates the reset process, moving the semiconductor devices from the discharge area 5 to the feed area 1. It should be noted that during the test sorting of semiconductor devices to be retested, the device can choose to return to the second test completion area 9 via the second conveyor belt to end the test sorting, or it can remain directly in the discharge area 5 to end the test sorting; this is not limited to this embodiment.
[0063] Specifically, in this embodiment, such as Figure 3 As shown, the second test completion area 9 is located within the third working area 12. The second test completion area 9 is located close to the discharge area 5 in the third working area 12. The purpose of this arrangement is to enable the test sorting machine to complete collaborative work between the various areas more conveniently during test sorting and reset.
[0064] In summary, the test sorting machine of this invention completes the test sorting of semiconductor devices under test through a first robotic arm, a sorting area, and a second robotic arm during the test sorting process. During reset, a third robotic arm completes the reset of unqualified semiconductor devices. This allows the test sorting machine to retest semiconductor devices without manual intervention, avoiding the low efficiency and high error associated with manual intervention. The test sorting machine also includes a preparation area and a second test completion area to improve its working efficiency. A first conveyor belt and a second conveyor belt are correspondingly provided so that the preparation area and the second test completion area participate in the test sorting and reset of the semiconductor devices under test. Furthermore, the test sorting machine of this invention has the advantages of simple structure and ease of implementation. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.
[0065] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A test classification machine, characterized in that, The test sorting machine includes at least: a feeding area, a first robotic arm, a sorting area, a second robotic arm, a discharging area, and a third robotic arm; The first robotic arm is located above the feeding area and the sorting area, and the first robotic arm transports the semiconductor device to be tested from the feeding area to the sorting area; The classification area is used to test the semiconductor devices under test, and the semiconductor devices that pass the test and those that fail the test are marked. The second robotic arm is located above the sorting area and the unloading area. The second robotic arm transports the qualified and unqualified semiconductor devices from the sorting area to the unloading area for separate placement. The third robotic arm is located above the feeding area and the discharging area, and the third robotic arm transports the test-failed semiconductor devices from the discharging area to the feeding area.
2. The test classification machine according to claim 1, characterized in that: The classification area includes a first shuttle, a test robotic arm module, a test classifier, and a second shuttle; The test classifier tests and marks the semiconductor device under test; the test robotic arm module is located above the test classifier, and the test robotic arm module transports the semiconductor device under test on the first shuttle to the test classifier, and transports the tested semiconductor device to the second shuttle. The second robotic arm transports the qualified and unqualified semiconductor devices from the second shuttle car to the discharge area for separate placement.
3. The test classification machine according to claim 2, characterized in that: The classification area also includes a first test completion area; The first test completion area is located on the output side of the second shuttle; The second robotic arm transports the tested and qualified semiconductor devices from the second shuttle to the first test completion area.
4. The test classification machine according to claim 1, characterized in that: The first robotic arm and the second robotic arm are positioned opposite each other, and the movement trajectory of the first robotic arm is parallel to the movement trajectory of the second robotic arm.
5. The test classification machine according to claim 1, characterized in that: The test sorting machine also includes an empty tray area; the empty tray area is located between the feeding area and the discharging area.
6. The test classification machine according to any one of claims 1-5, characterized in that: The feeding area and the discharging area are located within the first working area, and the sorting area is located within the second working area; the first working area and the second working area are arranged in parallel.
7. The test classification machine according to claim 6, characterized in that: The feeding area is located near the input side of the sorting area, and the discharging area is located near the output side of the sorting area.
8. The test classification machine according to claim 6, characterized in that: The test and sorting machine also includes a preparation area, which is connected to the feeding area via a first conveyor belt.
9. The test classification machine according to claim 8, characterized in that: The test sorting machine also includes a second test completion area, which is connected to the discharge area via a second conveyor belt.
10. The test classification machine according to claim 9, characterized in that: The preparation area and the second test completion area are located within the third working area. The preparation area is close to the feeding area; the second test completion area is close to the discharging area; the third working area, the first working area, and the second working area are parallel to each other, the third working area is adjacent to the first working area, and the first working area is adjacent to the second working area.