Computing device

Abstract

The embodiment of the utility model provides computing equipment which comprises a machine shell, a computing module, a heat dissipation module, a power module and a control module, the computing module comprises at least one computing power board, the heat dissipation module is used for conducting heat dissipation on the computing module, and the power module is electrically connected with the computing module; the control module is in communication connection with the calculation module; wherein the calculation module, the power supply module, the control module and the heat dissipation module are all arranged in the shell; the case comprises the partition module, the partition module defines the at least two accommodating areas, and the integration level of the computing device can be improved, so that space is saved, and wiring is simplified.

Description

[0001] This disclosure claims priority to Chinese Patent Application No. 2025102311215, filed with the Chinese Patent Office on February 27, 2025, entitled “Computing Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and more particularly to a computing device. Background Technology

[0003] Existing computing devices typically consist of separate components, resulting in low integration and significant gaps between them, leading to wasted space. Furthermore, this separate assembly complicates maintenance and upgrades. For example, replacing a single component may require disassembling multiple other parts, increasing maintenance difficulty and time costs. Utility Model Content

[0004] This application provides a computing device to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of the embodiments of this application, this application provides a computing device, including:

[0006] chassis;

[0007] The computing module includes at least one computing board;

[0008] The heat dissipation module is used to cool the computing module.

[0009] The power supply module is electrically connected to the computing module;

[0010] The control module communicates with the computing module.

[0011] The computing module, power supply module, control module, and heat dissipation module are all housed inside the chassis.

[0012] The housing includes a partition module that defines at least two accommodating areas.

[0013] In one embodiment, the two accommodating areas are used to accommodate the computing module and the power module, respectively, and the two accommodating areas are used to dissipate heat from the computing module and the power module, respectively.

[0014] In one implementation, the length of the receiving area is the same as the length of the housing.

[0015] In one embodiment, the accommodating area for the power module is a first accommodating area, which is also used to accommodate the control module and to dissipate heat from the control module.

[0016] In one embodiment, the accommodating area for the computing module is a second accommodating area, which is also used to accommodate a heat dissipation module.

[0017] In one embodiment, the housing defines a first receiving area and a second receiving area, the volumes of the first receiving area and the second receiving area being unequal.

[0018] In one embodiment, the housing defines a first receiving area and a second receiving area, which are two independent heat dissipation channels.

[0019] In one embodiment, the first and second accommodating areas are the same size in at least one direction.

[0020] In one embodiment, the first accommodating area and the second accommodating area have the same dimensions in the first direction and the second direction.

[0021] In one embodiment, the first accommodating area and the second accommodating area have different dimensions in the third direction, the first accommodating area being smaller in the third direction than the second accommodating area, and the ratio of the dimensions of the first accommodating area and the second accommodating area in the third direction being greater than 1 / 5 and less than 2 / 3.

[0022] In one embodiment, the housing includes an inlet panel, wherein the perforated area of ​​the inlet panel accounts for more than 50% of the total area of ​​the inlet panel.

[0023] In one embodiment, the housing includes an outlet panel, wherein the perforated area of ​​the outlet panel accounts for more than 50% of the total area of ​​the outlet panel.

[0024] In one embodiment, the casing includes a side panel, and the side panel and the computing board are arranged in parallel.

[0025] In one embodiment, the partition module is arranged perpendicularly to the computing board.

[0026] In one embodiment, the power module is fixedly mounted on the partition module.

[0027] In one embodiment, the partition module is dimensionally identical to the housing in at least one direction.

[0028] In one embodiment, the size of the partition module is consistent with the size of the housing in the first and / or second directions.

[0029] In one embodiment, the separator module is arranged parallel to the power module along the length of the power module.

[0030] In one embodiment, the heat dissipation module includes at least one first fan for dissipating heat from the computing module in the second housing area.

[0031] In one embodiment, the second receiving area has an air inlet area and an air outlet area at both ends in the first direction, and the air inlet area and / or the air outlet area are provided with a first fan.

[0032] In one embodiment, a first gap space is provided between the first fan disposed in the air intake area and the inlet panel, and / or a second gap space is provided between the first fan disposed in the air outlet area and the outlet panel.

[0033] In one embodiment, the size of the first spacing space is greater than or equal to 25 mm and less than or equal to 85 mm; and / or, the size of the second spacing space is greater than or equal to 25 mm and less than or equal to 85 mm.

[0034] In one embodiment, the first fan includes a fan bracket and at least one first fan unit, wherein the at least one first fan unit is disposed on the fan bracket.

[0035] In one embodiment, at least one first fan unit is mounted to a fan bracket by adhesive pins.

[0036] In one embodiment, a limit strip is provided on the side wall of the housing in the second direction. The limit strip has a limit slot, and the fan bracket is adapted to engage with the limit slot.

[0037] In one implementation, the power supply module and the heat dissipation module are located on opposite sides of the computing module.

[0038] In one embodiment, the computing module further includes at least one heat sink assembly.

[0039] In one embodiment, at least one heat sink assembly and the heat dissipation module are spaced apart in a first direction.

[0040] In one embodiment, the computing board is mounted on a heat sink assembly, and the housing includes a mounting structure disposed in a second receiving area, with the heat sink assembly mounted on the mounting structure.

[0041] In one embodiment, the mounting structure includes two mounting brackets respectively providing the top and bottom of the second receiving area.

[0042] In one embodiment, a heat sink assembly is provided on the non-chip side of the computing board. The heat sink assembly on the non-chip side of the computing board is a first heat sink assembly. The first heat sink assembly includes a first heat sink substrate and a plurality of first heat sink fins. The plurality of first heat sink fins are disposed on the side of the first heat sink substrate away from the computing board.

[0043] In one embodiment, the upper and lower parts of the first heat dissipation substrate are respectively mounted on two mounting brackets of the mounting structure.

[0044] In one embodiment, the area of ​​the first heat dissipation substrate is larger than the area of ​​the computing board, the upper part of the first heat dissipation substrate not covered by the computing board defines the upper mounting area, and the area of ​​the first heat dissipation substrate extending beyond the lower edge of the computing board defines the lower mounting area.

[0045] The first heat dissipation substrate is mounted on the corresponding mounting bracket via the upper mounting area and the lower mounting area.

[0046] In one embodiment, a heat sink assembly is provided on the chip side of the computing board. The heat sink assembly on the chip side of the computing board is a second heat sink assembly. The second heat sink assembly includes a second heat sink substrate and a plurality of second heat sink fins. The plurality of second heat sink fins are disposed on the side of the second heat sink substrate away from the computing board.

[0047] In one embodiment, the extension dimension of the second heat dissipation fin in the first direction is greater than the extension dimension of the computing board in the first direction.

[0048] In one embodiment, the first heat dissipation fin and / or the second heat dissipation fin extend along a second direction, perpendicular to the side plate of the housing in the second direction.

[0049] In one embodiment, the first heat dissipation fin and / or the second heat dissipation fin extend in the second direction by 55 mm to 70 mm.

[0050] In one embodiment, the second accommodating area is provided with a sound-absorbing component.

[0051] In one embodiment, the sound-absorbing component includes an air inlet side sound-absorbing component and / or an air outlet side sound-absorbing component; the top and bottom of the air inlet area of ​​the second accommodating area are respectively provided with air inlet side sound-absorbing components, and / or the top and bottom of the air outlet area of ​​the second accommodating area are respectively provided with air outlet side sound-absorbing components.

[0052] In one embodiment, the air inlet-side sound absorber and / or the air outlet-side sound absorber are defined with slots, and the upper and lower parts of the fan bracket are respectively engaged in the corresponding slots.

[0053] In one embodiment, a mounting bracket is provided between the air inlet-side sound absorber and the air outlet-side sound absorber of the sound absorption assembly.

[0054] In one embodiment, a sound-absorbing layer is provided on the inner side of the side panel of the housing in the second direction.

[0055] In one embodiment, the power module includes a power supply and a second fan disposed outside the power supply. The second fan is disposed in a first receiving area and is used to generate cooling airflow through the first receiving area.

[0056] In one embodiment, the control module includes a first control board and at least one second control board connected to the first control board. The first control board is connected to the computing board, and the at least one second control board is connected to at least one first fan of the heat dissipation module.

[0057] In one embodiment, there is a third partition space between the power module and the inlet panel, and the first control board is located in the third partition space and disposed on the partition module.

[0058] In one embodiment, the first fan disposed in the air intake area of ​​the second accommodating area is an air intake fan, and the air intake fan is located below the third partition space;

[0059] The first control board is located adjacent to the entrance panel and is disposed on the partition module. At least one second control board is disposed in the third partition space and is located between the first control board and the power module in the first direction.

[0060] In one embodiment, the first fan disposed in the air outlet area of ​​the second receiving area is an air outlet fan, and the air outlet fan is located below the power module.

[0061] There are two second control boards. The second control board connected to the intake fan signal is located in the third partition space, and the second control board connected to the exhaust fan signal is set on the partition module, located below the power supply module.

[0062] In one embodiment, the partition module includes a partition plate that divides the interior of the housing into two receiving areas.

[0063] In one embodiment, the partition extends from the inlet panel to the outlet panel in a first direction.

[0064] In one embodiment, the partition defines a wire harness fixing structure and / or a wiring channel.

[0065] In one embodiment, the wire harness fixing structure and / or the wiring channel are respectively provided with protective sleeves.

[0066] In one embodiment, the partition module further includes a power supply bracket located within the first receiving area and positioned above the partition plate to support the power supply module.

[0067] In one embodiment, the partition plate has a clearance structure for avoiding electrical connection structures between the power module and the computing board.

[0068] In one embodiment, an installation space is defined between the power supply brackets and the partition plate, and a second control board connected to the exhaust fan is disposed in the installation space.

[0069] In one embodiment, the housing extends 130 mm to 140 mm in the second direction.

[0070] In one implementation, the rated power of the computing board is 1500W to 2000W.

[0071] In one embodiment, the first fan unit of the heat dissipation module has a rated power of 5W to 7W and a speed of 2500 rpm to 3500 rpm.

[0072] In one implementation, the computing board includes:

[0073] plate body;

[0074] A chip array is disposed on the board, and the chip array includes a power-taking unit, which includes at least one chip.

[0075] The power supply module is located on the board and is used to connect to the power source. The power supply module is electrically connected to the power extraction unit and is used to supply power to the power extraction unit. The power supply module has a voltage monitoring point.

[0076] The processing module is located on the board and is electrically connected to the voltage monitoring point to collect the voltage of the voltage monitoring point.

[0077] In one embodiment, there are multiple power-gathering units connected in series, and the total number of power-gathering units is greater than 40 and less than 100.

[0078] In one embodiment, the power-gathering unit includes multiple chips, which are arranged at intervals along a first direction and connected in parallel.

[0079] In one embodiment, the power-gathering unit includes two chips connected in parallel.

[0080] In one embodiment, the heat dissipation airflow flows through the computing board in a first direction. In the first direction, the chip array includes a first power supply group and a second power supply group. The first power supply group and the second power supply group each include a plurality of power supply units arranged sequentially in a third direction.

[0081] The first power take-up group is located near the air inlet side of the panel, and the second power take-up group is located near the air outlet side of the panel.

[0082] In one embodiment, along a third direction, the middle regions of the first power supply group and the second power supply group each have vacant positions.

[0083] In one embodiment, the first power supply group and the second power supply group each include a plurality of power supply areas arranged sequentially along a third direction;

[0084] In the third direction, the distance between any two adjacent power-taking areas is greater than the distance between any two adjacent power-taking units within any power-taking area.

[0085] In one implementation, the number of power-taking areas in the second power-taking group is greater than the number of power-taking areas in the first power-taking group.

[0086] In one embodiment, the chip array includes at least one third power supply group located between the first power supply group and the second power supply group along a first direction. The third power supply group includes a plurality of power supply units arranged sequentially along the third direction.

[0087] In one embodiment, there are two third power supply groups, which are arranged at intervals in the first direction.

[0088] In one embodiment, the extension dimension of at least one third power draw group in the third direction is smaller than the extension dimension of the first power draw group in the third direction, and the extension dimension of at least one third power draw group in the third direction is smaller than the extension dimension of the second power draw group in the third direction.

[0089] In one implementation, the number of chips in the first power-supply group is greater than the number of chips in the second power-supply group, and the number of chips in the first power-supply group is less than the number of chips in the third power-supply group.

[0090] In one embodiment, the spacing between the first power supply group, the third power supply group, and the second power supply group increases sequentially along a first direction.

[0091] In one embodiment, the chip array is divided into a first chip array and a second chip array, with the center line extending along a third direction of the board as the dividing line. The total number of chips in the first chip array near the air intake side of the computing board is greater than the total number of chips in the second chip array near the air outlet side of the computing board.

[0092] In one embodiment, a temperature sensor is included, which is disposed on the plate and used to detect the temperature of the airflow flowing through the plate.

[0093] The processing module is electrically connected to the temperature sensor to collect the temperature detected by the temperature sensor.

[0094] The computing device of this application embodiment has its computing module, power module, control module and heat dissipation module all housed inside the casing, which can improve the integration of the computing device, thereby saving space and simplifying wiring; moreover, it is convenient to disassemble and assemble a single component independently, improving the convenience of maintenance and upgrade of each component.

[0095] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0096] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0097] Figure 1 An exploded view of a computing device according to an embodiment of this application is shown.

[0098] Figure 2A A partial three-dimensional structural schematic diagram of a computing device according to an embodiment of this application is shown.

[0099] Figure 2B A partial perspective structural schematic diagram of a computing device according to an embodiment of this application is shown.

[0100] Figure 3A A schematic diagram of the overall three-dimensional structure of a computing device according to an embodiment of this application is shown.

[0101] Figure 3B An exploded view of the casing structure of a computing device according to an embodiment of this application is shown.

[0102] Figure 4 A schematic diagram of the structure of a first fan of a computing device according to an embodiment of this application is shown.

[0103] Figure 5A A schematic diagram of the casing and some components of a computing device according to an embodiment of this application is shown.

[0104] Figure 5B A schematic diagram of the casing and some components of a computing device according to an embodiment of this application is shown from another perspective.

[0105] Figure 6 A schematic diagram of the structure of the computing module of a computing device according to an embodiment of this application is shown.

[0106] Figure 7 A schematic diagram of a power module of a computing device according to an embodiment of this application is shown.

[0107] Figure 8 , Figure 9 A schematic diagram of the computing board according to an embodiment of this application is shown.

[0108] Explanation of reference numerals in the attached figures:

[0109] Computing device 1;

[0110] Housing 10; receiving area 101; first receiving area 101a; second receiving area 101b; air inlet area 101b1; air outlet area 101b2; first partition space 101b11; second partition space 101b21; third partition space 101a1;

[0111] Separator module 11; Separator plate 111; Power supply bracket 1111; Wiring harness fixing structure 1112; Avoidance structure 1113;

[0112] Entrance panel 12; First cutout area 121; First sub-cutout area 121a; Second sub-cutout area 121b; User operation panel 122; Display screen 1221;

[0113] Export panel 13; second cutout area 131; third sub-cutout area 131a; fourth sub-cutout area 131b; protrusion 132; insertion port 133;

[0114] Side panel 14; air inlet filter plate 15; limiting strip 16; mounting structure 17; mounting bracket 171; top cover 18; bottom cover 19; snap fastener 181; first mounting bracket 102; second mounting bracket 103;

[0115] Computing module 20; computing board 21; heat sink assembly 22; first heat sink assembly 221; first heat sink substrate 2211; first heat sink fin 2212; second heat sink assembly 222; second heat sink substrate 2221; second heat sink fin 2222; second conductive element 231; first conductive element 232; signal interface 25;

[0116] Heat dissipation module 30; first fan 31; first fan unit 311; fan bracket 312; adhesive nail 313;

[0117] Power module 40; second fan 41; electrical connection structure 42; electrode 43; switch 44; power supply 45;

[0118] Control module 50; First control board 51; Second control board 52;

[0119] Sound-absorbing component 60; air inlet side sound-absorbing component 61; air outlet side sound-absorbing component 62; sound-absorbing layer 63;

[0120] Board 201; Chip 202; Voltage monitoring point 203; First voltage monitoring point 2031; Second voltage monitoring point 2032; Third voltage monitoring point 2033; Fourth voltage monitoring point 2034; Fifth voltage monitoring point 2035; Sixth voltage monitoring point 2036; Temperature sensor 205; Clock frequency generator 206; First clock frequency generator 2061; Second clock frequency generator 2062;

[0121] Chip array 210; first power supply group 211, second power supply group 212; third power supply group 213; power supply unit 2110; power supply module 23; electrical connector 233; electrical connection unit 2331; boost module 234; voltage regulator module 235; processor 24; analog-to-digital converter 241;

[0122] First direction L1; Second direction L2; Third direction L3. Detailed Implementation

[0123] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0124] This application provides a computing device capable of processing complex algorithms and achieving high-efficiency computing power. The computing device includes a computing module, a power supply module, a control module, and a heat dissipation module. The computing module includes a computing board to provide high-efficiency computing power, enabling the computing device to be used in applications requiring large amounts of computing resources. The heat dissipation module dissipates heat from the computing module, ensuring the computing board operates within a safe range and preventing performance degradation or damage due to overheating. The power supply module provides a stable power supply to the computing device, realizing voltage conversion and power distribution to ensure that all components of the computing device operate normally at their rated power. The control module is communicatively connected to the computing module to realize the allocation of computing tasks, control of various components, and monitoring of operation. This ensures the efficient computing and stable operation of the computing device.

[0125] Existing computing devices are generally assembled separately, with low integration and large gaps between components, which increases space waste and makes the maintenance and upgrading of computing devices more complicated.

[0126] The computing device of this application embodiment has its computing module, power module, control module and heat dissipation module all housed inside the casing, which can improve the integration of the computing device, thereby saving space and simplifying wiring; moreover, it is convenient to disassemble and assemble a single component independently, improving the convenience of maintenance and upgrade of each component.

[0127] The chassis includes a partition module that defines at least two receiving areas. That is, the cavity of the chassis is divided into at least two receiving areas by the partition module, which facilitates the arrangement of the above-mentioned components in different receiving areas within the same cavity. This not only improves the integration of the computing device, but also helps to form independent heat dissipation channels in different receiving areas, thereby improving the heat dissipation efficiency of the computing device.

[0128] The following detailed description uses specific embodiments and illustrations.

[0129] Figure 1 An exploded view of a computing device according to an embodiment of this application is shown. Figure 1 As shown,

[0130] The two accommodating areas 101 can be used to accommodate the computing module 20 and the power module 40 respectively. The two accommodating areas 101 are used to dissipate heat from the computing module 20 and the power module 40 respectively. This independent heat dissipation of the computing module 20 and the power module 40 is beneficial to improve the heat dissipation effect of the computing module 20 and the power module 40 at the same time.

[0131] For example, the power module 40 and the heat dissipation module 30 may be located on different sides of the computing module 20. For instance, the power module 40 may be located above the computing module 20, and the heat dissipation module 30 may be located on one or both sides of the computing module 20 in the horizontal direction.

[0132] For example, the accommodating area 101 that houses the power module 40 is a first accommodating area 101a. The first accommodating area 101a is also used to house the control module 50, and is used to dissipate heat from the control module 50. In this example, both the control module 50 and the power module 40 are located within the first accommodating area 101a, achieving simultaneous heat dissipation for both the control module 50 and the power module 40, while also improving the space utilization of the first accommodating area 101a, thereby increasing the integration of the computing device 1.

[0133] In some examples, the power module 40 and / or control module 50 can be placed horizontally in the first receiving area 101a to reduce the vertical space occupied by the power module 40 and / or control module 50. In other examples, the power module 40 and / or control module 50 can be placed vertically in the first receiving area 101a to reduce the horizontal space occupied by the power module 40 and / or control module 50. These are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the power module 40 and / or control module 50 can also be placed in the first receiving area 101a at an angle.

[0134] For example, continue to refer to Figure 1 The accommodating area 101 that houses the computing module 20 is the second accommodating area 101b, which also houses the heat dissipation module 30. In this example, both the computing module 20 and the heat dissipation module 30 are located within the second accommodating area 101b, which improves the space utilization of the second accommodating area 101b. Moreover, since the heat dissipation module 30 and the computing module 20 are located in the same accommodating area 101, it is convenient for the heat dissipation module 30 to dissipate heat from the computing module 20, which helps to improve the heat dissipation effect of the computing module 20.

[0135] In some examples, the computing module 20 and / or the heat dissipation module 30 can be placed horizontally in the second receiving area 101b to reduce the vertical space occupied by the computing module 20 and / or the heat dissipation module 30. In other examples, the computing module 20 and / or the heat dissipation module 30 can be placed vertically in the second receiving area 101b to reduce the horizontal space occupied by the computing module 20 and / or the heat dissipation module 30. These are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the computing module 20 and / or the heat dissipation module 30 can also be placed in the second receiving area 101b at an angle.

[0136] For example, the length of the receiving area 101 can be approximately the same as the length of the housing 10. This can be understood as the extension dimension of the receiving area 101 in the first direction L1 being approximately the same as the extension dimension of the housing 10 in the first direction L1. That is, the receiving area 101 is approximately distributed throughout the entire area of ​​the housing 10 in the first direction L1. This allows for full utilization of the interior of the housing 10, improving space utilization, and providing sufficient space for heat dissipation of various components, thereby improving heat dissipation effect.

[0137] For example, the number of accommodating areas 101 defined in the housing 10 is two, namely a first accommodating area 101a and a second accommodating area 101b. The volume of the first accommodating area 101a and the volume of the second accommodating area 101b may not be equal. According to the size of the different components accommodated in the first accommodating area 101a and the second accommodating area 101b and the overall space requirements, the volume of the first accommodating area 101a and the second accommodating area 101b can be divided in different proportions to meet the placement requirements of different components and the requirements of heat dissipation space, thereby improving space utilization and heat dissipation efficiency.

[0138] For example, the first accommodating area 101a and the second accommodating area 101b have the same dimensions in at least one direction to meet the space requirements for the arrangement of each component, while improving the regularity of the internal space of the housing 10.

[0139] In some examples, the first receiving area 101a and the second receiving area 101b have the same dimensions in the first direction L1 and the second direction L2 to maintain the neatness of the two receiving areas 101.

[0140] For example, the housing 10 defines a first receiving area 101a and a second receiving area 101b, which are two independent heat dissipation channels. The first receiving area 101a and the second receiving area 101b each form a corresponding heat dissipation channel, and the two heat dissipation channels are independent of each other and not interconnected. The heat dissipation channels are used for the flow of cooling medium, which can dissipate heat from the working components disposed within the heat dissipation channels.

[0141] It should be noted that by setting the dimensions of the first receiving area 101a and the second receiving area 101b in the first direction L1 and the second direction L2 to be the same, the first receiving area 101a and the second receiving area 101b can be respectively disposed through the housing 10 in the first direction L1 or in the second direction L2. This allows the first receiving area 101a and the second receiving area 101b to form independent heat dissipation channels in the first direction L1 or the second direction L2, so that the cooling medium can flow separately in their respective heat dissipation channels. This avoids the cooling medium in the two heat dissipation channels from affecting each other and improves the heat dissipation stability of the first receiving area 101a and the second receiving area 101b.

[0142] In some examples, the first accommodating area 101a and the second accommodating area 101b have different dimensions in the third direction L3 to meet the size requirements of different components arranged in the two accommodating areas 101.

[0143] In some examples, the size of the first accommodating area 101a on the third-direction L3 is smaller than the size of the second accommodating area 101b on the third-direction L3, so that components that occupy less space on the third-direction L3, such as the control module 50 and / or the power module 40, can be placed in the first accommodating area 101a, and components that occupy more space on the third-direction L3, such as the computing module 20 and / or the heat dissipation module 30, can be placed in the second accommodating area 101b.

[0144] For example, the ratio of the dimensions of the first accommodating area 101a and the second accommodating area 101b in the third direction L3 is greater than 1 / 5 and less than 2 / 3, which improves the rationality of space division and helps to improve space utilization. For example, the ratio of the dimensions of the first accommodating area 101a and the second accommodating area 101b in the third direction L3 can be 2 / 5, 1 / 2, 6 / 10, etc., and is not limited to these.

[0145] For example, continue to refer to Figure 1 The first accommodating area 101a and the second accommodating area 101b are arranged on the third direction L3, that is, the partition module 11 divides the interior of the housing 10 into two accommodating areas 101 on the third direction L3.

[0146] In some examples, the first receiving area 101a may be located above the second receiving area 101b. The first receiving area 101a houses the power module 40 and the control module 50, while the second receiving area 101b houses the computing module 20 and the heat dissipation module 30. Understandably, the power module 40 is generally heavier, and placing it in the upper first receiving area 101a helps avoid instability, thereby improving the overall stability of the computing device 1. In other examples, the first receiving area 101a may also be located below the second receiving area 101b.

[0147] In this embodiment of the application, the first direction L1 and the second direction L2 can be understood as two mutually perpendicular directions in the horizontal direction, and the third direction L3 can be understood as a vertical direction perpendicular to the horizontal direction.

[0148] Figure 2A This diagram shows a partial three-dimensional structural schematic of a computing device 1 according to an embodiment of the present application. Figure 2B This diagram shows a partial perspective view of a computing device according to an embodiment of the present application. Figure 3A A schematic diagram of the overall three-dimensional structure of a computing device 1 according to an embodiment of this application is shown.

[0149] For example, such as Figure 2A and Figure 3A As shown, the housing 10 may include an inlet panel 12, an outlet panel 13, two side panels 14, a top cover 18, and a bottom cover 19, which together form the interior of the housing 10.

[0150] In some examples, such as Figure 2A As shown, the top cover 18 and the bottom cover 19 may each have a snap 181 to facilitate the user's movement of the computing device 1.

[0151] In some examples, the housing 10 can be designed as a regular cuboid to suit home or office use. In other examples, the housing 10 can also be a cube, a circle, an ellipse, etc., and is not limited to these.

[0152] In some examples, the extension dimension of the housing 10 in the second direction L2 can be 130 to 140 mm. Specifically, the extension dimension of the housing 10 in the second direction L2 can be 3U to match the size of the rack that carries the computing device 1. Here, U is a standard unit of height, referred to as a "rack unit" or "cabinet unit". 1U equals 1.75 inches (approximately 44.45 mm).

[0153] In other examples, the extension dimension of the housing 10 in the second direction L2 may also be 130.5mm, 132mm, 133mm or 135mm, etc., and is not limited to this.

[0154] In a specific example, the dimensions of the housing 10 can be 455*440*130.5mm, that is, the extension dimension of the housing 10 in the first direction L1 is 455mm, the extension dimension in the third direction L3 is 440mm, and the extension dimension in the second direction L2 is 130.5mm.

[0155] It should be noted that the above examples are for illustrative purposes only and do not constitute a limitation on this application. The size of the housing 10 can be designed according to the size of the rack and the space occupied by the various components inside the computing device 1.

[0156] In some examples, two of the inlet panel 12, outlet panel 13, and two side panels 14 can be integrated or separate. For example, the outlet panel 13 and one of the side panels 14 can be integrated, while the other side panel 14 can be separate, to facilitate opening the separate side panel 14 for disassembly, assembly, maintenance, and other operations of the components inside the housing 10. Of course, this is only an example and does not constitute a limitation of this application. Those skilled in the art will understand that the components of the housing 10 can be arranged in other ways, such as the inlet panel 12 being separate from other components of the housing 10, at least one side panel 14 being separate from other components of the housing 10, or all components of the housing 10 being separate, etc., and are not limited to this.

[0157] For example, such as Figure 3A As shown, the inlet panel 12 of the housing 10 may have a first cutout area 121, which can serve as an air intake area to allow external airflow to enter the receiving area 101 of the housing 10.

[0158] In some examples, such as Figure 3A As shown, the first hollow area 121 includes a first sub-hollow area 121a and a second sub-hollow area 121b distributed in the third direction L3. The first sub-hollow area 121a is opposite to and connected to the first receiving area 101a, and external airflow can pass through the first sub-hollow area 121a to the first receiving area 101a to dissipate heat from the modules within the first receiving area 101a. The second sub-hollow area 121b is opposite to and connected to the second receiving area 101b, and external airflow can pass through the second sub-hollow area 121b to the second receiving area 101b to dissipate heat from the modules within the second receiving area 101b.

[0159] In some examples, the perforated area of ​​the inlet panel 12 of the housing 10 accounts for more than 50% of the total area of ​​the inlet panel 12. That is, the area of ​​the first perforated area 121 of the housing 10 accounts for more than 50% of the total area of ​​the inlet panel 12. It can be seen that there are large perforated areas distributed on the inlet panel 12 to increase the airflow into the receiving area 101 of the housing 10 and improve the heat dissipation efficiency.

[0160] For example, the proportion of the cutout area of ​​the inlet panel 12 of the casing 10 to the total area of ​​the inlet panel 12 can be 60%, 70%, 80%, 90%, etc., where a larger proportion can improve the heat dissipation efficiency of the computing device. This is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the aforementioned ratio can also be other values, which will not be elaborated here.

[0161] Figure 3B An exploded view of the casing structure of a computing device according to an embodiment of this application is shown.

[0162] For example, such as Figure 3A and Figure 3B As shown, an air inlet filter plate 15 may be provided on the inner side of the inlet panel 12 to filter the airflow entering through the inlet panel 12.

[0163] For example, such as Figure 2A As shown, the outlet panel 13 of the housing 10 may have a second hollow area 131, which can serve as an air outlet area for the airflow of the housing 10's receiving area 101 to diffuse to the outside of the housing 10.

[0164] In some examples, such as Figure 2A As shown, the second hollow area 131 includes a third sub-hollow area 131a and a fourth sub-hollow area 131b distributed in the third direction L3. The third sub-hollow area 131a is opposite to and connected to the first receiving area 101a. The airflow of each module flowing through the first receiving area 101a can be diffused to the outside through the third sub-hollow area 131a, thus forming an airflow circulation between the first receiving area 101a and the outside. The fourth sub-hollow area 131b is opposite to and connected to the second receiving area 101b. The airflow of each module flowing through the second receiving area 101b can be diffused to the outside through the fourth sub-hollow area 131b, thus forming an airflow circulation between the second receiving area 101b and the outside.

[0165] In some examples, the perforated area of ​​the outlet panel 13 of the housing 10 accounts for more than 50% of the total area of ​​the outlet panel 13. That is, the area of ​​the second perforated area 131 of the housing 10 accounts for more than 50% of the total area of ​​the outlet panel 13. It can be seen that there are large perforated areas distributed on the outlet panel 13 to increase the airflow from the receiving area 101 of the housing 10 to the outside, reduce wind resistance, and improve heat dissipation effect and efficiency.

[0166] For example, the proportion of the perforated area of ​​the outlet panel 13 of the casing 10 to the total area of ​​the outlet panel 13 can be 60%, 70%, 80%, 90%, etc., where a larger proportion can improve the heat dissipation efficiency of the computing device. This is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the aforementioned ratio can also be other values, which will not be elaborated here.

[0167] In some examples, such as Figure 3A As shown, the area between the first sub-cutout area 121a and the second sub-cutout area 121b of the entrance panel 12 can be equipped with a user operation panel 122, a display screen 1221, a switch and reset button, a data interface and a network interface, etc., to facilitate user operation and improve the human-computer interaction experience.

[0168] In some examples, such as Figure 2A As shown, the outlet panel 13 may have an extension port 132 and an insertion port 133. The extension port 132 corresponds to the switch 44 of the power module 40, making the switch 44 visible for easy user operation. The insertion port 133 corresponds to the power supply interface of the power module 40, and is used to allow external power cables to be connected to the power supply interface.

[0169] For example, the inlet panel 12 and outlet panel 13 of the housing 10 can be distributed in a first direction L1 and extend along a second direction L2 and a third direction L3, respectively. That is, the inlet panel 12 and outlet panel 13 are respectively arranged vertically and are distributed opposite to each other in the first direction L1. The two side panels 14 of the housing 10 can be distributed in the second direction L2 and extend along the first direction L1 and a third direction L3, respectively. That is, the two side panels 14 are respectively arranged vertically and are distributed opposite to each other in the second direction L2.

[0170] For example, the side plate 14 can be arranged parallel to the computing board 21 of the computing module 20, that is, the computing board 21 can be arranged vertically and extend along the first direction L1 and the third direction L3.

[0171] For example, the partition module 11 is arranged perpendicularly to the computing board 21. It is understood that the perpendicular arrangement of the partition module 11 and the computing board 21 means that the plane containing the partition module 11 is perpendicular to the plane containing the computing board 21. The partition module 11 may be plate-shaped or at least partially plate-shaped, defining two receiving areas 101 arranged in a direction perpendicular to the partition module 11 within the housing 10. In some specific examples, the partition module 11 may be arranged perpendicular to a third direction L3, i.e., a vertical direction. By arranging the computing board 21 perpendicularly to the partition module 11, the computing board 21 can be arranged vertically, extending along both the first direction L1 and the third direction L3, thereby fully utilizing the internal space of the receiving area 101 in which it is located, and thus improving the space utilization rate inside the housing 10.

[0172] Figure 4 This diagram shows a structural schematic of the first fan 31 of the computing device 1 according to an embodiment of the present application. Figure 5A A schematic diagram of the casing 10 and some components of the computing device 1 according to an embodiment of this application is shown.

[0173] In some examples, to improve the heat dissipation of the computing module 20, the computing device 1 in this embodiment of the application may employ air cooling, such as... Figure 4 As shown, the heat dissipation module 30 may include at least one first fan 31, which is used to dissipate heat from the computing module 20 in the second accommodating area 101b.

[0174] In other examples, computing device 1 may also use water cooling or oil cooling to dissipate heat from computing module 20.

[0175] For example, again Figure 2A As shown, the second receiving area 101b can have an air inlet area 101b1 and an air outlet area 101b2 at its two ends in the first direction L1, respectively. A first fan 31 is provided in the air inlet area 101b1 and / or the air outlet area 101b2. That is, there can be one or two first fans 31. When there is one first fan 31, it can be located in either the air inlet area 101b1 or the air outlet area 101b2. When there are two first fans 31, they can be located in the air inlet area 101b1 and the air outlet area 101b2 respectively to increase airflow and air circulation efficiency, thereby improving heat dissipation efficiency.

[0176] In some examples, see further. Figure 2A A first gap space 101b11 exists between the first fan 31 located in the air inlet area 101b1 and the inlet panel 12, and / or a second gap space 101b21 exists between the first fan 31 located in the air outlet area 101b2 and the outlet panel 13. That is, the space in the air inlet area 101b1 is larger than the space occupied by the first fan 31, and / or the space in the air outlet area 101b2 is larger than the space occupied by the first fan 31. This allows for spare space in the air inlet area 101b1 and / or the air outlet area 101b2, facilitating the subsequent replacement with a larger fan or the addition of sound-absorbing material, thus providing users with flexibility to adapt to different user needs.

[0177] In some specific examples, the size of the first partition space 101b11 is greater than or equal to 25 mm and less than or equal to 85 mm; and / or, the size of the second partition space 101b21 is greater than or equal to 25 mm and less than or equal to 85 mm. For example, the size of the first partition space 101b11 can be 25 mm, 55 mm, or 85 mm; the size of the second partition space 101b12 can be 25 mm, 55 mm, or 85 mm. The size of the first partition space 101b11 can be understood as the dimension between the first fan 31 and the inlet panel 12 in the first direction L1, and the size of the first partition space 101b11 can be understood as the dimension between the first fan 31 and the outlet panel 13 in the first direction L1.

[0178] In addition, in order to make the spare space formed by the first interval space 101b11 and the second interval space 101b12 have the same specifications, so that the user can replace the fan or sound insulation cotton of the same size in the first interval space 101b11 and the second interval space 101b12 in the future, the size of the first interval space 101b11 and the size of the second interval space 101b12 can be the same, for example, both are 25mm, 55mm or 85mm.

[0179] For example, such as Figure 4 As shown, the first fan 31 may include a fan bracket 312 and at least one first fan unit 311, with the at least one first fan unit 311 disposed on the fan bracket 312.

[0180] In some examples, the first fan 31 includes multiple first fan units 311 to enhance heat dissipation and meet the heat dissipation requirements of the computing module 20 with higher computing power. The multiple first fan units 311 can be arranged sequentially on the third direction L3 and fixed to the fan bracket 312. For example... Figure 4 As shown, each first fan 31 includes two first fan units 311.

[0181] In other examples, the first fan 31 may include a first fan unit 311 to match the computing module 20 with relatively low heat dissipation requirements.

[0182] In some examples, the first fan unit 311 can be mounted to the fan bracket 312 with adhesive pins 313 to reduce the vibration of the fan unit and facilitate the assembly and disassembly of the fan unit.

[0183] In other examples, the first fan unit 311 may also be mounted to the fan bracket 312 by other fasteners, such as screws, clips or magnetic fasteners, etc., and is not limited to these.

[0184] For example, the fan bracket 312 can be mounted on the partition module 11.

[0185] In some examples, such as Figure 4 and combined Figure 2A As shown, the upper end of the fan bracket 312 is mounted on the partition plate 111 of the partition module 11 to improve the stability of the fan bracket 312 and reduce the degree of vibration.

[0186] In some examples, such as Figure 4 and combined Figure 2A As shown, the lower end of the fan bracket 312 can be installed on the flange of the bottom cover 19 of the housing 10 to improve the stability of the fan bracket 312 and reduce the degree of vibration.

[0187] Figure 5B A schematic diagram of the casing and some components of a computing device according to an embodiment of this application is shown from another perspective.

[0188] In some examples, such as Figure 5A and Figure 5B As shown, the housing 10 is provided with a limiting strip 16 on the side wall in the second direction L2, that is, a limiting strip 16 is provided on the inner wall of one side plate 14 of the housing 10. The limiting strip 16 has a limiting slot, and the fan bracket 312 is adapted to the limiting slot for engagement, so as to provide positioning for the installation of the fan bracket 312, while ensuring that the fan bracket 312 is installed in place and improving the stability of the fan bracket 312.

[0189] like Figure 5A and Figure 5B As shown, the side plate 14 of the housing 10 is provided with two limiting strips 16 distributed in the first direction L1. The limiting strips 16 can be parallel to the extension direction of the fan bracket 312, for example, extending along the third direction L3. The two limiting strips 16 respectively cooperate with the fan bracket 312 located in the air inlet area 101b1 and the fan bracket 312 located in the air outlet area 101b2 to limit the two fan brackets 312 respectively.

[0190] In some examples, the limiting strip 16 can be made of an elastic material, such as plastic, polyurethane, or silicone, and is not limited to these. While working in conjunction with the fan bracket 312 for installation and limiting, the limiting strip 16 also ensures a certain level of quiet operation.

[0191] In some examples, the first fan unit 311 may be an axial fan extending axially along a first direction L1 to generate an airflow flowing along the first direction L1 in the second receiving area 101b. In other examples, the first fan unit 311 may also be a centrifugal fan, a cross-flow fan, or a mixed-flow fan, etc., and is not limited thereto.

[0192] For example, the first fan unit 311 may have a rated power of 5 to 7W and a speed of 2,500 to 3,500 rpm to improve heat dissipation efficiency and reduce fan noise.

[0193] In one specific example, the rated power of the first fan unit 311 can be 6W, and the speed can be 3000 rpm. In another example, the rated power of the first fan unit 311 can be 5W, 5.5W, 6.5W, or 7W, etc., and is not limited thereto. The speed of the first fan unit 311 can be 2500 rpm, 2800 rpm, 3200 rpm, etc., and is not limited thereto.

[0194] It should be noted that the above examples are merely illustrative and do not constitute a limitation on this application. Those skilled in the art will understand that the rated power and speed of the first fan unit 311 can be selected in other ways according to heat dissipation and noise reduction requirements.

[0195] For example, in order to reduce fan noise, such as Figure 5A and Figure 5B and combined Figure 2A As shown, the second receiving area 101b may be provided with a sound-absorbing component 60 to absorb noise, protect the module of the second receiving area 101b, and guide the airflow of the second receiving area 101b.

[0196] In some examples, the sound-absorbing component 60 includes an air inlet-side sound absorber 61 and / or an air outlet-side sound absorber 62; the top and bottom of the air inlet area 101b1 of the second accommodating area 101b are respectively provided with air inlet-side sound absorbers 61, and / or the top and bottom of the air outlet area 101b2 of the second accommodating area 101b are respectively provided with air outlet-side sound absorbers 62. The air inlet-side sound absorber 61 and the air outlet-side sound absorber 62 can, on the one hand, close off part of the gaps in the second accommodating area 101b, blocking the airflow through the gaps, so that the airflow flows through the computing module 20 that needs to be cooled as much as possible, increasing the heat dissipation efficiency; on the other hand, they can absorb noise and achieve a quiet effect.

[0197] like Figure 5A and Figure 5B and combined Figure 2A , Figure 2BAs shown, the top and bottom of the air inlet area 101b1 of the second receiving area 101b are respectively provided with air inlet side sound-absorbing components 61. The air inlet side sound-absorbing components 61 can absorb the noise of the first fan 31 located in the air inlet area 101b1, and at the same time provide a buffering and protection effect for the vibration of the first fan 31. The top and bottom of the air outlet area 101b2 of the second receiving area 101b are respectively provided with air outlet side sound-absorbing components 62. The air outlet side sound-absorbing components 62 can absorb the noise of the first fan 31 located in the air outlet area 101b2, and at the same time provide a buffering and protection effect for the vibration of the first fan 31. In this way, the noise of the computing device 1 can be greatly reduced, thereby providing the user with a computing device 1 with a near-silent effect.

[0198] In some examples, the inlet-side sound absorber 61 and the outlet-side sound absorber 62 can be sound-absorbing cotton, such as corrugated sponge or polyurethane sponge, etc., and are not limited thereto. In other examples, the inlet-side sound absorber 61 and the outlet-side sound absorber 62 can be sound absorbers made of acoustic foam or fabric sound-absorbing materials, etc., and are not limited thereto.

[0199] In some examples, the inlet-side sound absorber 61 and / or the outlet-side sound absorber 62 may be defined with slots (not labeled), and the upper and lower parts of the fan bracket 312 are respectively engaged in the corresponding slots. The inlet-side sound absorber 61 and the outlet-side sound absorber 62 may each be defined with slots. The upper part of the fan bracket 312 located in the inlet area 101b1 is engaged in the slot of the top inlet-side sound absorber 61, and the lower part of the fan bracket 312 is engaged in the slot of the bottom inlet-side sound absorber 61. Correspondingly, the upper part of the fan bracket 312 located in the outlet area 101b2 is engaged in the slot of the top outlet-side sound absorber 62, and the lower part of the fan bracket 312 is engaged in the slot of the bottom outlet-side sound absorber 62. This improves the stability of the fan bracket 312 in the air intake area 101b1 and the fan bracket 312 in the air outlet area 101b2, reducing vibration and noise.

[0200] In some examples, such as Figure 5A As shown, a sound-absorbing layer 63 can be provided on the inner side of the side plate 14 on the second direction L2 of the housing 10 to improve the sound absorption effect, reduce noise, and thus achieve a silent effect.

[0201] For example, such as Figure 5A and Figure 5B As shown, a mounting bracket 171 can be provided between the air inlet side sound absorber 61 and the air outlet side sound absorber 62. The mounting bracket 171 is used to install the computing module 20. Figure 5A and Figure 5BAs shown, there is a mounting bracket 171 between the air inlet side sound absorber 61 and the air outlet side sound absorber 62 located at the bottom, and there is a mounting bracket (not shown) between the air inlet side sound absorber 61 and the air outlet side sound absorber 62 located at the top. The mounting bracket at the top and the mounting bracket at the bottom 171 can fix the top and bottom of the computing module 20 respectively, thereby improving the stability of the computing module 20.

[0202] Figure 6 A schematic diagram of the structure of the computing module 20 of the computing device 1 according to an embodiment of this application is shown.

[0203] For example, such as Figure 6 As shown, the computing module 20 also includes at least one heat sink group 22 to increase the heat dissipation area of ​​the computing module 20 and improve heat dissipation efficiency.

[0204] In some examples, at least one heat sink assembly 22 and the heat dissipation module 30 are spaced apart in the first direction L1 to ensure smooth airflow; at the same time, spare space is provided to facilitate the subsequent replacement of a larger fan or the addition of sound-absorbing cotton, thereby providing users with room for flexibility to meet various user needs.

[0205] For example, the computing board 21 can be installed on the heat sink assembly 22. The housing 10 includes a mounting structure 17 disposed in the second receiving area 101b. The heat sink assembly 22 is installed on the mounting structure 17, thereby fixing the computing board 21 and the heat sink assembly 22.

[0206] In some examples, the computing board 21 can be mounted to the heat sink assembly 22 using fasteners such as screws or bolts. In other examples, the computing board 21 can be mounted to the heat sink assembly 22 using rivets, clips, or other means, and is not limited to these.

[0207] In some examples, refer again Figure 5A and combined Figure 2A As shown, the mounting structure 17 may include two mounting brackets 171 located at the top and bottom of the second receiving area 101b, respectively. The top mounting bracket 171 and the bottom mounting bracket 171 can fix the top and bottom of the heat sink assembly 22 respectively, and at the same time provide a load-bearing function for the computing board 21 and the heat sink assembly 22, thereby improving the stability of the computing module 20.

[0208] For example, such as Figure 6As shown, a heat sink assembly 22 is provided on the non-chip side of the computing board 21. The heat sink assembly 22 on the non-chip side of the computing board 21 is a first heat sink assembly 221. The first heat sink assembly 221 includes a first heat sink substrate 2211 and a plurality of first heat sink fins 2212. The plurality of first heat sink fins 2212 are disposed on the side of the first heat sink substrate 2211 away from the computing board 21, so as to diffuse the heat of the computing board 21 away from the computing board 21, increase the heat dissipation area, and improve the heat dissipation effect.

[0209] Multiple first heat dissipation fins 2212 can be arranged sequentially on the third direction L3 to increase the heat dissipation area.

[0210] In some examples, the upper and lower parts of the first heat dissipation substrate 2211 can be mounted on two mounting brackets 171 respectively, thereby fixing the computing module 20 to the mounting brackets 171 through the first heat dissipation substrate 2211.

[0211] In some examples, such as Figure 6 As shown, the area of ​​the first heat dissipation substrate 2211 is larger than that of the computing board 21. The upper part of the first heat dissipation substrate 2211, which is not covered by the computing board 21, defines an upper mounting area. The area of ​​the first heat dissipation substrate 2211 that extends beyond the lower edge of the computing board 21 defines a lower mounting area. The first heat dissipation substrate 2211 is mounted on the corresponding mounting bracket 171 through the upper mounting area and the lower mounting area, respectively. That is, a portion of the first heat dissipation substrate 2211 covers the non-chip side of the computing board 21. The upper and lower parts of the first heat dissipation substrate 2211 each have exposed areas not covered by the computing board 21 to facilitate the installation of the first heat dissipation substrate 2211 and the mounting bracket 171.

[0212] In some examples, the first heat sink 2211 can be mounted to the mounting bracket 171 using fasteners such as screws or bolts. In other examples, the first heat sink 2211 can be mounted to the mounting bracket 171 using rivets, clips, or other means, and is not limited to these.

[0213] For example, such as Figure 6 As shown, a heat sink assembly 22 is provided on the chip side of the computing board 21. The heat sink assembly 22 on the chip side of the computing board 21 is a second heat sink assembly 222. The second heat sink assembly 222 includes a second heat sink substrate 2221 and a plurality of second heat sink fins 2222. The plurality of second heat sink fins 2222 are disposed on the side of the second heat sink substrate 2221 away from the computing board 21, so as to directly diffuse the heat of the chip side with more heat generation away from the computing board 21 by utilizing the second heat sink assembly 222, thereby improving the heat dissipation effect.

[0214] Multiple second heat dissipation fins 2222 can be arranged sequentially on the third direction L3 to increase the heat dissipation area.

[0215] In some examples, the first heat sink assembly 221 can be a single unit, and the second heat sink assembly 222 can be composed of three parts arranged on the third direction L3. In other examples, the first heat sink assembly 221 and the second heat sink assembly 222 can be either a single unit or separate units, and are not limited to these.

[0216] In some examples, such as Figure 6 As shown, along the first direction L1, the first heat dissipation fin 2212 and the second heat dissipation fin 2222 are wedge-shaped, meaning that along the airflow direction, the upstream sections of the first heat dissipation fin 2212 and the second heat dissipation fin 2222 have oblique cut surfaces, making the area of ​​the upstream sections of the first heat dissipation fin 2212 and the second heat dissipation fin 2222 smaller than the area of ​​the downstream sections. When the airflow passes through the computing module 20, it first passes through the oblique cut surfaces and is guided downstream by the oblique cut surfaces, which can reduce the airflow resistance. At the same time, the airflow temperature increases after passing through the upstream section of the computing board 21, and the downstream section of the computing board 21 can be cooled by the downstream sections of the first heat dissipation fin 2212 and the second heat dissipation fin 2222, which have larger areas, thereby ensuring the heat dissipation effect of the downstream section of the computing board 21.

[0217] In some examples, such as Figure 6 As shown, the extension dimension of the second heat dissipation fin 2222 in the first direction L1 is greater than the extension dimension of the computing board 21 in the first direction L1, so as to increase the area of ​​the second heat dissipation fin 2222 and improve the heat dissipation effect on the computing board 21.

[0218] In some examples, the first heat dissipation fin 2212 and / or the second heat dissipation fin 2222 extend along the second direction L2, perpendicular to the side plate 14 of the casing 10 in the second direction L2. That is, the first heat dissipation fin 2212 and the second heat dissipation fin 2222 can extend horizontally, perpendicular to the vertically extending computing board 21, and also perpendicular to the vertically extending side plate 14. This increases the heat dissipation area while making full use of the space around the computing board 21, thereby improving space utilization.

[0219] In some examples, the extension dimension of the first heat dissipation fin 2212 and / or the second heat dissipation fin 2222 in the second direction L2 can be about 3U / 2, to match the housing 10 with an extension dimension of 3U in the second direction L2, so as to make the most of the internal space of the housing 10 and increase the heat dissipation efficiency.

[0220] The ratio of the extension dimensions of the first heat sink group 221 and the second heat sink group 222 in the first direction L1 to the extension dimensions in the third direction L3 can be 7 / 10 to 6 / 5, respectively.

[0221] The ratio of the extension dimension of the first heat dissipation fin 2212 and the extension dimension of the second heat dissipation fin 2222 in the first direction L1 to the extension dimension in the second direction L2 can be 5 / 2 to 9 / 2.

[0222] In some examples, the extension dimension of the first heat sink 2212 and / or the second heat sink 2222 in the second direction L2 can be from 55mm to 70mm, which includes the value 3U / 2. Depending on the size of the rack supporting the computing device 1 and the size of the housing 10 of the computing device 1, the extension dimension of the first heat sink 2212 and the second heat sink 2222 in the second direction L2 can be arbitrarily adjusted within the aforementioned range.

[0223] In some examples, the thickness of the first heat dissipation fin 2212 and / or the second heat dissipation fin 2222 can be 0.6mm-0.8mm to ensure its structural strength, while more first heat dissipation fins 2212 and second heat dissipation fins 2222 can be arranged on the fixed computing board 21.

[0224] In some examples, the overall size of the first heat sink assembly 221 can be 284.8mm*221mm*60mm, that is, the extension size of the first heat sink assembly 221 in the third direction L3 can be 284.8mm, the size in the first direction L1 is 221mm, and the size in the second direction L2 is 60mm.

[0225] In some examples, the overall size of the second heat sink assembly 222 can be 221mm*77.8mm*60mm, that is, the extension size of the first heat sink assembly 221 in the third direction L3 can be 221mm, the size in the first direction L1 is 77.8mm, and the size in the second direction L2 is 60mm.

[0226] In some examples, the spacing between two adjacent first heat dissipation fins 2212 on the third direction L3 can be 4.3 mm, and the spacing between two adjacent second heat dissipation fins 2222 on the third direction L3 can be 4.3 mm.

[0227] It should be noted that the above examples are for illustrative purposes only and do not constitute a limitation on this application. The dimensions of the first heat sink group 221, the second heat sink group 222, the first heat sink fin 2212, and the second heat sink fin 2222 can also be other values.

[0228] In some examples, the surfaces of the first heat sink fin 2212 and the second heat sink fin 2222 may be nickel-plated to prevent oxidation and integrally insulated to prevent the computing board 21 from becoming conductive. In some examples, the surfaces of the first heat sink fin 2212 and the second heat sink fin 2222 may be painted with a uniform dark color to enhance aesthetics.

[0229] For example, such as Figure 6 and combined Figure 2A and Figure 7 As shown, the computing board 21 has a first conductive element 232 and a second conductive element 231. The first conductive element 232 and the second conductive element 231 are electrically connected to the two electrodes 43 of the power module 40 through two electrical connection structures 42, respectively.

[0230] For example, such as Figure 6 As shown, the computing board 21 also has a signal interface 25, through which the computing board 21 communicates with the first control board 51 of the control module 50.

[0231] For example, the rated power of the computing board 21 can be 1500W to 2000W, which can meet the needs of high computing power and increase the application range of the computing device 1.

[0232] In one specific example, the rated power of the computing board 21 is 1600W. In another example, the rated power of the computing board 21 can be 1500W, 1700W, 1800W, 1900W, 2000W, etc., and is not limited to these.

[0233] It should be noted that the above examples are for illustrative purposes only and do not constitute a limitation on this application. Those skilled in the art will understand that the rated power of the computing board 21 can be flexibly selected according to computing power requirements.

[0234] For example, refer again Figure 5A As shown, the partition module 11 has the same dimensions as the housing 10 in at least one direction. For example, in the first direction L1 and / or the second direction L2, the dimensions of the partition module 11 are the same as those of the housing 10, so as to divide the interior of the housing 10 into two receiving areas 101 with approximately the same dimensions in the first direction L1 and / or the second direction L2, making the interior of the housing 10 more regular and facilitating the arrangement of various components.

[0235] For example, refer again Figure 2A and Figure 2B As shown, the power module 40 and the control module 50 can be fixedly mounted on the partition module 11. In some examples, the partition module 11 divides the interior of the housing 10 into a first accommodating area 101a located above and a second accommodating area 101b located below. The power module 40 and the control module 50 can be located in the first accommodating area 101a and mounted on the partition module 11.

[0236] For example, the partition module 11 can be arranged parallel to the power module 40 along its length. For instance, if the partition module 11 extends horizontally, the power module 40 is placed horizontally on the partition module 11. Or, if the partition module 11 extends vertically, the power module 40 is placed vertically on the partition module 11.

[0237] For example, such as Figure 5A As shown, the partition module 11 includes a partition plate 111, which divides the interior of the housing 10 into two receiving areas 101.

[0238] In some examples, the partition 111 extends from the inlet panel 12 to the outlet panel 13 in the first direction L1, that is, the size of the partition 111 in the first direction L1 is approximately the same as the size of the housing 10 in the first direction L1, so as to divide the interior of the housing 10 into two receiving areas 101 with approximately the same extension size in the first direction L1, which facilitates the adaptation to the arrangement space requirements of each component, while maintaining the neatness of the receiving areas 101.

[0239] In some examples, the separator 111 may define a wire harness fixing structure 1112 and / or a wiring channel. For example... Figure 5A As shown, the wire harness fixing structure 1112 may include an inwardly recessed circular notch on the edge of the partition plate 111. The wiring channel may include a wire-passing hole (not shown) formed on the surface of the partition plate 111.

[0240] In some examples, the harness fixing structure 1112 and / or the cable routing channel may be provided with protective sleeves (not shown) to protect the cables from being squeezed or scratched.

[0241] For example, such as Figure 5A As shown, the partition module 11 may also include a power support 1111, which is located in the first accommodating area 101a and is disposed above the partition plate 111 to support the power module 40 and maintain the stability of the power module 40.

[0242] Figure 7 A schematic diagram of a power module 40 of a computing device 1 according to an embodiment of this application is shown.

[0243] In some examples, such as Figure 5A and combined Figure 2A , Figure 2B and Figure 7As shown, the partition plate 111 may have a clearance structure 1113, which is used to avoid the electrical connection structure 42 between the power module 40 and the computing board 21. The edge of the partition plate 111 has an inwardly recessed clearance notch through which the electrical connection structure 42 of the power module 40 passes to connect with the computing board 21. The electrodes 43 of the power module 40 are exposed to connect with the computing board 21 via the electrical connection structure 42.

[0244] In some examples, an installation space is defined between the power supply bracket 1111 and the partition plate 111, and a second control board 52 connected to the exhaust fan signal can be disposed in the installation space.

[0245] like Figure 7 As shown, in some examples, the power module 40 may include a power supply 45 and a second fan 41 disposed outside the power supply 45. The second fan 41 is disposed in the first receiving area 101a and is used to generate cooling airflow through the first receiving area 101a to dissipate heat from the power module 40.

[0246] In some examples, the power supply 45 may be provided with at least one hook (not shown), and the side plate 14 of the housing 10 may be provided with a hanging hole (not shown) in the area corresponding to the hook. The hanging hole slides with the corresponding hook to guide the installation of the power supply 45, while limiting and fixing the power supply 45.

[0247] In some examples, the power supply 45 can be secured to the housing 10 using fasteners such as screws, bolts, etc.

[0248] In some examples, the second fan 41 may be located at one end of the power supply 45 near the inlet panel 12 to facilitate airflow from the cutout area of ​​the inlet panel 12 into the first receiving area 101a, and after flowing through the power supply 45, out of the first receiving area 101a from the cutout area of ​​the outlet panel 13, thereby improving the heat dissipation efficiency of the power supply 45.

[0249] In some examples, refer again Figure 1 and Figure 2A As shown, there is a third partition space 101a1 between the power module 40 and the entrance panel 12. The first control board 51 of the control module 50 can be located within the third partition space 101a1, positioned above the partition plate 111. The first control board 51 of the control module 50 is communicatively connected to the computing board 21.

[0250] In some examples, the first control board 51 can serve as the main control board, interacting with the user control area and also performing control functions such as controlling the computing board 21, the power supply 45, and the fan.

[0251] In other examples, continue to refer to Figure 1 and Figure 2AAs shown, the control module 50 may further include at least one second control board 52 connected to the first control board 51, and the at least one second control board 52 is communicatively connected to at least one first fan 31 of the heat dissipation module 30. In this example, the first control board 51 can serve as the main control board to interact with the user control area, and the second control board 52 can serve as the fan control board to achieve modular control and facilitate maintenance and management.

[0252] In some examples, there may be one second control board 52, which can be communicatively connected to each of the two first fans 31. In other examples, there may be two second control boards 52, which can be communicatively connected to each of the two first fans 31.

[0253] For example, the first control board 51 may be adjacent to the entrance panel 12 and disposed above the partition plate 111, and at least one second control board 52 may be disposed within the third partition space 101a1 and located between the first control board 51 and the power module 40 in the first direction L1.

[0254] In some examples, the first control panel 51 may be adjacent to the user operation panel 122 on the entrance panel 12 to facilitate the connection between the first control panel 51 and the user operation panel 122.

[0255] In some examples, the first fan 31 located in the air intake area 101b1 of the second accommodating area 101b is referred to as the air intake fan. The air intake fan may be located below the third partition space 101a1 to facilitate communication between the second control board 52 and the air intake fan.

[0256] In some examples, the first fan 31 located in the air outlet area 101b2 of the second receiving area 101b is referred to as the outlet fan, and the outlet fan is located below the power module 40. In an example where there is one second control board 52, the second control board 52 may be located within the third partition space 101a1. In an example where there are two second control boards 52, the second control board 52 connected to the intake fan may be located in the third partition space 101a1, and the second control board 52 connected to the outlet fan may be located on the partition module 11 and below the power module 40.

[0257] For example, the second control board 52, which is connected to the exhaust fan, can be installed in the installation space between the power supply 45 bracket 1111 of the partition module 11 and the partition plate 111, which improves space utilization and facilitates communication between the second control board 52 and the exhaust fan.

[0258] In some examples, the connector between the first fan 31 and the second control board 52 can be a universal connector to be compatible with fans of different specifications, increasing scalability.

[0259] In some examples, the first control board 51 is mounted on the partition plate 111 via the first mounting bracket 102, and the second control board 52 is mounted on the partition plate 111 via the second mounting bracket 103.

[0260] In some examples, the partition plate 111 may have mounting grooves and limiting protrusions (not shown) that mate with the first mounting bracket 102 and the second mounting bracket 103 respectively, for mounting and limiting the first mounting bracket 102 and the second mounting bracket 103.

[0261] In some examples, the first mounting bracket 102 and the second mounting bracket 103 can be mounted on the partition plate 111 by means of screws or clips.

[0262] Figure 8 , Figure 9 A schematic diagram of the computing board 21 according to an embodiment of this application is shown.

[0263] The computing board of this application embodiment can be applied to computing devices to achieve high-efficiency computing capabilities. The computing board includes a board body, a chip array disposed on the board body, a power supply module, and a processing module; the chip array includes a power-harvesting unit, the power-harvesting unit includes at least one chip, the power supply module is used to connect to a power source, the power supply module is electrically connected to the power-harvesting unit, and is used to supply power to the power-harvesting unit, the power supply module has a voltage monitoring point, the processing module is electrically connected to the voltage monitoring point, and is used to collect the voltage of the voltage monitoring point to ensure voltage stability and facilitate rapid identification of fault points.

[0264] The processing module can be connected to the control module to upload the voltage data collected from the voltage monitoring points. The control module can record and store historical data of the voltage monitoring points of the computing board. When the voltage data shows abnormal fluctuations, frequent drops, or instability, it indicates that the computing board is likely to be faulty. By analyzing the historical voltage data, abnormal voltage monitoring points can be identified, thereby quickly determining the location of the fault.

[0265] The processing module may include a memory that records and stores the collected voltage data for maintenance personnel to access, enabling them to quickly locate the fault.

[0266] The processing module may include a processor and an analog-to-digital converter (ADC). The ADC is connected to a voltage monitoring point to collect the voltage at that point, and the processor is connected to the ADC to acquire the voltage at the monitoring point. The processor can also compare the collected voltage with a preset voltage to determine whether the computing board's operating state is stable.

[0267] The processor can be an MCU (Microcontroller Unit), an FPGA (Field-Programmable Gate Array), a DSP (Digital Signal Processor), or something similar, but is not limited to these.

[0268] The processor can acquire the voltage of different voltage monitoring points on the power supply module through multiple AD (Analog-to-Digital Converter) channels, and communicate with the control board through I2C (Inter-Integrated Circuit) or SPI (Serial Peripheral Interface) to realize power management and fault detection.

[0269] The number of voltage monitoring points can be set based on the hardware resources of the processing module itself, such as the number of pins and the number of analog-to-digital converter channels. If the hardware resources of the processing module are sufficient, more voltage monitoring points can be set on the computing board; that is, the power supply module can have multiple voltage monitoring points. The processor connects to multiple voltage monitoring points through multiple analog-to-digital converters to monitor the voltage at multiple locations on the computing board. If the voltage at a certain monitoring point is abnormal (e.g., too high or too low), the specific fault location can be quickly located, thereby shortening fault diagnosis time and improving maintenance efficiency. Historical data from the voltage monitoring points can be used for fault analysis and trend prediction. By analyzing historical voltage change records, potential patterns and problems can be identified, enabling preventative maintenance and preventing future failures.

[0270] Under normal circumstances, based on the total voltage of the computing board and the number of power-harvesting units connected in series, the voltage drop value at each stage of power-harvesting units can be determined. When the value at one or more voltage monitoring points differs significantly from the corresponding voltage value, it can be determined that there is a faulty chip in the upstream power-harvesting unit, thus narrowing down the scope of troubleshooting faulty chips. Based on this, provided that the hardware resources of the processing module are sufficient, the number of voltage monitoring points can also be determined according to the number of power-harvesting units in the chip array. The more power-harvesting units there are, the more voltage monitoring points there should be. For example, one voltage monitoring point can be set at intervals of a certain number of power-harvesting units.

[0271] The following detailed description uses specific embodiments and illustrations.

[0272] like Figure 8 and Figure 9As shown, the computing board 21 has six voltage monitoring points 203. The processor 24 collects the voltage of each of the six voltage monitoring points 203 through a six-channel analog-to-digital converter 241. In this example, limited by the hardware resources of the processing module itself, the processing module has six pins and six analog-to-digital converter channels. The processing module collects the voltage of each of the six voltage monitoring points through the six pins and the corresponding analog-to-digital converter channels.

[0273] In other examples, the processing module may have more pins and analog-to-digital converter channels, so more voltage monitoring points can be set on the computing board, for example, eight, ten or more voltage monitoring points, and not limited to this.

[0274] It should be noted that the above are merely examples and do not constitute a limitation on this application. Those skilled in the art can select different processing modules and set up a corresponding number of voltage monitoring points for the computing board according to monitoring needs and cost control.

[0275] For example, such as Figure 8 As shown, the power supply module 23 may include a first conductive element 232 and a second conductive element 231. The first conductive element 232 is used to connect to the negative terminal of the power supply, and the second conductive element 231 is used to connect to the positive terminal of the power supply. The processing module is connected between the first conductive element 232 and the second conductive element 231. That is, the second conductive element 231 serves as the current input of the computing board 21, and the first conductive element 232 serves as the current output of the computing board 21, thereby realizing the power supply of the computing board 21.

[0276] For example, such as Figure 8 As shown, the power supply module 23 may include an electrical connector 233, which is connected between the first conductive element 232 and the second conductive element 231. The electrical connector 233 is connected in series with multiple power taking units 2110, and the electrical connector 233 has a voltage monitoring point 203.

[0277] Multiple power-collecting groups can be distributed on the board 201 along the first direction L1. Each power-collecting group includes multiple power-collecting units 2110 arranged sequentially on the third direction L3. Each power-collecting unit 2110 includes multiple chips 202 arranged sequentially along the first direction L1. The multiple chips 202 of each power-collecting unit 2110 are connected in parallel, thus forming a chip array 210 on the board 201.

[0278] like Figure 9As shown, the electrical connector 233 connects each power-gathering unit 2110 in series between the first conductive element 232 and the second conductive element 231, and the multiple chips 202 of each power-gathering unit 2110 are connected in parallel. The electrical connector 233 may include multiple electrical connection units 2331. In the third direction L3, an electrical connection unit 2331 is connected between two adjacent chips 202, and in the first direction L1, an electrical connection unit 2331 is connected between two adjacent power-gathering groups. In this way, the power-gathering units 2110 are connected in series sequentially through the electrical connector 233, which includes multiple electrical connection units 2331.

[0279] Electrical connector 233 can be a metal busbar, such as a conductive copper busbar, to reduce voltage drop.

[0280] For example, the electrical connector may have multiple voltage monitoring points evenly distributed along the series path of multiple series-connected power supply groups.

[0281] like Figure 9 As shown, taking a chip array 210 with four power-taking groups as an example, the bottom one is the first power-taking group 211, the top one is the second power-taking group 212, and the two in the middle are the third power-taking groups 213. The electrical connector 233 has four voltage monitoring points 203, namely the first voltage monitoring point 2031, the second voltage monitoring point 2032, the third voltage monitoring point 2033, and the fourth voltage monitoring point 2034. The input end of the electrical connector 233, that is, one end of the electrical connector 233 connected to the second conductive member 231, has the first voltage monitoring point 2031, which is also the left end of the topmost second power-taking group 212. The electrical connector 233 has a second voltage monitoring point 2032 approximately three-quarters of its length, that is, a position adjacent to the right end of the topmost third power-taking group 213. A third voltage monitoring point 2033 is located approximately halfway down the electrical connector 233, specifically between the left end of the lower third power take-up group 213 and the left end of the lower first power take-up group 211. A fourth voltage monitoring point 2034 is located approximately one-quarterway down the electrical connector 233, specifically near the right end of the first power take-up group 211. Thus, four voltage monitoring points 203 are evenly distributed along the series path of each power take-up group, enabling a comprehensive and real-time understanding of the computing board 21's operating status. This ensures the stable and efficient operation of the computing board 21 and allows for rapid detection of power supply problems or voltage anomalies, facilitating fault diagnosis and localization.

[0282] In some examples, such as Figure 9As shown, the power supply module 23 includes a booster module 234, which is connected to at least one downstream power-taking unit 2110 on the data transmission path and is used to provide the required voltage for the data transmission of at least one downstream power-taking unit 2110.

[0283] It should be noted that data transmission between chip 202 and the outside world is achieved through the signal interface 25 of computing board 21. The voltage required for data transmission of chip 202 is generally higher than the voltage required by the internal circuit of chip 202. In order to ensure the stability of data transmission of chip 202, each power supply group is equipped with an auxiliary power supply module. Since the voltage of the current power supply group cannot meet the power supply requirements for data transmission, the auxiliary power supply module needs to take power from each level in sequence along the data transmission direction. For the last level of power supply group that cannot continue to take power from each level, computing board 21 is equipped with a booster module 234 to meet the power requirements for data transmission.

[0284] In some examples, such as Figure 9 As shown, the power supply module 23 may also include a voltage regulator module 235. The voltage regulator module 235 is connected between the voltage output terminal of the boost module 234 and at least one downstream power collection unit 2110. That is, the output voltage of the boost module 234 is output to the corresponding power collection unit after passing through the voltage regulator module 235, so as to ensure the stability of the voltage.

[0285] like Figure 9 As shown, the voltage output terminals of the boost module 234 and the voltage output terminal of the voltage regulator module 235 each have voltage monitoring points 203, namely, the fifth voltage monitoring point 2035 of the voltage output terminal of the boost module 234 and the sixth voltage monitoring point 2036 of the voltage output terminal of the voltage regulator module 235. This serves two purposes: firstly, it monitors the output voltage to ensure it meets the data transmission needs of the final power supply groups; secondly, when the voltage is unstable or abnormal, faults can be quickly identified based on the voltage at different monitoring points 203. For example, if the voltage at monitoring point 203 of the voltage output terminal of the boost module 234 is abnormal, the boost module 234 is faulty; if the voltage at monitoring point 203 of the voltage output terminal of the boost module 234 is normal, but the voltage at monitoring point 203 of the voltage output terminal of the voltage regulator module 235 is abnormal, the voltage regulator module 235 is faulty.

[0286] For example, the boost module 234 may include a voltage control chip, an input voltage switching element, an output voltage switching element, an inductor, a capacitor, etc. The voltage control chip is used to control the on / off state of the input voltage switching element and the output voltage switching element according to a preset voltage range. The voltage control chip can monitor the output voltage of the boost module 234 in real time to determine whether the actual output voltage is within the preset voltage range. If the output voltage does not fall within the preset voltage range, the voltage control chip will adjust the on / off time of the input voltage switching element and the output voltage switching element to stabilize the output voltage and bring it within the preset voltage range, thus meeting the power requirements of the chip 202.

[0287] The input voltage switching element and the output voltage switching element can be metal-oxide-semiconductor field-effect transistors, that is, the input voltage switching element is a high-side MOS (Metal Oxide Semiconductor) field-effect transistor and the output voltage switching element is a low-side MOS field-effect transistor, so as to reduce the on-resistance and improve the efficiency of the boost module 234.

[0288] For example, the voltage regulator module 235 can be a low dropout regulator (LDO), which has a lower input-output voltage difference, meaning it can still operate stably when the input voltage is close to the output voltage.

[0289] For example, signal interface 25 is connected to each chip 202 sequentially via a signal transmission link, such as... Figure 9 As shown, the computing board 21 includes at least two clock frequency generators 206. One clock frequency generator 206 is located near the start of the signal transmission link to synchronize the data transmitted at the start of the signal transmission link and ensure that the signal has accurate timing characteristics when it is sent. At least one clock frequency generator 206 is located near the middle area of ​​the signal transmission link to solve the signal distortion problem caused by signal attenuation, timing offset or electromagnetic interference in long-distance transmission. By regenerating or enhancing the clock signal, the stability of signal transmission is ensured.

[0290] like Figure 9 As shown, there are two clock frequency generators 206 on the signal transmission link. The first clock frequency generator 2061 is set near the beginning of the signal transmission link, and the second clock frequency generator 2062 is set near the middle area of ​​the signal transmission link. They perform timing calibration on the signal, compensate for phase deviation or frequency attenuation caused by the increase in transmission distance, prevent waveform distortion caused by accumulated errors, ensure the stability of signal transmission, and avoid signal distortion.

[0291] For example, the clock frequency generator 206 can be a crystal oscillator.

[0292] For example, such as Figure 9 As shown, the signal interface 25 is sequentially connected to the first power supply group 211, the third power supply group 213, and the second power supply group 212 via a signal transmission link. The chip 202 in the first power supply group 211 adjacent to the signal interface 25 is electrically connected to the starting end of the signal transmission link, and the chip 202 in the second power supply group 212 adjacent to the second conductive element 231 is electrically connected to the ending end of the signal transmission link. Similarly, the chip 202 in the first power supply group 211 adjacent to the first conductive element 232 is electrically connected to the first conductive element 232, and the chip 202 in the second power supply group 212 adjacent to the second conductive element 231 is electrically connected to the second conductive element 231. That is, signal transmission begins from the chip 202 in the first power supply group 211 closest to the signal interface 25, and power transmission begins from the chip 202 in the second power supply group 212 closest to the second conductive element 231, ensuring stable signal transmission and facilitating wiring.

[0293] For example, such as Figure 9 As shown, the first conductive component 232, the second conductive component 231, the signal interface 25, the processing module (processor 24 and analog-to-digital converter 241), the boost module 234 and the voltage regulator module 235 are arranged on the same side of the board 201 in the third direction L3. This provides sufficient space for the arrangement of the chip array 210 and facilitates the connection between each component and the chip 202.

[0294] For example, such as Figure 9 As shown, a signal interface 25, a processing module (processor 24 and analog-to-digital converter 241), a boost module 234 and a voltage regulator module 235 are provided in the area between the first conductive component 232 and the second conductive component 231 to improve the utilization of the space on the board 201 and facilitate the connection of various components.

[0295] For example, the end of the chip array 210 located on the same side as the first conductive element 232, the second conductive element 231, and the signal interface 25 on the third direction L3 is designated as the first end, and the end of the chip array 210 located opposite to the first conductive element 232, the second conductive element 231, and the signal interface 25 on the third direction L3 is designated as the second end. The power-taking unit 2110 of the first end of the power-taking group adjacent to the second conductive element 231 is connected to the second conductive element 231 and sequentially connected in series along the third direction L3 to the power-taking unit 2110 of the second end of the same power-taking group. The power-taking unit 2110 of the second end of the same power-taking group is then connected in series with the power-taking unit 2110 of the second end of the next adjacent power-taking group, and then sequentially connected in series along the third direction L3 to the power-taking unit 2110 of the first end of the same power-taking group, and so on, until the power-taking unit 2110 of the first end of the last power-taking group is electrically connected to the first conductive element 232.

[0296] For example, along the direction of heat dissipation airflow, the upstream side of the power-taking group is the first side, and the downstream side is the second side. The chip 202 on the second side of the power-taking unit 2110 at the first end of the power-taking group adjacent to the first conductive element 232 is connected to the signal interface 25 and connected to the chip 202 on the first side of the power-taking unit 2110. The chip 202 on the first side of the power-taking unit 2110 is sequentially connected to the chip 202 on the first side and the chip 202 on the second side of the adjacent power-taking unit 2110, and sequentially connected to the chip 202 on the second side of the power-taking unit 2110 at the second end of this power-taking group. The chip 202 on the second side of the power-taking unit 2110 at the second end of this power-taking group continues to be connected to the chip 202 on the first side of the adjacent power-taking unit 2110 at the second end of the power-taking group, and so on, until it is connected to the chip 202 on the first side of the power-taking unit 2110 at the last power-taking group.

[0297] For example, a temperature sensor 205 is provided on the board 201. The temperature sensor 205 is used to detect the temperature of the airflow flowing through the board 201 in order to monitor the heat dissipation effect of the computing board 21 and make it easy to adjust the speed of the heat dissipation module, such as the fan, in a timely manner, so as to ensure the heat dissipation effect of the computing board 21.

[0298] In some examples, there can be multiple temperature sensors, which can be distributed in different areas of the computing board to monitor the temperature distribution in different areas of the computing board in real time. This helps to detect local overheating problems in a timely manner and ensure the uniformity of temperature distribution.

[0299] In some examples, multiple temperature sensors can be arranged in areas adjacent to the air inlet and air outlet sides of the board, respectively, with the air inlet and air outlet sides located at two edges of the computing board, facilitating wiring between the temperature sensors and the processing module.

[0300] In other examples, a temperature sensor may also be placed in the middle area of ​​the plate.

[0301] It should be noted that the above are merely examples and do not constitute a limitation on this application. The number and location of temperature sensors can be flexibly designed according to the temperature uniformity requirements of the computing board and the convenience of wiring.

[0302] In a specific example, such as Figure 9 As shown, there are two temperature sensors 205 on the board 201. One temperature sensor 205 is located in the area between the first power supply group 211 and the adjacent third power supply group 213, and the other temperature sensor 205 is located in the area between the second power supply group 212 and the adjacent third power supply group 213.

[0303] The chip array comprises multiple power-harvesting groups, which are spaced apart in a first direction. Each power-harvesting group includes multiple power-harvesting units arranged sequentially and in series in a second direction. Each power-harvesting unit includes multiple chips connected in parallel. The large number of chips in the chip array can enhance the computing power of the computing board, thereby improving its overall performance. Furthermore, the array arrangement can improve the heat dissipation and temperature uniformity of the multiple chips.

[0304] In some examples, the total number of power-harvesting units 2110 can be greater than 40 and less than 100 to increase the computing power of the computing board 21. For example... Figure 9 As shown, there are 80 power-harvesting units 2110, each including two chips connected in parallel, totaling 160 chips. Specifically, the first power-harvesting group 211 includes 20 power-harvesting units 2110, the two third power-harvesting groups 213 each include 21 power-harvesting units 2110, and the second power-harvesting group 212 includes 18 power-harvesting units 2110. In some examples, the number of power-harvesting units 2110 can also be 50, 70, or 90, etc., and is not limited thereto. It should be noted that this is only an example and does not constitute a limitation of this application; the number of power-harvesting units 2110 can be flexibly designed according to the computing power requirements of the computing board 21 and the space available on the computing board 21.

[0305] For example, such as Figure 9 As shown, the heat dissipation airflow flows through the computing board 21 along the first direction L1. The first power supply group 211, at least one third power supply group 213, and the second power supply group 212 are arranged in sequence along the first direction L1. That is, the first power supply group 211 is adjacent to the air intake side of the board 201, the second power supply group 212 is adjacent to the air outlet side of the board 201, and the third power supply group 213 is located between the first power supply group 211 and the second power supply group 212.

[0306] Along the third direction L3, the middle areas of the first power-taking group 211 and the second power-taking group 212 each have vacant spaces. That is, no chips 202 are arranged in the middle areas of the first power-taking group 211 and the second power-taking group 212 to form a larger heat dissipation channel. On the one hand, this can increase the airflow and wind speed from the middle area of ​​the first power-taking group 211 to the downstream third power-taking group 213 and the second power-taking group 212, reducing wind resistance. On the other hand, it can reduce the number of chips 202 in the downstream second power-taking group 212, improve the heat dissipation effect of the second power-taking group 212, and thus make the overall temperature of the computing board 21 more uniform.

[0307] For example, the first power supply group 211 and the second power supply group 212 each include multiple power supply areas arranged sequentially along the third direction L3; on the third direction L3, the distance between any two adjacent power supply areas is greater than the distance between any two adjacent power supply units 2110 in any power supply area, so as to increase the vacancy on the first power supply group 211 and the second power supply group 212 respectively and improve the heat dissipation effect.

[0308] For example, the number of power-taking areas in the second power-taking group 212 is greater than the number of power-taking areas in the first power-taking group 211, so as to ensure the heat dissipation effect of the second power-taking group 212 located downstream of the heat dissipation airflow, thereby making the overall temperature of the computing board 21 more uniform.

[0309] like Figure 9 As shown, the first power supply group 211 includes four power supply areas, and the second power supply group 212 includes six power supply areas. The spacing between two adjacent power supply areas in the four power supply areas of the first power supply group 211 is greater than the spacing between two adjacent chips 202 in each power supply area. Correspondingly, the spacing between two adjacent power supply areas in the six power supply areas of the second power supply group 212 is greater than the spacing between two adjacent chips 202 in each power supply area. In this way, large-spacing vacant spaces are formed in the first power supply group 211 and the second power supply group 212, which improves the heat dissipation effect of the computing board 21 and helps to maintain temperature uniformity.

[0310] For example, along the first direction L1, the spacing between the first power-taking group 211, the third power-taking group 213, and the second power-taking group 212 increases sequentially. That is, along the direction of heat dissipation airflow, the spacing between two adjacent power-taking groups increases sequentially, so as to increase the spacing between downstream power-taking groups and make the overall temperature of the computing board 21 more uniform.

[0311] For example, such as Figure 9 As shown, the extension dimension of at least one third power supply group 213 in the third direction L3 is smaller than the extension dimension of the first power supply group 211 in the third direction L3, and the extension dimension of at least one third power supply group 213 in the third direction L3 is smaller than the extension dimension of the second power supply group 212 in the third direction L3. That is to say, compared with the first power supply group 211 and the second power supply group 212, the extension dimension of the third power supply group 213 in the third direction L3 is smaller, so that an arrangement area can be left at the end of the third power supply group 213, which is convenient for arranging the wiring and some electrical connection units 2331 of the electrical connector 233 in the arrangement area.

[0312] For example, the number of chips 202 in the first power supply group 211 is greater than the number of chips 202 in the second power supply group 212, and the number of chips 202 in the first power supply group 211 is less than the number of chips 202 in the third power supply group 213. Figure 9As shown, the first power supply group 211 has 40 chips 202, the second power supply group 212 has 36 chips 202, and each third power supply group 213 has 42 chips. This is only an example and does not constitute a limitation of this application. The number of chips 202 in each power supply group can be adjusted according to the space of the board 201, heat dissipation requirements, and computing power requirements.

[0313] For example, taking the center line of the board 201 extending from the third direction L3 as the dividing line, the chip array 210 is divided into a first chip array 210 and a second chip array 210. The total number of chips 202 in the first chip array 210 near the air intake side of the computing board 21 is greater than the total number of chips 202 in the second chip array 210 near the air outlet side of the computing board 21. That is, the number of chips 202 in the second chip array 210 downstream of the heat dissipation airflow is less than the number of chips 202 in the first chip array 210 upstream of the heat dissipation airflow. This allows more chips 202 to be arranged in the relatively lower temperature upstream area, while appropriately reducing the number of chips 202 in the relatively higher temperature upstream area, thus ensuring the heat dissipation effect and temperature uniformity of the computing board 21.

[0314] It should be noted that the computing devices in the above embodiments can be used in combination with each other, and are not limited to the aforementioned combinations. The features and technical solutions in different embodiments can be flexibly adjusted and combined according to actual needs to achieve optimal performance and functionality.

[0315] Other configurations of the computing device 1 in the above embodiments can be adopted from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0316] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0317] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0318] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0319] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0320] It should be noted that although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps. The above drawings are merely illustrative of the processes included in the method according to exemplary embodiments of this application and are not intended to be limiting. It is readily understood that the processes shown in the above drawings do not indicate or limit the temporal order of these processes. Furthermore, it is readily understood that these processes may be performed synchronously or asynchronously in multiple modules, for example.

[0321] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0322] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A computing device, characterized in that, include: chassis; The computing module includes at least one computing board; A heat dissipation module is used to dissipate heat from the computing module; The power supply module is electrically connected to the computing module; The control module is communicatively connected to the computing module; The computing module, the power module, the control module, and the heat dissipation module are all housed within the casing. The housing includes a partition module that defines at least two accommodating areas.

2. The computing device according to claim 1, characterized in that, The two accommodating areas are respectively used to accommodate the computing module and the power module, and the two accommodating areas are respectively used to dissipate heat from the computing module and the power module.

3. The computing device according to claim 1, characterized in that, The length of the receiving area is the same as the length of the casing.

4. The computing device according to claim 2, characterized in that, The accommodating area for the power module is a first accommodating area, which is also used to accommodate the control module and to dissipate heat from the control module.

5. The computing device according to claim 2, characterized in that, The area accommodating the computing module is a second accommodating area, which also accommodates the heat dissipation module.

6. The computing device according to claim 1, characterized in that, The housing defines a first receiving area and a second receiving area, the volumes of the first receiving area and the second receiving area are not equal.

7. The computing device according to claim 1, characterized in that, The casing defines a first accommodating area and a second accommodating area, which are two independent heat dissipation channels.

8. The computing device according to claim 6, characterized in that, The first and second accommodating areas have the same dimensions in at least one direction.

9. The computing device according to claim 6, characterized in that, The first accommodating area and the second accommodating area have the same dimensions in the first direction and the second direction.

10. The computing device according to claim 6, characterized in that, The first and second accommodating areas have different dimensions in the third direction. The first accommodating area is smaller than the second accommodating area in the third direction. The ratio of the dimensions of the first and second accommodating areas in the third direction is greater than 1 / 5 and less than 2 / 3.

11. The computing device according to claim 1, characterized in that, The housing includes an inlet panel, and the area of ​​the cutout in the inlet panel accounts for more than 50% of the total area of ​​the inlet panel.

12. The computing device according to claim 1, characterized in that, The housing includes an outlet panel, and the perforated area of ​​the outlet panel accounts for more than 50% of the total area of ​​the outlet panel.

13. The computing device according to claim 1, characterized in that, The casing includes a side panel, which is arranged in parallel with the computing board.

14. The computing device according to claim 1, characterized in that, The power module and the control module are fixedly installed on the partition module.

15. The computing device according to claim 1, characterized in that, The partition module is dimensionally identical to the housing in at least one direction.

16. The computing device according to claim 1, characterized in that, In the first and / or second direction, the dimensions of the partition module are consistent with the dimensions of the housing.

17. The computing device according to claim 1, characterized in that, The separator module is arranged parallel to the power module along its length.

18. The computing device according to claim 1, characterized in that, The separation module is arranged perpendicularly to the computing board.

19. The computing device according to claim 1, characterized in that, The heat dissipation module includes at least one first fan, which is used to dissipate heat from the computing module in the second housing area.

20. The computing device according to claim 19, characterized in that, The second accommodating area has an air inlet area and an air outlet area at both ends in the first direction, and the air inlet area and / or the air outlet area are provided with the first fan.

21. The computing device according to claim 19, characterized in that, The first fan located in the air intake area has a first gap space between it and the inlet panel, and / or the first fan located in the air outlet area has a second gap space between it and the outlet panel.

22. The computing device according to claim 21, characterized in that, The size of the first interval space is greater than or equal to 25 mm and less than or equal to 85 mm; and / or, the size of the second interval space is greater than or equal to 25 mm and less than or equal to 85 mm.

23. The computing device according to claim 19, characterized in that, The first fan includes a fan bracket and at least one first fan unit, wherein the at least one first fan unit is disposed on the fan bracket.

24. The computing device according to claim 23, characterized in that, The at least one first fan unit is mounted to the fan bracket by adhesive nails.

25. The computing device according to claim 23, characterized in that, The housing has a limit strip on its side wall in the second direction. The limit strip has a limit slot, and the fan bracket is adapted to engage with the limit slot.

26. The computing device according to claim 1, characterized in that, The power supply module and the heat dissipation module are located on opposite sides of the computing module.

27. The computing device according to claim 1, characterized in that, The computing module also includes at least one heat sink assembly.

28. The computing device according to claim 27, characterized in that, The at least one heat sink assembly and the heat dissipation module are spaced apart in a first direction.

29. The computing device according to claim 27, characterized in that, The computing board is mounted on the heat sink assembly, and the casing includes a mounting structure disposed in the second accommodating area, with the heat sink assembly mounted on the mounting structure.

30. The computing device according to claim 29, characterized in that, The mounting structure includes two mounting brackets respectively disposed at the top and bottom of the second receiving area.

31. The computing device according to claim 27, characterized in that, The heat sink assembly is provided on the non-chip side of the computing board. The heat sink assembly on the non-chip side of the computing board is a first heat sink assembly. The first heat sink assembly includes a first heat sink substrate and a plurality of first heat sink fins. The plurality of first heat sink fins are disposed on the side of the first heat sink substrate away from the computing board.

32. The computing device according to claim 31, characterized in that, The upper and lower parts of the first heat dissipation substrate are respectively mounted on two mounting brackets of the mounting structure.

33. The computing device according to claim 32, characterized in that, The area of ​​the first heat dissipation substrate is larger than that of the computing board. The upper part of the first heat dissipation substrate that is not covered by the computing board defines the upper mounting area, and the area of ​​the first heat dissipation substrate that extends beyond the lower edge of the computing board defines the lower mounting area. The first heat dissipation substrate is mounted on the corresponding mounting bracket via the upper mounting area and the lower mounting area, respectively.

34. The computing device according to claim 31, characterized in that, The computing board has a heat sink assembly on the chip side. The heat sink assembly on the chip side of the computing board is a second heat sink assembly. The second heat sink assembly includes a second heat sink substrate and a plurality of second heat sink fins. The plurality of second heat sink fins are disposed on the side of the second heat sink substrate away from the computing board.

35. The computing device according to claim 34, characterized in that, The extension dimension of the second heat dissipation fin in the first direction is greater than the extension dimension of the computing board in the first direction.

36. The computing device according to claim 34, characterized in that, The first heat dissipation fin and / or the second heat dissipation fin extend along a second direction, perpendicular to the side plate of the housing in the second direction.

37. The computing device according to claim 27, characterized in that, The first and / or second heat dissipation fins extend in the second direction by 55 mm to 70 mm.

38. The computing device according to claim 5, characterized in that, The second accommodating area is equipped with sound-absorbing components.

39. The computing device according to claim 38, characterized in that, The sound-absorbing component includes an air inlet side sound-absorbing component and / or an air outlet side sound-absorbing component; the air inlet side sound-absorbing component is respectively provided at the top and bottom of the air inlet area of ​​the second accommodating area, and / or the air outlet side sound-absorbing component is respectively provided at the top and bottom of the air outlet area of ​​the second accommodating area.

40. The computing device according to claim 39, characterized in that, The air inlet side sound absorber and / or the air outlet side sound absorber are defined with a bayonet, and the upper and lower parts of the fan bracket are respectively locked into the corresponding bayonet.

41. The computing device according to claim 39, characterized in that, A mounting bracket is provided between the air inlet side sound absorber and the air outlet side sound absorber of the sound absorption assembly.

42. The computing device according to claim 1, characterized in that, The housing has a sound-absorbing layer on the inner side of the side plate in the second direction.

43. The computing device according to claim 4, characterized in that, The power module includes a power supply and a second fan disposed outside the power supply. The second fan is disposed in the first receiving area and is used to generate cooling airflow through the first receiving area.

44. The computing device according to claim 43, characterized in that, The control module includes a first control board and at least one second control board connected to the first control board. The first control board is connected to the computing board, and the at least one second control board is connected to at least one first fan of the heat dissipation module.

45. The computing device according to claim 44, characterized in that, There is a third partition space between the power module and the inlet panel, and the first control board is located in the third partition space and is disposed on the partition module.

46. ​​The computing device according to claim 45, characterized in that, The first fan located in the air intake area of ​​the second accommodating area is an air intake fan, and the air intake fan is located below the third partition space; The first control board is located adjacent to the entrance panel and is disposed on the partition module. At least one second control board is disposed within the third partition space and is located between the first control board and the power module in a first direction.

47. The computing device according to claim 45, characterized in that, The first fan located in the air outlet area of ​​the second containment area is an air outlet fan, and the air outlet fan is located below the power module; There are two second control boards. The second control board connected to the intake fan is located in the third partition space, and the second control board connected to the exhaust fan is located on the partition module, below the power module.

48. The computing device according to claim 1, characterized in that, The partition module includes a partition plate that divides the interior of the housing into two receiving areas.

49. The computing device according to claim 48, characterized in that, The partition extends from the inlet panel to the outlet panel in a first direction.

50. The computing device according to claim 48, characterized in that, The partition plate defines a wire harness fixing structure and / or a wiring channel.

51. The computing device according to claim 50, characterized in that, The wiring harness fixing structure and / or the wiring channel are respectively provided with protective sleeves.

52. The computing device according to claim 48, characterized in that, The partition module also includes a power supply bracket, which is located within the first accommodating area and positioned above the partition plate to support the power supply module.

53. The computing device according to claim 52, characterized in that, The partition plate has a clearance structure, which is used to avoid the electrical connection structure between the power module and the computing board.

54. The computing device according to claim 52, characterized in that, An installation space is defined between the power supply brackets and the partition plate, and a second control board connected to the exhaust fan is disposed in the installation space.

55. The computing device according to any one of claims 1 to 54, characterized in that, The housing extends 130 mm to 140 mm in the second direction.

56. The computing device according to any one of claims 1 to 54, characterized in that, The rated power of the computing board is 1500W to 2000W.

57. The computing device according to any one of claims 1 to 54, characterized in that, The rated power of the first fan unit of the heat dissipation module is 5W to 7W, and the speed is 2500 rpm to 3500 rpm.

58. The computing device according to claim 1, characterized in that, The computing board includes: plate body; A chip array is disposed on the board, the chip array including a power-taking unit, the power-taking unit including at least one chip; A power supply module is disposed on the board and is used to connect to a power source. The power supply module is electrically connected to the power extraction unit and is used to supply power to the power extraction unit. The power supply module has a voltage monitoring point. A processing module is installed on the board and electrically connected to the voltage monitoring point for collecting the voltage of the voltage monitoring point.

59. The computing device according to claim 58, characterized in that, The number of power-gathering units is multiple, and the multiple power-gathering units are connected in series. The total number of power-gathering units is greater than 40 and less than 100.

60. The computing device according to claim 58, characterized in that, The power extraction unit includes multiple chips, which are arranged at intervals along a first direction and connected in parallel.

61. The computing device according to claim 58, characterized in that, The power supply unit includes two chips connected in parallel.

62. The computing device according to claim 58, characterized in that, The cooling airflow flows through the computing board in a first direction. Along the first direction, the chip array includes a first power supply group and a second power supply group. The first power supply group and the second power supply group each include a plurality of power supply units arranged sequentially along a third direction. The first power supply group is located near the air inlet side of the plate, and the second power supply group is located near the air outlet side of the plate.

63. The computing device according to claim 62, characterized in that, Along the third direction, the middle area of ​​the first power-taking group and the middle area of ​​the second power-taking group each have vacant positions.

64. The computing device according to claim 62, characterized in that, The first power supply group and the second power supply group each include multiple power supply areas arranged sequentially along a third direction; In the third direction, the distance between any two adjacent power-collecting areas is greater than the distance between any two adjacent power-collecting units within any power-collecting area.

65. The computing device according to claim 64, characterized in that, The number of power-taking areas in the second power-taking group is greater than the number of power-taking areas in the first power-taking group.

66. The computing device according to claim 63, characterized in that, The chip array includes at least one third power supply group located between the first power supply group and the second power supply group along a first direction. The third power supply group includes a plurality of power supply units arranged sequentially along the third direction.

67. The computing device according to claim 66, characterized in that, The number of the third power supply groups is two, and the two third power supply groups are arranged at intervals in the first direction.

68. The computing device according to claim 66, characterized in that, The extension dimension of the at least one third power take-up group in the third direction is smaller than the extension dimension of the first power take-up group in the third direction, and the extension dimension of the at least one third power take-up group in the third direction is smaller than the extension dimension of the second power take-up group in the third direction.

69. The computing device according to claim 66, characterized in that, The number of chips in the first power-supply group is greater than the number of chips in the second power-supply group, and the number of chips in the first power-supply group is less than the number of chips in the third power-supply group.

70. The computing device according to claim 66, characterized in that, Along the first direction, the spacing between the first power-taking group, the third power-taking group, and the second power-taking group increases sequentially.

71. The computing device according to claim 58, characterized in that, Using the center line extending along a third direction of the board as the dividing line, the chip array is divided into a first chip array and a second chip array. The total number of chips in the first chip array near the air inlet side of the computing board is greater than the total number of chips in the second chip array near the air outlet side of the computing board.

72. The computing device according to claim 58, characterized in that, Includes a temperature sensor, which is disposed on the plate and used to detect the temperature of the airflow flowing through the plate; The processing module is electrically connected to the temperature sensor and is used to collect the temperature detected by the temperature sensor.

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