PO film embossing device

Abstract

The utility model provides a PO film embossing device, and belongs to the technical field of embossing. The PO film embossing device comprises an embossing structure and a cooling structure, the embossing structure comprises a fixing frame, a lifting assembly, a buffering assembly, a mounting plate, a clamping assembly, an embossing plate and a rotating assembly, the lifting assembly is arranged in the fixing frame, the buffering assembly is connected with the lifting assembly, the mounting plate is connected with the buffering assembly, and the clamping assembly is connected with the rotating assembly. The mounting plate is arranged on one side of the fixing frame, the clamping assembly is arranged in the mounting plate and connected with the embossing plate in a clamping mode, the rotating assembly is arranged on one side of the fixing frame, the cooling structure comprises an air blower, a connecting pipe, a branch pipe, a first air outlet pipe, a second air outlet pipe, a heating wire and an air outlet cover, and the air blower is mounted on one side of the fixing frame. According to the PO film embossing device, the PO film can be conveniently and timely cooled, the embossing quality is improved, and the practicability of the device is improved.

Description

Technical Field

[0001] This application relates to the field of embossing, and more specifically, to a PO film embossing apparatus. Background Technology

[0002] PO film is a new type of agricultural film produced in Japan using high-grade olefin raw materials and other additives, employing an external spraying and drying process. It typically refers to polymers of ethylene, propylene, or higher olefins. Ethylene (PE) and propylene (PP) are the most important. During PO film production, embossing is generally required. Current embossing equipment suffers from problems such as inconvenient adjustment of embossing force and difficulty in limiting the fabric's position.

[0003] Chinese patent application CN202123379102.3 discloses a PE film embossing device, including a base plate, an L-shaped plate fixedly connected to the top of the base plate, a cylinder fixedly connected to the top of the L-shaped plate near the middle, a piston disposed near the top of the cylinder, a round rod fixedly connected to the bottom of the piston, a through hole matching the round rod being opened at the bottom of the cylinder, the bottom end of the round rod extending through the through hole to the bottom of the cylinder and fixedly connected to a thicker cylinder, a cylinder fixedly connected to the top of the L-shaped plate near the middle, an air guide pipe fixedly connected to the air outlet at the bottom of the cylinder, the bottom end of the air guide pipe penetrating the top of the L-shaped plate and communicating with the inside of the cylinder. Through a series of structures, this device has the characteristics of convenient adjustment of embossing force and convenient limiting of fabric.

[0004] The above solution also has the following shortcomings: When in use, the membrane cloth is not easy to cool down in time after being heated and embossed, which can easily cause thermal deformation of the membrane cloth, affecting the quality of embossing and thus reducing the practicality of the device. Utility Model Content

[0005] To overcome the above shortcomings, this application provides a PO film embossing device, which aims to improve the problem that the film cloth is not easy to cool in time after heating and embossing, which easily causes thermal deformation of the film cloth, affects the quality of embossing, and thus reduces the practicality of the device.

[0006] This application provides a PO film embossing device, including an embossing structure and a cooling structure. The embossing structure includes a fixed frame, a lifting assembly, a buffer assembly, a mounting plate, a snap-fit ​​assembly, an embossing plate, and a rotating assembly. The lifting assembly is disposed within the fixed frame, the buffer assembly is connected to the lifting assembly, the mounting plate is connected to the buffer assembly, the snap-fit ​​assembly is disposed within the mounting plate, and the snap-fit ​​assembly snaps into the embossing plate. The rotating assembly is disposed on one side of the fixed frame. The cooling structure includes a blower, a connecting pipe, a branch pipe, a first air outlet pipe, a second air outlet pipe, a heating wire, and an air outlet cover. The blower is installed on one side of the fixed frame. Both ends of the connecting pipe are connected to the blower and the branch pipe, respectively. One end of the branch pipe is connected to the first air outlet pipe, and the other end of the branch pipe is connected to the second air outlet pipe. The heating wire is installed inside the first air outlet pipe, and both the first and second air outlet pipes are connected to the air outlet cover at one end.

[0007] In one specific implementation, the lifting assembly includes an electric push rod and a lifting plate, the electric push rod is installed inside the fixed frame, and the lifting plate is connected to the movable end of the electric push rod.

[0008] In the above process, the electric push rod and lifting plate can be set to easily drive the embossing plate to rise and fall, which facilitates embossing.

[0009] In one specific implementation, a limit rod is provided on one side of the lifting plate, and the limit rod is slidably connected to the fixed frame.

[0010] In the above implementation process, the movement of the lifting plate can be conveniently limited by the sliding connection between the limiting rod and the fixed frame.

[0011] In one specific implementation, the buffer assembly includes a connecting rod and a first spring. The connecting rod is disposed on one side of the mounting plate and is slidably connected to the lifting plate. The two ends of the first spring are respectively connected to the lifting plate and the mounting plate.

[0012] In the above implementation process, the connection rod and the first spring can be used to facilitate buffering and protect the PO film.

[0013] In one specific implementation, the snap-fit ​​assembly includes a slide rod, a slide plate, and a second spring. The slide rod is slidably connected to the mounting plate, the slide plate is connected to the slide rod, the slide plate is slidably connected to the mounting plate, the slide plate is snap-fitted to the embossed plate, and the second spring is sleeved on the slide rod.

[0014] In the above implementation process, the embossed board can be easily disassembled and replaced by the sliding rod, sliding plate and second spring.

[0015] In one specific implementation, the rotating assembly includes a motor, a rotating shaft, and a rotating plate. The motor is mounted on one side of the fixed frame, the rotating shaft is connected to the output end of the motor, and the rotating plate is connected to the rotating shaft.

[0016] In the above process, the motor, shaft and plate make it easy to drive the PO film to rotate, which facilitates cooling during embossing and material loading and unloading, thus improving work efficiency.

[0017] In one specific implementation, a placement groove is provided on one side of the rotating plate, and the embossed plate is fitted into the placement groove.

[0018] In the above implementation process, the placement slot facilitates the placement of PO film.

[0019] In one specific implementation, support legs are provided at the four corners of the bottom of the fixed frame.

[0020] In the above implementation process, by providing support legs at the four corners of the bottom of the fixed frame, the device can be easily supported at a certain height, making it convenient for users to use.

[0021] Compared with the prior art, the beneficial effects of this application are as follows: the snap-fit ​​component allows for easy disassembly and replacement of the embossing plate; the rotating component facilitates the rotation of the PO film, enabling cooling during embossing and facilitating material loading and unloading, thus improving work efficiency; the blower directs air through the connecting pipe, branch pipe, first air outlet pipe, and air outlet hood to the PO film, while the heating wire is activated to heat the PO film; air is simultaneously blown through the second air outlet pipe and air outlet hood to the heated and embossed PO film, facilitating timely cooling of the PO film, thus improving embossing quality and enhancing the practicality of the device. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a PO film embossing device provided in an embodiment of this application;

[0024] Figure 2 A side view of a PO film embossing device provided for an embodiment of this application;

[0025] Figure 3A cross-sectional structural diagram of a PO film embossing device provided for an embodiment of this application;

[0026] Figure 4 This is a top cross-sectional view of the snap-fit ​​assembly provided in an embodiment of this application.

[0027] In the diagram: 10-embossed structure; 110-fixed frame; 120-lifting assembly; 121-electric push rod; 122-lifting plate; 130-buffer assembly; 131-connecting rod; 132-first spring; 140-mounting plate; 150-clamping assembly; 151-slide rod; 152-slide plate; 153-second spring; 160-embossed plate; 170-rotating assembly; 171-motor; 172-rotating shaft; 173-rotating plate; 180-limiting rod; 190-placement slot; 20-cooling structure; 210-blower; 220-connecting pipe; 230-branch pipe; 240-first air outlet pipe; 250-second air outlet pipe; 260-heating wire; 270-air outlet cover. Detailed Implementation

[0028] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Example

[0031] Please see Figure 1 This application provides a PO film embossing apparatus, including an embossing structure 10 and a cooling structure 20.

[0032] Specifically, the cooling structure 20 facilitates timely cooling of the PO film, improving the embossing quality and enhancing the practicality of the device.

[0033] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4The embossed structure 10 includes a fixed frame 110, a lifting assembly 120, a buffer assembly 130, a mounting plate 140, a snap-fit ​​assembly 150, an embossed plate 160, and a rotating assembly 170. The lifting assembly 120 is disposed within the fixed frame 110. The buffer assembly 130 is connected to the lifting assembly 120. The mounting plate 140 is connected to the buffer assembly 130. The snap-fit ​​assembly 150 is disposed within the mounting plate 140 and snaps into the embossed plate 160. The rotating assembly 170 is disposed on one side of the fixed frame 110.

[0034] In a specific configuration, the lifting assembly 120 includes an electric push rod 121 and a lifting plate 122. The electric push rod 121 is installed inside the fixed frame 110, and the lifting plate 122 is connected to the movable end of the electric push rod 121. The electric push rod 121 and the lifting plate 122 facilitate the lifting and lowering of the embossing plate 160, thus facilitating embossing.

[0035] In a specific configuration, a limit rod 180 is provided on one side of the lifting plate 122. The limit rod 180 is slidably connected to the fixed frame 110. The slidable connection between the limit rod 180 and the fixed frame 110 facilitates the limitation of the movement of the lifting plate 122.

[0036] In a specific configuration, the buffer assembly 130 includes a connecting rod 131 and a first spring 132. The connecting rod 131 is disposed on one side of the mounting plate 140 and is slidably connected to the lifting plate 122. The two ends of the first spring 132 are respectively connected to the lifting plate 122 and the mounting plate 140. The connection rod 131 and the first spring 132 facilitate buffering and protect the PO film.

[0037] In a specific configuration, the snap-fit ​​assembly 150 includes a slide rod 151, a sliding plate 152, and a second spring 153. The slide rod 151 is slidably connected to the mounting plate 140, the sliding plate 152 is connected to the slide rod 151, the sliding plate 152 is slidably connected to the mounting plate 140, and the sliding plate 152 is snap-fitted to the embossed plate 160. The second spring 153 is sleeved on the slide rod 151. The arrangement of the slide rod 151, the sliding plate 152, and the second spring 153 facilitates the easy disassembly and replacement of the embossed plate 160.

[0038] In a specific configuration, the rotating assembly 170 includes a motor 171, a rotating shaft 172, and a rotating plate 173. The motor 171 is mounted on one side of the fixed frame 110, the rotating shaft 172 is connected to the output end of the motor 171, and the rotating plate 173 is connected to the rotating shaft 172. The arrangement of the motor 171, rotating shaft 172, and rotating plate 173 facilitates the rotation of the PO film, enabling cooling during embossing and facilitating material loading and unloading, thereby improving work efficiency.

[0039] In a specific configuration, a placement groove 190 is provided on one side of the rotating plate 173, and the embossed plate 160 is attached to the placement groove 190. The placement groove 190 facilitates the placement of PO film.

[0040] In a specific configuration, support legs are provided at the four corners of the bottom of the fixed frame 110. By providing support legs at the four corners of the bottom of the fixed frame 110, the device can be easily supported at a certain height, making it convenient for users to use.

[0041] Please see Figure 1 , Figure 2 and Figure 3 The cooling structure 20 includes a blower 210, a connecting pipe 220, a branch pipe 230, a first air outlet pipe 240, a second air outlet pipe 250, a heating wire 260, and an air outlet cover 270. The blower 210 is installed on one side of the fixed frame 110. The two ends of the connecting pipe 220 are respectively connected to the blower 210 and the branch pipe 230. One end of the branch pipe 230 is connected to the first air outlet pipe 240, and the other end of the branch pipe 230 is connected to the second air outlet pipe 250. The heating wire 260 is installed in the first air outlet pipe 240. One end of both the first air outlet pipe 240 and the second air outlet pipe 250 is connected to the air outlet cover 270.

[0042] The working principle of this PO film embossing device is as follows: When using the PO film embossing device, the PO film is placed in the placement groove 190. The blower 210 is turned on, blowing air through the connecting pipe 220, branch pipe 230, first air outlet pipe 240, and air outlet cover 270 onto the PO film. Simultaneously, the heating wire 260 is turned on to heat the PO film. The electric push rod 121 drives the lifting plate 122 and embossing plate 160 to move, facilitating embossing. The connecting rod 131 and the first spring 132 provide cushioning and protection for the PO film. The sliding rod 15... 1. The sliding plate 152 and the second spring 153 facilitate the disassembly and replacement of the embossing plate 160. After embossing, the motor 171 drives the rotating shaft 172 and the rotating plate 173 to rotate, which facilitates the rotation of the heated embossed PO film. At this time, air is blown onto the heated embossed PO film through the second air outlet 250 and the air outlet hood 270, which facilitates timely cooling of the PO film, improves the embossing quality, and enhances the practicality of the device. At the same time, the other end of the rotating plate 173 is used for the next embossing, which facilitates cooling during embossing and also facilitates loading and unloading, thus improving work efficiency.

[0043] It should be noted that the specific models and specifications of the electric push rod 121, motor 171, blower 210 and heating wire 260 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0044] The power supply and operating principle of the electric actuator 121, motor 171, blower 210 and heating wire 260 are clear to those skilled in the art and will not be described in detail here.

[0045] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A PO film embossing device, characterized in that, include An embossed structure (10) includes a fixed frame (110), a lifting assembly (120), a buffer assembly (130), a mounting plate (140), a snap-fit ​​assembly (150), an embossed plate (160), and a rotating assembly (170). The lifting assembly (120) is disposed within the fixed frame (110), the buffer assembly (130) is connected to the lifting assembly (120), the mounting plate (140) is connected to the buffer assembly (130), the snap-fit ​​assembly (150) is disposed within the mounting plate (140), and the snap-fit ​​assembly (150) snaps into the embossed plate (160). The rotating assembly (170) is disposed on one side of the fixed frame (110). The cooling structure (20) includes a blower (210), a connecting pipe (220), a branch pipe (230), a first air outlet pipe (240), a second air outlet pipe (250), a heating wire (260), and an air outlet cover (270). The blower (210) is installed on one side of the fixed frame (110). The two ends of the connecting pipe (220) are connected to the blower (210) and the branch pipe (230) respectively. One end of the branch pipe (230) is connected to the first air outlet pipe (240), and the other end of the branch pipe (230) is connected to the second air outlet pipe (250). The heating wire (260) is installed inside the first air outlet pipe (240). One end of both the first air outlet pipe (240) and the second air outlet pipe (250) is connected to the air outlet cover (270).

2. The PO film embossing device according to claim 1, characterized in that, The lifting assembly (120) includes an electric push rod (121) and a lifting plate (122). The electric push rod (121) is installed inside the fixed frame (110), and the lifting plate (122) is connected to the movable end of the electric push rod (121).

3. The PO film embossing device according to claim 2, characterized in that, A limit rod (180) is provided on one side of the lifting plate (122), and the limit rod (180) is slidably connected to the fixed frame (110).

4. The PO film embossing device according to claim 2, characterized in that, The buffer assembly (130) includes a connecting rod (131) and a first spring (132). The connecting rod (131) is disposed on one side of the mounting plate (140) and is slidably connected to the lifting plate (122). The two ends of the first spring (132) are respectively connected to the lifting plate (122) and the mounting plate (140).

5. The PO film embossing device according to claim 1, characterized in that, The snap-fit ​​assembly (150) includes a slide rod (151), a slide plate (152), and a second spring (153). The slide rod (151) is slidably connected to the mounting plate (140), the slide plate (152) is connected to the slide rod (151), the slide plate (152) is slidably connected to the mounting plate (140), the slide plate (152) is snap-fitted to the embossed plate (160), and the second spring (153) is sleeved on the slide rod (151).

6. The PO film embossing device according to claim 1, characterized in that, The rotating assembly (170) includes a motor (171), a rotating shaft (172), and a rotating plate (173). The motor (171) is mounted on one side of the fixed frame (110), the rotating shaft (172) is connected to the output end of the motor (171), and the rotating plate (173) is connected to the rotating shaft (172).

7. The PO film embossing device according to claim 6, characterized in that, The rotating plate (173) has a placement groove (190) on one side, and the embossed plate (160) is attached to the placement groove (190).

8. The PO film embossing device according to claim 1, characterized in that, Support legs are provided at the four corners of the bottom of the fixed frame (110).

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