Detection workbench of wafer arranging machine detection device

Abstract

The utility model discloses a detection workbench of a wafer arranging machine detection device, and belongs to the technical field of wafer detection workbenches. The device mainly comprises a support, a guide rail and a top frame are installed on the support, a sliding plate is installed on the guide rail in a sliding mode, a detection head and a feeding mechanism are installed at the side end of the top frame, the feeding mechanism is installed on the sliding plate, the feeding mechanism is provided with a first air cylinder installed on the sliding plate and a supporting plate installed at the output end of the first air cylinder, and a first suction cup and a workbench are installed on the supporting plate. The workbench is arranged right below the detection head, the bottom of the workbench is provided with an underframe for supporting, the workbench is provided with a guide groove and a positioning mechanism, the positioning mechanism is installed on the underframe, the positioning mechanism comprises a sliding rail fixed on the underframe and two groups of clamping plates installed on the sliding rail in a sliding manner, and the clamping plates are provided with limiting columns matched with the guide groove. According to the detection workbench of the wafer arranging machine detection device, the problem that wafers of different sizes cannot be completely placed in the detection range of the detection head is solved.

Description

Technical Field

[0001] This application relates to the field of wafer inspection platform technology, specifically an inspection platform for a wafer stacking machine inspection device. Background Technology

[0002] The main function of the wafer stacking machine inspection device is to detect the position, neatness, and presence of defects of the wafers during the stacking process. In the wafer inspection device, the wafers are mainly supported by the inspection table so that the inspection device can inspect the wafers.

[0003] For example, the patent with publication number CN220819923U discloses a wafer inspection device. The inspection device includes a fixed base and a support frame installed on the side of the fixed base. An inspection head is installed on the support frame, and an inspection platform is installed at the center of the fixed base, with the inspection platform located directly below the inspection head.

[0004] In the aforementioned disclosed patent, the testing device mainly uses a testing stage to hold the wafer and performs testing on the wafer under the action of the testing head. However, in actual use, the wafers come in different sizes to adapt to different application scenarios. When testing wafers of different sizes, a limiting block is provided at the edge of the testing stage (as in the aforementioned patent). Figure 1 As shown in the figure, the wafer cannot be accurately aligned on the inspection stage, and the wafer cannot be completely placed within the inspection range of the inspection head. Therefore, it is necessary to provide an inspection stage of the wafer stacking machine inspection device to solve the above problems.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore may include information that does not constitute prior art. Utility Model Content

[0006] Based on the aforementioned problems in the existing technology, the problem to be solved by this application is to provide a testing table for a wafer stacking machine testing device, which solves the problem that wafers of different sizes cannot be completely placed within the testing range of the testing head.

[0007] To achieve the above objectives, this application provides the following technical solution: a testing table for a wafer stacking machine testing device, comprising a support, on which a guide rail and a top frame are mounted, a sliding plate is slidably mounted on the guide rail, a testing head is mounted on the side end of the top frame, a feeding mechanism is mounted on the sliding plate, the feeding mechanism has a first cylinder mounted on the sliding plate and a support plate mounted on the output end of the first cylinder, a first suction cup is mounted on the support plate, a workbench is located directly below the testing head, a base frame is provided at the bottom of the workbench for support, a guide groove is provided on the workbench, a positioning mechanism is mounted on the base frame, the positioning mechanism includes a slide rail fixed to the base frame, two sets of clamping plates slidably mounted on the slide rail, the clamping plates are provided with limiting posts adapted to the guide groove, and the two sets of clamping plates are adapted to move closer or further apart under the action of external force to position the wafer.

[0008] Preferably, a transmission unit is installed on the base frame. The transmission unit consists of transmission wheels with bearings installed at both ends below the base frame and belts disposed on two sets of transmission wheels. The two sets of clamps are respectively fixedly connected to the front and rear ends of the belts.

[0009] Preferably, the limiting posts are made of silicone material and arranged in an arc shape.

[0010] Preferably, a buffer mechanism is also installed on the base frame. The buffer mechanism includes a guide post fixed to the bottom of the base frame and a guide plate slidably installed on the guide post. A second cylinder is also installed on the side of the base frame, and the output end of the second cylinder is connected to the guide plate.

[0011] Preferably, a second suction cup is mounted on a bearing on the guide plate, and a first motor is mounted on the bottom of the guide plate, with the output end of the first motor connected to the second suction cup.

[0012] Preferably, the guide rail has a screw drive structure inside, and the slide plate is connected to the screw drive structure.

[0013] The beneficial effects of this application are as follows: The inspection table of the wafer stacking machine inspection device provided by this application uses a second cylinder to drive a second suction cup on a guide plate, so that the wafer is suitable for slowly approaching the table and to prevent the wafer from falling onto the table and being damaged due to inertia. The second suction cup is suitable for rotating on the guide plate to adjust the orientation of the wafer. At the same time, through the cooperation of the belt and two sets of transmission wheels, the two sets of clamping plates are driven to move closer or further apart and to align the wafers on the table, thereby achieving the purpose of aligning wafers of different sizes and solving the problem that wafers of different sizes cannot be completely placed within the inspection range of the inspection head.

[0014] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is an overall schematic diagram of the inspection platform of a wafer stacking machine inspection device in this application;

[0017] Figure 2 for Figure 1 A cross-sectional view of the central testing station;

[0018] Figure 3 for Figure 2 Schematic diagram of the central adjustment mechanism;

[0019] The following are the labeling elements in the figure:

[0020] 1. Support frame; 11. Guide rail; 12. Top frame; 121. Detection head; 13. Slide plate; 2. Feeding mechanism; 22. First cylinder; 23. First suction cup; 3. Workbench; 31. Guide groove; 32. Base frame; 4. Buffer mechanism; 41. Guide plate; 42. Guide column; 43. Second cylinder; 44. Second suction cup; 45. First motor; 5. Positioning mechanism; 51. Second motor; 52. Transmission unit; 521. Belt; 522. Transmission wheel; 53. Clamping plate; 531. Limiting column; 54. Slide rail. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0023] like Figure 1As shown, this application provides a testing table for a wafer stacking machine testing device, including a support 1 and a guide rail 11 mounted on the support 1. A slide plate 13 is slidably mounted on the guide rail 11. A screw drive structure is provided inside the guide rail 11, and the slide plate 13 is connected to the screw drive structure. The screw drive structure is prior art, and its specific structure and principle can be found in the prior art.

[0024] A loading mechanism 2 is installed on the slide plate 13. The loading mechanism 2 includes a first cylinder 22 installed on the slide plate 13, and a tray (not shown in the figure) is connected to the output end of the first cylinder 22. A first suction cup 23 is installed on the tray. The first suction cup 23 is suitable for adsorbing the wafer. The slide plate 13 is suitable for moving along the guide rail 11 under the drive of the screw drive structure, and driving the wafer on the first suction cup 23 to move synchronously.

[0025] Meanwhile, a top frame 12 is installed on the support 1. A test head 121 for testing wafers is installed on the side end of the top frame 12. A workbench 3 for carrying wafers is provided below the test head 121. A base frame 32 for supporting the workbench 3 is installed at the bottom of the workbench 3.

[0026] like Figure 2 As shown, a buffer mechanism 4 is provided below the base 32 to reduce the impact force of the wafer falling onto the worktable 3, in conjunction with the reference. Figure 3 As shown, the buffer mechanism 4 includes a guide post 42 fixed below the base frame 32 and a guide plate 41 slidably mounted on the guide post 42. A second cylinder 43 is fixed on the inner side wall of the base frame 32. The output end of the second cylinder 43 is connected to the guide plate 41, and the second cylinder 43 is adapted to drive the guide plate 41 to slide along the guide post 42.

[0027] Meanwhile, a second suction cup 44 for adsorbing and lifting the wafer is installed in the bearing of the center section of the guide plate 41, and a first motor 45 is provided at the bottom of the guide plate 41. The output end of the first motor 45 is connected to the second suction cup 44 to drive the second suction cup 44 to rotate.

[0028] When the wafer needs to be placed on the workbench 3, the first suction cup 23 on the feeding mechanism 2 first adsorbs the wafer onto it, and the drive slide plate 13 of the screw drive structure moves, driving the wafer on the first suction cup 23 to move synchronously. After the first suction cup 23 is directly above the workbench 3, the first cylinder 22 drives the guide plate 41 and drives the first suction cup 23 to move closer to the workbench 3.

[0029] Then, the second cylinder 43 drives the guide plate 41 to move along the guide post 42, and indirectly drives the second suction cup 44 to approach the wafer on the first suction cup 23. After the second suction cup 44 comes into contact with the wafer, the guide plate 41 stops moving, the second suction cup 44 begins to adsorb, and the first suction cup 23 stops adsorbing the wafer, thereby transferring the wafer to the second suction cup 44. Then, the first motor 45 drives the second suction cup 44 to rotate so that the wafer rotates synchronously, thereby achieving the purpose of adjusting the orientation of the wafer.

[0030] After the wafer on the second suction cup 44 is turned, the second cylinder 43 continues to operate, driving the guide plate 41 to move downward, and indirectly driving the wafer on the second suction cup 44 to move closer to the table surface 3. When the wafer touches the table 3, the second suction cup 44 stops adsorbing the wafer, so that the wafer is placed on the table 3, and the purpose of preventing the wafer from falling onto the table 3 and being damaged due to inertia is achieved.

[0031] Continue to refer to Figure 2 As shown, a positioning mechanism 5 is provided on the side of the buffer mechanism 4. The positioning mechanism 5 is mounted on the base frame 32. The positioning mechanism 5 is used to position the wafer on the workbench 3. The positioning mechanism 5 includes a transmission unit 52 provided at the bottom of the workbench 3. The transmission unit 52 consists of transmission wheels 522 with bearings mounted at both ends below the base frame 32, and belts 521 provided on the two sets of transmission wheels 522. A second motor 51 is connected to the transmission wheel 522 on the left side of the transmission unit 52. The second motor 51 is adapted to drive one set of transmission wheels 522 to rotate and indirectly drive the belt 521 to move, thereby driving the other set of transmission wheels 522 to rotate under the transmission action of the belt 521, so that the belt 521 can continuously transmit.

[0032] A slide rail 54 is fixed on the top of the base frame 32, and clamping plates 53 are symmetrically installed at both ends of the slide rail 54. At least two sets of limiting posts 531 are installed on the clamping plates 53. The limiting posts 531 are made of silicone material, and the limiting posts 531 on each set of clamping plates 53 are arranged in an arc shape. The workbench 3 is provided with guide grooves 31 corresponding to the limiting posts 531. As the two sets of clamping plates 53 move closer or further away from each other, the limiting posts 531 move synchronously along the guide grooves 31 and move closer to the center of the workbench 3.

[0033] At the same time, the bottoms of the two sets of clamps 53 are fixedly connected to the front and rear ends of the belt 521 respectively (e.g. Figure 2 As shown in the figure, during the transmission process of belt 521, since the front and rear sides of belt 521 move in opposite directions, the two sets of clamps 53 are adapted to move closer or further apart from each other when driven by belt 521.

[0034] After the wafer is placed on the workbench 3, the second motor 51 drives the transmission wheel 522 connected to it to rotate, and with the cooperation of another set of transmission wheels 522, drives the belt 521 to continuously transmit power, so that the two sets of clamping plates 53 move closer to each other, and indirectly drive the limiting post 531 on the clamping plate 53 to move along the guide groove 31, so that the limiting post 531 moves closer to the center of the workbench 3 and abuts against the wafer, so as to align the wafer at the center of the workbench 3, and achieve the purpose of aligning wafers of different sizes, and prevent the wafer position from exceeding the detection range of the detection head 121. After the wafer alignment is completed, the detection head 121 operates and detects the wafer on the workbench 3.

[0035] In summary, by driving the second suction cup 44 on the guide plate 41 with the second cylinder 43, the wafer is made to slowly approach the worktable 3, thus preventing the wafer from being damaged due to inertia when it falls onto the worktable 3. The second suction cup 44 is adapted to rotate on the guide plate 41 to adjust the orientation of the wafer. At the same time, through the cooperation of the belt 521 and the two sets of transmission wheels 522, the two sets of clamping plates 53 are driven to move closer or further apart, and to align the wafer on the worktable 3. This achieves the purpose of aligning wafers of different sizes and solves the problem that wafers of different sizes cannot be completely placed within the detection range of the detection head 121.

[0036] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations are possible for those skilled in the art. Any improvements and modifications made within the spirit and principles of this application, without departing from its principles, should also be considered within the scope of protection of this application.

Claims

1. A testing table for a wafer stacking machine testing device, characterized in that: The testing station includes: A bracket (1) is provided, on which a guide rail (11) and a top frame (12) are mounted. A sliding plate (13) is slidably mounted on the guide rail (11), and a detection head (121) is mounted on the side end of the top frame (12). The feeding mechanism (2) is mounted on the slide plate (13). The feeding mechanism (2) has a first cylinder (22) mounted on the slide plate (13) and a support plate mounted on the output end of the first cylinder (22). A first suction cup (23) is mounted on the support plate. The workbench (3) is located directly below the detection head (121). The bottom of the workbench (3) is provided with a base frame (32) for support. The workbench (3) is provided with a guide groove (31). A positioning mechanism (5) is mounted on the base frame (32), and the positioning mechanism (5) includes: A slide rail (54) is fixed to the base frame (32). Two sets of clamping plates (53) are slidably mounted on the slide rail (54), and the clamping plates (53) are provided with limiting posts (531) that are adapted to the guide groove (31); Wherein: the two sets of clamps (53) are adapted to move closer or further apart under the action of external force in order to position the wafer.

2. The inspection table of the wafer stacking machine inspection device according to claim 1, characterized in that: The base frame (32) is equipped with a transmission unit (52). The transmission unit (52) consists of transmission wheels (522) with bearings installed at both ends below the base frame (32) and belts (521) set on the two sets of transmission wheels (522). The two sets of clamps (53) are fixedly connected to the front and rear ends of the belts (521) respectively.

3. The inspection table of the wafer stacking machine inspection device according to claim 2, characterized in that: The limiting posts (531) are made of silicone material and arranged in an arc shape.

4. The inspection table of the wafer stacking machine inspection device according to claim 3, characterized in that: A buffer mechanism (4) is also installed on the base frame (32). The buffer mechanism (4) includes a guide post (42) fixed below the base frame (32) and a guide plate (41) slidably installed on the guide post (42). A second cylinder (43) is also installed on the side of the base frame (32). The output end of the second cylinder (43) is connected to the guide plate (41).

5. The inspection table of the wafer stacking machine inspection device according to claim 4, characterized in that: A second suction cup (44) is mounted on the bearing of the guide plate (41), and a first motor (45) is mounted on the bottom of the guide plate (41). The output end of the first motor (45) is connected to the second suction cup (44).

6. The inspection table of the wafer stacking machine inspection device according to claim 1, characterized in that: The guide rail (11) is equipped with a screw drive structure inside, and the slide plate (13) is connected to the screw drive structure.

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