Rectangular wafer electron beam evaporation clamp
By designing a fixture adapted to rectangular wafers, the problems of wafer displacement and tilting during the deposition process were solved, achieving efficient and stable coating operations and multi-wafer adaptation, while protecting the wafer surface.
Patent Information
- Application Number
- CN202520524005.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-24
AI Technical Summary
Existing fixture devices cannot effectively fix rectangular wafers, causing the wafers to shift or tilt during deposition, affecting film uniformity and process stability. At the same time, they have low loading and unloading efficiency and lack modular design. When adapting to wafers of different sizes, the entire fixture needs to be replaced, which can easily damage the wafer surface.
A rectangular wafer electron beam evaporation fixture was designed, including a mounting substrate, a limiting baffle, and a connecting block. The limiting baffle is provided with a limiting slot that matches the rectangular wafer. It can be detachably connected by fasteners. Combined with an elastic pin and a hand grip, it can achieve stable fixing and convenient disassembly of the wafer.
It ensures that the wafer does not shift during the evaporation process, improving the accuracy and efficiency of the coating. It supports the simultaneous operation of multiple wafers and can be adapted to wafers of different sizes by changing the limit baffle, avoiding the need to replace the entire fixture and protecting the wafer surface.
Smart Images
Figure CN223866747U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of integrated optical modulator manufacturing technology, specifically to a fixture for electron beam evaporation process of rectangular wafers. Background Technology
[0002] Electron beam evaporation is an important thin-film deposition technique in the manufacturing of optoelectronic devices, widely used in integrated optical modulators. Traditionally, wafers are typically designed to be circular. However, with the development of optoelectronic devices, the application of rectangular wafers is gradually increasing. Existing fixtures cannot effectively hold rectangular wafers, easily leading to wafer displacement or tilting during deposition, affecting film uniformity and process stability. Furthermore, existing fixtures have low loading and unloading efficiency, with most only supporting single-wafer loading; they also lack modular design, requiring replacement of the entire fixture when adapting to wafers of different sizes; additionally, the ejection mechanism of existing fixtures is prone to damaging the wafer surface. Therefore, developing a fixture that can stably hold rectangular wafers and is easy to operate is of significant practical importance. Utility Model Content
[0003] The technical problem to be solved by this invention is that traditional fixtures cannot be adapted to rectangular wafers, resulting in wafer displacement, uneven coating, and low efficiency. To this end, this invention proposes a fixture that can be adapted to electron beam evaporation of rectangular wafers.
[0004] To address the aforementioned technical problems, this utility model provides the following technical solution:
[0005] A rectangular wafer electron beam evaporation fixture includes: a mounting substrate having a through hole in its central region; a limiting baffle located on one side of the mounting substrate, the limiting baffle having at least one limiting slot matching the shape of the rectangular wafer; a connecting block located on the side of the limiting baffle away from the mounting substrate, the connecting block, the limiting baffle, and the mounting substrate being detachably and fixedly connected by fasteners passing through them; a portion of the connecting block is located above the limiting slot of the limiting baffle to restrict the position of the rectangular wafer.
[0006] In some embodiments of this utility model, an elastic ejector pin is also included on the side of the mounting substrate away from the limiting baffle. The elastic ejector pin is made of elastic metal material. In the initial state, a portion of the elastic ejector pin is located in the through hole of the mounting substrate. When the elastic ejector pin is triggered, it can move towards the side closer to the limiting baffle to eject the rectangular wafer.
[0007] In some embodiments of this utility model, the elastic ejector pin includes an ejector pin portion, a connecting portion, and an elastic portion located between the two; wherein, the elastic ejector pin is connected to the mounting base plate by a fastening screw passing through the connecting portion, the free end of the ejector pin portion is located in the through hole of the mounting base plate, and the elastic portion is constructed in the form of a spring.
[0008] In some embodiments of this utility model, the free end of the ejector pin is constructed as an outwardly convex arc shape, and its surface is covered with a conductive rubber layer.
[0009] In some embodiments of this utility model, a hand grip bar is also included that can be detachably installed on the side of the mounting base away from the limiting baffle.
[0010] In some embodiments of this utility model, a limiting slot is formed on the limiting baffle, and the limiting slot is adapted to match two rectangular wafers.
[0011] In some embodiments of this utility model, a clearance notch is provided in a portion of the limiting slot.
[0012] In some embodiments of this utility model, the connecting block includes a connecting body that abuts against the limiting baffle and a blocking part that extends to the upper region of the limiting slot.
[0013] In some embodiments of this utility model, at least two sets of connecting pressure blocks are provided, and each set of connecting pressure blocks is provided with two of the pressure-blocking parts.
[0014] In some embodiments of this utility model, the mounting base plate and the limiting baffle are constructed as circular plates, wherein the mounting base plate is provided with a plurality of ventilation holes in the area matching the limiting slot.
[0015] The technical solution of this utility model has the following technical advantages over the prior art:
[0016] The rectangular wafer electron beam evaporation fixture provided by this utility model includes a mounting substrate and a limiting baffle. The limiting baffle uses limiting slots that match the shape of the rectangular wafer to accurately position the wafer, ensuring that the wafer does not shift during evaporation and guaranteeing the accuracy of the evaporation process. Furthermore, different limiting baffles can be used to accommodate rectangular wafers of different shapes and sizes without requiring a complete replacement of the fixture. Additionally, through holes on the evaporation mounting substrate allow for easy removal of the rectangular wafer after coating. The installation and disassembly process of the fixture is simple and convenient, improving the evaporation coating efficiency of rectangular wafers. Attached Figure Description
[0017] The preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, which will help to understand the purpose and advantages of this utility model, wherein:
[0018] Figure 1 A schematic diagram of a specific embodiment of the rectangular wafer electron beam evaporation fixture provided by this utility model;
[0019] Figure 2 An exploded view of a specific embodiment of the rectangular wafer electron beam evaporation fixture provided by this utility model;
[0020] Figure 3 A cross-sectional view of a specific embodiment of the rectangular wafer electron beam evaporation fixture provided by this utility model. Detailed Implementation
[0021] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0024] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0025] like Figures 1-3 The image shows a specific embodiment of the rectangular wafer electron beam evaporation fixture (hereinafter referred to as the fixture) provided by this utility model. The fixture is used to stably and accurately fix the rectangular wafer during the electron beam evaporation process, while facilitating the installation and removal of the wafer, thereby improving the efficiency and quality of the electron coating process.
[0026] like Figure 1 As shown, the fixture includes components such as a mounting base plate 10, a limiting baffle 20, a connecting pressure block 30, and an elastic ejector pin 40. The mounting base plate 10 has a through hole 11 in its central region. The limiting baffle 20 is located on one side of the mounting base plate 10 and has at least one limiting slot 21 that matches the shape of the rectangular wafer. The connecting pressure block 30 is located on the side of the limiting baffle 20 away from the mounting base plate 10. A portion of the connecting pressure block 30 is located above the limiting slot 21 of the limiting baffle 20 to restrict the position of the rectangular wafer. The connecting pressure block 30, the limiting baffle 20, and the mounting base plate 10 are detachably and securely connected by fasteners 50 passing through them, facilitating the assembly and maintenance of the fixture. When it is necessary to replace the limiting baffle 20 or the connecting pressure block 30 with different specifications, the operation can be performed quickly and conveniently.
[0027] The aforementioned fixture, employing a limiting slot 21 that matches the shape of the rectangular wafer, can precisely position the rectangular wafer, ensuring that the wafer does not shift during evaporation and guaranteeing the accuracy of the evaporation process. Furthermore, different limiting baffles 20 can be used to accommodate rectangular wafers of different shapes and sizes, eliminating the need to replace the entire fixture. Additionally, the through-hole 11 on the evaporation mounting substrate 10 allows for convenient removal of the rectangular wafer after coating is completed.
[0028] Specifically, in one alternative implementation, such as Figure 1 As shown, the mounting substrate 10 and the limiting baffle 20 are constructed as circular plates to match the mounting space of the electron beam evaporation chamber. The mounting substrate 10 has several ventilation holes 12 in the area matching the limiting slot 21 to connect to the chamber vacuum system for vacuuming and adsorbing the wafer before coating.
[0029] Specifically, in one alternative implementation, such as Figure 1 As shown, the limiting baffle 20 has a limiting slot 21, which is adapted to match two rectangular wafers. By using a single limiting slot 21 to match two rectangular wafers, the space utilization of the fixture is improved, allowing for simultaneous evaporation of multiple wafers and increasing work efficiency. In other alternative embodiments, the limiting baffle 20 may have two or more limiting slots 21, with each limiting slot 21 matching one rectangular wafer.
[0030] Specifically, in one optional embodiment, a portion of the limiting slot 21 is provided with an avoidance notch 22. The avoidance notch 22 facilitates the installation and removal of rectangular wafers, preventing collisions and damage caused by insufficient operating space when placing or removing wafers. It also helps the wafer to detach smoothly from the limiting slot 21 when the elastic ejector pin 40 ejects the wafer.
[0031] Specifically, in one alternative implementation, such as Figure 1 , Figure 2 As shown, the fixture also includes an elastic ejector pin 40 mounted on the side of the mounting substrate 10 away from the limiting baffle 20. The elastic ejector pin 40 is made of elastic metal material and has good elastic recovery capability. In the initial state, a portion of the elastic ejector pin 40 is located within the through hole 11 of the mounting substrate 10, and does not contact the rectangular wafer located in the limiting slot 21, thus avoiding the elastic ejector pin 40 affecting the positioning of the rectangular wafer. When the coating is completed, by triggering the elastic ejector pin 40, it can be moved towards the side closer to the limiting baffle 20 to eject the rectangular wafer, making the operation simple and convenient.
[0032] In one alternative implementation, such as Figure 3 As shown, the elastic ejector pin 40 includes an ejector pin portion 41, a connecting portion 42, and an elastic portion 43 located between the two, all three being integrally formed from elastic metal wire. The connecting portion 42 is formed into a ring by metal wire to facilitate fixing with a fastening screw 44. The elastic ejector pin 40 is connected to the mounting base plate 10 by a fastening screw 44 passing through the connecting portion 42. The elastic portion 43 is constructed in the form of a spring, extending spirally in a direction parallel to the surface of the mounting base plate 10. The ejector pin portion 41 is constructed in the shape of a slender needle, extending from the end of the elastic portion 43 toward the direction of the limiting baffle 20, and its free end is located in the through hole 11 of the mounting base plate 10.
[0033] More specifically, such as Figure 3 As shown, the free end of the ejector pin 41 is constructed in an outwardly convex arc shape, and its surface is covered with a conductive rubber layer. The outwardly convex arc design of the free end of the ejector pin 41 allows for better contact with the edge of the rectangular wafer, preventing damage to the wafer during ejection. The conductive rubber layer on the surface increases the friction between the ejector pin and the wafer, ensuring the wafer is stably ejected during the ejection process. Furthermore, the conductive rubber layer provides conductivity, helping to release the charge on the wafer during electron beam evaporation, preventing charge accumulation from affecting the evaporation process, and ensuring the stability and reliability of the evaporation process.
[0034] Specifically, in one alternative implementation, such as Figure 2 , Figure 3As shown, the fixture also includes a detachable handgrip 60 mounted on the side of the mounting substrate 10 away from the limiting baffle 20. The handgrip 60 facilitates the operator's grip and movement of the fixture. When installing or removing wafers and placing the fixture into the electron beam evaporation equipment, the operator can operate the fixture more stably and conveniently using the handgrip 60, improving work efficiency and reducing potential contamination or damage from direct contact with other parts of the fixture. The detachable design allows the handgrip 60 to be removed when not in use, facilitating the storage and organization of the fixture and saving space.
[0035] Specifically, in one alternative implementation, such as Figure 2 As shown, the connecting pressure block 30 includes a connecting body 31 that abuts against the limiting baffle 20 and a blocking part 32 that extends into the upper region of the limiting slot 21. The blocking part 32 of the connecting pressure block 30 is located in the upper region of the limiting slot 21, which can effectively limit the position of the rectangular wafer, prevent the wafer from moving in the vertical direction, and further enhance the fixing effect on the wafer.
[0036] More specifically, such as Figure 1 , Figure 2 As shown, the connecting pressure block 30 is provided in at least two sets, and each set of connecting pressure block 30 is provided with two pressure-blocking parts 32, which can hold the wafer from multiple positions, making the holding force distribution more uniform, avoiding the problem of wafer deformation or insecure fixation due to excessive or insufficient local pressure, and ensuring the stability of the wafer throughout the evaporation process. Figure 1 , Figure 2 As shown, four sets of connecting pressure blocks 30 are provided. Two sets of connecting pressure blocks 30 are provided for each rectangular wafer. One connecting pressure block 30 is located in the area of the first side of the rectangular wafer, and the other connecting pressure block 30 is located in the area of the second side adjacent to the first side of the rectangular wafer. Each connecting pressure block 30 is provided with two blocking parts 32. The two blocking parts 32 can be extended in the same direction or extended in a vertical direction, so that the connecting pressure blocks 30 can press the wafer from multiple positions.
[0037] Specifically, such as Figure 1 , Figure 2 As shown, an elastic buffer pad 70 is provided in the connection area between the connecting pressure block 30 and the limiting baffle 20. By providing the elastic buffer pad 70, it can be ensured that multiple connecting pressure blocks 30 press the wafer evenly.
[0038] When using the above-mentioned fixture to mount the wafer, first position the limiting baffle 20 on the mounting substrate 10, then place the wafer into the limiting slot 21 provided in the limiting baffle 20 to initially fix it; install multiple connecting pressure blocks 30 in sequence, rotate the adjusting screw until the connecting pressure block 30 slightly contacts the edge of the wafer, and continue to tighten the screw until the elastic buffer pad 70 is compressed by 1 / 3 of its thickness to ensure uniform clamping force.
[0039] When using the above-mentioned fixture for coating, the fixture is inserted into the electron beam evaporation chamber by holding the handle 60. After the coating is completed, the vacuum adsorption is turned off, and the elastic pin 40 is triggered to lift the wafer by 0.5-2mm, making it easier to pick up with tweezers.
[0040] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this utility model.
Claims
1. A rectangular wafer electron beam evaporation fixture, characterized in that, include: The mounting substrate has a through hole in its central region; A limiting baffle located on one side of the mounting substrate, wherein at least one limiting slot hole matching the shape of the rectangular wafer is formed on the limiting baffle; A connecting block is located on the side of the limiting baffle away from the mounting substrate. The connecting block, the limiting baffle, and the mounting substrate are detachably and fixedly connected by fasteners passing through them. A portion of the connecting block is located above the limiting slot of the limiting baffle to restrict the position of the rectangular wafer.
2. The rectangular wafer electron beam evaporation fixture according to claim 1, characterized in that, It also includes a resilient ejector pin installed on the side of the mounting substrate away from the limiting baffle. The resilient ejector pin is made of a resilient metal material. In the initial state, a portion of the resilient ejector pin is located in the through hole of the mounting substrate. When the resilient ejector pin is triggered, it moves toward the side closer to the limiting baffle to eject the rectangular wafer.
3. A rectangular wafer electron beam evaporation fixture according to claim 2, characterized in that, The elastic ejector pin includes an ejector pin portion, a connecting portion, and an elastic portion located between the two; wherein, the elastic ejector pin is connected to the mounting base plate by a fastening screw passing through the connecting portion, the free end of the ejector pin portion is located in the through hole of the mounting base plate, and the elastic portion is constructed in the form of a spring.
4. A rectangular wafer electron beam evaporation fixture according to claim 3, characterized in that, The free end of the ejector pin is convexly arc-shaped and its surface is covered with a conductive rubber layer.
5. A rectangular wafer electron beam evaporation fixture according to claim 1, characterized in that, It also includes a hand grip that can be detachably installed on the side of the mounting base away from the limiting baffle.
6. A rectangular wafer electron beam evaporation fixture according to claim 1, characterized in that, The limiting baffle has a limiting slot, which is adapted to match two rectangular wafers.
7. A rectangular wafer electron beam evaporation fixture according to claim 1, characterized in that, A portion of the limiting slot is provided with an avoidance notch.
8. A rectangular wafer electron beam evaporation fixture according to claim 1, characterized in that, The connecting block includes a connecting body that abuts against the limiting baffle and a blocking part that extends into the upper region of the limiting slot.
9. A rectangular wafer electron beam evaporation fixture according to claim 8, characterized in that, The connecting pressure block is provided in at least two sets, and each set of connecting pressure block is provided with two pressure blocking parts.
10. A rectangular wafer electron beam evaporation fixture according to claim 1, characterized in that, The mounting base plate and the limiting baffle are both circular plates, wherein the mounting base plate has several ventilation holes in the area that matches the limiting slot.