Semiconductor device measuring jig

Abstract

The utility model relates to a semiconductor device measuring jig which is applied to the field of jigs and comprises a base and a pressing plate, the base is provided with a plurality of placing grooves, the pressing plate is provided with a connecting unit used for connecting the base and the pressing plate, and a plurality of semiconductor devices abut between the pressing plate and the groove bottoms of the placing grooves respectively. The device has the technical effects that the semiconductor device is erected in the placement groove, and the base and the pressing plate are connected through the connecting unit, so that the semiconductor device is respectively abutted between the pressing plate and the groove bottom of the placement groove, and the position of the semiconductor device is fixed. The possibility of inclination of the position of the semiconductor device is reduced, the possibility of pin deformation caused by pin damage in the laminating process of a double-faced adhesive tape laminating mode is reduced, and the accuracy of a subsequent pin standing height measurement result is improved.

Description

Technical Field

[0001] This application relates to the field of fixture technology, and in particular to a semiconductor device measurement fixture. Background Technology

[0002] Semiconductor device measurement fixtures are crucial auxiliary tools in semiconductor manufacturing and testing. They are mainly used to fix devices in place, thereby facilitating the measurement of the pin standing height of semiconductor devices after the lead cutting process.

[0003] In related technologies, the height of semiconductor device pins is measured in the following way: double-sided tape is applied to a metal block, the plastic encapsulation of the semiconductor device is attached to the double-sided tape of the metal block, and then it is placed on a projector to measure the height between the pin and the heat sink of the semiconductor device, thereby realizing the measurement of the standing height of the semiconductor device pin.

[0004] The above-mentioned method of fixing the semiconductor device to the metal block with double-sided tape may cause the semiconductor device to tilt during the bonding process, increasing the measurement error. In addition, the pins may be touched by hand during the bonding process, causing pin deformation and resulting in inaccurate measurement results. Summary of the Invention

[0005] To address the issues of potential tilting of semiconductor devices during bonding with metal blocks using double-sided adhesive, and the risk of pin deformation due to hand contact during bonding, leading to inaccurate measurement results, this application provides a semiconductor device measurement fixture. The fixture comprises a base and a pressure plate. The base has several placement slots, and the pressure plate has connecting units for connecting the base and the pressure plate. Several semiconductor devices are respectively pressed against the pressure plate and the bottom of the placement slots.

[0006] In one specific implementation, the pressure plate has several pressure rods on its surface facing the base, each corresponding to a placement groove, and several semiconductor devices are respectively pressed against the pressure rods and the bottom of the placement groove.

[0007] In one specific implementation, the connecting unit includes a mounting rod that passes through a pressure plate, the end of the mounting rod facing away from the base having a hand-tightening handle, the base having a threaded groove on the surface facing the base plate that matches the mounting rod, and the end of the mounting rod facing the base being threaded into the threaded groove.

[0008] In one specific implementation, a pressure block is provided at one end of each of the pressure rods facing the base.

[0009] In one specific implementation, the pressure plate has a plurality of mounting holes, and a plurality of pressure rods pass through the plurality of mounting holes respectively. A compression spring is fitted around the outer edge of the pressure rod, and the compression spring is located between the pressure plate and the pressure block.

[0010] In one specific implementation, the end of the pressure rod away from the pressure block is provided with an anti-detachment block.

[0011] In one specific implementation, the walls of several placement slots are respectively provided with anti-foolproof slots corresponding to the pins of semiconductor devices.

[0012] In one specific implementation, several of the placement slots are arranged in a single row along the length of the base.

[0013] In one specific implementation, the pressure block is made of silicone or rubber.

[0014] In one specific implementation, there is a 0-0.5 mm gap between the wall of the placement slot and the semiconductor device.

[0015] In summary, this application has the following beneficial technical effects: Semiconductor devices are placed in a placement slot, and a connecting unit connects the base and the pressure plate, causing the semiconductor devices to be firmly pressed between the pressure plate and the bottom of the placement slot, thereby fixing the position of the semiconductor devices. This reduces the possibility of semiconductor device tilting, reduces the possibility of damage to the pins and pin deformation during double-sided adhesive bonding, and improves the accuracy of subsequent measurements of pin standing height. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0017] Figure 2 This is a schematic diagram illustrating the structure of the threaded groove in the embodiments of this application.

[0018] Figure 3 This is a schematic diagram illustrating the structure of a compression spring in the embodiments of this application.

[0019] Reference numerals: 1. Base; 2. Pressure plate; 3. Placement slot; 4. Pressure rod; 5. Mounting rod; 6. Hand-tightening handle; 7. Threaded groove; 8. Pressure block; 9. Compression spring; 10. Anti-detachment block; 11. Anti-fooling groove; 12. Semiconductor device; 13. Pin. Detailed Implementation

[0020] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0021] This application discloses a semiconductor device measurement fixture.

[0022] Reference Figure 1 , Figure 2 and Figure 3The semiconductor device 12 measuring fixture includes a base 1 and a pressure plate 2. The base 1 has several placement slots 3 arranged in a single row along the length of the base 1. This reduces the possibility of ghosting during projector measurement when multiple rows of placement slots 3 are arranged, thus reducing measurement errors. In this embodiment, eight placement slots 3 are used as an example, but the number can be adjusted according to the number of stamping cycles of the product.

[0023] Reference Figure 1 , Figure 2 and Figure 3 Several placement slots 3 are provided with anti-misplacement slots 11 on their walls, which correspond to the positions of the pins 13 of the semiconductor device 12. The shape and size of the anti-misplacement slots 11 are matched with the pins 13 of the semiconductor device 12, thereby reducing the possibility of the semiconductor device 12 being placed in reverse and improving the accuracy of the semiconductor device 12's placement.

[0024] Reference Figure 1 , Figure 2 and Figure 3 The pressure plate 2 is provided with a connecting unit for connecting the base 1 and the pressure plate 2. Several semiconductor devices 12 are respectively pressed between the pressure plate 2 and the bottom of the placement groove 3. The placement groove 3 plays a limiting role in the position of the semiconductor devices 12, and there is a gap of 0 to 0.5 mm between the groove wall of the placement groove 3 and the semiconductor devices 12, which further improves the positioning accuracy of the placement groove 3 for the semiconductor devices 12.

[0025] Therefore, the semiconductor device 12 is placed in the placement groove 3, and the base 1 and the pressure plate 2 are connected by a connecting unit, so that the semiconductor device 12 is pressed against the bottom of the pressure plate 2 and the placement groove 3, thereby fixing the position of the semiconductor device 12. This reduces the possibility of the semiconductor device 12 tilting, reduces the possibility of damage to the pin 13 and deformation of the pin 13 during the double-sided adhesive bonding process, and improves the accuracy of subsequent measurements of the standing height of the pin 13.

[0026] Reference Figure 1 and Figure 3A plurality of pressure rods 4, corresponding to the placement grooves 3, are provided on the surface of the pressure plate 2 facing the base 1. A plurality of semiconductor devices 12 are respectively pressed against the pressure rods 4 and the bottom of the placement grooves 3. A pressure block 8 is detachably connected to one end of each of the pressure rods 4 facing the base 1. The pressure block 8 is made of silicone or rubber with anti-static effect. This material can effectively prevent the generation and accumulation of static electricity, thereby reducing the damage of static electricity to the semiconductor devices 12. In addition, silicone and rubber materials have good elasticity and wear resistance, which can buffer external impact and vibration to a certain extent, reducing the possibility of damaging the semiconductor devices 12. In this embodiment, the area of ​​the end of the pressure block 8 accounts for about 1 / 4 to 1 / 5 of the end face of the semiconductor device 12. On the one hand, it can ensure that the semiconductor device 12 fits the placement groove 3 more flatly, and on the other hand, it reduces the possibility that the measurement position cannot be accurately determined during subsequent projector measurement.

[0027] Therefore, the pressure block 8 increases the contact area between the pressure rod 4 and the semiconductor device 12, which helps to distribute the pressure of the pressure rod 4 on the semiconductor device 12 more evenly, reducing the possibility of damage to the semiconductor device 12 due to excessive local pressure. By increasing the contact area, the pressure rod 4 and the pressure block 8 can better fix the semiconductor device 12 in the placement slot 3, improving the stability of the semiconductor device 12 placement.

[0028] Reference Figure 1 and Figure 3 The pressure plate 2 has several mounting holes, and in this embodiment, the number of mounting holes corresponds to the number of placement slots 3, which is set to eight. Several pressure rods 4 pass through the several mounting holes, and a compression spring 9 is sleeved on the outer edge of the pressure rod 4. The compression spring 9 is located between the pressure plate 2 and the pressure block 8. An anti-detachment block 10 is fixedly connected to the end of the pressure rod 4 away from the pressure block 8. The anti-detachment block 10 reduces the possibility of the pressure rod 4 falling out of the mounting hole when subjected to external force, which ensures that the pressure rod 4 and the pressure block 8 can be stably connected to the pressure plate 2.

[0029] Therefore, the compression spring 9 has an elastic compression amount, and the compression spring 9 can apply force to the pressure block 8 so that the pressure block 8 is always in close contact with the end face of the semiconductor device 12, reducing the possibility that the semiconductor device 12 and the placement groove 3 will not fit tightly due to the thickness error of the semiconductor device 12, thereby reducing subsequent measurement errors.

[0030] Reference Figure 1 and Figure 2The connecting unit includes a mounting rod 5 passing through the pressure plate 2. In this embodiment, there are two mounting rods 5, and eight placement slots 3 are located between the two mounting rods 5. A hand-cranked handle 6 is fixedly connected to the end of the mounting rod 5 facing away from the base 1 for easy gripping by the operator. A threaded groove 7 matching the size of the mounting rod 5 is opened on the surface of the base 1 facing the bottom plate. The end of the mounting rod 5 facing the base 1 is threaded into the threaded groove 7. Therefore, when the operator turns the hand-cranked handle 6, the pressure plate 2 and the base 1 are connected by the threaded connection, so that the pressure rod 4 on the pressure plate 2 presses the semiconductor device 12 against the bottom of the placement slot 3 and the pressure rod 4, thereby fixing the position of the semiconductor device 12.

[0031] The implementation principle of this application embodiment is as follows: Semiconductor devices 12 are sequentially placed in the placement groove 3. The operator turns the handle 6 to connect the pressure plate 2 and the base 1 through a threaded connection. At this time, the pressure rod 4 on the pressure plate 2 presses the semiconductor device 12 against the bottom of the placement groove 3 and the pressure rod 4, thereby fixing the position of the semiconductor device 12, reducing the possibility of the semiconductor device 12 tilting, reducing the possibility of damage to the pin 13 and deformation of the pin 13 during the bonding process using double-sided adhesive, and improving the accuracy of the subsequent measurement of the standing height of the pin 13.

[0032] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A semiconductor device measuring fixture, characterized in that: It includes a base (1) and a pressure plate (2). The base (1) has several placement slots (3). The pressure plate (2) has a connecting unit for connecting the base (1) and the pressure plate (2). Several semiconductor devices (12) are respectively pressed against the bottom of the pressure plate (2) and the placement slots (3).

2. The semiconductor device measuring fixture according to claim 1, characterized in that: The pressure plate (2) has several pressure rods (4) on its surface facing the base (1) that correspond to the placement groove (3) respectively, and several semiconductor devices (12) are respectively pressed against the pressure rods (4) and the bottom of the placement groove (3).

3. The semiconductor device measuring fixture according to claim 1, characterized in that: The connecting unit includes an installation rod (5) that passes through the pressure plate (2). The end of the installation rod (5) facing away from the base (1) is provided with a hand-tightening handle (6). The base (1) has a threaded groove (7) that matches the installation rod (5) on the surface facing the base plate. The end of the installation rod (5) facing the base (1) is threaded into the threaded groove (7).

4. The semiconductor device measuring fixture according to claim 2, characterized in that: Each of the aforementioned pressure rods (4) has a pressure block (8) at one end facing the base (1).

5. The semiconductor device measuring fixture according to claim 4, characterized in that: The pressure plate (2) has several mounting holes, and several pressure rods (4) pass through several mounting holes respectively. A compression spring (9) is sleeved on the outer edge of the pressure rod (4), and the compression spring (9) is located between the pressure plate (2) and the pressure block (8).

6. The semiconductor device measuring fixture according to claim 4, characterized in that: The end of the pressure rod (4) facing away from the pressure block (8) is provided with an anti-detachment block (10).

7. The semiconductor device measuring fixture according to claim 1, characterized in that: Each of the placement slots (3) has a foolproof slot (11) on its wall corresponding to the pin (13) of the semiconductor device (12).

8. The semiconductor device measuring fixture according to claim 1, characterized in that: Several of the placement slots (3) are arranged in a single row along the length of the base (1).

9. The semiconductor device measuring fixture according to claim 4, characterized in that: The pressure block (8) is made of silicone or rubber.

10. The semiconductor device measuring fixture according to claim 1, characterized in that: There is a 0-0.5 mm gap between the wall of the placement groove (3) and the semiconductor device (12).

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