Double-station winding laser welding device

Abstract

The utility model discloses a double-station winding laser welding device. The double-station winding laser welding device comprises a wire feeding mechanism, a tin wire winding mechanism and a laser welding mechanism. The tin wire ring winding mechanism comprises a ring winding support, a first through hole is formed in the center area of the ring winding support in the height direction, a connecting rod is arranged in the first through hole, second through holes are formed in the two sides of the ring winding support in the circumferential direction in the height direction, and tin wire lowering guide rods are slidably connected into the second through holes. The lower end of the tin wire lowering guide rod abuts against a sliding support which is a hollow body, the sliding support is sleeved with a connecting rod in sliding connection with the sliding support, the connecting rod is inserted into the supporting rod in a penetrating mode, a first elastic element is arranged between the upper end of the supporting rod and the top end of the sliding support, and a third through hole is formed in the connecting rod in the height direction. And a tin wire clamping guide rod is connected in the third through hole in a sliding manner. The circuit board automatic laser welding machine solves the technical problems of low efficiency, great harm to people, low product consistency and poor quality caused by manual laser welding of a circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board laser welding technology, specifically to a dual-station ring-shaped laser welding device. Background Technology

[0002] Flexible printed circuit boards (FPCs) are widely used in automotive electronics and other fields due to their lightweight, flexibility, and high-density wiring characteristics. However, the laser welding process in their production still largely relies on manual operation. Manual welding requires close contact with the laser equipment and solder, and the aerosols (such as metal vapors and volatile organic compounds) and ultraviolet radiation generated during the welding process pose a threat to the health of operators. At the same time, manual operation is inefficient, and the parameters (such as laser power, focal length, and dwell time) are greatly affected by the operator's experience, easily leading to problems such as uneven solder joint strength, cold solder joints, or overheating.

[0003] However, current automated soldering technologies still have significant shortcomings in the FPC field. Traditional wave soldering and reflow soldering processes are prone to deformation or delamination of flexible substrates due to high thermal stress and low positioning accuracy. Existing automated solutions are mostly designed for rigid PCBs and lack process optimization for FPC material characteristics (such as low heat capacity and easy warping), resulting in poor soldering consistency and poor quality. Utility Model Content

[0004] The purpose of this invention is to overcome the above-mentioned technical deficiencies and provide a dual-station circular laser welding device to solve the technical problems of low efficiency, high damage, low product consistency and poor quality caused by manual laser welding of circuit boards in the field of circuit board laser welding technology.

[0005] To achieve the above-mentioned technical objectives, the present invention provides a dual-station circumferential laser welding device, comprising:

[0006] The system includes a wire feeding mechanism, a solder wire winding mechanism, and a laser welding mechanism. The solder wire winding mechanism includes a winding bracket. A first through hole is formed in the central region of the winding bracket along the height direction. A connecting rod is disposed in the first through hole. The winding bracket has second through holes on both sides along the height direction. A solder wire lowering guide rod is slidably connected in the second through hole. The lower end of the solder wire lowering guide rod abuts against a sliding bracket. The sliding bracket is hollow. The sliding bracket is sleeved on the connecting rod and slidably connected to it. The connecting rod is inserted through a support rod. A first elastic element is disposed between the upper end of the support rod and the top end of the sliding bracket. A third through hole is formed in the connecting rod along the height direction. A solder wire clamping guide rod is slidably connected in the third through hole. One end of the solder wire clamping guide rod is fixedly connected to the output end of a solder wire clamping drive source. The other end of the solder wire clamping guide rod is fixedly connected to the upper end of a clamping claw.

[0007] Compared with the prior art, the beneficial effects of this utility model include:

[0008] 1. No Harm: In traditional soldering methods, operators may be exposed to high temperatures, strong light, and harmful gases at close range, posing risks of burns, eye damage, and inhalation of toxic gases. This new invention, through automated design, utilizes a wire winding mechanism, a wire cutting mechanism, and a wire feeding mechanism to reduce the need for manual intervention, keeping operators away from the soldering area and effectively reducing harm to the human body.

[0009] 2. High efficiency: The dual-station circumferential laser welding device provided by this utility model has two welding stations in the worktable, which greatly improves the welding efficiency of the product.

[0010] 3. High product quality: The laser welding machine in the dual-station ring-shaped laser welding device provided by this utility model has the characteristics of high energy density and precise control, which can ensure the consistency and strength of the weld. At the same time, the ring-shaped welding technology can achieve precise welding and ensure high-quality product output. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the wire feeding mechanism provided by this utility model;

[0012] Figure 2 This is a three-dimensional structural diagram of the wire-cutting mechanism provided by this utility model;

[0013] Figure 3 This is a three-dimensional structural diagram of the laser welding mechanism and camera unit provided by this utility model;

[0014] Figure 4 This is a three-dimensional structural diagram of the tin wire winding mechanism provided by this utility model;

[0015] Figure 5 This is a front view structural schematic diagram of the tin wire winding mechanism provided by this utility model;

[0016] Figure 6 This is a front view structural diagram of the wire-cutting mechanism provided by this utility model;

[0017] Figure 7 This is a three-dimensional structural diagram of the dual-station ring-shaped laser welding device provided by this utility model. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 This embodiment provides a dual-station tin wire winding laser welding device, including a wire feeding mechanism, a tin wire winding mechanism, a wire cutting mechanism, a laser welding mechanism, and a worktable.

[0022] Furthermore, the solder wire winding mechanism 1 includes a winding bracket 11, and a first through hole 11A is formed in the central region along the height direction of the winding bracket 11. A connecting rod 12 is disposed in the first through hole 11A. Specifically, the connecting rod 12 is fixedly connected to the winding bracket 11, and the two are relatively stationary.

[0023] Furthermore, the ring bracket 11 has second through holes 11B on both sides of the circumference along the height direction, and a solder wire lowering guide rod 13 is slidably connected in the second through hole 11B; the lower end of the solder wire lowering guide rod 13 abuts against a sliding bracket 14. Specifically, when the sliding bracket 14 needs to move downward, the solder wire lowering guide rod 13 moves downward, pushing the sliding bracket 14 downward.

[0024] Furthermore, the sliding bracket 14 is a hollow body, and is slidably connected to the connecting rod 12. A support rod 15 is inserted through the connecting rod 12, and a first elastic element is provided between the upper end of the support rod 15 and the top end of the sliding bracket 14. Specifically, the first elastic element serves a reset function; that is, after the solder wire lowering guide rod 13 pushes the sliding bracket 14 downwards and completes the corresponding action, the elasticity of the first elastic element resets both the solder wire lowering guide rod 13 and the sliding bracket 14, preparing for the subsequent pushing of the sliding bracket 14 by the solder wire lowering guide rod 13.

[0025] Preferably, the first elastic element is selected as a spring.

[0026] Furthermore, the connecting rod 12 has a third through hole 12A along its height direction. A solder wire clamping guide rod 16 is slidably connected within the third through hole 12A. One end of the solder wire clamping guide rod 16 is fixedly connected to the output end of the solder wire clamping drive source 17, and the other end is fixedly connected to the upper end of the clamping claw 18. Specifically, the solder wire clamping guide rod 16 is fitted with a spring. One end of the spring abuts against one side of the sliding bracket 14, and the other end of the spring abuts against one side of the clamping claw 18. The spring has a reset function. When the solder wire clamping guide rod 16 applies a pulling force to the clamping claw 18, it drives the lower end of the clamping claw 18 to clamp the solder wire 2. When the solder wire clamping guide rod 16 no longer applies a pulling force to the clamping claw 18, the clamping claw 18 resets under the action of the spring, and the clamping claw 18 no longer applies a clamping force to the solder wire 2.

[0027] Furthermore, a loop needle 19 is fixedly connected to the lower end of the connecting rod 12. The loop needle 19 includes a first loop needle part 191, a second loop needle part 192, and a third loop needle part 193. The cross-sectional diameters of the first loop needle part 191, the second loop needle part 192, and the third loop needle part 193 are gradually increased and integrally formed. The lower end of the clamping claw 18 is located on one side of the third loop needle part 193. A solder wire groove is provided at the end of the clamping claw 18. The diameter of the solder wire groove is slightly smaller than the diameter of the solder wire 2, which facilitates clamping the solder wire 2 and provides a limiting function for the solder wire 2.

[0028] Furthermore, a connecting plate 21 is fixedly connected to the upper end of the two solder wire lowering guide rods 13, and a solder wire lowering drive source 20 is fixedly connected to the top end of the loop bracket 11. The output end of the solder wire lowering drive source 20 is positioned above the connecting plate 21.

[0029] Preferably, the solder wire lowering drive source 20 is selected as a pneumatic drive source, and the output shaft of the pneumatic drive source extends and shortens to drive the solder wire lowering guide rod 13 to move downward and reset.

[0030] Furthermore, a horizontal drive source 22 is fixedly connected to one side of the ring support 11, a ring drive source 23 is fixedly connected to the output end of the horizontal drive source 22, and a ring claw 24 is fixedly connected to the output end of the ring drive source 23. The two ring claws 24 are arranged side by side.

[0031] Preferably, both the horizontal drive source 22 and the horizontal drive source 23 are pneumatic drive sources. The horizontal drive source 22 drives the horizontal claw 24 to move left and right in the horizontal direction, and the horizontal drive source 23 drives the relative movement of the two sets of claws 24.

[0032] Furthermore, specifically, after the clamping jaws 18 clamp the solder wire 2 fed by the wire feeding mechanism 3, the winding drive source 23 drives the two winding jaws 24 to move in opposite directions until the distance between the two winding jaws 24 is greater than the thickness of the lower end of the clamping jaws 18. At this time, the winding horizontal drive source 22 drives the two winding jaws 24 to move towards the winding needle 19 until the winding jaws 24 abut against the solder wire clamped by the clamping jaws 18 and the winding needle 19. The horizontal drive source 22 continues to drive the two winding claws 24 to move. Under the pushing action of the two winding claws 24, the solder wire 2 is initially bent into a U-shape. When the two winding claws 24 are about to move past the winding needle 19, the drive source 23 drives the two winding claws 24 to move in the same direction. At this time, the two winding claws squeeze the U-shaped solder wire into the circular solder wire 2, and under the action of pre-tightening force, it is sleeved on the winding needle 19.

[0033] Furthermore, the wire feeding mechanism 3 includes a pressure wheel 31 and a drive wheel 32. The pressure wheel 31 is drivenly connected to the output end of the wire feeding drive source 33. The fixed end of the wire feeding drive source 33 is fixed on the wire feeding fixed plate 34. A buffer block 35 is rotatably connected to one side of the wire feeding fixed plate 34. The buffer block 35 is rotatably connected to the pressure wheel 31. An abutment block 36 is fixedly connected to one side of the wire feeding fixed plate 34. The abutment block 36 is located on one side of the buffer block 35. A second elastic element is provided between the buffer block 35 and the abutment block 36.

[0034] Preferably, the second elastic element is selected as a spring, and the pressure wheel 31 is selected as a bearing.

[0035] Furthermore, a reel 36 is rotatably connected to the top of the wire feeding fixing plate 34, and the tin wire 2 is wound on the reel 36.

[0036] Furthermore, a wire feeding limiting block 37 is fixed on one side of the wire feeding fixing plate 34. Wire feeding nozzles 38 are provided at both the upper and lower ends of the wire feeding limiting block 37. The conical ends of the two wire feeding nozzles 38 face the gap between the pressing wheel 31 and the driving wheel 32. The annular ends of the wire feeding nozzles 38 are connected to wire feeding pipes 39.

[0037] Furthermore, the solder wire 2 on the reel 36 is first inserted into the wire feeding pipe 39, passes through the wire feeding nozzle 38 located at the upper end of the wire feeding limit block 37, then passes through the gap between the pressure roller 31 and the drive roller 32, wherein the outer wall surfaces of the pressure roller 31 and the drive roller 32 are in close contact with the outer wall surface of the solder wire 2, and finally the solder wire 2 passes through the wire feeding nozzle 38 located at the lower end of the wire feeding limit block 37 and continues to be inserted into the wire feeding pipe 39.

[0038] Furthermore, since the device can accommodate solder wires 2 of different diameters, the buffer block 35 adjusts at different angles depending on the diameter of the solder wire 2, but the buffer block 35 always drives the pressure wheel 31 to abut against the solder wire 2 to prevent the solder wire 2 from sagging and changing the travel path of the solder wire 2.

[0039] Furthermore, it also includes a wire cutting mechanism 4. The wire cutting mechanism 4 includes a wire cutting drive source 41, wire cutting claws 42, and wire cutting blades 43. The fixed end of the wire cutting drive source 41 is fixed to the wire feeding fixed plate 34, and the output end of the wire cutting drive source 41 is drivenly connected to the wire cutting claws 42. One end of the two relatively parallel wire cutting claws 42 is fixedly connected to the wire cutting blades 43.

[0040] Furthermore, after the wire feeding mechanism 3 feeds the solder wire 2 to one side of the winding needle 19, the wire cutting drive source 41 drives the wire cutting claw 42 to move in the same direction, thereby driving the wire cutting blade 43 to move in the same direction and cut the solder wire 2 fed by the wire feeding mechanism 3.

[0041] Preferably, the wire-cutting drive source 41 is selected as a pneumatic drive source.

[0042] Furthermore, the wire feeding fixing plate 34 is slidably connected to the first fixed side plate 51 via the sliding module 5. A laser welding mechanism 6 is fixedly connected to one side of the first fixed side plate 51. One side of the winding bracket 11 is fixedly connected to the first fixed side plate 51. A camera unit 7 is fixedly connected to one side of the laser welding mechanism 6. A second fixed side plate 52 is fixedly connected to one side of the laser welding mechanism 6. The second fixed side plate 52 is fixedly connected to the moving end of the three-axis moving module 8 to realize the movement of the wire feeding mechanism 3, the solder wire winding mechanism 1, and the laser welding mechanism 6 in three dimensions.

[0043] Preferably, the sliding module 5 includes a linear guide rail and a slider, and the linear guide rail and slider are used to realize the movement of the wire feeding fixing plate.

[0044] Preferably, the three-axis motion module 8 is existing technology. The three-axis motion module 8 is a core component of automated equipment composed of three linear motion modules: X-axis, Y-axis, and Z-axis. It achieves precise positioning and movement in three-dimensional space through sliding engagement. Its typical structure includes an X-axis motion module as the base, a Y-axis module slidably mounted on the X-axis, and a Z-axis module slidably engaged with the Y-axis module. Finally, functional components are connected via a mounting plate, supporting quick disassembly to adapt to different production needs. This design enables precise positioning in multiple locations, improving automated production efficiency.

[0045] Preferably, the top of the three-axis moving module 8 is provided with two of the wire feeding mechanisms 3, the solder wire winding mechanism 1, the wire cutting mechanism 4, and the laser welding mechanism 6, forming a dual-station winding laser welding, which greatly improves the manufacturing efficiency of the product.

[0046] Furthermore, the three-axis moving module 8 is set on the table surface of the workbench 9. A conveyor belt 10 is set above the table surface of the workbench 9 to transport incoming products and processed products. Specifically, the incoming products consist of circuit boards and PIN pins. The PIN pins are inserted into the PIN holes of the circuit board, but the PIN pins and the circuit board are not connected. At this time, solder wire and laser soldering are needed to connect them.

[0047] Furthermore, the camera unit 7 identifies the products transported by the conveyor belt 10 and simultaneously feeds the information back to the three-axis motion module 8 to correct the position of the laser welding mechanism 6 until the welding core of the laser welding mechanism 6 is directly above the welding point position on the conveyed product.

[0048] Furthermore, the laser welding mechanism 6 heats and melts the annular solder wire formed by the solder wire winding mechanism 1 to form a solder joint, thereby connecting the PIN pin to the circuit board.

[0049] Furthermore, the laser welding mechanism 6 is equipped with a vision system. The vision system of the laser welding mechanism 6 will detect the welding quality of the PIN and the circuit board, and detect whether there are problems such as missing solder, air holes and solder joint deviation. If the quality is not up to standard, it will remind manual handling or collect the defective products to the MES system so that the staff can handle them in time.

[0050] Working principle: The dual-station winding laser welding device provided by this utility model includes a wire feeding mechanism 3, a solder wire winding mechanism 1, a wire cutting mechanism 4, a laser welding mechanism 6, and a worktable 9.

[0051] In the first step, the solder wire 2 on the reel 36 is first inserted into the wire feeding tube 39, passes through the wire feeding nozzle 38 located at the upper end of the wire feeding limit block 37, and then passes through the gap between the pressure wheel 31 and the drive wheel 32, wherein the outer wall surfaces of the pressure wheel 31 and the drive wheel 32 are in close contact with the outer wall surface of the solder wire 2. Finally, the solder wire 2 passes through the wire feeding nozzle 38 located at the lower end of the wire feeding limit block 37 and continues to be inserted into the wire feeding tube 39. The wire feeding drive source 33 drives the drive wheel 32 to rotate. Due to the friction between the wire feeding drive source 33 and the solder wire 2, the solder wire 2 moves forward until it is delivered to one side of the winding needle 19.

[0052] In the second step, when the solder wire clamping drive source 17 drives the solder wire clamping guide rod 16 to apply a pulling force to the clamping claw 18, the lower end of the clamping claw 18 is driven to move towards the winding needle 19, thereby clamping the solder wire 2 between the clamping claw 18 and the winding needle 19.

[0053] In the third step, the winding drive source 23 drives the two winding claws 24 to move in opposite directions until the distance between the two winding claws 24 is greater than the thickness of the lower end of the clamping claw 18. At this time, the winding horizontal drive source 22 drives the two winding claws 24 to move towards the winding needle 19 until the winding claws 24 abut against the solder wire 2 clamped by the clamping claw 18 and the winding needle 19. The winding horizontal drive source 22 continues to drive the two winding claws 24 to move. Under the pushing action of the two winding claws 24, the solder wire 2 is initially bent into a U-shape. When the two winding claws 24 are about to move past the winding needle 19, the winding drive source 23 drives the two winding claws 24 to move in the same direction. At this time, the two winding claws squeeze the U-shaped solder wire into a circular solder wire 2 and, under the action of pre-tightening force, sleeve it onto the winding needle 19.

[0054] Fourth, under the action of the camera unit 7, the position signal is fed back to the three-axis moving module 8, and the three-axis moving module 8 drives the laser welding mechanism 6 to be located directly above the welding point position on the conveyed product.

[0055] Fifth step, the solder wire lowering drive source 20 drives the solder wire lowering guide rod 13 to move downward, thereby pushing the sliding bracket 14 downward until the sliding bracket 14 pushes the annular solder wire 2 to the designated position of the product, that is, the center of the annular solder wire 2 is coaxial with the PIN pin.

[0056] In the sixth step, the laser welding mechanism 6 operates to weld the annular solder wire 2 to the designated position, and the laser welding machine performs quality inspection on the weld joint of the product. After inspection, the product is conveyed to the next work station via the conveyor belt 10.

[0057] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A dual-station ring-shaped laser welding device, characterized in that, include: The system includes a wire feeding mechanism, a solder wire winding mechanism, and a laser welding mechanism. The solder wire winding mechanism includes a winding bracket. A first through hole is formed in the central region of the winding bracket along the height direction. A connecting rod is disposed in the first through hole. The winding bracket has second through holes on both sides along the height direction. A solder wire lowering guide rod is slidably connected in the second through hole. The lower end of the solder wire lowering guide rod abuts against a sliding bracket. The sliding bracket is hollow. The sliding bracket is sleeved on the connecting rod and slidably connected to it. The connecting rod is inserted through a support rod. A first elastic element is disposed between the upper end of the support rod and the top end of the sliding bracket. A third through hole is formed in the connecting rod along the height direction. A solder wire clamping guide rod is slidably connected in the third through hole. One end of the solder wire clamping guide rod is fixedly connected to the output end of a solder wire clamping drive source. The other end of the solder wire clamping guide rod is fixedly connected to the upper end of a clamping claw.

2. The dual-station ring-shaped laser welding device according to claim 1, characterized in that, The lower end of the connecting rod is fixedly connected to a loop needle; the loop needle includes a first loop needle part, a second loop needle part and a third loop needle part; the cross-sectional diameters of the first loop needle part, the second loop needle part and the third loop needle part gradually increase and are integrally formed; the lower end of the clamping claw is located on one side of the third loop needle part; the end of the clamping claw is provided with a solder wire groove.

3. The dual-station ring-shaped laser welding device according to claim 2, characterized in that, A connecting plate is fixedly connected to the upper ends of the two solder wire lowering guide rods; a solder wire lowering drive source is fixedly connected to the top end of the winding bracket; the output end of the solder wire lowering drive source is located above the connecting plate.

4. The dual-station circumferential laser welding apparatus according to claim 3, characterized in that, A horizontal drive source for winding is fixedly connected to one side of the winding bracket; a winding drive source is fixedly connected to the output end of the horizontal drive source for winding; a winding claw is fixedly connected to the output end of the winding drive source for winding; and two winding claws are arranged side by side.

5. The dual-station ring-shaped laser welding device according to claim 4, characterized in that, The wire feeding mechanism includes a pressure wheel and a drive wheel; the pressure wheel is driven to the output end of the wire feeding drive source; the fixed end of the wire feeding drive source is fixed to the wire feeding fixed plate; a buffer block is rotatably connected to one side of the wire feeding fixed plate; the pressure wheel is rotatably connected to the buffer block; an abutment block is fixedly connected to one side of the wire feeding fixed plate; the abutment block is located on one side of the buffer block; a second elastic element is provided between the buffer block and the abutment block.

6. The dual-station ring-shaped laser welding apparatus according to claim 5, characterized in that, A wire feeding limiting block is also fixed on one side of the wire feeding fixing plate; wire feeding nozzles are provided at both the upper and lower ends of the wire feeding limiting block; the conical ends of the two wire feeding nozzles are both facing the gap between the pressing wheel and the driving wheel; the annular ends of the wire feeding nozzles are all connected to wire feeding pipes.

7. The dual-station ring-shaped laser welding apparatus according to claim 6, characterized in that, It also includes a wire cutting mechanism; the wire cutting mechanism includes a wire cutting drive source, wire cutting claws and wire cutting blades; the fixed end of the wire cutting drive source is fixed to the wire feeding fixed plate; the output end of the wire cutting drive source is driven and connected to the wire cutting claws; one end of the two relatively parallel wire cutting claws is fixedly connected to the wire cutting blades.

8. The dual-station ring-shaped laser welding apparatus according to claim 7, characterized in that, The wire feeding fixing plate is slidably connected to the first fixed side plate via a sliding module; a laser welding mechanism is fixedly connected to one side of the first fixed side plate; one side of the winding bracket is fixedly connected to the first fixed side plate; a camera unit is fixedly connected to one side of the laser welding mechanism; a second fixed side plate is fixedly connected to one side of the laser welding mechanism; the second fixed side plate is fixedly connected to the moving end of the three-axis moving module to realize the movement of the wire feeding mechanism, the solder wire winding mechanism, and the laser welding mechanism in three dimensions.

9. The dual-station ring-shaped laser welding apparatus according to claim 8, characterized in that, It also includes a worktable; the three-axis moving module is disposed on the table surface of the worktable; a conveyor belt is disposed above the table surface of the worktable to transport incoming products and processed products.

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