Wafer rounding tool positioning clamp
By designing a wafer rounded corner tooling positioning fixture, the problems of insufficient debris handling and size adaptability in the existing technology are solved, realizing effective debris collection and multi-size adaptable clamping, and improving the operating environment and clamping stability.
Patent Information
- Application Number
- CN202423281378.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing wafer chamfering fixtures lack guiding flow and suction effects when removing debris, leading to contamination of the work surface. They also lack active clamping force and height adjustment functions, making it difficult to adapt to wafers of different sizes.
A wafer rounded corner tooling positioning fixture was designed, which includes a clamping base, mounting base, sliding plate, motor, lead screw, clamping component, positioning plate and cleaning component. The structure design of the guide channel and receiving hopper realizes the suction and treatment of debris, and the height can be adjusted by the cooperation of threaded rod and spring to adapt to the clamping of wafers of different sizes.
It enables effective collection and handling of debris during the chamfering process, adapts to the clamping requirements of wafers of different sizes, and avoids problems such as contamination of the worktable and unstable clamping.
Smart Images

Figure CN223863567U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer rounding tooling technology, specifically to a wafer rounding tooling positioning fixture. Background Technology
[0002] Wafer chamfering is an important step in semiconductor manufacturing. It involves finely cutting away the four corners of a chip to create a chamfered shape. The main purpose of wafer chamfering is to improve the chip's mechanical strength, increasing its resistance to torsion and vibration. In practical applications, wafer chamfering can also prevent chip damage and optimize soldering results. A search revealed existing technology (publication number: CN207915258U), which describes "a chamfering fixture for wafers, comprising a base, a front clamping block and a rear clamping block on the base, a transverse front groove on the upper surface of the front clamping block located at the center line of the front clamping block, and two transverse parallel rear grooves on the upper surface of the rear clamping block located at the trisection lines of the rear clamping block, with limiting strips provided in both the front and rear grooves, the limiting strips being fixedly connected to the front and rear grooves by welding, and the limiting strips being higher than the surfaces of the front and rear clamping blocks; with the above solution, the wafer is placed between the front and rear clamping blocks during wafer processing, and its position is limited by the limiting strips on the clamping blocks. The limiting strips are higher than the surface of the clamping blocks, thus facilitating the discharge of debris, and the clamping blocks have textured surfaces to prevent wafer slippage, thus avoiding scratches during wafer processing, and thereby avoiding angular dispersion and wafer wear problems."
[0003] While existing wafer chamfering fixtures achieve the desired wafer clamping effect, they still have some shortcomings: existing wafer chamfering fixtures do not have a guiding flow and suction effect when removing debris, resulting in debris from chamfering still contaminating the work surface; secondly, the front and rear clamping blocks lack active clamping force, and the clamping effect of a single limiting strip is inaccurate, easily leading to clamping instability during the chamfering process; and thirdly, there is no height adjustment function between the clamping blocks and the base, making it inconvenient to clamp wafers of different sizes. Utility Model Content
[0004] To overcome the shortcomings of existing technologies, a wafer rounding tooling positioning fixture is provided to solve the problems that existing wafer rounding fixtures do not have the effect of handling the debris from the rounding and do not have height adjustment to accommodate wafers of different sizes.
[0005] To achieve the above objectives, a wafer rounding corner tooling positioning fixture is provided, comprising: a fixture base and a mounting base. The fixture base has a flow guide groove inside, and a receiving hopper is connected to the upper opening of the flow guide groove. A cleaning component is connected to the lower opening of the flow guide groove. The mounting base is fixed to the upper side of the fixture base and has two sets of symmetrical components about the receiving hopper. A motor is fixed to the upper side of the mounting base. A sliding plate is slidably connected to the upper end face of the mounting base, and a clamping component is slidably connected to the inner side of the sliding plate. A positioning plate is slidably connected to the outer side of the clamping component.
[0006] Furthermore, the bottom of the receiving hopper is provided with a discharge hole, which is connected to the upper opening of the guide channel, and the guide channel is designed with an "eight" shaped structure.
[0007] Furthermore, the output shaft of the motor is connected to a lead screw, which horizontally passes through the slide plate and is threadedly connected to the slide plate.
[0008] Furthermore, the inner end face of the slide plate is provided with a guide groove, and the bottom of the slide plate is slidably connected to the guide rail groove opened on the upper end face of the mounting base.
[0009] Furthermore, the clamping member includes a guide block slidably connected in the guide groove, and a lifting plate is connected to the inner end of the guide block. The lifting plate has a through-hole groove inside, and a limit block is slidably connected inside the through-hole groove.
[0010] Furthermore, the clamping member also includes a clamping plate, which is vertically welded to the inner end of the lifting plate, and a buffer strip is provided on the inner end face of the clamping plate.
[0011] Furthermore, the positioning plate has a positioning groove inside, and the upper groove of the positioning groove is provided with a threaded sleeve, and a threaded rod is screwed into the threaded sleeve. At the same time, a spring is provided at the bottom of the positioning groove, and the front and rear ends of the limiting block are slidably connected in the positioning groove, and the lifting plate is located between the threaded rod and the spring.
[0012] Furthermore, the cleaning component includes a connecting pipe connected to the outer end of the guide channel, and a dust collection box is connected to the upper end of the connecting pipe. A filter plate is provided on the other side of the dust collection box, and a dust pump is connected to one side of the filter plate through a pipe.
[0013] The beneficial effects of this utility model are as follows:
[0014] 1. The system utilizes a positioning plate, positioning groove, threaded sleeve, threaded rod, and spring to facilitate the vertical movement of the threaded rod through rotation. This, in conjunction with the spring, enables the lifting plate to move downwards. This allows for adjustment of the distance between the wafer and the receiving hopper after clamping, based on the wafer size. This facilitates better collection of chamfered debris and adapts to the clamping operation of wafers of different sizes.
[0015] 2. By utilizing the receiving hopper and the guide channel, the dust pump is turned on simultaneously during chamfering. The dust pump creates a negative pressure suction effect at the discharge hole on the upper side of the guide channel through the connecting pipe, which facilitates the downward suction of all the debris generated during the chamfering process until the debris enters the dust collection box, thus achieving the effect of easy debris handling. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the front section structure of an embodiment of the present utility model.
[0017] Figure 2 This is a schematic diagram of the connection structure between the clamp seat and the receiving hopper in an embodiment of this utility model.
[0018] Figure 3 This is a three-dimensional structural diagram of the clamping component according to an embodiment of the present utility model.
[0019] Figure 4 This is an embodiment of the present utility model. Figure 1 Schematic diagram of the structure at point A in the middle.
[0020] In the diagram: 1. Fixture base; 11. Guide channel; 12. Receiving hopper; 121. Discharge hole; 2. Mounting base; 21. Motor; 211. Lead screw; 22. Slide plate; 221. Guide groove; 3. Clamping component; 31. Guide block; 32. Lifting plate; 33. Through hole groove; 34. Limiting block; 35. Clamping plate; 36. Buffer strip; 4. Positioning plate; 41. Spring; 42. Threaded rod; 43. Threaded sleeve; 44. Positioning slide groove; 5. Cleaning assembly; 51. Dust pump; 52. Filter plate; 53. Dust collection box; 54. Connecting pipe. Detailed Implementation
[0021] Reference Figures 1 to 4As shown, this utility model provides a wafer rounding corner tooling positioning fixture, including: a fixture base 1 and a mounting base 2. The fixture base 1 has a guide groove 11 inside, and a receiving hopper 12 is connected to the upper opening of the guide groove 11. A cleaning component 5 is connected to the lower opening of the guide groove 11. The bottom of the receiving hopper 12 has a discharge hole 121, which communicates with the upper opening of the guide groove 11. The guide groove 11 is designed with an "eight" shape. The mounting base 2 is fixed to the upper side of the fixture base 1, and the mounting base 2 has two sets of symmetrical about the receiving hopper 12. A motor 21 is fixed to the upper side of the mounting base 2, and a sliding plate is slidably connected to the upper surface of the mounting base 2. 22, and a clamping member 3 is slidably connected to the inner side of the slide plate 22, and a positioning plate 4 is slidably connected to the outer side of the clamping member 3. A lead screw 211 is connected to the output shaft end of the motor 21, and the lead screw 211 horizontally passes through the slide plate 22, and the lead screw 211 is threadedly connected to the slide plate 22. A guide groove 221 is opened on the inner end face of the slide plate 22, and the bottom of the slide plate 22 is slidably connected to the guide rail groove opened on the upper end face of the mounting base 2. The cleaning component 5 includes a connecting pipe 54 connected to the outer end of the guide groove 11, and a dust collection box 53 is connected to the upper end of the connecting pipe 54. A filter plate 52 is provided on the other side of the dust collection box 53, and a dust pump 51 is connected to one side of the filter plate 52 through a pipe.
[0022] In this embodiment, the fixture base 1, the mounting base 2, the clamping member 3, the positioning plate 4, and the cleaning component 5 constitute the main structure of the wafer rounding tooling positioning fixture involved in this application.
[0023] Specifically, the guide channel 11 is designed as a variable diameter channel cavity structure that is wider at the top and narrower at the bottom, so that its lower port is connected to the connecting pipe 54.
[0024] Specifically, the inner end of the lead screw 211 is rotatably connected to the outer end face of the positioning plate 4, so that when the lead screw 211 rotates, it can drive the slide plate 22 to move, and then push the clamping member 3 inward through the slide plate 22 to achieve the clamping function.
[0025] Specifically, the filter plate 52 is detachably connected to one side of the outer wall of the dust collection box 53, and the filter plate 52 is equipped with an air filter element. The filter plate 52 is connected to the inner cavity of the dust collection box 53, so that when the dust pump 51 draws impurities into the dust collection box 53, they are blocked by the filter element.
[0026] like Figure 3 and Figure 4In the clamping component 3, there is a guide block 31 slidably connected in the guide groove 221, and a lifting plate 32 is connected to the inner end of the guide block 31. The lifting plate 32 has a through hole groove 33 inside, and a limit block 34 is slidably connected inside the through hole groove 33. The clamping component 3 also includes a clamping plate 35, which is vertically welded to the inner end of the lifting plate 32. A buffer strip 36 is provided on the inner end face of the clamping plate 35. A positioning slide groove 44 is provided inside the positioning slide groove 44. A threaded sleeve 43 is provided on the upper groove of the positioning slide groove 44, and a threaded rod 42 is screwed into the threaded sleeve 43. A spring 41 is provided at the bottom of the positioning slide groove 44. The front and rear ends of the limit block 34 are slidably connected in the positioning slide groove 44, and the lifting plate 32 is located between the threaded rod 42 and the spring 41.
[0027] Specifically, the limiting block 34 and the lifting plate 32 are connected in a cross-shaped vertical connection, and the limiting block 34 protrudes on both sides of the lifting plate 32. After the limiting block 34 and the positioning groove 44 are slidably engaged, the lifting plate 32 can move in the horizontal direction. At the same time, a vertical through hole cavity is opened inside the positioning plate 4, that is, the lifting plate 32 can move up and down and left and right inside the positioning plate 4.
[0028] Specifically, the buffer bar 36 provides buffer protection and clamping for the wafer, and also creates a gap between the wafer and the clamping plate 35 to allow debris to fall.
[0029] In use, the positioning plate, positioning groove, threaded sleeve, threaded rod, and spring facilitate the up-and-down movement of the threaded rod through rotation. This, in conjunction with the spring, enables the lifting plate to move downwards. This allows for adjustment of the distance between the wafer and the receiving hopper after clamping, based on the wafer's size. The receiving hopper and guide channel allow the dust pump to be activated simultaneously during chamfering. The dust pump, through the connecting pipe, creates a negative pressure suction effect at the discharge hole on the upper side of the guide channel, thus facilitating the downward suction of all debris generated during the chamfering process until it enters the dust collection box.
[0030] The wafer rounding tooling positioning fixture of this utility model can effectively solve the problems of existing wafer rounding fixtures not being able to handle the chamfering debris and not having height adjustment to adapt to wafers of different sizes. It realizes the effect of handling the chamfering debris and having height adjustment to adapt to wafers of different sizes on the basis of existing wafer rounding tooling positioning fixture technology.
Claims
1. A wafer rounding corner tooling positioning fixture, comprising: The fixture base (1) and the mounting base (2) are characterized in that: the fixture base (1) has a guide groove (11) inside, and a receiving hopper (12) is connected to the upper opening of the guide groove (11), and a cleaning component (5) is connected to the lower opening of the guide groove (11). The mounting base (2) is fixed on the upper side of the fixture base (1), and the mounting base (2) has two sets of symmetrical about the receiving hopper (12). A motor (21) is fixed on the upper side of the mounting base (2). A sliding plate (22) is slidably connected to the upper end face of the mounting base (2), and a clamping member (3) is slidably connected to the inner side of the sliding plate (22). A positioning plate (4) is slidably connected to the outer side of the clamping member (3).
2. The wafer rounding corner tooling positioning fixture according to claim 1, characterized in that, The bottom of the receiving hopper (12) is provided with a discharge hole (121), and the discharge hole (121) is connected to the upper opening of the guide channel (11), and the guide channel (11) is designed with an "eight" shaped structure.
3. The wafer rounding corner tooling positioning fixture according to claim 1, characterized in that, The output shaft of the motor (21) is connected to a lead screw (211), which horizontally passes through the slide plate (22) and is threadedly connected to the slide plate (22).
4. A wafer rounding corner tooling positioning fixture according to claim 1, characterized in that, The inner end face of the slide plate (22) is provided with a guide groove (221), and the bottom of the slide plate (22) is slidably connected to the guide rail groove opened on the upper end face of the mounting base (2).
5. A wafer rounding corner tooling positioning fixture according to claim 1, characterized in that, The clamping member (3) includes a guide block (31) slidably connected in the guide groove (221), and a lifting plate (32) is connected to the inner end of the guide block (31). The lifting plate (32) has a through hole groove (33) inside, and a limit block (34) is slidably connected inside the through hole groove (33).
6. A wafer rounding corner tooling positioning fixture according to claim 5, characterized in that, The clamping member (3) also includes a clamping plate (35), which is vertically welded to the inner end of the lifting plate (32), and the inner end face of the clamping plate (35) is provided with a buffer strip (36).
7. A wafer rounding corner tooling positioning fixture according to claim 1, characterized in that, The positioning plate (4) has a positioning groove (44) inside, and a threaded sleeve (43) is provided on the upper side of the positioning groove (44). A threaded rod (42) is screwed into the threaded sleeve (43). A spring (41) is provided at the bottom of the positioning groove (44). The front and rear ends of the limiting block (34) are slidably connected in the positioning groove (44), and the lifting plate (32) is located between the threaded rod (42) and the spring (41).
8. A wafer rounding corner tooling positioning fixture according to claim 7, characterized in that, The cleaning component (5) includes a connecting pipe (54) connected to the outer end of the guide channel (11), and a dust collection box (53) is connected to the upper end of the connecting pipe (54). A filter plate (52) is provided on the other side of the dust collection box (53), and a dust pump (51) is connected to one side of the filter plate (52) through a pipe.
Citation Information
Patent Citations
A chamfer anchor clamps for wafer
CN207915258U