Heat dissipation structure based on PCBA module
By adopting a PCBA-based heat dissipation structure, parallel fin arrangement, and optimized air circulation design in the E1.S enterprise-class solid-state drive, the problem of insufficient heat dissipation under high-performance applications is solved, achieving stronger heat dissipation capabilities and stability.
Patent Information
- Application Number
- CN202423111930.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing E1.S enterprise-class solid-state drives have insufficient heat dissipation capabilities under high-performance applications, resulting in excessively rapid temperature rise and affecting performance.
The heat dissipation structure based on PCBA module is adopted, including PCBA module, copper base, first U-shaped structure, second U-shaped structure and heat dissipation fins. The fins are arranged in parallel and through inlaid steps and rolled edge design, combined with emulsion silicone and fixed mounting plate, to increase the contact area and air circulation ventilation.
Improved heat dissipation performance, optimized user experience, and ensured stable operation of the hard drive under high-performance applications.
Smart Images
Figure CN223871233U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat dissipation structure based on a PCBA module. Background Technology
[0002] Enterprise solid-state drives (ESSDs) are used in data centers, servers, the internet, cloud services, smart manufacturing, and high-performance computing. Based on signal protocols, they can be divided into three development stages: SATA protocol, the transition from SATA to PCIe protocol, and PCIe protocol. Traditional 2.5-inch SATA SSDs and M.2 SATA SSDs use the SATA protocol. U.2 interface SSDs represent the transition from SATA to PCIe protocol and are currently the mainstream enterprise-grade SSDs. E1.S and E3.S use the PCIe protocol and represent the next generation of mainstream enterprise-grade SSDs. Among them, E1.S replaces the traditional M.2. Its main features include a gold finger interface on the circuit board with a thickness of 1.53mm-1.63mm, which is stronger than the 0.75mm-0.85mm circuit board of M.2, making it less prone to deformation and improving mechanical strength, suitable for larger size and more layer circuit designs; secondly, the gold finger spacing is 0.6mm, which is larger than the 0.5mm of M.2, resulting in better contact and wear resistance, suitable for higher current power supplies; thirdly, the DC12V high-power power supply can improve the overall power supply, making it more suitable for ultra-large capacity enterprise-level solid-state drives; in addition, it has excellent compatibility and expandability, supporting PCIe x4 and PCIe x8.
[0003] Currently, there are three mainstream thicknesses for E1.S chips: 9.5mm, 15mm, and 25mm. The 9.5mm thickness lacks a heatsink structure, resulting in average heat dissipation, and is suitable for larger capacity PCIe Gen3 x4 slots (theoretically reaching up to 4GB / s). The 15mm thickness features a heatsink structure, providing stronger heat dissipation capabilities, and is suitable for large capacity PCIe Gen4 x4 (theoretically reaching up to 8GB / s) and PCIe Gen3 x8 (theoretically reaching up to 8GB / s). The 15mm thickness features an even taller heatsink structure and is currently the thickest mainstream thickness, with heat dissipation capabilities suitable for large capacity PCIe Gen5 x4 (theoretically reaching up to 16GB / s) and PCIe Gen4 x8 (theoretically reaching up to 16GB / s).
[0004] The existing E1.S heatsink structure has the following technical disadvantages:
[0005] 1. Even with a thickness of 25mm and a larger fin structure, the heat generated by PCIE Gen5 x8 (theoretically up to 16GB / s), PCIE Gen6 x4, and PCIE Gen6 x8 exceeds the limits of the heat dissipation structure, causing enterprise-grade solid-state drives to reduce speed for protection due to excessively rapid temperature rise or high temperature, thus failing to realize their performance advantages.
[0006] 2. The air circulation of E1.S enterprise-grade solid-state drives uses front and rear fans to accelerate airflow. In order to avoid turbulence and poor air circulation, the orientation of its heat dissipation fins is limited, and sufficient gaps must be reserved, resulting in a very simple fin structure that makes it difficult to improve heat dissipation capacity.
[0007] This invention provides a heat dissipation structure based on PCBA modules, which can enhance heat dissipation performance and optimize user experience. Utility Model Content
[0008] In order to overcome the shortcomings of the existing technology, this utility model provides a heat dissipation structure based on PCBA module, which can enhance heat dissipation performance and optimize user experience.
[0009] The technical solution adopted by this utility model to solve its technical problem is: a heat dissipation structure based on a PCBA module, wherein the improvement is that the heat dissipation structure based on the PCBA module includes a PCBA module, a copper base, a first U-shaped structure, a second U-shaped structure, and heat dissipation fins; the copper base is close to the PCBA module; the first U-shaped structure is covered on the top of the copper base and located on the top of the PCBA module; the second U-shaped structure is covered on the bottom of the PCBA module and is fixedly installed with the first U-shaped structure; the heat dissipation fins are fixedly installed on the inner side of the first U-shaped structure, and the heat dissipation fins are arranged parallel to each other in the horizontal direction.
[0010] In the above structure, the first U-shaped structure is provided with inlaid steps and rolled edges; the inlaid steps are distributed on both sides of the interior of the first U-shaped structure; the rolled edges are fixedly installed on the interior top surface of the first U-shaped structure.
[0011] In the above structure, the heat dissipation fins pass through the rolled edge and are mounted on the inlaid steps.
[0012] In the above structure, the heat dissipation fins are provided with mounting holes, and the distribution of the mounting holes is adapted to the distribution of the rolled edge.
[0013] In the above structure, the heat dissipation structure based on the PCBA module also includes emulsion thermal silicone, which is applied to the side of the copper base near the PCBA module and the inner side of the second U-shaped structure.
[0014] In the above structure, the heat dissipation structure based on the PCBA module also includes a fixed mounting plate, which is fixedly installed at the bottom of the first U-shaped structure.
[0015] In the above structure, a hollowed-out section is provided in the middle of the fixed mounting plate, and the hollowed-out section is close to the copper base.
[0016] In the above structure, the fixed mounting plate is provided with a first screw hole, the PCBA module is provided with a second screw hole, and the second U-shaped structure is provided with a third screw hole. The distribution positions of the first screw hole, the second screw hole, and the third screw hole are compatible.
[0017] In the above structure, the heat dissipation structure based on the PCBA module also includes a fixing screw, which passes through the first screw hole, the second screw hole and the third screw hole at the same time, and the nut of the fixing screw is close to the third screw hole.
[0018] The beneficial effects of this utility model are as follows: By fixing heat dissipation fins inside the first U-shaped structure and arranging them parallel to each other, the heat dissipation fins form a stacked condensation fin structure, thereby increasing the contact area between the heat dissipation fins and the air. Furthermore, the design of the first U-shaped structure and the heat dissipation fins can improve the ventilation volume of air circulation, thereby enhancing the heat dissipation performance and optimizing the user experience. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation structure based on a PCBA module according to this utility model. Figure 1 ;
[0020] Figure 2 This is a schematic diagram of the overall structure of a heat dissipation structure based on a PCBA module according to this utility model. Figure 2 ;
[0021] Figure 3 This is a schematic diagram of the overall structure of a heat dissipation structure based on a PCBA module according to this utility model. Figure 3 ;
[0022] Figure 4 This is a schematic diagram of the heat dissipation fins of a heat dissipation structure based on a PCBA module according to the present invention;
[0023] Figure 5 This is a schematic diagram of the structure of a PCBA module based on a heat dissipation structure of a PCBA module according to the present invention;
[0024] Figure 6 This is a schematic diagram of a fixed mounting plate based on a heat dissipation structure of a PCBA module according to the present invention. Detailed Implementation
[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0026] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.
[0027] Reference Figures 1-6 As shown, this utility model discloses a heat dissipation structure based on a PCBA module. The heat dissipation structure based on the PCBA module includes a PCBA module 3, a copper base 7, a first U-shaped structure 1, a second U-shaped structure 2, and heat dissipation fins 4. The copper base 7 is close to the PCBA module 3. The first U-shaped structure 1 covers the top of the copper base 7 and is located on the top of the PCBA module 3. The second U-shaped structure 2 covers the bottom of the PCBA module 3 and is fixedly installed with the first U-shaped structure 1. The heat dissipation fins 4 are fixedly installed on the inner side of the first U-shaped structure 1, and the heat dissipation fins 4 are arranged parallel to each other in the horizontal direction.
[0028] It should be noted that in this embodiment, the PCBA module 3 is a common core component in electronic products, which typically contains various electronic components. Specifically, the PCBA module 3 includes a controller chip 301, a PMU power management chip 302, a power-down protection control chip 303, a flash memory chip 304, and a DRAM chip 305. During normal operation, the heat generated by the PCBA module 3, from highest to lowest, is as follows: controller chip 301, PMU power management chip 302, power-down protection control chip 303, flash memory chip 304, and DRAM chip 305. Therefore, the PCBA module 3 is the heat source of the entire heat dissipation structure. The copper base 7 is used to conduct the heat generated by the PCBA module 3 to the heat dissipation fins 4 for heat dissipation. The first U-shaped structure 1 is mainly used for heat dissipation of the heat dissipation fins 4 and the copper base 7. The installation provides mechanical support, and the design of the first U-shaped structure 1 can improve the ventilation volume of air circulation; the second U-shaped structure 2 is used to provide mechanical support for the installation of PCBA module 3 and the first U-shaped structure 1, so as to strengthen the stability of the entire heat dissipation structure; the heat dissipation fin 4, as the core component of the entire heat dissipation structure, is made of copper, a metal material with high thermal conductivity, and the heat dissipation fin 4 can dissipate heat on a larger surface area to improve heat dissipation efficiency; in the specific implementation of this utility model, by fixing the heat dissipation fin 4 inside the first U-shaped structure 1, and arranging the heat dissipation fins 4 parallel to each other, a stacked condensation fin structure is formed between the heat dissipation fins 4 to increase the contact area between the heat dissipation fins 4 and the air, and the design of the first U-shaped structure 1 and the heat dissipation fin 4 can improve the ventilation volume of air circulation, thereby enhancing the heat dissipation performance and optimizing the user experience.
[0029] It should also be noted that, in this embodiment, the first U-shaped structure 1 is the bottom shell of the E1.S enterprise-grade solid-state drive, made of aluminum, and can be manufactured by extrusion molding and milling or die casting. In addition, the front of the first U-shaped structure 1 is anodized, while the rear retains the original color of the aluminum material, which facilitates installation reference and positioning at the application end. Furthermore, the front and rear of the first U-shaped structure 1 are open, allowing for front and rear air convection circulation. Its U-shaped structure also helps to avoid air circulation turbulence and maintain a stable air circulation direction.
[0030] It should also be noted that, in this embodiment, the second U-shaped structure 2 is the upper shell of the E1.S enterprise-grade solid-state drive, and the surface can be labeled with trademarks, etc. It is made of aluminum and can be processed by extrusion molding and milling or die casting. The exterior of the second U-shaped structure 2 is two-tone, with the front part anodized and the rear part retaining the original aluminum color, which is convenient for application installation reference and positioning. The second U-shaped structure 2 is also provided with LED top holes and LED side holes for LED indicator light transmission display. In addition, the front and back of the second U-shaped structure 2 are open, which is used for front and rear air convection circulation. Through air circulation, some of the heat of PCBA module 3 and its components can be directly removed.
[0031] Reference Figure 1 , Figure 2 and Figure 3 As shown, the first U-shaped structure 1 is provided with inlaid steps and rolled edges 5; the inlaid steps are distributed on both sides of the interior of the first U-shaped structure 1; the rolled edges 5 are fixedly installed on the interior top surface of the first U-shaped structure 1; the heat dissipation fins 4 pass through the rolled edges 5 and are mounted on the inlaid steps; the heat dissipation fins 4 are provided with mounting holes 9, and the distribution position of the mounting holes 9 is adapted to the distribution position of the rolled edges 5.
[0032] It should be noted that, in this embodiment, the design of the inlaid steps and rolled edges 5 is to ensure that the heat dissipation fins 4 are arranged parallel to each other, so as to ensure the airflow between adjacent heat dissipation fins 4, thereby further enhancing the heat dissipation performance and optimizing the user experience; the design of the mounting holes 9 is to ensure that the heat dissipation fins 4 can be inserted into the rolled edges 5.
[0033] The heat dissipation structure based on the PCBA module also includes emulsion thermal silicone, which is applied to the side of the copper base 7 near the PCBA module 3 and the inner side of the second U-shaped structure 2.
[0034] It should be noted that, in this embodiment, the design of the emulsion-like thermal silicone is to avoid gaps between the heat-generating components and the heat dissipation structure on the PCBA module 3, which would affect heat conduction and thus further enhance the heat dissipation performance.
[0035] Reference Figure 2As shown, the heat dissipation structure based on the PCBA module further includes a mounting plate 6, which is fixedly installed on the bottom of the first U-shaped structure 1. The mounting plate 6 is provided with a first screw hole 10, the PCBA module 3 is provided with a second screw hole, and the second U-shaped structure 2 is provided with a third screw hole. The distribution positions of the first screw hole 10, the second screw hole, and the third screw hole are compatible. The heat dissipation structure based on the PCBA module further includes a fixing screw 8, which passes through the first screw hole 10, the second screw hole, and the third screw hole simultaneously, and the nut of the fixing screw 8 is close to the third screw hole.
[0036] It should be noted that, in this embodiment, the design of the first screw hole 10, the second screw hole, the third screw hole, and the fixing bolt is to ensure the stability of the installation of the mounting plate 6 with the PCBA module 3 and the second U-shaped structure 2; in addition, the rear of the mounting plate 6 is provided with two push-pull bracket screw holes for the application end to install the push-pull bracket; and the mounting plate 6 is provided with an LED bottom hole for the LED indicator light to transmit light for display.
[0037] Reference Figure 6 As shown, a cutout 11 is provided in the middle of the fixed mounting plate 6, and the cutout 11 is close to the copper base 7.
[0038] It should be noted that in this embodiment, the cutout 11 is designed to bring the PCBA module 3 into contact with the copper base 7, so as to ensure efficient heat dissipation.
[0039] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A heat dissipation structure based on a PCBA module, characterized in that, The heat dissipation structure based on the PCBA module includes a PCBA module, a copper base, a first U-shaped structure, a second U-shaped structure, and heat dissipation fins; the copper base is close to the PCBA module; the first U-shaped structure covers the top of the copper base and is located on the top of the PCBA module; the second U-shaped structure covers the bottom of the PCBA module and is fixedly installed with the first U-shaped structure; the heat dissipation fins are fixedly installed on the inner side of the first U-shaped structure, and the heat dissipation fins are arranged parallel to each other in the horizontal direction.
2. The heat dissipation structure based on a PCBA module according to claim 1, characterized in that, The first U-shaped structure is provided with inlaid steps and rolled edges; the inlaid steps are distributed on both sides of the interior of the first U-shaped structure; the rolled edges are fixedly installed on the interior top surface of the first U-shaped structure.
3. The heat dissipation structure based on a PCBA module according to claim 2, characterized in that, The heat dissipation fins pass through the rolled edge and are mounted on the inlaid steps.
4. The heat dissipation structure based on a PCBA module according to claim 3, characterized in that, The heat dissipation fins are provided with mounting holes, and the distribution of the mounting holes is adapted to the distribution of the rolled edge.
5. A heat dissipation structure based on a PCBA module according to claim 1, characterized in that, The heat dissipation structure based on the PCBA module also includes emulsion thermal silicone, which is applied to the side of the copper base near the PCBA module and the inner side of the second U-shaped structure.
6. The heat dissipation structure based on a PCBA module according to claim 1, characterized in that, The heat dissipation structure based on the PCBA module also includes a mounting plate, which is fixedly installed at the bottom of the first U-shaped structure.
7. A heat dissipation structure based on a PCBA module according to claim 6, characterized in that, The fixed mounting plate has a cutout in the middle, which is close to the copper base.
8. A heat dissipation structure based on a PCBA module according to claim 6, characterized in that, The mounting plate is provided with a first screw hole, the PCBA module is provided with a second screw hole, and the second U-shaped structure is provided with a third screw hole. The first screw hole, the second screw hole, and the third screw hole are distributed in a matching manner.
9. A heat dissipation structure based on a PCBA module according to claim 8, characterized in that, The heat dissipation structure based on the PCBA module also includes a fixing screw, which passes through the first screw hole, the second screw hole and the third screw hole, and the nut of the fixing screw is close to the third screw hole.